SG11201606347XA - Deposition apparatus - Google Patents

Deposition apparatus

Info

Publication number
SG11201606347XA
SG11201606347XA SG11201606347XA SG11201606347XA SG11201606347XA SG 11201606347X A SG11201606347X A SG 11201606347XA SG 11201606347X A SG11201606347X A SG 11201606347XA SG 11201606347X A SG11201606347X A SG 11201606347XA SG 11201606347X A SG11201606347X A SG 11201606347XA
Authority
SG
Singapore
Prior art keywords
deposition apparatus
deposition
Prior art date
Application number
SG11201606347XA
Inventor
Masahiro Atsumi
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Publication of SG11201606347XA publication Critical patent/SG11201606347XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8408—Processes or apparatus specially adapted for manufacturing record carriers protecting the magnetic layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J27/00—Ion beam tubes
    • H01J27/02—Ion sources; Ion guns
    • H01J27/08—Ion sources; Ion guns using arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H01J37/32064—Circuits specially adapted for controlling the arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32614—Consumable cathodes for arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32944—Arc detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
SG11201606347XA 2014-03-18 2014-11-14 Deposition apparatus SG11201606347XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014055570 2014-03-18
PCT/JP2014/005736 WO2015140858A1 (en) 2014-03-18 2014-11-14 Film formation device

Publications (1)

Publication Number Publication Date
SG11201606347XA true SG11201606347XA (en) 2016-09-29

Family

ID=54143884

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201606347XA SG11201606347XA (en) 2014-03-18 2014-11-14 Deposition apparatus

Country Status (7)

Country Link
US (3) US10676813B2 (en)
JP (1) JP6126302B2 (en)
KR (1) KR101862967B1 (en)
CN (2) CN106029941B (en)
SG (1) SG11201606347XA (en)
TW (1) TWI593818B (en)
WO (1) WO2015140858A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106029941B (en) * 2014-03-18 2019-06-18 佳能安内华股份有限公司 Precipitation equipment
JP6205441B2 (en) * 2016-01-26 2017-09-27 株式会社神戸製鋼所 Arc evaporator
JP6350603B2 (en) * 2016-07-07 2018-07-04 トヨタ自動車株式会社 Arc discharge generator and film forming method
CN111542645B (en) * 2017-12-27 2022-07-26 佳能安内华股份有限公司 Film forming method and film forming apparatus

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS517866A (en) 1974-06-26 1976-01-22 Hitachi Ltd SAIRISUTAKUDOHOSHIKI
JPH0517866A (en) * 1991-07-11 1993-01-26 Nissin Electric Co Ltd Arc type evaporating source
GB9503305D0 (en) 1995-02-20 1995-04-12 Univ Nanyang Filtered cathodic arc source
JP3732250B2 (en) 1995-03-30 2006-01-05 キヤノンアネルバ株式会社 In-line deposition system
DE19618073C1 (en) * 1996-05-06 1997-09-18 Inovap Vakuum Und Plasmatechni Ignition unit for a vacuum arc discharge evaporator
US5896012A (en) * 1997-08-08 1999-04-20 Kabushiki Kaisha Kobe Seiko Sho Metal ion plasma generator having magnetic field forming device located such that a triggering is between the magnetic field forming device and an anode
JPH11350115A (en) * 1998-06-12 1999-12-21 Ulvac Corp Vapor deposition apparatus using coaxial vacuum arc vapor deposition source
JP2004162084A (en) 2002-11-11 2004-06-10 Fujitsu Ltd Film deposition method, and film deposition system
JP3823914B2 (en) * 2002-11-20 2006-09-20 日新電機株式会社 Evaporation source apparatus and vacuum arc deposition apparatus for vacuum arc deposition
CN2585870Y (en) * 2002-12-24 2003-11-12 中国科学院物理研究所 Appts. for preparing large thin fiml by adopting arc for heating target material
JP4269263B2 (en) * 2003-07-01 2009-05-27 富士電機デバイステクノロジー株式会社 Method and apparatus for forming hard carbon film
JP2005029855A (en) * 2003-07-08 2005-02-03 Fuji Electric Device Technology Co Ltd Vacuum arc deposition system, vacuum arc deposition method, and magnetic recording medium
JP4110175B2 (en) * 2006-03-22 2008-07-02 株式会社神戸製鋼所 Arc ion plating method
JP2008050653A (en) * 2006-08-24 2008-03-06 Shimadzu Corp Film deposition apparatus and film deposition method
JP5063143B2 (en) * 2007-03-02 2012-10-31 株式会社リケン Arc type evaporation source
JP4633816B2 (en) 2008-03-31 2011-02-16 株式会社フェローテック Target exchange type plasma generator
JP5280459B2 (en) 2008-12-25 2013-09-04 キヤノンアネルバ株式会社 Sputtering equipment
TWI379916B (en) * 2009-02-24 2012-12-21 Ind Tech Res Inst Vacuum coating device and coating method
JP4576476B1 (en) * 2009-12-28 2010-11-10 株式会社フェローテック Striker-type plasma generator and plasma processing apparatus
CN101792895B (en) * 2010-03-25 2012-07-25 中国科学院宁波材料技术与工程研究所 Cathodic vacuum arc source film depositing device and method for depositing film
WO2013099059A1 (en) * 2011-12-28 2013-07-04 キヤノンアネルバ株式会社 Film-forming device
WO2013099058A1 (en) * 2011-12-28 2013-07-04 キヤノンアネルバ株式会社 Film-forming device
CN106029941B (en) * 2014-03-18 2019-06-18 佳能安内华股份有限公司 Precipitation equipment
JP6403269B2 (en) * 2014-07-30 2018-10-10 株式会社神戸製鋼所 Arc evaporation source
CN111542645B (en) * 2017-12-27 2022-07-26 佳能安内华股份有限公司 Film forming method and film forming apparatus

Also Published As

Publication number Publication date
US10676813B2 (en) 2020-06-09
CN106029941B (en) 2019-06-18
KR101862967B1 (en) 2018-07-04
US20160326630A1 (en) 2016-11-10
JP6126302B2 (en) 2017-05-10
KR20160132969A (en) 2016-11-21
TW201536942A (en) 2015-10-01
WO2015140858A1 (en) 2015-09-24
CN110158038B (en) 2022-01-18
US11821067B2 (en) 2023-11-21
TWI593818B (en) 2017-08-01
US20240052477A1 (en) 2024-02-15
US20200255933A1 (en) 2020-08-13
JPWO2015140858A1 (en) 2017-04-06
CN106029941A (en) 2016-10-12
CN110158038A (en) 2019-08-23

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