SG10201503374QA - Substrate Polishing Apparatus - Google Patents
Substrate Polishing ApparatusInfo
- Publication number
- SG10201503374QA SG10201503374QA SG10201503374QA SG10201503374QA SG10201503374QA SG 10201503374Q A SG10201503374Q A SG 10201503374QA SG 10201503374Q A SG10201503374Q A SG 10201503374QA SG 10201503374Q A SG10201503374Q A SG 10201503374QA SG 10201503374Q A SG10201503374Q A SG 10201503374QA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing apparatus
- substrate polishing
- substrate
- polishing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014094137A JP6345474B2 (en) | 2014-04-30 | 2014-04-30 | Substrate polishing equipment |
JP2014111263 | 2014-05-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201503374QA true SG10201503374QA (en) | 2015-11-27 |
Family
ID=54354540
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201808052SA SG10201808052SA (en) | 2014-04-30 | 2015-04-29 | Substrate Polishing Apparatus |
SG10201503374QA SG10201503374QA (en) | 2014-04-30 | 2015-04-29 | Substrate Polishing Apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201808052SA SG10201808052SA (en) | 2014-04-30 | 2015-04-29 | Substrate Polishing Apparatus |
Country Status (2)
Country | Link |
---|---|
US (2) | US10576604B2 (en) |
SG (2) | SG10201808052SA (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201808052SA (en) * | 2014-04-30 | 2018-10-30 | Ebara Corp | Substrate Polishing Apparatus |
JP6659368B2 (en) * | 2016-01-15 | 2020-03-04 | 株式会社荏原製作所 | Cleaning apparatus, substrate processing apparatus, and substrate processing method |
JP6842859B2 (en) | 2016-08-12 | 2021-03-17 | 株式会社荏原製作所 | Dressing equipment, polishing equipment, holders, housings and dressing methods |
CN207571415U (en) * | 2017-08-25 | 2018-07-03 | 合肥鑫晟光电科技有限公司 | Glass baseplate surface wet method stripping off device |
KR102037747B1 (en) * | 2018-01-08 | 2019-10-29 | 에스케이실트론 주식회사 | Wafer Polishing Apparatus |
US20210323117A1 (en) * | 2020-04-16 | 2021-10-21 | Applied Materials, Inc. | High throughput polishing modules and modular polishing systems |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4635434A (en) * | 1985-03-14 | 1987-01-13 | Suzuki Ken Ichi | Protective device for a grinder or the like |
JP3095516B2 (en) | 1992-03-04 | 2000-10-03 | 川崎製鉄株式会社 | Waxless polishing machine |
JP3733973B2 (en) | 1993-12-14 | 2006-01-11 | 株式会社荏原製作所 | Polishing device |
US5653623A (en) * | 1993-12-14 | 1997-08-05 | Ebara Corporation | Polishing apparatus with improved exhaust |
JP3673792B2 (en) | 1994-12-06 | 2005-07-20 | 株式会社荏原製作所 | Polishing device |
KR100445139B1 (en) * | 1996-01-23 | 2004-11-17 | 가부시키 가이샤 에바라 세이사꾸쇼 | Polishing apparatus |
JPH10264014A (en) | 1997-03-20 | 1998-10-06 | Speedfam Co Ltd | Grinding device |
US6036582A (en) * | 1997-06-06 | 2000-03-14 | Ebara Corporation | Polishing apparatus |
US6042455A (en) * | 1997-12-11 | 2000-03-28 | Ebara Corporation | Polishing apparatus |
US6139680A (en) * | 1998-12-15 | 2000-10-31 | United Microelectronics Corp. | Exhaust line of chemical-mechanical polisher |
US6117779A (en) * | 1998-12-15 | 2000-09-12 | Lsi Logic Corporation | Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint |
JP2002018368A (en) | 2000-07-05 | 2002-01-22 | Dainippon Screen Mfg Co Ltd | Substrate treating tool |
JP3958539B2 (en) * | 2001-08-02 | 2007-08-15 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
JP2003100683A (en) | 2001-09-21 | 2003-04-04 | Hitachi Ltd | Device and method for manufacturing semiconductor device |
KR20040031071A (en) * | 2001-09-28 | 2004-04-09 | 신에쯔 한도타이 가부시키가이샤 | Grinding work holding disk, work grinding device and grinding method |
JP4018958B2 (en) * | 2001-10-30 | 2007-12-05 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP4448297B2 (en) | 2002-12-27 | 2010-04-07 | 株式会社荏原製作所 | Substrate polishing apparatus and substrate polishing method |
JP2005286221A (en) | 2004-03-30 | 2005-10-13 | Dainippon Screen Mfg Co Ltd | Apparatus and method for treating substrate |
US7776228B2 (en) * | 2006-04-11 | 2010-08-17 | Ebara Corporation | Catalyst-aided chemical processing method |
ATE450885T1 (en) * | 2006-04-18 | 2009-12-15 | Tokyo Electron Ltd | LIQUID PROCESSING APPARATUS |
JP2008166709A (en) | 2006-12-05 | 2008-07-17 | Ebara Corp | Substrate polishing device and substrate polishing equipment |
JP2009177566A (en) | 2008-01-25 | 2009-08-06 | Seiko Epson Corp | Image processing capable of improving print image quality |
US7988535B2 (en) * | 2008-04-18 | 2011-08-02 | Applied Materials, Inc. | Platen exhaust for chemical mechanical polishing system |
JP2011079076A (en) * | 2009-10-05 | 2011-04-21 | Toshiba Corp | Polishing device and polishing method |
JP5547472B2 (en) * | 2009-12-28 | 2014-07-16 | 株式会社荏原製作所 | Substrate polishing apparatus, substrate polishing method, and polishing pad surface temperature control apparatus for substrate polishing apparatus |
JP5628067B2 (en) * | 2011-02-25 | 2014-11-19 | 株式会社荏原製作所 | Polishing apparatus provided with temperature adjustment mechanism of polishing pad |
TWI548483B (en) * | 2011-07-19 | 2016-09-11 | 荏原製作所股份有限公司 | Polishing device and method |
JP5844163B2 (en) * | 2012-01-12 | 2016-01-13 | 株式会社荏原製作所 | Polishing equipment |
JP5795977B2 (en) | 2012-03-14 | 2015-10-14 | 株式会社荏原製作所 | Polishing equipment |
JP5927129B2 (en) * | 2013-01-31 | 2016-05-25 | 株式会社荏原製作所 | Polishing equipment |
SG10201808052SA (en) * | 2014-04-30 | 2018-10-30 | Ebara Corp | Substrate Polishing Apparatus |
-
2015
- 2015-04-29 SG SG10201808052SA patent/SG10201808052SA/en unknown
- 2015-04-29 SG SG10201503374QA patent/SG10201503374QA/en unknown
- 2015-04-29 US US14/699,075 patent/US10576604B2/en not_active Expired - Fee Related
-
2020
- 2020-02-07 US US16/784,757 patent/US11472002B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
SG10201808052SA (en) | 2018-10-30 |
US11472002B2 (en) | 2022-10-18 |
US20200198093A1 (en) | 2020-06-25 |
US10576604B2 (en) | 2020-03-03 |
US20150314418A1 (en) | 2015-11-05 |
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