SG10201706464YA - Dressing device, polishing apparatus, holder, housing and dressing method - Google Patents
Dressing device, polishing apparatus, holder, housing and dressing methodInfo
- Publication number
- SG10201706464YA SG10201706464YA SG10201706464YA SG10201706464YA SG10201706464YA SG 10201706464Y A SG10201706464Y A SG 10201706464YA SG 10201706464Y A SG10201706464Y A SG 10201706464YA SG 10201706464Y A SG10201706464Y A SG 10201706464YA SG 10201706464Y A SG10201706464Y A SG 10201706464YA
- Authority
- SG
- Singapore
- Prior art keywords
- dressing
- holder
- housing
- polishing apparatus
- dressing device
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016158456A JP6842859B2 (en) | 2016-08-12 | 2016-08-12 | Dressing equipment, polishing equipment, holders, housings and dressing methods |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201706464YA true SG10201706464YA (en) | 2018-03-28 |
Family
ID=61159270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201706464YA SG10201706464YA (en) | 2016-08-12 | 2017-08-08 | Dressing device, polishing apparatus, holder, housing and dressing method |
Country Status (3)
Country | Link |
---|---|
US (2) | US10636665B2 (en) |
JP (1) | JP6842859B2 (en) |
SG (1) | SG10201706464YA (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6842859B2 (en) | 2016-08-12 | 2021-03-17 | 株式会社荏原製作所 | Dressing equipment, polishing equipment, holders, housings and dressing methods |
CN111482891A (en) * | 2020-04-20 | 2020-08-04 | 北京烁科精微电子装备有限公司 | Chemical mechanical planarization equipment |
US12017325B2 (en) * | 2021-03-04 | 2024-06-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for removing debris during chemical mechanical planarization |
KR102624639B1 (en) * | 2021-10-12 | 2024-01-15 | 에스케이실트론 주식회사 | Cleaning apparatus for wafer polishing pad |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4222204A (en) * | 1979-06-18 | 1980-09-16 | Benner Robert L | Holder for an abrasive plate |
JP3722591B2 (en) * | 1997-05-30 | 2005-11-30 | 株式会社日立製作所 | Polishing equipment |
US5885137A (en) * | 1997-06-27 | 1999-03-23 | Siemens Aktiengesellschaft | Chemical mechanical polishing pad conditioner |
US6517419B1 (en) | 1999-10-27 | 2003-02-11 | Strasbaugh | Shaping polishing pad for small head chemical mechanical planarization |
JP3797861B2 (en) * | 2000-09-27 | 2006-07-19 | 株式会社荏原製作所 | Polishing device |
US6508697B1 (en) * | 2001-07-16 | 2003-01-21 | Robert Lyle Benner | Polishing pad conditioning system |
JP2003251568A (en) * | 2002-02-28 | 2003-09-09 | Sanwa Kenma Kogyo Kk | Grinding wheel |
US7052371B2 (en) * | 2003-05-29 | 2006-05-30 | Tbw Industries Inc. | Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk |
US7544113B1 (en) * | 2003-05-29 | 2009-06-09 | Tbw Industries, Inc. | Apparatus for controlling the forces applied to a vacuum-assisted pad conditioning system |
CN101817162A (en) * | 2004-01-26 | 2010-09-01 | Tbw工业有限公司 | Multi-step, in-situ pad conditioning system for chemical mechanical planarization |
EP1708848B1 (en) * | 2004-01-26 | 2009-03-18 | TBW Industries, Inc | Chemical mechanical planarization process control utilizing in-situ conditioning process |
CN101934491B (en) | 2004-11-01 | 2012-07-25 | 株式会社荏原制作所 | Polishing apparatus |
US7217172B2 (en) * | 2005-07-09 | 2007-05-15 | Tbw Industries Inc. | Enhanced end effector arm arrangement for CMP pad conditioning |
US20070087672A1 (en) * | 2005-10-19 | 2007-04-19 | Tbw Industries, Inc. | Apertured conditioning brush for chemical mechanical planarization systems |
JPWO2007108315A1 (en) * | 2006-03-22 | 2009-08-06 | 株式会社荏原製作所 | Substrate processing apparatus and substrate processing method |
CN101568406A (en) * | 2006-12-15 | 2009-10-28 | Tbw工业有限公司 | Abrasive configuration for fluid dynamic removal of abraded material and the like |
JP4803167B2 (en) * | 2007-12-10 | 2011-10-26 | ヤマハ株式会社 | Polishing equipment |
US8795032B2 (en) * | 2008-06-04 | 2014-08-05 | Ebara Corporation | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
JP5415735B2 (en) * | 2008-09-26 | 2014-02-12 | 株式会社荏原製作所 | Dressing method, dressing condition determining method, dressing condition determining program, and polishing apparatus |
JP5306065B2 (en) * | 2009-06-04 | 2013-10-02 | 株式会社荏原製作所 | Dressing apparatus and dressing method |
US20110177623A1 (en) * | 2010-01-15 | 2011-07-21 | Confluense Llc | Active Tribology Management of CMP Polishing Material |
CN101972988B (en) * | 2010-06-28 | 2012-05-16 | 清华大学 | Trimming head for polishing pad |
TW201303754A (en) * | 2011-07-04 | 2013-01-16 | Mitac Int Corp | Taxi-calling service management system and server and device thereof |
USD743456S1 (en) * | 2012-09-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
TWD160526S (en) * | 2012-09-26 | 2014-05-11 | 荏原製作所股份有限公司 | Dressing pellet for dresser disk |
USD737873S1 (en) * | 2012-09-26 | 2015-09-01 | Ebara Corporation | Dresser disk |
USD722331S1 (en) * | 2012-09-26 | 2015-02-10 | Ebara Corporation | Dressing pellet for dresser disk |
JP5919157B2 (en) * | 2012-10-01 | 2016-05-18 | 株式会社荏原製作所 | dresser |
JP5996382B2 (en) * | 2012-11-06 | 2016-09-21 | 株式会社ディスコ | Chuck table of cutting equipment |
USD743455S1 (en) * | 2013-03-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
JP6254383B2 (en) * | 2013-08-29 | 2017-12-27 | 株式会社荏原製作所 | Dressing apparatus, chemical mechanical polishing apparatus including the dressing apparatus, and dresser disk used therefor |
KR102431971B1 (en) * | 2014-04-18 | 2022-08-16 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate processing device and substrate processing method |
SG10201808052SA (en) * | 2014-04-30 | 2018-10-30 | Ebara Corp | Substrate Polishing Apparatus |
JP1524299S (en) * | 2014-05-15 | 2015-05-25 | ||
JP6367614B2 (en) * | 2014-06-09 | 2018-08-01 | 株式会社ディスコ | Grinding wheel manufacturing method |
JP2016119368A (en) * | 2014-12-19 | 2016-06-30 | 株式会社荏原製作所 | Conditioning device, buff processing unit, substrate processing apparatus, dresser, and conditioning method |
SG10201906815XA (en) | 2014-08-26 | 2019-08-27 | Ebara Corp | Substrate processing apparatus |
US9539699B2 (en) * | 2014-08-28 | 2017-01-10 | Ebara Corporation | Polishing method |
JP6842859B2 (en) * | 2016-08-12 | 2021-03-17 | 株式会社荏原製作所 | Dressing equipment, polishing equipment, holders, housings and dressing methods |
-
2016
- 2016-08-12 JP JP2016158456A patent/JP6842859B2/en active Active
-
2017
- 2017-08-08 SG SG10201706464YA patent/SG10201706464YA/en unknown
- 2017-08-11 US US15/675,442 patent/US10636665B2/en active Active
-
2020
- 2020-03-18 US US16/822,411 patent/US10777417B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10777417B2 (en) | 2020-09-15 |
JP2018024067A (en) | 2018-02-15 |
US20180047572A1 (en) | 2018-02-15 |
JP6842859B2 (en) | 2021-03-17 |
US20200219728A1 (en) | 2020-07-09 |
US10636665B2 (en) | 2020-04-28 |
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