SG11201702302QA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG11201702302QA
SG11201702302QA SG11201702302QA SG11201702302QA SG11201702302QA SG 11201702302Q A SG11201702302Q A SG 11201702302QA SG 11201702302Q A SG11201702302Q A SG 11201702302QA SG 11201702302Q A SG11201702302Q A SG 11201702302QA SG 11201702302Q A SG11201702302Q A SG 11201702302QA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
polishing
Prior art date
Application number
SG11201702302QA
Inventor
Junichi Ueno
Michito Sato
Kaoru Ishii
Hiromi Kishida
Yosuke Kanai
Yuya Nakanishi
Original Assignee
Shinetsu Handotai Kk
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk, Fujikoshi Machinery Corp filed Critical Shinetsu Handotai Kk
Publication of SG11201702302QA publication Critical patent/SG11201702302QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG11201702302QA 2014-10-30 2015-09-24 Polishing apparatus SG11201702302QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014221600A JP6141814B2 (en) 2014-10-30 2014-10-30 Polishing equipment
PCT/JP2015/004842 WO2016067518A1 (en) 2014-10-30 2015-09-24 Polishing device

Publications (1)

Publication Number Publication Date
SG11201702302QA true SG11201702302QA (en) 2017-05-30

Family

ID=55856888

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702302QA SG11201702302QA (en) 2014-10-30 2015-09-24 Polishing apparatus

Country Status (8)

Country Link
US (1) US10414017B2 (en)
JP (1) JP6141814B2 (en)
KR (1) KR102318648B1 (en)
CN (1) CN107107308B (en)
DE (1) DE112015004589T5 (en)
SG (1) SG11201702302QA (en)
TW (1) TWI633972B (en)
WO (1) WO2016067518A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
JP7305178B2 (en) * 2019-09-19 2023-07-10 株式会社ブイ・テクノロジー Polishing equipment
JP7406980B2 (en) * 2019-12-24 2023-12-28 株式会社荏原製作所 Polishing unit, substrate processing equipment, and polishing method
CN111805410A (en) * 2020-06-01 2020-10-23 长江存储科技有限责任公司 Grinding system
US20220126418A1 (en) * 2020-10-26 2022-04-28 Illinois Tool Works Inc. Grinding/polishing systems and methods having proximity sensors
CN112692721B (en) * 2020-12-23 2022-07-05 华虹半导体(无锡)有限公司 Wafer positioning device and scratch tracking method for CMP (chemical mechanical polishing) process
CN113579989B (en) * 2021-08-13 2024-01-26 西安奕斯伟材料科技股份有限公司 Slip sheet detection device and polishing system

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733171A (en) * 1996-07-18 1998-03-31 Speedfam Corporation Apparatus for the in-process detection of workpieces in a CMP environment
JP2716653B2 (en) 1993-11-01 1998-02-18 不二越機械工業株式会社 Wafer polishing apparatus and polishing method
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
JPH08247721A (en) * 1995-03-15 1996-09-27 Omron Corp Dimension measuring instrument
US20010012108A1 (en) * 1996-07-26 2001-08-09 Paul Holzapfel Methods and apparatus for the in-process measurement of thin film layers
JP3761673B2 (en) * 1997-06-17 2006-03-29 株式会社荏原製作所 Polishing device
US6045434A (en) * 1997-11-10 2000-04-04 International Business Machines Corporation Method and apparatus of monitoring polishing pad wear during processing
JP2000127033A (en) 1998-10-27 2000-05-09 Speedfam-Ipec Co Ltd Polishing device
JP2001096455A (en) * 1999-09-28 2001-04-10 Ebara Corp Polishing device
JP2001133217A (en) * 1999-11-05 2001-05-18 Keyence Corp Optical displacement gauge
JP2003059876A (en) * 2001-08-16 2003-02-28 Ebara Corp Device and method for detecting object and polishing the device
DE10314212B4 (en) 2002-03-29 2010-06-02 Hoya Corp. Method for producing a mask blank, method for producing a transfer mask
JP2006011434A (en) * 2002-03-29 2006-01-12 Hoya Corp Manufacturing method for mask blank substrate, mask blank and transfer mask
CN100387396C (en) * 2004-04-01 2008-05-14 上海宏力半导体制造有限公司 Sliding-vane detecting method for chemical-mechanical grinder platform
JP2008093811A (en) 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd Polishing head and polishing device
JP5491273B2 (en) * 2010-05-11 2014-05-14 ダイトエレクトロン株式会社 Wafer chamfering device
US9862070B2 (en) * 2011-11-16 2018-01-09 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement
CN103831710B (en) * 2012-11-27 2017-07-25 盛美半导体设备（上海）有限公司 Grinding head with wafer detecting apparatus

Also Published As

Publication number Publication date
TWI633972B (en) 2018-09-01
CN107107308B (en) 2020-04-24
TW201627103A (en) 2016-08-01
WO2016067518A1 (en) 2016-05-06
JP6141814B2 (en) 2017-06-07
KR102318648B1 (en) 2021-10-28
DE112015004589T5 (en) 2017-08-31
KR20170076664A (en) 2017-07-04
US10414017B2 (en) 2019-09-17
US20170304986A1 (en) 2017-10-26
JP2016087713A (en) 2016-05-23
CN107107308A (en) 2017-08-29

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