MX2016010851A - Tratamiento para bastidores electrochapeados para evitar la metalizacion del bastidor. - Google Patents

Tratamiento para bastidores electrochapeados para evitar la metalizacion del bastidor.

Info

Publication number
MX2016010851A
MX2016010851A MX2016010851A MX2016010851A MX2016010851A MX 2016010851 A MX2016010851 A MX 2016010851A MX 2016010851 A MX2016010851 A MX 2016010851A MX 2016010851 A MX2016010851 A MX 2016010851A MX 2016010851 A MX2016010851 A MX 2016010851A
Authority
MX
Mexico
Prior art keywords
treatment
electroplating
avoid rack
metallization
electroplating racks
Prior art date
Application number
MX2016010851A
Other languages
English (en)
Inventor
V Chapaneri Roshan
Hyslop Alison
D Herdman Roderick
Original Assignee
Macdermid Acumen Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Acumen Inc filed Critical Macdermid Acumen Inc
Publication of MX2016010851A publication Critical patent/MX2016010851A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Se describe un bastidor chapado para soportar sustratos no conductores durante un proceso de electrodeposición. El bastidor chapado es recubierto con un material no conductor, tal como plastisol PVC. El bastidor chapado es tratado con una solución no acuosa que comprende un inhibidor de metalización previo al proceso de electrodeposición para inhibir el "rack plate up" cuando se utilizan reactivos de ataque que no contienen acido crómico.
MX2016010851A 2014-02-19 2015-01-16 Tratamiento para bastidores electrochapeados para evitar la metalizacion del bastidor. MX2016010851A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/184,011 US20150233011A1 (en) 2014-02-19 2014-02-19 Treatment for Electroplating Racks to Avoid Rack Metallization
PCT/US2015/011704 WO2015126544A1 (en) 2014-02-19 2015-01-16 Treatment for electroplating racks to avoid rack metallization

Publications (1)

Publication Number Publication Date
MX2016010851A true MX2016010851A (es) 2016-11-17

Family

ID=53797590

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016010851A MX2016010851A (es) 2014-02-19 2015-01-16 Tratamiento para bastidores electrochapeados para evitar la metalizacion del bastidor.

Country Status (8)

Country Link
US (1) US20150233011A1 (es)
EP (1) EP3108039A4 (es)
JP (1) JP2017511843A (es)
CN (1) CN106103811A (es)
CA (1) CA2939316A1 (es)
MX (1) MX2016010851A (es)
TW (1) TWI623653B (es)
WO (1) WO2015126544A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9809899B2 (en) * 2014-08-07 2017-11-07 Macdermid Acumen, Inc. Treatment for electroplating racks to avoid rack metallization
US9506150B2 (en) * 2014-10-13 2016-11-29 Rohm And Haas Electronic Materials Llc Metallization inhibitors for plastisol coated plating tools
FR3027923B1 (fr) * 2014-11-04 2023-04-28 Pegastech Procede de metallisation de pieces plastiques
JP6648885B2 (ja) * 2015-09-08 2020-02-14 奥野製薬工業株式会社 めっき用治具の皮膜形成用組成物、めっき用治具及びめっき処理方法
EP3228729A1 (en) 2016-04-04 2017-10-11 COVENTYA S.p.A. Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath
FR3074808B1 (fr) 2017-12-13 2020-05-29 Maxence RENAUD Outillage de galvanoplastie
GB2587662A (en) 2019-10-04 2021-04-07 Macdermid Inc Prevention of unwanted plating on rack coatings for electrodeposition

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443988A (en) * 1965-05-06 1969-05-13 Photocircuits Corp Printed circuits,work holders and method of preventing electroless metal deposition
US3619243A (en) * 1970-02-17 1971-11-09 Enthone No rerack metal plating of electrically nonconductive articles
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US3939056A (en) * 1973-10-19 1976-02-17 Sony Corporation Coated plating rack
AU8113175A (en) * 1974-07-11 1976-11-18 Kollmorgen Corp Process for the formation of real images and products produced thereby
US5817388A (en) * 1996-11-08 1998-10-06 Carl M. Rodia & Associates Multi-component dye compositions for optical recording media
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic
US20090277798A1 (en) * 2005-09-02 2009-11-12 Ebara-Udylite Co. Ltd. Catalyst attachment-enhancing agent
JP2007092111A (ja) * 2005-09-28 2007-04-12 Okuno Chem Ind Co Ltd めっき析出阻害用組成物
US20140178770A1 (en) * 2012-02-07 2014-06-26 Battelle Memorial Institute Electrolytes for dendrite-free energy storage devices having high coulombic effciency
US8980460B2 (en) * 2012-02-07 2015-03-17 Battelle Memorial Institute Methods and electrolytes for electrodeposition of smooth films

Also Published As

Publication number Publication date
EP3108039A4 (en) 2017-10-18
JP2017511843A (ja) 2017-04-27
CN106103811A (zh) 2016-11-09
US20150233011A1 (en) 2015-08-20
TWI623653B (zh) 2018-05-11
TW201534768A (zh) 2015-09-16
EP3108039A1 (en) 2016-12-28
WO2015126544A1 (en) 2015-08-27
CA2939316A1 (en) 2015-08-27

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