SG10201506731PA - Buffing apparatus, and substrate processing apparatus - Google Patents

Buffing apparatus, and substrate processing apparatus

Info

Publication number
SG10201506731PA
SG10201506731PA SG10201506731PA SG10201506731PA SG10201506731PA SG 10201506731P A SG10201506731P A SG 10201506731PA SG 10201506731P A SG10201506731P A SG 10201506731PA SG 10201506731P A SG10201506731P A SG 10201506731PA SG 10201506731P A SG10201506731P A SG 10201506731PA
Authority
SG
Singapore
Prior art keywords
substrate processing
buffing
processing apparatus
buffing apparatus
substrate
Prior art date
Application number
SG10201506731PA
Inventor
Kuniaki Yamaguchi
Toshio Mizuno
Itsuki Kobata
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014171859A external-priority patent/JP6430177B2/en
Priority claimed from JP2014210949A external-priority patent/JP2016078156A/en
Priority claimed from JP2014248993A external-priority patent/JP2016111264A/en
Priority claimed from JP2014256473A external-priority patent/JP2016119333A/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201506731PA publication Critical patent/SG10201506731PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/002—Grinding heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
SG10201506731PA 2014-08-26 2015-08-25 Buffing apparatus, and substrate processing apparatus SG10201506731PA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014171859A JP6430177B2 (en) 2014-08-26 2014-08-26 Buff processing module and processing device
JP2014210949A JP2016078156A (en) 2014-10-15 2014-10-15 Processing module
JP2014248993A JP2016111264A (en) 2014-12-09 2014-12-09 Buff processing device and substrate processing device
JP2014256473A JP2016119333A (en) 2014-12-18 2014-12-18 Buff processing unit, and substrate processing apparatus

Publications (1)

Publication Number Publication Date
SG10201506731PA true SG10201506731PA (en) 2016-03-30

Family

ID=55401430

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201506731PA SG10201506731PA (en) 2014-08-26 2015-08-25 Buffing apparatus, and substrate processing apparatus

Country Status (5)

Country Link
US (1) US10183374B2 (en)
KR (1) KR102213468B1 (en)
CN (1) CN105390417B (en)
SG (1) SG10201506731PA (en)
TW (1) TWI702111B (en)

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JP6885754B2 (en) * 2017-03-09 2021-06-16 株式会社Ｓｃｒｅｅｎホールディングス Board processing method and board processing equipment
CN107471087A (en) * 2017-09-13 2017-12-15 武汉新芯集成电路制造有限公司 It is a kind of to prevent crystal column surface from the method damaged occur
US11515130B2 (en) * 2018-03-05 2022-11-29 Applied Materials, Inc. Fast response pedestal assembly for selective preclean
JP7098240B2 (en) * 2018-08-22 2022-07-11 株式会社ディスコ Abrasive pad
DE102018121626A1 (en) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Polishing device
CN109015314A (en) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 A kind of based CMP apparatus
CN110103119A (en) * 2018-09-20 2019-08-09 杭州众硅电子科技有限公司 A kind of polishing handling parts module
CN109148341A (en) * 2018-10-16 2019-01-04 杭州众硅电子科技有限公司 A kind of CMP wafer cleaning equipment
TWI718508B (en) * 2019-03-25 2021-02-11 智勝科技股份有限公司 Polishing pad, manufacturing method of polishing pad and polishing method
KR102644399B1 (en) * 2019-06-05 2024-03-08 주식회사 케이씨텍 Substrate cleaning apparatus
US20220134505A1 (en) * 2020-11-05 2022-05-05 Applied Materials, Inc. Horizontal buffing module
CN112372509B (en) * 2020-11-11 2022-02-25 西安奕斯伟硅片技术有限公司 Method and apparatus for changing initial state of polishing pad to hydrophilicity

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US2309016A (en) * 1942-02-09 1943-01-19 Norton Co Composite grinding wheel
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US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
WO1999039873A1 (en) * 1998-02-04 1999-08-12 Koennemann Ronny Grinding spindle
JP2000141215A (en) * 1998-11-05 2000-05-23 Sony Corp Flattening grinding device and its method
JP4127346B2 (en) 1999-08-20 2008-07-30 株式会社荏原製作所 Polishing apparatus and method
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US6248006B1 (en) * 2000-01-24 2001-06-19 Chartered Semiconductor Manufacturing Ltd. CMP uniformity
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Also Published As

Publication number Publication date
CN105390417B (en) 2020-04-07
KR20160024797A (en) 2016-03-07
US20160059376A1 (en) 2016-03-03
TWI702111B (en) 2020-08-21
KR102213468B1 (en) 2021-02-08
US10183374B2 (en) 2019-01-22
CN105390417A (en) 2016-03-09
TW201618898A (en) 2016-06-01

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