SG10201501193YA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10201501193YA
SG10201501193YA SG10201501193YA SG10201501193YA SG10201501193YA SG 10201501193Y A SG10201501193Y A SG 10201501193YA SG 10201501193Y A SG10201501193Y A SG 10201501193YA SG 10201501193Y A SG10201501193Y A SG 10201501193YA SG 10201501193Y A SG10201501193Y A SG 10201501193YA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
polishing
Prior art date
Application number
SG10201501193YA
Inventor
Yoshida Shinji
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201501193YA publication Critical patent/SG10201501193YA/en

Links

SG10201501193YA 2014-02-21 2015-02-16 Polishing apparatus SG10201501193YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014031488A JP6393489B2 (en) 2014-02-21 2014-02-21 Polishing equipment

Publications (1)

Publication Number Publication Date
SG10201501193YA true SG10201501193YA (en) 2015-09-29

Family

ID=53905159

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501193YA SG10201501193YA (en) 2014-02-21 2015-02-16 Polishing apparatus

Country Status (5)

Country Link
JP (1) JP6393489B2 (en)
KR (1) KR102172963B1 (en)
CN (1) CN104858772B (en)
SG (1) SG10201501193YA (en)
TW (1) TWI647067B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6704244B2 (en) * 2015-12-03 2020-06-03 株式会社ディスコ Polishing equipment
CN105619236A (en) * 2016-01-08 2016-06-01 哈尔滨秋冠光电科技有限公司 High-speed machining and automatic measuring integrated equipment
CN108067959A (en) * 2016-11-10 2018-05-25 天津市昊航复合管业有限公司 Temperature quickly cooling device in a kind of composite steel tube bruting process
JP2019102687A (en) * 2017-12-05 2019-06-24 株式会社ディスコ Polishing device
JP7031491B2 (en) * 2018-05-22 2022-03-08 株式会社Sumco Work double-sided polishing device and double-sided polishing method
DE102018121626A1 (en) * 2018-09-05 2020-03-05 Rud. Starcke Gmbh & Co. Kg Polishing device
CN109015344A (en) * 2018-09-25 2018-12-18 天通银厦新材料有限公司 A kind of sapphire substrate grinding device
CN111283548B (en) * 2018-12-07 2023-07-18 株式会社迪思科 Method for machining disc-shaped workpiece
CN110039379B (en) * 2019-03-20 2021-04-13 洛阳市精科主轴有限公司 Ultra-precise grinding temperature compensation instrument and grinding process

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2688490B2 (en) * 1988-05-18 1997-12-10 東芝機械株式会社 Method and apparatus for measuring profile of plastic sheet
JPH05209723A (en) * 1992-01-29 1993-08-20 Mitsui Toatsu Chem Inc Method for measuring thickness of transparent sheet
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP2005203729A (en) 2003-12-19 2005-07-28 Ebara Corp Substrate polishing apparatus
JP4631021B2 (en) * 2004-03-12 2011-02-16 株式会社ディスコ Polishing equipment
EP1758711B1 (en) * 2004-06-21 2013-08-07 Ebara Corporation Polishing apparatus and polishing method
JP5443180B2 (en) * 2010-01-13 2014-03-19 株式会社ディスコ Thickness detection device and grinding machine
JP5517698B2 (en) * 2010-03-30 2014-06-11 株式会社ディスコ Polishing equipment
JP2011224758A (en) 2010-04-22 2011-11-10 Disco Corp Polishing method
JP5752961B2 (en) 2011-03-11 2015-07-22 株式会社ディスコ Measuring device
CN102423872A (en) * 2011-12-07 2012-04-25 深圳深爱半导体股份有限公司 Method for polishing silicon chip

Also Published As

Publication number Publication date
KR102172963B1 (en) 2020-11-02
TW201536478A (en) 2015-10-01
CN104858772A (en) 2015-08-26
CN104858772B (en) 2019-09-06
JP2015155136A (en) 2015-08-27
KR20150099420A (en) 2015-08-31
JP6393489B2 (en) 2018-09-19
TWI647067B (en) 2019-01-11

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