1301642 玖、發明說明： 【發明所屬之技術領域】 本發明廣義上關於化學機械研磨系統與製程。 ， 【先前技術】 積體電路通常是藉由持續沉積導體、半導體或絕緣層 而形成在基材（特別是矽晶圓）上。隨著持續沉積與蝕刻一 系列層面後’基材最外或最上之表面逐漸變成不平坦。此 0 不平坦表面在積體電路製造過程之微影蝕刻步驟中會呈現 問題。明確言之，如果不平坦表面之峰與谷間之最大高度 差超過該備之焦點深度，該光微影蝕刻設備可能無法將 光影像聚焦在光阻層上。因此，需求能定時平坦化該基材 表面。 化學機械研磨（CMP)係可接受之平坦化方法中之一。 化學機械研磨方法通常需要在一含有化學反應劍之研磨漿 中機械性地磨擦該基材。在一典型之研磨操作中，基材是 由一承載頭夾持而壓向一旋轉中之研磨墊。該承載頭也可 φ 相對研磨墊而旋轉與移動該基材。該動作之結果使介於該 該承載頭與該研磨墊間之研磨料（其可嵌入研磨墊中或包 含在研磨漿），會藉由磨擦該表面而平坦化該不平坦之基材 表面。 研磨過程產生之振動可能會減低平坦化之品質或損壞 ' 研磨設備。此外，振動可發生過大之聲響。 ， 1301642 【發明 在 面上的 襯组件 旋轉之 的吸收 之振動 本 包括一 背襯組 座、一 或一位 套且該 套可允 該 該背襯 開。該 中至少 該平衡 縮環所 殼體， 該 内。該 該伸縮 内容】 一特點中，本發明是指用於將一基材定位在一研磨 一承載頭。該承載頭包括一具有一基材支撐面之背 、一可連接至一驅動軸以便隨該驅動軸繞一旋轉軸 设體，及一位於該背襯組件與殼體間之負荷路徑上 材料。該吸收材料減低從該背襯組件傳遞至該殼體 ό 發明之實施可包括下列一或多數特色。該承載頭可 介於該背襯組件與該殼體間之平衡機構，以允許該 件相對该殼體平衡。該背襯組件可包括一硬質基 固5又至該硬質基座以界定一可加壓腔之彈性薄膜， 於該基座底面上之可壓縮薄膜。該殼體可提供一襯 平衡機構可包括一延伸進入該襯套之平衡桿，該襯 許該平衡桿垂直移動，同時避免該平衡桿橫向移動。 平衡機構可包括一耦合至該殼體之頂部、一耦合至 、、且件之底部’且該吸收材料可將該頂部與底部隔 吸收材料可使用—壓敏黏著劑裝設在該頂部與底部 之上。該吸收材料可大體上形成一圓環狀本體。 機構可包括一實質上平面之伸縮環，可在垂直該伸 在平面之希：* + , S 1方向伸縮，以便將背襯組件平衡至該 而°亥吸收材料是裝設至該伸縮環。 吸收材祖 4可位於平衡機構與背襯組件間之負荷路 +衡機構可句紅 匕括一實質上平面之伸縮環，可在 環所在平面> + + 垂直方向伸縮，以便將背襯組件平衡 4 1301642 至該设體’而該吸收材料可緊接著該 包括延伸推人# n L τ如環。該伸縮環可 進入該吸收材料之複數個突出 ^ m ϋΛ- 4J. », α丨或一凸緣。 該及收材科可具有黏彈性。該吸 時可能無法回彈至盆用古#收 欠材枓當承受一變形 彈至/、原有开，狀〇例如， ^ ^ ^ ^ Q弹時吸收材料可 月匕會 > 於該變形量之百分之六。 在另一特點中，本發明指一種包 械研磨設備。 ^括該承載頭之化學機 本發明之一或多數具體實施例 β 、，π 貝也W <、、，田即將會在隨附圖式1301642 发明, INSTRUCTION DESCRIPTION: TECHNICAL FIELD OF THE INVENTION The present invention relates generally to chemical mechanical polishing systems and processes. [Prior Art] An integrated circuit is usually formed on a substrate (particularly a germanium wafer) by continuously depositing a conductor, a semiconductor or an insulating layer. With the continuous deposition and etching of a series of layers, the outermost or uppermost surface of the substrate gradually becomes uneven. This 0 uneven surface presents a problem in the lithography etching step of the integrated circuit fabrication process. Specifically, if the difference in height between the peak and the valley of the uneven surface exceeds the depth of focus of the preparation, the photolithographic etching apparatus may not be able to focus the optical image on the photoresist layer. Therefore, it is required to periodically planarize the surface of the substrate. Chemical mechanical polishing (CMP) is one of the acceptable planarization methods. Chemical mechanical polishing methods typically require mechanical abrasion of the substrate in a slurry containing a chemical reaction sword. In a typical grinding operation, the substrate is held by a carrier head and pressed against a rotating polishing pad. The carrier head can also φ rotate and move the substrate relative to the polishing pad. As a result of this action, an abrasive between the carrier head and the polishing pad (which can be embedded in the polishing pad or contained in the slurry) planarizes the surface of the uneven substrate by rubbing the surface. Vibrations generated by the grinding process may reduce the quality of flattening or damage 'grinding equipment. In addition, the vibration can be excessively loud. , 1301642 [Invented vibration of the lining assembly rotating on the surface of the lining includes a backing set, one or one sleeve and the sleeve allows the backing to be opened. At least the balance ring is the housing of the ring. The telescopic content] In one feature, the invention is used to position a substrate on a grinding-bearing head. The carrier head includes a back having a substrate support surface, a body connectable to a drive shaft for rotation about the drive shaft, and a load path between the backing assembly and the housing. The absorbent material is reduced from the backing assembly to the housing. The practice of the invention may include one or more of the following features. The carrier head can be spaced between the backing assembly and the housing to allow the member to be balanced relative to the housing. The backing assembly can include a rigid substrate 5 and the rigid base to define an elastic film of a pressurizable chamber, a compressible film on the bottom surface of the base. The housing can provide a lining balancing mechanism that can include a balance bar extending into the bushing that allows the balance bar to move vertically while avoiding lateral movement of the balance bar. The balancing mechanism can include a top coupled to the top of the housing, a coupled to, and a bottom portion of the member and the absorbent material can be used to separate the top and bottom absorbent materials - a pressure sensitive adhesive is disposed on the top and bottom Above. The absorbent material can generally form an annular body. The mechanism can include a substantially planar telescoping ring that can be telescoped in a direction perpendicular to the plane: * + , S 1 to balance the backing assembly thereto and the absorbent material is attached to the telescoping ring. The absorbent material progenitor 4 can be located between the balance mechanism and the backing assembly. The load path + balance mechanism can include a substantially planar telescopic ring that can be telescoped in the plane of the ring > + + to extend the backing assembly. Balancing 4 1301642 to the body' and the absorbing material can be followed by the extension of the person #n L τ such as a ring. The telescoping ring can enter a plurality of protrusions of the absorbing material ^ m ϋΛ - 4J. », α 丨 or a flange. The material and the closure can have viscoelastic properties. The suction time may not be able to rebound to the pot with the ancient #收收材枓 When subjected to a deformation bomb to /, the original open, such as, ^ ^ ^ ^ Q bomb when the absorbent material can be a month will be > in the deformation Six percent of the amount. In another feature, the invention is directed to an abrasive grinding apparatus. A chemical machine including the carrier head. One or most of the specific embodiments of the present invention, β, π, and also W <,,, will be in the accompanying drawings.
及以下之說明中提出。本發明 A ^ _ 之，、他特色、目的與優勢將 。由明與圖式以及中請專利範圍t明顯得知。 【實施方式】 請參考第1圖，在研磨時，一包括 〜傷了 a栝一承载頭100之化 學機械研磨（CMP)設備會夾持—基材。適用之CMP系統的 說明可在美國專利第5,738,574號中獲得，其全數揭露書 將以引用方式併入本文。 研磨時，承載頭1〇〇以一預定負荷力將基材1〇壓向一 研磨墊。同時，一馬達帶動該承載頭以旋轉該基材。此外， 一滑塊可在該研磨墊之表面上橫向振盪該承載頭丨〇〇與基 材。 該承載頭1 〇〇包括一振動吸收材料可明顯地減低在二 相鄰零件間傳遞之振動能量，據以在研磨時減低或避免振 動。大體上，該吸收材料比研磨設備之二相鄰零件（其通常 是由堅硬材料製成，如金屬）具有明顯較佳之振動吸收特 1301642 徵。該吸收材料可為一具有些許或無記憶性之黏彈性體以 提供良好之振動吸收特徵，諸如市售之隔離吸收材料 C-1002’是由位於美國伊州印地安納波里市zi〇nesville路 7911號之E A-R特殊複合材料公司（Speciaity c〇mp〇sites) 所製造。 如第1圖所示’該承載頭1〇〇包括一殼體1〇2、一基 座1〇4、一平衡機構106、一護圈u〇及一基材背襯組件 112(也可考慮包括基座1〇4)。殼體1〇2係大體上圓形且可 使用一組螺栓（未顯不）連接至驅動軸7 4。驅動軸帶動該殼 體繞一軸107轉動。延伸通過殼體1〇2以便氣動控制該承 載頭的一通道126將說明如下。殼體1〇2具有一適配於一 垂直通過該殼體之垂直内孔124的圓柱狀襯套122。 平衡機構106包括一平衡桿15〇與一伸縮環152。該 平衡柃150可適配於襯套122内，使得該桿15〇可自由地在 内孔内移動，同時襯套122可避免平衡桿15〇橫向移動。伸 縮環152可藉由一吸收材料23〇在平衡桿15〇之下端附接至 一凸緣220,以避免或減輕從伸縮環152經由平衡環22〇 傳遞至殼體102之振動能量。該吸收材料23〇是〇 〇6英吋 厚。壓敏黏著劑（未顯示）將吸收材料23〇黏接至殼體ι〇2 與伸縮環152 〇 大體上為一平面圓環之伸縮環 之基座 1 52會附接至大體上環狀And the following description is presented. The invention A ^ _, his characteristics, purposes and advantages will be. It is obvious from the scope of the Ming and the drawings and the scope of the patent. [Embodiment] Referring to Fig. 1, at the time of polishing, a chemical mechanical polishing (CMP) apparatus including a damaged carrier 100 will hold the substrate. A description of a suitable CMP system is available in U.S. Patent No. 5,738,574, the entire disclosure of which is incorporated herein by reference. During the grinding, the carrier head 1 is pressed against the polishing pad by a predetermined load. At the same time, a motor drives the carrier head to rotate the substrate. Further, a slider can laterally oscillate the carrier head and the substrate on the surface of the polishing pad. The carrier head 1 includes a vibration absorbing material that significantly reduces the vibrational energy transmitted between two adjacent parts, thereby reducing or avoiding vibration during grinding. In general, the absorbent material has a significantly better vibration absorption characteristic 1301642 than two adjacent parts of the grinding apparatus, which are typically made of a hard material, such as a metal. The absorbent material can be a viscoelastic elastomer with little or no memory to provide good vibration absorption characteristics, such as the commercially available barrier absorbent material C-1002' is located in Zi〇nesville, Indianapolis, Illinois, USA. Manufactured by EAR Special Composites, Inc., No. 7911, Speciaity c〇mp〇sites. As shown in FIG. 1 , the carrier head 1 includes a housing 1 , 2 , a base 1 , 4 , a balancing mechanism 106 , a retainer u , and a substrate backing assembly 112 (also considered Includes base 1〇4). The housing 1〇2 is generally circular and can be coupled to the drive shaft 74 using a set of bolts (not shown). The drive shaft drives the housing to rotate about a shaft 107. A passage 126 extending through the housing 1〇2 for pneumatically controlling the carrier head will be described below. The housing 1 2 has a cylindrical bushing 122 adapted to pass vertically through the vertical bore 124 of the housing. The balance mechanism 106 includes a balance bar 15A and a telescoping ring 152. The balance weir 150 can be adapted into the bushing 122 such that the rod 15〇 is free to move within the bore while the bushing 122 prevents lateral movement of the balance bar 15〇. The shrink ring 152 can be attached to a flange 220 at the lower end of the balance bar 15〇 by an absorbent material 23 to avoid or mitigate the vibrational energy transmitted from the bellows 152 to the housing 102 via the gimbal 22 . The absorbing material 23 〇 is 吋 6 inches thick. A pressure sensitive adhesive (not shown) bonds the absorbent material 23 to the housing ι2 and the telescoping ring 152. The base of the telescopic ring, which is generally a planar ring, is attached to the substantially annular ring.
平衡。平衡機構允許囍A本俺嫂 1 i 平衡機構允許藉由平衡桿15〇在内孔122 122内垂直移動 垂直方 1301642 而使基座104上下移動，同時避免該基座之任词 吸收材料230在平衡桿150之下端附接至一凸〗 避免該基座之任何橫向運動。吸收材料2 3 〇減 基座104經由平衡機構1〇6傳入殼體102之振 外夾環1 6 4將一滚動隔板1 6 〇之外緣 I 〇 4，而一内夾環1 6 2將該滾動隔板丨6 〇之内 體。因此，滾動隔板160密封由殼體1〇2、平福 平衡環220、吸收材料23〇、伸縮環152與基座 負荷腔1 0 8，而留出一開口 i 2 6以進入腔i 〇 8 126會連接至一泵（未顯示），其藉由將流體（如： 泵出腔1 08而分別降低或升高該基座。藉由控 腔1 〇8之流體壓力，該泵可將該基座以一需求 朝向該研磨表面。 濩圈110大體上是一固設於基底1〇4之圓 時，流體被泵入腔1 〇 8，據以在腔丨〇 8中產生 之壓力會施加一向下之力於基座1〇4，隨後會 向下之力於護圈110上。向下之力將護圈11〇 32 〇 背襯組件1 1 2包括一夾置於護圈丨i 〇與基 彈性隔板11 6。弹性隔板11 6的一内緣被夾置 II 4之下夾環1 7 2與一上失環丨7 4間。支撐結 支撐板1 7 0是附接於該下夾環1 7 2。該彈性隔 板170相對於基底104而在垂直方向少許移動 係大體上之碟狀硬質構件，具有複數個通過 ‘橫向移動。 缘220,同時 低或避免從 動能量。 夾置於基座 緣夾置於殼 ί機構1 0 6、 104形成之 中。該開口 έ氣）泵入或 制泵入負荷 負荷力下壓 環。當研磨 壓力。產生 轉而施加一 壓向研磨墊 底104間之, 於支撐結構 構11 4的一 板允許支撐 。支撐板170 其間之開孔 7 1301642 176(第2圖只標出一處）。支撐板170在其外緣具有—向下 之突出唇部1 7 8。balance. The balancing mechanism allows the 平衡A 俺嫂1 i balancing mechanism to allow the pedestal 104 to move up and down by vertically moving the vertical side 1301642 in the inner hole 122 122 by the balance bar 15 , while avoiding the arbitrarily absorbing material 230 of the pedestal The lower end of the balance bar 150 is attached to a projection to avoid any lateral movement of the base. The absorbing material 2 3 reduces the susceptor 104 to the outer ring of the housing 102 via the balancing mechanism 1 〇 6 , and the outer ring I 〇 4 of the rolling partition 16 6 , and the inner clamping ring 1 6 2 Align the inside of the rolling partition 丨6 。. Therefore, the rolling partition 160 is sealed by the casing 1 2, the flat balance ring 220, the absorbing material 23 〇, the bellows 152 and the pedestal load chamber 110, leaving an opening i 26 to enter the cavity i 〇 8 126 is coupled to a pump (not shown) that lowers or raises the base by pumping fluid (e.g., pumping out of chamber 108). By controlling the fluid pressure of chamber 1 〇 8, the pump can The susceptor faces the grinding surface at a demand. When the cymbal 110 is substantially fixed to the circle of the substrate 1 〇 4, the fluid is pumped into the cavity 1 〇 8 so that the pressure generated in the cavity 8 is applied. A downward force on the base 1〇4, and then a downward force on the retainer 110. The downward force will hold the retainer 11〇32 〇 the backing assembly 1 1 2 including a clip placed on the retainer 丨i 〇 And a base elastic baffle 116. An inner edge of the elastic baffle 116 is sandwiched between the lower ring 172 and the upper ring 丨7 4 . The support knot support plate 170 is attached to The lower clamping ring 172. The elastic spacer 170 is slightly moved in a vertical direction relative to the base 104 to be a substantially disk-shaped rigid member, and has a plurality of through-lateral movements. Or you avoid energy from moving. Interposed base rim interposed ί mechanism housing 106, and formed of 104. The gas opening έ) or pumped into Zhibeng load force under a load pressure ring. When grinding the pressure. The resulting application of a pressure to the polishing pad 104 is supported by a plate of the support structure 11 4 . The support plate 170 has an opening 7 1301642 176 (only one is shown in Fig. 2). The support plate 170 has a downwardly projecting lip portion 178 at its outer edge.
一彈性薄膜118延伸環繞支撐板170之該唇部178 , 且被夾置於支撐板17〇與下夾環172間，以形成—大體上 碟狀之下表面1 20。彈性薄膜係由一可彎曲或具彈性之材 料形成，諸如氯丁二烯或乙烯丙烯橡膠。或者，該彈性隔 板與彈性薄膜可結合成一單件之薄膜。介於彈性薄膜 11 8、支撐結構1 1 4、彈性隔板11 6、基座1 04與伸縮環i 5 2 間之密封容積界定了只具有一開孔250(通過平衡桿15〇) 的一腔190。一泵（未顯示）會連接至該開口 250，藉由將 流體經由開口 250泵入腔以控制腔190内之壓力，據以控 制薄膜下表面1 20作用在基材1 〇之向下壓力。 請參考第2A與2B圖，在另一實施中，平衡桿15〇, 與伸縮環1 5 2 ’是形成為一單一零件。另外，此實施並未包 括一支撐結構1 1 4或一彈性隔板11 6。而是該彈性薄膜係 直接連接至基座104。An elastic film 118 extends around the lip 178 of the support plate 170 and is sandwiched between the support plate 17 〇 and the lower clamp ring 172 to form a substantially dish-shaped lower surface 120. The elastic film is formed of a bendable or elastic material such as chloroprene or ethylene propylene rubber. Alternatively, the elastic spacer and the elastic film may be combined into a single piece of film. The sealing volume between the elastic film 181, the support structure 141, the elastic partition 116, the pedestal 104 and the telescopic ring i5 2 defines a one having only one opening 250 (through the balance bar 15 〇) Cavity 190. A pump (not shown) is coupled to the opening 250 to control the pressure within the chamber 190 by pumping fluid through the opening 250 to control the downward pressure of the lower surface of the membrane 110 on the substrate 1 . Referring to Figures 2A and 2B, in another implementation, the balance bar 15〇, and the bellows 1 5 2 ' are formed as a single piece. Additionally, this implementation does not include a support structure 112 or an elastomeric partition 116. Rather, the elastic film is attached directly to the base 104.
在此實施中，吸收材料23 〇,係置於伸縮環152，與基座 104’間。明確言之，伸縮環152，包括複數個徑向外延至基 座104’内數個槽242中之球狀突出物240。槽242中係填 充黏彈性吸收材料230,，而槽頂部會以一固設至基座1〇4, 其他部份之圓環244密閉。例如，該吸收材料可包括一介 於突出物240與基座間之底層，使得可減少從基座傳 至平衡機構106’之振動能量。 或者，可以不用個別之突出物24〇，伸縮環152，可包 8 與殼 或位 振動 傳至 在變 承受 十， 材料 特殊 何比 料。 1301642 括一徑向外延之圓環，且係陷於基座104’與圓環244 黏彈性吸收材料2 3 0，内。 以上說明本發明一些實施例。然而，應瞭解可作出 改變而不脫離本發明精神與範疇。例如，該吸收材料可 於任何.熟習此項技藝人員所知之其他種類之研磨設備 如’該研磨設備可使用一線性帶式而非一旋轉塾。該 没備可使用一標準無研磨料之研磨墊（或一固定磨料1 且可使用一具有/不具有磨料微粒之漿劑。另外，該吸 料可使用於其他型式之承載頭内。該承载頭可使用一 支標結構或基座而非一彈性薄膜，以支持該基材。一 縮承載膜可位於該硬質支撐結構之底部上。該護圈可 接觸該研磨墊。 孩振勳吸收材料也可使 體間負荷路徑上之其他位置（諸如介於護圈與 於基座本身内）。其他具有吸收特性之材料可用 ’只要其可明顯地減低或避免振動能量由材料 另一端。通常該材料可為黏彈性材料。另外， 形時不會回彈成原始形狀之吸收材料。明確言 變形時，該吸收材料應可回彈少於變形量之 雖然回彈少於變形量百分之六係較佳。例如， :為任何isodamp c_1〇〇〇系列隔絕吸收材料 稷合材料公司製造）、一黏-彈性體、一軟質塑 緊鄰該吸收材料之材料的振動吸收特徵要好之 間之 各種 使用 。例 研磨 备）， 收材 堅硬 可壓 無須 薄膜 座間 吸收 一端 選擇 ，當 分之 吸收 -A-R 或任 他材 9 1301642 吸收材料之厚度可加以變化以提供在 牧具有不同負 承載頭旋轉速度、研磨墊旋轉速度、吸收材料：可、 件下之最佳結·。一較厚之吸收材料 ：:乍條 」用以改進該振動 吸收，雖然基材與研磨塾間相對運動之控制不良，可起因 於一太厚之吸收材料。一較薄之吸收材料也可使用，儘管 如及收材料太薄，其可能無法充分減低或避免振動能量之 傳遞。 因此，其他具體實施例將落入以下專利申請範圍之範 嘴0 【圖式簡單說明】 第1圖係一承載頭之斷面圖。 第2 A圖係一替代性實施之承載頭的斷面圖。 第2 B圖係第2 A圖之承載頭的吸收材料放大圖。 各種圖式中類似之參考符號表示類似之元件。In this implementation, the absorbent material 23 is placed between the telescoping ring 152 and the base 104'. Specifically, the telescoping ring 152 includes a plurality of spherical projections 240 that are radially extended into a plurality of slots 242 in the base 104'. The groove 242 is filled with a viscoelastic absorbing material 230, and the top of the groove is sealed to the pedestal 1 〇 4, and the other portion of the ring 244 is sealed. For example, the absorbent material can include a bottom layer between the protrusions 240 and the base such that the vibrational energy transmitted from the base to the balance mechanism 106' can be reduced. Alternatively, the individual protrusions 24 〇 can be omitted, and the expansion ring 152 can be transmitted to the casing or the position of the vibration to the tenth, and the material is special. 1301642 includes a radially epitaxial ring and is trapped within the susceptor 104' and the ring 244 viscoelastic absorbing material 230. Some embodiments of the invention have been described above. However, it should be understood that changes may be made without departing from the spirit and scope of the invention. For example, the absorbent material can be any other type of abrasive device known to those skilled in the art such as 'the abrasive device can use a linear belt rather than a rotating belt. It is not possible to use a standard abrasive-free polishing pad (or a fixed abrasive 1 and a slurry with or without abrasive particles. Alternatively, the absorbent can be used in other types of carrier heads. The head may use a standard structure or base instead of an elastic film to support the substrate. A shrink-bearing film may be located on the bottom of the rigid support structure. The retainer may contact the polishing pad. Other locations on the interbody load path can also be used (such as between the retainer and the susceptor itself). Other materials with absorbing properties can be used 'as long as they can significantly reduce or avoid vibrational energy from the other end of the material. Usually The material may be a viscoelastic material. In addition, the shape does not rebound into the original shape of the absorbent material. In the case of deformation, the absorbent material should be able to rebound less than the amount of deformation, although the rebound is less than six percent of the deformation. Preferably, for example: for any isodamp c_1〇〇〇 series of absorbent absorbing materials, manufactured by the company, a visco-elastomer, a soft plastic material that absorbs the vibration of the material adjacent to the absorbent material. Use a variety of symptoms among the better. Example: Grinding preparation), the material is hard and compressible without the need to absorb the end of the film holder. When the absorption-AR or any other material 9 1301642, the thickness of the absorbent material can be varied to provide different negative carrier head rotation speed, polishing pad. Rotation speed, absorbing material: the best knot under the piece. A thicker absorbent material is used to improve the vibration absorption, although poor control of the relative motion between the substrate and the abrasive crucible can result from a too thick absorbent material. A thinner absorbing material can also be used, although if the material is too thin, it may not sufficiently reduce or avoid the transmission of vibrational energy. Therefore, other specific embodiments will fall within the scope of the following patent application. [A brief description of the drawings] Fig. 1 is a sectional view of a carrier head. Figure 2A is a cross-sectional view of an alternative implementation of the carrier head. Figure 2B is an enlarged view of the absorbent material of the carrier head of Figure 2A. Like reference symbols in the various drawings indicate similar elements.
【元件代表符號簡單說明】 10 基材 100承載頭 104基座 106平衡機構 107旋轉軸 11 0護圈 114支撐結構 32研磨塾 1 〇 2殼體 104’基座 106’平衡機構 108負荷腔 112負荷組件 116彈性隔板 10 1301642 118 彈性薄膜 120 下 表 面 122 襯套 124 内 孔 126 通道 150 平 衡 桿 150, 平衡桿 152 伸 縮 環 152, 伸縮環 160 滚 動 隔板 162 内夾環 164 外 夾 環 170 支撐板 172 下 夾 環 174 上爽壞 176 開 口 190 腔 220 平 衡 環 230 吸收材料 230, 吸收材料 240 球狀突出物 242 槽 244 圓環 250 開 口 256 下表面 11[Simplified Description of Component Symbols] 10 Substrate 100 Carrier Head 104 Base 106 Balance Mechanism 107 Rotary Shaft 11 0 Retainer 114 Support Structure 32 Grinding 塾1 〇2 Housing 104' Base 106' Balance Mechanism 108 Load Chamber 112 Load Assembly 116 Elastic spacer 10 1301642 118 Elastic film 120 Lower surface 122 Bushing 124 Inner hole 126 Channel 150 Balance bar 150, Balance bar 152 Telescopic ring 152, Telescopic ring 160 Rolling spacer 162 Inner clamping ring 164 Outer clamping ring 170 Support Plate 172 lower clamp ring 174 smooth 176 opening 190 cavity 220 balance ring 230 absorbing material 230, absorbing material 240 spherical protrusion 242 groove 244 ring 250 opening 256 lower surface 11