SG10201503514TA - Polishing apparatus - Google Patents
Polishing apparatusInfo
- Publication number
- SG10201503514TA SG10201503514TA SG10201503514TA SG10201503514TA SG10201503514TA SG 10201503514T A SG10201503514T A SG 10201503514TA SG 10201503514T A SG10201503514T A SG 10201503514TA SG 10201503514T A SG10201503514T A SG 10201503514TA SG 10201503514T A SG10201503514T A SG 10201503514TA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing apparatus
- polishing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014100381 | 2014-05-14 | ||
| JP2014100382A JP2015217445A (en) | 2014-05-14 | 2014-05-14 | Polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201503514TA true SG10201503514TA (en) | 2015-12-30 |
Family
ID=54537740
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201503514TA SG10201503514TA (en) | 2014-05-14 | 2015-05-05 | Polishing apparatus |
| SG10201802846XA SG10201802846XA (en) | 2014-05-14 | 2015-05-05 | Polishing apparatus |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201802846XA SG10201802846XA (en) | 2014-05-14 | 2015-05-05 | Polishing apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9833875B2 (en) |
| KR (2) | KR102260613B1 (en) |
| CN (1) | CN105081961B (en) |
| SG (2) | SG10201503514TA (en) |
| TW (1) | TWI656944B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6216686B2 (en) * | 2014-05-30 | 2017-10-18 | 株式会社荏原製作所 | Polishing equipment |
| KR102173323B1 (en) * | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | Carrier head, chemical mechanical polishing apparatus and wafer polishing method |
| JP7108450B2 (en) * | 2018-04-13 | 2022-07-28 | 株式会社ディスコ | Polishing equipment |
| JP7049984B2 (en) * | 2018-12-27 | 2022-04-07 | 株式会社荏原製作所 | How to control the tilt of the grinder and the stationary ring |
| JP7178259B2 (en) * | 2018-12-27 | 2022-11-25 | 株式会社荏原製作所 | Polishing device and polishing method |
| JP2020189366A (en) * | 2019-05-22 | 2020-11-26 | 株式会社荏原製作所 | Polishing device and polishing method |
| USD954567S1 (en) * | 2019-06-25 | 2022-06-14 | Ebara Corporation | Measurement jig |
| KR20210006550A (en) | 2019-07-08 | 2021-01-19 | 삼성전자주식회사 | rotation body module and chemical mechanical polishing apparatus having the same |
| JP7339811B2 (en) * | 2019-08-27 | 2023-09-06 | 株式会社荏原製作所 | Abnormality detection method and polishing device for roller that transmits local load to retainer ring |
| CN111113201A (en) * | 2020-02-17 | 2020-05-08 | 中国工程物理研究院激光聚变研究中心 | Floating pressure clamping device and method for optical element quick polishing |
| CN111975500B (en) * | 2020-08-19 | 2022-04-12 | 无锡起舟五金弹簧有限公司 | Spring end face grinding device |
| US11623321B2 (en) * | 2020-10-14 | 2023-04-11 | Applied Materials, Inc. | Polishing head retaining ring tilting moment control |
| US20230356355A1 (en) * | 2022-05-03 | 2023-11-09 | Applied Materials, Inc. | Polishing head with local inner ring downforce control |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2873314B2 (en) | 1989-03-30 | 1999-03-24 | 住友シチックス株式会社 | Method and apparatus for polishing semiconductor substrate |
| JPH0569310A (en) | 1991-04-23 | 1993-03-23 | Mitsubishi Materials Corp | Device for grinding mirror surface of wafer |
| EP0911115B1 (en) * | 1992-09-24 | 2003-11-26 | Ebara Corporation | Polishing apparatus |
| JPH06262514A (en) | 1993-03-17 | 1994-09-20 | Speedfam Co Ltd | Surface polishing device with vibration preventing device |
| US5584746A (en) * | 1993-10-18 | 1996-12-17 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafers and apparatus therefor |
| DE69526129T2 (en) * | 1994-05-23 | 2002-08-22 | Sumitomo Electric Industries | Method and device for manufacturing a semiconductor covered with hard material by polishing |
| JP2982635B2 (en) * | 1994-12-20 | 1999-11-29 | 株式会社東京精密 | Wafer polishing method and apparatus |
| JP3807807B2 (en) * | 1997-02-27 | 2006-08-09 | 株式会社荏原製作所 | Polishing device |
| US6110025A (en) * | 1997-05-07 | 2000-08-29 | Obsidian, Inc. | Containment ring for substrate carrier apparatus |
| JP2000005988A (en) * | 1998-04-24 | 2000-01-11 | Ebara Corp | Polishing device |
| US6354907B1 (en) * | 1999-03-11 | 2002-03-12 | Ebara Corporation | Polishing apparatus including attitude controller for turntable and/or wafer carrier |
| US6705930B2 (en) | 2000-01-28 | 2004-03-16 | Lam Research Corporation | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
| KR100811172B1 (en) * | 2000-05-12 | 2008-03-10 | 멀티-플레이너 테크놀로지즈 인코포레이티드 | Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
| US6540592B1 (en) * | 2000-06-29 | 2003-04-01 | Speedfam-Ipec Corporation | Carrier head with reduced moment wear ring |
| JP3627143B2 (en) | 2000-10-23 | 2005-03-09 | 株式会社東京精密 | Wafer polishing equipment |
| JP4814677B2 (en) * | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | Substrate holding device and polishing device |
| JP5547472B2 (en) * | 2009-12-28 | 2014-07-16 | 株式会社荏原製作所 | Substrate polishing apparatus, substrate polishing method, and polishing pad surface temperature control apparatus for substrate polishing apparatus |
| JP5831974B2 (en) * | 2011-11-08 | 2015-12-16 | Ｍｉｐｏｘ株式会社 | Sheet glass having edge polished by polishing tape, and method and apparatus for polishing sheet glass edge |
| JP5976522B2 (en) * | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| US10702972B2 (en) * | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
-
2015
- 2015-05-04 TW TW104114107A patent/TWI656944B/en active
- 2015-05-05 SG SG10201503514TA patent/SG10201503514TA/en unknown
- 2015-05-05 SG SG10201802846XA patent/SG10201802846XA/en unknown
- 2015-05-11 KR KR1020150065211A patent/KR102260613B1/en active IP Right Grant
- 2015-05-12 US US14/710,535 patent/US9833875B2/en active Active
- 2015-05-13 CN CN201510242162.0A patent/CN105081961B/en active Active
-
2017
- 2017-10-31 US US15/799,582 patent/US11059144B2/en active Active
-
2021
- 2021-05-28 KR KR1020210068780A patent/KR20210066775A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN105081961A (en) | 2015-11-25 |
| US20150328743A1 (en) | 2015-11-19 |
| US11059144B2 (en) | 2021-07-13 |
| KR20150130923A (en) | 2015-11-24 |
| KR20210066775A (en) | 2021-06-07 |
| TWI656944B (en) | 2019-04-21 |
| US20180065228A1 (en) | 2018-03-08 |
| KR102260613B1 (en) | 2021-06-07 |
| TW201600234A (en) | 2016-01-01 |
| US9833875B2 (en) | 2017-12-05 |
| SG10201802846XA (en) | 2018-05-30 |
| CN105081961B (en) | 2018-12-14 |
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