JP3095516B2 - Waxless polishing machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wax-less polishing apparatus for a semiconductor substrate and the like, and more particularly to a wax-less polishing apparatus capable of flattening the surface of a semiconductor substrate by polishing in the manufacture of a semiconductor device.

[0002]

2. Description of the Related Art With the rapid progress of LSI technology in recent years, integrated circuits have become higher in density and the element size has been correspondingly reduced. Along with this, attempts have been made to increase the number of wiring layers, resulting in extremely large irregularities due to steps on the surface of the semiconductor substrate. Had become.

Meanwhile, as one of means for realizing the flattening of the surface of an integrated circuit, there is a mechanochemical polishing apparatus (for example, see JP-A-3-248532). This device is available, for example, from Westech Systems Inc.
It is mainly a waxless type polishing machine sold as "2 Automatic Wafer Polisher", which combines mechanical elements such as colloidal silica and chemical elements such as alkaline solvents.

[0004] That is, as shown in FIG. 4, a polishing platen 3, which is rotatable by attaching a polishing cloth 2 for polishing a surface of a semiconductor substrate (hereinafter simply referred to as a substrate) 1 as a workpiece, and a substrate, 1, a polishing mechanism 5 that presses the polishing plate 4 against the surface of the polishing cloth 2 at a predetermined pressure to be rotatable, and a nozzle 7 that supplies an abrasive 6 onto the polishing cloth 2. It is composed of As shown in the enlarged cross-sectional view of FIG. 5, the substrate 1 is sucked through a vacuum evacuation hole 9 formed by, for example, a poly-based soft material 8 fixed to the lower surface of the polishing plate 5. Then, an abrasive 6 is dropped from the nozzle 7 onto the polishing cloth 2 of the rotating polishing platen 3, and the polishing plate 4 and the polishing platen 3 which rotate while being applied with a constant pressure through the pressing mechanism 5. Then, the surface of the substrate 1 is polished.

[0005]

However, in the conventional mechanochemical polishing apparatus as described above, the abrasive 6 dropped onto the polishing cloth 2 from the nozzle 7 is rotated by the rotation of the polishing platen 3 so that the surface of the polishing cloth 2 is removed. Although it is spread out as a whole, it has a drawback that it is not supplied sufficiently between the polishing cloth 2 and the polishing plate 4, and there is a problem that a large amount of the abrasive 6 must be used to make up for it.

[0006] It is an object of the present invention to provide a waxless polishing apparatus which has solved the above-mentioned problems of the prior art.

[0007]

According to the present invention, there is provided a rotatable polishing plate having a polishing cloth attached thereon for polishing an object to be polished, a polishing plate for holding the object to be polished, and a polishing plate for holding the object to be polished. And a pressurizing mechanism that is rotatable while pressurizing the polishing cloth surface with the pressure of the above, wherein a supply port for supplying a polishing agent is provided on a peripheral side portion of the polishing plate. It is a waxless type polishing apparatus characterized by the following.

[0008] Incidentally, the supply port may be preferably ring-shaped, or slit-shaped or lattice shape.

[0009]

According to the present invention, since the abrasive is supplied from the supply port provided on the peripheral side of the rotating polishing plate, a sufficient amount of the abrasive is supplied between the polishing cloth and the polishing plate. The accuracy of the flatness of the surface of the object to be polished can be improved.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view showing a configuration of a polishing apparatus according to the present invention, and FIG. 2 is a view taken on line AA of FIG. In addition,
The same members as those in the conventional example are denoted by the same reference numerals, and description thereof will be omitted.
In these figures, reference numeral 10 denotes a cover integrally provided so as to surround the side portions of the polishing plate 4 and the pressing mechanism 5, and a polishing member 10 is provided between the inner surface thereof and the side surfaces of the polishing plate 4 and the pressing mechanism 5. A flow path 11 into which the agent 6 is introduced is provided, and a supply port 12 is provided along the peripheral side of the polishing plate 4. The supply port 12 has a ring shape as shown in FIG.

When the substrate 1 is polished using a polishing apparatus provided with such a cover 10, the polishing liquid is introduced from a polishing agent tank (not shown) into the flow path 11 of the cover 10 during the polishing. The polishing agent 6 can be supplied in a large amount from the supply port 12 directly between the polishing plate 4 and the polishing cloth 2 through the side portion of the polishing plate 4, whereby the surface of the substrate 1 has a high flatness. Can be polished so that

In the above embodiment, the supply port 12 has been described as a ring, but the present invention is not limited to this. For example, a slit-like supply port 12a as shown in FIG. Alternatively, the supply method of the abrasive can be controlled by providing a lattice-shaped supply port 12b as shown in FIG. 3 (b) and a porous supply port 12c as shown in FIG. 3 (c). Needless to say, the polishing apparatus of the present invention can be widely applied to fields other than the semiconductor device field.

[0013]

As described above, according to the present invention, since the abrasive is supplied from the supply port provided on the peripheral side of the polishing plate, a sufficient amount of polishing agent is supplied between the polishing cloth and the polishing plate. Can be supplied, thereby improving the quality of the object to be polished and contributing to a reduction in the amount of the abrasive used.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a configuration of a polishing apparatus of the present invention.

FIG. 2 is a view taken along the line AA of FIG. 1;

FIGS. 3 (a), 3 (b) and 3 (c) are plan views showing another embodiment of the supply port.

FIG. 4 is a perspective view showing a conventional example of a mechanochemical polishing apparatus.

FIG. 5 is an enlarged partial side sectional view showing a main part of a conventional mechanochemical polishing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate (semiconductor substrate) 2 Polishing cloth 3 Polishing platen 4 Polishing plate 5 Pressing mechanism 6 Abrasive 8 Flexible material 9 Vacuum hole 10 Cover 11 Flow path 12 Supply port

Continuation of front page (56) References JP-A-4-129669 (JP, A) JP-A-2-60127 (JP, A) JP-A-5-49253 (JP, U) (58) Fields surveyed (Int) .Cl. ⁷ , DB name) B24B 37/00 H01L 21/304 622

Claims (2)

(57) [Claims] 1. A rotatable polishing platen to which a polishing cloth for polishing an object to be polished is affixed, a polishing plate for holding the object to be polished, and the polishing plate being attached to the surface of the polishing cloth with a predetermined pressure. In a waxless type polishing apparatus having a pressurizing mechanism that is rotatable while pressurizing, a supply port for supplying an abrasive to a peripheral side portion of the polishing plate is connected to a phosphorus.
A waxless type polishing apparatus, wherein the polishing apparatus is provided so as to have a brush-like shape . 2. A polishing cloth for polishing an object to be polished is attached.
A rotatable polishing platen that holds the object to be polished
Polishing plate and the polishing plate at a predetermined pressure.
Pressurization that allows free rotation while pressing against the polishing cloth surface
A waxless type polishing apparatus having a mechanism
Slip the supply port for supplying abrasive to the peripheral side of the polishing plate.
A waxless- type polishing apparatus characterized in that the polishing apparatus is provided so as to have a slit shape or a lattice shape .