SG10201607132XA - Plating Apparatus, Plating Method, And Substrate Holder - Google Patents

Plating Apparatus, Plating Method, And Substrate Holder

Info

Publication number
SG10201607132XA
SG10201607132XA SG10201607132XA SG10201607132XA SG10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA
Authority
SG
Singapore
Prior art keywords
plating
substrate holder
plating method
plating apparatus
holder
Prior art date
Application number
SG10201607132XA
Inventor
Junko Mine
Tsutomu Nakada
Mitsutoshi Yahagi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201607132XA publication Critical patent/SG10201607132XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
    • H01L2224/1146—Plating
    • H01L2224/11462—Electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13147—Copper [Cu] as principal constituent
SG10201607132XA 2015-08-28 2016-08-26 Plating Apparatus, Plating Method, And Substrate Holder SG10201607132XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015168969A JP6317299B2 (en) 2015-08-28 2015-08-28 Plating apparatus, plating method, and substrate holder

Publications (1)

Publication Number Publication Date
SG10201607132XA true SG10201607132XA (en) 2017-03-30

Family

ID=58098210

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201607132XA SG10201607132XA (en) 2015-08-28 2016-08-26 Plating Apparatus, Plating Method, And Substrate Holder

Country Status (6)

Country Link
US (2) US10316426B2 (en)
JP (2) JP6317299B2 (en)
KR (1) KR102483669B1 (en)
CN (2) CN106480480B (en)
SG (1) SG10201607132XA (en)
TW (1) TWI687555B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018161079A1 (en) 2017-03-03 2018-09-07 Harland Medical Systems, Inc. Coating composition comprised of a hydrophilic crosslinker, a hydrophobic crosslinker and optionally a hydrogel and methods of making and using the same
JP6859150B2 (en) * 2017-03-22 2021-04-14 株式会社荏原製作所 How to determine the plating equipment and plating tank configuration
KR102557221B1 (en) 2017-06-28 2023-07-20 가부시키가이샤 에바라 세이사꾸쇼 Substrate holder and plating device
JP6891060B2 (en) 2017-07-11 2021-06-18 株式会社荏原製作所 Regulation plate, anode holder, and substrate holder
US10875048B2 (en) * 2017-09-05 2020-12-29 Harland Medical Systems, Inc Coating apparatus with an automatic fluid level system, and methods of using the same
JP6744646B2 (en) * 2017-10-20 2020-08-19 アルメックスＰｅ株式会社 Surface treatment equipment
JP6975650B2 (en) * 2018-01-18 2021-12-01 株式会社荏原製作所 Current measurement module and inspection board using inspection board
JP6942072B2 (en) * 2018-02-22 2021-09-29 株式会社荏原製作所 Plating equipment
JP6966958B2 (en) * 2018-03-01 2021-11-17 株式会社荏原製作所 Plating equipment with paddles and paddles used to stir the plating solution
JP6993288B2 (en) * 2018-05-07 2022-01-13 株式会社荏原製作所 Plating equipment
JP7182911B2 (en) * 2018-06-21 2022-12-05 株式会社荏原製作所 Plating equipment and plating method
KR102111304B1 (en) * 2018-08-09 2020-05-18 (주)선우하이테크 Electro plating system and method having fuction of controlling constant current
CN108754590A (en) * 2018-08-22 2018-11-06 深圳市创智成功科技有限公司 Conducting ring, based on its for electric installation and based on the electroplate jig for electric installation
TWI728668B (en) * 2019-01-31 2021-05-21 日商Ａｌｍｅｘ Ｐｅ股份有限公司 Workpiece holding jig and surface treatment device
JP7079224B2 (en) * 2019-06-14 2022-06-01 株式会社荏原製作所 Non-volatile storage medium for storing plating methods, plating equipment, and programs
JP7256708B2 (en) 2019-07-09 2023-04-12 株式会社荏原製作所 Plating equipment
JP7227875B2 (en) * 2019-08-22 2023-02-22 株式会社荏原製作所 Substrate holder and plating equipment
TWI722555B (en) * 2019-09-04 2021-03-21 日月光半導體製造股份有限公司 Electroplating holder
JP7296832B2 (en) * 2019-09-10 2023-06-23 株式会社荏原製作所 Plating equipment
KR102454154B1 (en) * 2020-12-28 2022-10-14 가부시키가이샤 에바라 세이사꾸쇼 Substrate liquid contact method and plating apparatus
CN115119515B (en) * 2021-01-20 2023-03-24 株式会社荏原制作所 Plating apparatus and method for measuring film thickness of substrate
CN114959842A (en) * 2021-02-18 2022-08-30 日月光半导体制造股份有限公司 Electroplating device and method for manufacturing packaging structure
US20230383431A1 (en) * 2021-03-03 2023-11-30 Ebara Corporation Substrate holder, apparatus for plating, and method of manufacturing apparatus for plating
JP7027622B1 (en) * 2021-06-17 2022-03-01 株式会社荏原製作所 Resistors and plating equipment
JP7093478B1 (en) 2021-06-18 2022-06-29 株式会社荏原製作所 Plating equipment and plating method
JP7285389B1 (en) * 2022-06-27 2023-06-01 株式会社荏原製作所 Plating equipment and plating method

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Also Published As

Publication number Publication date
US10513795B2 (en) 2019-12-24
JP2017043815A (en) 2017-03-02
US20170058423A1 (en) 2017-03-02
JP2018090911A (en) 2018-06-14
US20190249326A1 (en) 2019-08-15
JP6317299B2 (en) 2018-04-25
JP6488041B2 (en) 2019-03-20
KR20170026112A (en) 2017-03-08
CN111304715B (en) 2021-01-26
TWI687555B (en) 2020-03-11
CN111304715A (en) 2020-06-19
CN106480480B (en) 2020-05-05
TW201708623A (en) 2017-03-01
KR102483669B1 (en) 2023-01-02
CN106480480A (en) 2017-03-08
US10316426B2 (en) 2019-06-11

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