SG10202111430WA - Elastic membrane, substrate holding device, and polishing apparatus - Google Patents

Elastic membrane, substrate holding device, and polishing apparatus

Info

Publication number
SG10202111430WA
SG10202111430WA SG10202111430WA SG10202111430WA SG10202111430WA SG 10202111430W A SG10202111430W A SG 10202111430WA SG 10202111430W A SG10202111430W A SG 10202111430WA SG 10202111430W A SG10202111430W A SG 10202111430WA SG 10202111430W A SG10202111430W A SG 10202111430WA
Authority
SG
Singapore
Prior art keywords
holding device
substrate holding
polishing apparatus
elastic membrane
membrane
Prior art date
Application number
SG10202111430WA
Inventor
Satoru Yamaki
Makoto Fukushima
Keisuke Namiki
Osamu Nabeya
Shingo Togashi
Tomoko Owada
Yoshikazu Kato
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2018042410A external-priority patent/JP7141222B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202111430WA publication Critical patent/SG10202111430WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10202111430WA 2017-04-12 2018-04-11 Elastic membrane, substrate holding device, and polishing apparatus SG10202111430WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017078933 2017-04-12
JP2018042410A JP7141222B2 (en) 2017-04-12 2018-03-08 ELASTIC MEMBRANE, SUBSTRATE HOLDING DEVICE, AND POLISHING APPARATUS

Publications (1)

Publication Number Publication Date
SG10202111430WA true SG10202111430WA (en) 2021-11-29

Family

ID=63790273

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202111430WA SG10202111430WA (en) 2017-04-12 2018-04-11 Elastic membrane, substrate holding device, and polishing apparatus

Country Status (3)

Country Link
US (2) US11088011B2 (en)
KR (1) KR102498118B1 (en)
SG (1) SG10202111430WA (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102091418B1 (en) * 2018-06-01 2020-04-23 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
KR102629679B1 (en) * 2018-11-09 2024-01-29 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
KR102637832B1 (en) * 2018-11-09 2024-02-19 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
KR102637833B1 (en) * 2018-11-09 2024-02-19 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
KR102288733B1 (en) * 2019-09-25 2021-08-11 (주)에스티아이 Substrate processing apparatus
US11565367B2 (en) * 2020-07-09 2023-01-31 Applied Materials, Inc. Retaining ring
USD989012S1 (en) 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
CN115609468A (en) * 2022-11-22 2023-01-17 苏州江锦自动化科技有限公司 Wafer grinding equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165058A (en) * 1998-12-09 2000-12-26 Applied Materials, Inc. Carrier head for chemical mechanical polishing
KR100916829B1 (en) * 2003-02-10 2009-09-14 가부시키가이샤 에바라 세이사꾸쇼 Elastic membrane
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
TWI628043B (en) 2014-03-27 2018-07-01 日商荏原製作所股份有限公司 Elastic membrane, substrate holding apparatus, and polishing apparatus
KR101583815B1 (en) 2014-12-22 2016-01-11 주식회사 케이씨텍 Membrane in carrier head for chemical mechanical polishing apparatus
KR101673140B1 (en) 2014-12-22 2016-11-08 주식회사 케이씨텍 Membrane in carrier head for chemical mechanical polishing apparatus

Also Published As

Publication number Publication date
KR20180115226A (en) 2018-10-22
US11088011B2 (en) 2021-08-10
US20180301367A1 (en) 2018-10-18
KR102498118B1 (en) 2023-02-09
US20210335650A1 (en) 2021-10-28

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