MY185286A - Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use - Google Patents

Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use

Info

Publication number
MY185286A
MY185286A MYPI2018000069A MYPI2018000069A MY185286A MY 185286 A MY185286 A MY 185286A MY PI2018000069 A MYPI2018000069 A MY PI2018000069A MY PI2018000069 A MYPI2018000069 A MY PI2018000069A MY 185286 A MY185286 A MY 185286A
Authority
MY
Malaysia
Prior art keywords
electroless nickel
phosphorous
methods
ion concentration
plating baths
Prior art date
Application number
MYPI2018000069A
Other languages
English (en)
Inventor
Alan J Ruffini
Matthew J Wojcik
Jean Laplante
Nilesh Misty
Original Assignee
Coventya Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coventya Inc filed Critical Coventya Inc
Publication of MY185286A publication Critical patent/MY185286A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/739—Magnetic recording media substrates
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/858—Producing a magnetic layer by electro-plating or electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
MYPI2018000069A 2015-07-17 2016-07-14 Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use MY185286A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562193728P 2015-07-17 2015-07-17
PCT/US2016/042271 WO2017015054A1 (en) 2015-07-17 2016-07-14 Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use

Publications (1)

Publication Number Publication Date
MY185286A true MY185286A (en) 2021-04-30

Family

ID=57834788

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018000069A MY185286A (en) 2015-07-17 2016-07-14 Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use

Country Status (6)

Country Link
US (1) US20180209047A1 (enExample)
EP (1) EP3325688B1 (enExample)
JP (1) JP2018523019A (enExample)
MY (1) MY185286A (enExample)
SG (1) SG10201913013PA (enExample)
WO (1) WO2017015054A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7560093B2 (ja) * 2020-06-03 2024-10-02 奥野製薬工業株式会社 無電解ニッケル－リンめっき浴
JP7730667B2 (ja) * 2021-06-03 2025-08-28 東洋鋼鈑株式会社 ニッケル－リン合金被覆基板、ニッケル－リン合金膜の無電解めっきのための溶液、及びニッケル－リン合金被覆基板の製造方法
WO2023101770A1 (en) * 2021-11-30 2023-06-08 Coventya, Inc. Electroless antipathogenic coating
CN114438481B (zh) * 2022-01-24 2023-07-07 四川轻化工大学 非晶态镍磷合金镀层及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU65309A1 (enExample) 1972-05-08 1973-11-23
US4511614A (en) * 1983-10-31 1985-04-16 Ball Corporation Substrate having high absorptance and emittance black electroless nickel coating and a process for producing the same
JPH01201484A (ja) * 1987-10-06 1989-08-14 Hitachi Ltd 化学ニッケルめっき液及びその使用方法
US6048585A (en) * 1996-11-14 2000-04-11 Atotech Deutschland Gmbh Removal of orthophosphite ions from electroless nickel plating baths
US6524642B1 (en) * 2001-04-21 2003-02-25 Omg Fidelity, Inc. Electroless metal-plating process
MY160341A (en) * 2008-10-16 2017-02-28 Atotech Deutschland Gmbh Metal plating additive, and method for plating substrates and products therefrom.
DE602008005748D1 (de) 2008-10-17 2011-05-05 Atotech Deutschland Gmbh Spannungsreduzierte Ni-P/Pd-Stapel für Waferoberfläche
WO2014123535A1 (en) 2013-02-08 2014-08-14 OMG Electronic Chemicals, Inc. Methods for metallizing an aluminum paste
EP3026143A1 (en) * 2014-11-26 2016-06-01 ATOTECH Deutschland GmbH Plating bath and method for electroless deposition of nickel layers

Also Published As

Publication number Publication date
US20180209047A1 (en) 2018-07-26
EP3325688A1 (en) 2018-05-30
SG10201913013PA (en) 2020-03-30
JP2018523019A (ja) 2018-08-16
EP3325688B1 (en) 2021-02-24
WO2017015054A1 (en) 2017-01-26
EP3325688A4 (en) 2019-02-13

Similar Documents

Publication Publication Date Title
EP2868778A3 (en) Plating bath and method
MX2013001838A (es) Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos
MY185286A (en) Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use
MY176735A (en) Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method
TW201129714A (en) Method for improving plating on non-conductive substrates
WO2014015063A3 (en) Electroless nickel coatings and compositions and methods for forming the coatings
MY166049A (en) Electroless nickel alloy plating bath and process for depositing thereof
PH12016502562A1 (en) Molten a1 plated steel wire and method for producing same
MY153896A (en) Surface-coated aluminum and zinc plated steel sheet and method of preparing same
MY182304A (en) Plating bath composition and method for electroless plating of palladium
MX369015B (es) Método para formar una película de recubrimiento de capas múltiples.
PT3356579T (pt) Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido
EP3650579A4 (en) SOLUTION FOR CHEMICAL NICKEL PLATING AND METHOD FOR FORMING A NICKEL PLATING FILM
MX339242B (es) Proceso para deposicion por via quimica de metales utilizando baño de chapado altamente alcalino.
MX2016010851A (es) Tratamiento para bastidores electrochapeados para evitar la metalizacion del bastidor.
MX2019006153A (es) Arnip quimicamente modificado.
MX2016001847A (es) Metodo de formacion de pelicula de recubrimiento de capas multiples.
MY181601A (en) Plating bath composition and method for electroless plating of palladium
SG11202105789TA (en) Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof
WO2015187402A8 (en) Aqueous electroless nickel plating bath and method of using the same
BR112016030814A2 (pt) Processo para a deposição eletrolítica de um revestimento em zinco ou liga de zinco sobre um substrato metálico, substrato metálico revestido com zinco ou liga de zinco, banho de galvanização alcalino aquoso, e, uso de um aditivo de banho de galvanização em zinco
MX2016001677A (es) Formar una imagen conductiva utilizando enchapado no electrónico de alta velocidad.
GB201203425D0 (en) Method for the manufacture of a coated substrate
MY173728A (en) Method for depositing a copper seed layer onto a barrier layer
MX2015013325A (es) Aditivo para baño de galvanizado con aleacion de cinc acido, baño de galvanizado con aleacion de cinc acido y metodo para producir un articulo galvanizado con aleacion de cinc.