SG10201706464YA - Dressing device, polishing apparatus, holder, housing and dressing method - Google Patents

Dressing device, polishing apparatus, holder, housing and dressing method

Info

Publication number
SG10201706464YA
SG10201706464YA SG10201706464YA SG10201706464YA SG10201706464YA SG 10201706464Y A SG10201706464Y A SG 10201706464YA SG 10201706464Y A SG10201706464Y A SG 10201706464YA SG 10201706464Y A SG10201706464Y A SG 10201706464YA SG 10201706464Y A SG10201706464Y A SG 10201706464YA
Authority
SG
Singapore
Prior art keywords
dressing
holder
housing
polishing apparatus
dressing device
Prior art date
Application number
SG10201706464YA
Inventor
Hiroyuki Shinozaki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201706464YA publication Critical patent/SG10201706464YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201706464YA 2016-08-12 2017-08-08 Dressing device, polishing apparatus, holder, housing and dressing method SG10201706464YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016158456A JP6842859B2 (en) 2016-08-12 2016-08-12 Dressing equipment, polishing equipment, holders, housings and dressing methods

Publications (1)

Publication Number Publication Date
SG10201706464YA true SG10201706464YA (en) 2018-03-28

Family

ID=61159270

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201706464YA SG10201706464YA (en) 2016-08-12 2017-08-08 Dressing device, polishing apparatus, holder, housing and dressing method

Country Status (3)

Country Link
US (2) US10636665B2 (en)
JP (1) JP6842859B2 (en)
SG (1) SG10201706464YA (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6842859B2 (en) 2016-08-12 2021-03-17 株式会社荏原製作所 Dressing equipment, polishing equipment, holders, housings and dressing methods
KR102624639B1 (en) * 2021-10-12 2024-01-15 에스케이실트론 주식회사 Cleaning apparatus for wafer polishing pad

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* Cited by examiner, † Cited by third party
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US5885137A (en) * 1997-06-27 1999-03-23 Siemens Aktiengesellschaft Chemical mechanical polishing pad conditioner
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JP3797861B2 (en) * 2000-09-27 2006-07-19 株式会社荏原製作所 Polishing device
US6508697B1 (en) * 2001-07-16 2003-01-21 Robert Lyle Benner Polishing pad conditioning system
JP2003251568A (en) * 2002-02-28 2003-09-09 Sanwa Kenma Kogyo Kk Grinding wheel
US7052371B2 (en) * 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
US7544113B1 (en) * 2003-05-29 2009-06-09 Tbw Industries, Inc. Apparatus for controlling the forces applied to a vacuum-assisted pad conditioning system
US7040967B2 (en) * 2004-01-26 2006-05-09 Tbw Industries Inc. Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization
WO2005072332A2 (en) * 2004-01-26 2005-08-11 Tbw Industries, Inc. Chemical mechanical planarization process control utilizing in-situ conditioning process
KR101044739B1 (en) 2004-11-01 2011-06-28 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus and polishing method
WO2007008822A2 (en) * 2005-07-09 2007-01-18 Tbw Industries Inc. Enhanced end effector arm arrangement for cmp pad conditioning
US20070087672A1 (en) * 2005-10-19 2007-04-19 Tbw Industries, Inc. Apertured conditioning brush for chemical mechanical planarization systems
WO2007108315A1 (en) * 2006-03-22 2007-09-27 Ebara Corporation Substrate processing apparatus and substrate processing method
CA2671055A1 (en) * 2006-12-15 2008-06-26 Tbw Industries, Inc. Abrasive configuration for fluid dynamic removal of abraded material and the like
JP4803167B2 (en) * 2007-12-10 2011-10-26 ヤマハ株式会社 Polishing equipment
KR101958874B1 (en) * 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
JP5415735B2 (en) * 2008-09-26 2014-02-12 株式会社荏原製作所 Dressing method, dressing condition determining method, dressing condition determining program, and polishing apparatus
JP5306065B2 (en) * 2009-06-04 2013-10-02 株式会社荏原製作所 Dressing apparatus and dressing method
US20110177623A1 (en) * 2010-01-15 2011-07-21 Confluense Llc Active Tribology Management of CMP Polishing Material
CN101972988B (en) * 2010-06-28 2012-05-16 清华大学 Trimming head for polishing pad
TW201303754A (en) * 2011-07-04 2013-01-16 Mitac Int Corp Taxi-calling service management system and server and device thereof
USD722331S1 (en) * 2012-09-26 2015-02-10 Ebara Corporation Dressing pellet for dresser disk
USD743456S1 (en) * 2012-09-26 2015-11-17 Ebara Corporation Dresser disk
TWD160526S (en) * 2012-09-26 2014-05-11 荏原製作所股份有限公司 Dressing pellet for dresser disk
USD737873S1 (en) * 2012-09-26 2015-09-01 Ebara Corporation Dresser disk
JP5919157B2 (en) * 2012-10-01 2016-05-18 株式会社荏原製作所 dresser
JP5996382B2 (en) * 2012-11-06 2016-09-21 株式会社ディスコ Chuck table of cutting equipment
USD743455S1 (en) * 2013-03-26 2015-11-17 Ebara Corporation Dresser disk
JP6254383B2 (en) * 2013-08-29 2017-12-27 株式会社荏原製作所 Dressing apparatus, chemical mechanical polishing apparatus including the dressing apparatus, and dresser disk used therefor
CN106256016B (en) * 2014-04-18 2020-06-23 株式会社荏原制作所 Substrate processing apparatus and substrate processing system
US10576604B2 (en) * 2014-04-30 2020-03-03 Ebara Corporation Substrate polishing apparatus
JP1524299S (en) * 2014-05-15 2015-05-25
JP6367614B2 (en) * 2014-06-09 2018-08-01 株式会社ディスコ Grinding wheel manufacturing method
JP2016119368A (en) * 2014-12-19 2016-06-30 株式会社荏原製作所 Conditioning device, buff processing unit, substrate processing apparatus, dresser, and conditioning method
US9700988B2 (en) 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus
US9539699B2 (en) * 2014-08-28 2017-01-10 Ebara Corporation Polishing method
JP6842859B2 (en) * 2016-08-12 2021-03-17 株式会社荏原製作所 Dressing equipment, polishing equipment, holders, housings and dressing methods

Also Published As

Publication number Publication date
US20200219728A1 (en) 2020-07-09
JP2018024067A (en) 2018-02-15
JP6842859B2 (en) 2021-03-17
US20180047572A1 (en) 2018-02-15
US10636665B2 (en) 2020-04-28
US10777417B2 (en) 2020-09-15

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