SG10201700888YA - Elastic membrane, substrate holding apparatus, and polishing apparatus - Google Patents

Elastic membrane, substrate holding apparatus, and polishing apparatus

Info

Publication number
SG10201700888YA
SG10201700888YA SG10201700888YA SG10201700888YA SG10201700888YA SG 10201700888Y A SG10201700888Y A SG 10201700888YA SG 10201700888Y A SG10201700888Y A SG 10201700888YA SG 10201700888Y A SG10201700888Y A SG 10201700888YA SG 10201700888Y A SG10201700888Y A SG 10201700888YA
Authority
SG
Singapore
Prior art keywords
substrate holding
elastic membrane
polishing apparatus
polishing
holding apparatus
Prior art date
Application number
SG10201700888YA
Inventor
Makoto Fukushima
Hozumi Yasuda
Keisuke Namiki
Osamu Nabeya
Shingo Togashi
Satoru Yamaki
Shintaro Isono
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201700888YA publication Critical patent/SG10201700888YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
SG10201700888YA 2014-03-27 2015-03-24 Elastic membrane, substrate holding apparatus, and polishing apparatus SG10201700888YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014066999 2014-03-27

Publications (1)

Publication Number Publication Date
SG10201700888YA true SG10201700888YA (en) 2017-03-30

Family

ID=54158041

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201700888YA SG10201700888YA (en) 2014-03-27 2015-03-24 Elastic membrane, substrate holding apparatus, and polishing apparatus
SG10201502293TA SG10201502293TA (en) 2014-03-27 2015-03-24 Elastic membrane, substrate holding apparatus, and polishing apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201502293TA SG10201502293TA (en) 2014-03-27 2015-03-24 Elastic membrane, substrate holding apparatus, and polishing apparatus

Country Status (6)

Country Link
US (2) US9573244B2 (en)
JP (2) JP6165795B2 (en)
KR (2) KR101819792B1 (en)
CN (2) CN109093507B (en)
SG (2) SG10201700888YA (en)
TW (2) TWI628043B (en)

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JP6383152B2 (en) * 2014-01-10 2018-08-29 平田機工株式会社 Transfer method, holding device and transfer system
JP6165795B2 (en) * 2014-03-27 2017-07-19 株式会社荏原製作所 Elastic film, substrate holding device, and polishing device
TWI730044B (en) * 2016-03-15 2021-06-11 日商荏原製作所股份有限公司 Substrate grinding method, top ring and substrate grinding device
JP7157521B2 (en) * 2016-03-15 2022-10-20 株式会社荏原製作所 Substrate polishing method, top ring and substrate polishing apparatus
WO2017171262A1 (en) * 2016-04-01 2017-10-05 강준모 Carrier head for chemical-mechanical polishing apparatus comprising substrate receiving member
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
CN107813220A (en) * 2016-09-13 2018-03-20 清华大学 Pressure-loaded film
JP6833591B2 (en) 2016-10-28 2021-02-24 株式会社荏原製作所 Substrate holding device, elastic film, polishing device, and how to replace the elastic film
US11179823B2 (en) 2016-10-28 2021-11-23 Ebara Corporation Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane
KR102498118B1 (en) 2017-04-12 2023-02-09 가부시키가이샤 에바라 세이사꾸쇼 Elastic membrane, substrate holding device, and polishing apparatus
JP7141222B2 (en) * 2017-04-12 2022-09-22 株式会社荏原製作所 ELASTIC MEMBRANE, SUBSTRATE HOLDING DEVICE, AND POLISHING APPARATUS
TWI673786B (en) * 2017-08-25 2019-10-01 台灣積體電路製造股份有限公司 Chemical mechanical polishing apparatus and method of manufacturing semiconductor device
CN109420968B (en) * 2017-08-25 2022-04-05 台湾积体电路制造股份有限公司 Chemical mechanical polishing apparatus and method for manufacturing semiconductor device
KR102052878B1 (en) * 2017-12-01 2019-12-10 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
USD918161S1 (en) 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
CN108188865B (en) * 2018-03-16 2020-01-10 中国工程物理研究院激光聚变研究中心 Laser crystal polishing device
CN108161702B (en) * 2018-03-16 2019-09-06 中国工程物理研究院激光聚变研究中心 A kind of polishing machine
KR102121728B1 (en) * 2018-05-03 2020-06-12 주식회사 케이씨텍 Retaining ring and carrier head comprising the same
KR20200016175A (en) * 2018-08-06 2020-02-14 가부시키가이샤 에바라 세이사꾸쇼 Substrate holding apparatus, substrate adsorption measuring method, substrate polishing apparatus, substrate polishing method, method for removing liquid from top of polishing substrate, elastic membrane for pressing wafer to polishing pad, substrate release method and quantitative gas supply apparatus
JP7158223B2 (en) 2018-09-20 2022-10-21 株式会社荏原製作所 Polishing head and polishing equipment
KR102629679B1 (en) * 2018-11-09 2024-01-29 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
KR102637833B1 (en) * 2018-11-09 2024-02-19 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
KR102637832B1 (en) * 2018-11-09 2024-02-19 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
JP7300297B2 (en) * 2019-04-02 2023-06-29 株式会社荏原製作所 LAMINATED MEMBRANE, SUBSTRATE HOLDING DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING LAMINATED MEMBRANE
US11325223B2 (en) * 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
SG10202008012WA (en) * 2019-08-29 2021-03-30 Ebara Corp Elastic membrane and substrate holding apparatus
CN112792728B (en) * 2021-02-03 2022-11-22 华海清科股份有限公司 Flexible membrane for chemical mechanical polishing, bearing head and polishing equipment

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US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6857945B1 (en) 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
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JP6165795B2 (en) * 2014-03-27 2017-07-19 株式会社荏原製作所 Elastic film, substrate holding device, and polishing device
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Also Published As

Publication number Publication date
TW201808531A (en) 2018-03-16
KR20180006483A (en) 2018-01-17
JP2017164901A (en) 2017-09-21
CN109093507A (en) 2018-12-28
JP6480510B2 (en) 2019-03-13
SG10201502293TA (en) 2015-10-29
TW201536475A (en) 2015-10-01
CN104942704A (en) 2015-09-30
TWI628043B (en) 2018-07-01
US9573244B2 (en) 2017-02-21
KR20150112837A (en) 2015-10-07
US20170144267A1 (en) 2017-05-25
US10213896B2 (en) 2019-02-26
JP6165795B2 (en) 2017-07-19
US20150273657A1 (en) 2015-10-01
CN109093507B (en) 2021-08-03
TWI589396B (en) 2017-07-01
KR101996747B1 (en) 2019-07-04
JP2015193070A (en) 2015-11-05
CN104942704B (en) 2018-10-02
KR101819792B1 (en) 2018-01-17

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