SG10201808052SA - Substrate Polishing Apparatus - Google Patents

Substrate Polishing Apparatus

Info

Publication number
SG10201808052SA
SG10201808052SA SG10201808052SA SG10201808052SA SG10201808052SA SG 10201808052S A SG10201808052S A SG 10201808052SA SG 10201808052S A SG10201808052S A SG 10201808052SA SG 10201808052S A SG10201808052S A SG 10201808052SA SG 10201808052S A SG10201808052S A SG 10201808052SA
Authority
SG
Singapore
Prior art keywords
polishing
substrate
polishing apparatus
substrate polishing
polishing surface
Prior art date
Application number
SG10201808052SA
Inventor
Hiroyuki Shinozaki
Hiroshi Aono
Tadakazu Sone
Kenji Shinkai
Hideo Aizawa
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014094137A external-priority patent/JP6345474B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201808052SA publication Critical patent/SG10201808052SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

SUBSTRATE POLISHING APPARATUS A substrate processing apparatus has a table on which a polishing surface for polishing a substrate is provided, and a discharge suction section which has a discharge port which communicates with a fluid supply source and through which a fluid is discharged to the polishing surface and a suction opening which communicates with a vacuum source and through which the fluid existing on the polishing surface is sucked. Fig. 4
SG10201808052SA 2014-04-30 2015-04-29 Substrate Polishing Apparatus SG10201808052SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014094137A JP6345474B2 (en) 2014-04-30 2014-04-30 Substrate polishing equipment
JP2014111263 2014-05-29

Publications (1)

Publication Number Publication Date
SG10201808052SA true SG10201808052SA (en) 2018-10-30

Family

ID=54354540

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201808052SA SG10201808052SA (en) 2014-04-30 2015-04-29 Substrate Polishing Apparatus
SG10201503374QA SG10201503374QA (en) 2014-04-30 2015-04-29 Substrate Polishing Apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201503374QA SG10201503374QA (en) 2014-04-30 2015-04-29 Substrate Polishing Apparatus

Country Status (2)

Country Link
US (2) US10576604B2 (en)
SG (2) SG10201808052SA (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201808052SA (en) * 2014-04-30 2018-10-30 Ebara Corp Substrate Polishing Apparatus
JP6659368B2 (en) * 2016-01-15 2020-03-04 株式会社荏原製作所 Cleaning apparatus, substrate processing apparatus, and substrate processing method
JP6842859B2 (en) * 2016-08-12 2021-03-17 株式会社荏原製作所 Dressing equipment, polishing equipment, holders, housings and dressing methods
CN207571415U (en) * 2017-08-25 2018-07-03 合肥鑫晟光电科技有限公司 Glass baseplate surface wet method stripping off device
KR102037747B1 (en) * 2018-01-08 2019-10-29 에스케이실트론 주식회사 Wafer Polishing Apparatus
US20210323117A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems

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US4635434A (en) * 1985-03-14 1987-01-13 Suzuki Ken Ichi Protective device for a grinder or the like
JP3095516B2 (en) 1992-03-04 2000-10-03 川崎製鉄株式会社 Waxless polishing machine
US5653623A (en) * 1993-12-14 1997-08-05 Ebara Corporation Polishing apparatus with improved exhaust
JP3733973B2 (en) 1993-12-14 2006-01-11 株式会社荏原製作所 Polishing device
JP3673792B2 (en) 1994-12-06 2005-07-20 株式会社荏原製作所 Polishing device
KR100445139B1 (en) * 1996-01-23 2004-11-17 가부시키 가이샤 에바라 세이사꾸쇼 Polishing apparatus
JPH10264014A (en) 1997-03-20 1998-10-06 Speedfam Co Ltd Grinding device
US6036582A (en) * 1997-06-06 2000-03-14 Ebara Corporation Polishing apparatus
US6042455A (en) * 1997-12-11 2000-03-28 Ebara Corporation Polishing apparatus
US6117779A (en) * 1998-12-15 2000-09-12 Lsi Logic Corporation Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint
US6139680A (en) * 1998-12-15 2000-10-31 United Microelectronics Corp. Exhaust line of chemical-mechanical polisher
JP2002018368A (en) 2000-07-05 2002-01-22 Dainippon Screen Mfg Co Ltd Substrate treating tool
JP3958539B2 (en) * 2001-08-02 2007-08-15 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP2003100683A (en) 2001-09-21 2003-04-04 Hitachi Ltd Device and method for manufacturing semiconductor device
CN1312740C (en) * 2001-09-28 2007-04-25 信越半导体株式会社 Grinding work holding disk, work grinding device and grinding method
JP4018958B2 (en) * 2001-10-30 2007-12-05 大日本スクリーン製造株式会社 Substrate processing equipment
JP4448297B2 (en) 2002-12-27 2010-04-07 株式会社荏原製作所 Substrate polishing apparatus and substrate polishing method
JP2005286221A (en) 2004-03-30 2005-10-13 Dainippon Screen Mfg Co Ltd Apparatus and method for treating substrate
US7776228B2 (en) * 2006-04-11 2010-08-17 Ebara Corporation Catalyst-aided chemical processing method
ATE450885T1 (en) * 2006-04-18 2009-12-15 Tokyo Electron Ltd LIQUID PROCESSING APPARATUS
JP2008166709A (en) 2006-12-05 2008-07-17 Ebara Corp Substrate polishing device and substrate polishing equipment
JP2009177566A (en) 2008-01-25 2009-08-06 Seiko Epson Corp Image processing capable of improving print image quality
US7988535B2 (en) 2008-04-18 2011-08-02 Applied Materials, Inc. Platen exhaust for chemical mechanical polishing system
JP2011079076A (en) * 2009-10-05 2011-04-21 Toshiba Corp Polishing device and polishing method
JP5547472B2 (en) * 2009-12-28 2014-07-16 株式会社荏原製作所 Substrate polishing apparatus, substrate polishing method, and polishing pad surface temperature control apparatus for substrate polishing apparatus
JP5628067B2 (en) * 2011-02-25 2014-11-19 株式会社荏原製作所 Polishing apparatus provided with temperature adjustment mechanism of polishing pad
TWI548483B (en) * 2011-07-19 2016-09-11 荏原製作所股份有限公司 Polishing device and method
JP5844163B2 (en) * 2012-01-12 2016-01-13 株式会社荏原製作所 Polishing equipment
JP5795977B2 (en) 2012-03-14 2015-10-14 株式会社荏原製作所 Polishing equipment
JP5927129B2 (en) * 2013-01-31 2016-05-25 株式会社荏原製作所 Polishing equipment
SG10201808052SA (en) * 2014-04-30 2018-10-30 Ebara Corp Substrate Polishing Apparatus

Also Published As

Publication number Publication date
US20200198093A1 (en) 2020-06-25
US11472002B2 (en) 2022-10-18
US10576604B2 (en) 2020-03-03
US20150314418A1 (en) 2015-11-05
SG10201503374QA (en) 2015-11-27

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