SG10201500361UA - Substrate holding apparatus and polishing apparatus - Google Patents
Substrate holding apparatus and polishing apparatusInfo
- Publication number
- SG10201500361UA SG10201500361UA SG10201500361UA SG10201500361UA SG10201500361UA SG 10201500361U A SG10201500361U A SG 10201500361UA SG 10201500361U A SG10201500361U A SG 10201500361UA SG 10201500361U A SG10201500361U A SG 10201500361UA SG 10201500361U A SG10201500361U A SG 10201500361UA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate holding
- polishing
- polishing apparatus
- holding apparatus
- substrate
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014008286A JP6232297B2 (en) | 2014-01-21 | 2014-01-21 | Substrate holding device and polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201500361UA true SG10201500361UA (en) | 2015-08-28 |
Family
ID=53543981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201500361UA SG10201500361UA (en) | 2014-01-21 | 2015-01-16 | Substrate holding apparatus and polishing apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9550271B2 (en) |
| JP (1) | JP6232297B2 (en) |
| KR (1) | KR101849824B1 (en) |
| CN (1) | CN104786139B (en) |
| SG (1) | SG10201500361UA (en) |
| TW (1) | TWI630068B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI674171B (en) * | 2012-01-31 | 2019-10-11 | 日商荏原製作所股份有限公司 | Substrate holding device, polishing device, and polishing method |
| KR102424495B1 (en) * | 2015-11-09 | 2022-07-26 | 주식회사 케이씨텍 | Carrier head of chemical mechanical apparatus |
| CN107756246A (en) * | 2016-08-18 | 2018-03-06 | 宝山钢铁股份有限公司 | A kind of pressing device and its application method for polished machine sample |
| KR102644392B1 (en) * | 2018-05-15 | 2024-03-08 | 주식회사 케이씨텍 | Carrier for substrate and chemical mechanical polishing apparatus comprising the same |
| CN108807258B (en) * | 2018-06-05 | 2020-12-18 | 日照亿铭科技服务有限公司 | Semiconductor chip production process |
| KR102627543B1 (en) * | 2018-11-07 | 2024-01-24 | 주식회사 케이씨텍 | Carrier for substrate and chemical mechanical polishing apparatus comprising the same |
| KR102195920B1 (en) * | 2018-11-30 | 2020-12-29 | 세메스 주식회사 | Apparatus for treating substrate |
| CN111244021B (en) * | 2020-01-16 | 2022-12-09 | 北京北方华创微电子装备有限公司 | Chuck base and semiconductor processing equipment |
| CN115106927A (en) * | 2022-06-28 | 2022-09-27 | 东莞市盈鑫半导体材料有限公司 | Negative pressure heat laminating process for wax-free polishing adsorption pad |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6358121B1 (en) * | 1999-07-09 | 2002-03-19 | Applied Materials, Inc. | Carrier head with a flexible membrane and an edge load ring |
| CN100433269C (en) | 2000-05-12 | 2008-11-12 | 多平面技术公司 | Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same |
| US6848980B2 (en) * | 2001-10-10 | 2005-02-01 | Applied Materials, Inc. | Vibration damping in a carrier head |
| US7255637B2 (en) * | 2000-09-08 | 2007-08-14 | Applied Materials, Inc. | Carrier head vibration damping |
| JP3970561B2 (en) * | 2001-07-10 | 2007-09-05 | 株式会社荏原製作所 | Substrate holding device and substrate polishing device |
| JP3875528B2 (en) * | 2001-09-18 | 2007-01-31 | 株式会社荏原製作所 | Polishing equipment |
| TWI301642B (en) * | 2002-04-16 | 2008-10-01 | Applied Materials Inc | Vibration damping in a carrier head |
| JP4448297B2 (en) * | 2002-12-27 | 2010-04-07 | 株式会社荏原製作所 | Substrate polishing apparatus and substrate polishing method |
| US7575504B2 (en) * | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
| JP5464820B2 (en) * | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | Polishing equipment |
| JP5199691B2 (en) | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | Polishing equipment |
| JP5964064B2 (en) * | 2012-01-31 | 2016-08-03 | 株式会社荏原製作所 | Substrate holding apparatus, polishing apparatus, and polishing method |
| JP5922965B2 (en) | 2012-03-29 | 2016-05-24 | 株式会社荏原製作所 | Substrate holding apparatus, polishing apparatus, and polishing method |
| TWI674171B (en) * | 2012-01-31 | 2019-10-11 | 日商荏原製作所股份有限公司 | Substrate holding device, polishing device, and polishing method |
| JP5976522B2 (en) | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
-
2014
- 2014-01-21 JP JP2014008286A patent/JP6232297B2/en active Active
-
2015
- 2015-01-16 SG SG10201500361UA patent/SG10201500361UA/en unknown
- 2015-01-16 KR KR1020150007927A patent/KR101849824B1/en active IP Right Grant
- 2015-01-19 US US14/599,976 patent/US9550271B2/en active Active
- 2015-01-19 TW TW104101638A patent/TWI630068B/en active
- 2015-01-20 CN CN201510027839.9A patent/CN104786139B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20150202733A1 (en) | 2015-07-23 |
| US9550271B2 (en) | 2017-01-24 |
| KR101849824B1 (en) | 2018-04-17 |
| CN104786139B (en) | 2018-12-14 |
| TW201529226A (en) | 2015-08-01 |
| TWI630068B (en) | 2018-07-21 |
| KR20150087117A (en) | 2015-07-29 |
| JP6232297B2 (en) | 2017-11-15 |
| CN104786139A (en) | 2015-07-22 |
| JP2015136737A (en) | 2015-07-30 |
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