SG10202101299QA - Polishing apparatus and polishing method - Google Patents
Polishing apparatus and polishing methodInfo
- Publication number
- SG10202101299QA SG10202101299QA SG10202101299QA SG10202101299QA SG10202101299QA SG 10202101299Q A SG10202101299Q A SG 10202101299QA SG 10202101299Q A SG10202101299Q A SG 10202101299QA SG 10202101299Q A SG10202101299Q A SG 10202101299QA SG 10202101299Q A SG10202101299Q A SG 10202101299QA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- polishing apparatus
- polishing method
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Disintegrating Or Milling (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017142578A JP6948868B2 (en) | 2017-07-24 | 2017-07-24 | Polishing equipment and polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202101299QA true SG10202101299QA (en) | 2021-03-30 |
Family
ID=65014740
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201806039QA SG10201806039QA (en) | 2017-07-24 | 2018-07-13 | Polishing apparatus and polishing method |
SG10202101299QA SG10202101299QA (en) | 2017-07-24 | 2018-07-13 | Polishing apparatus and polishing method |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201806039QA SG10201806039QA (en) | 2017-07-24 | 2018-07-13 | Polishing apparatus and polishing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US11911867B2 (en) |
JP (2) | JP6948868B2 (en) |
KR (1) | KR102549750B1 (en) |
CN (2) | CN109290940B (en) |
SG (2) | SG10201806039QA (en) |
TW (2) | TW202313252A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7403998B2 (en) * | 2019-08-29 | 2023-12-25 | 株式会社荏原製作所 | Polishing equipment and polishing method |
CN110695840B (en) * | 2019-11-07 | 2021-02-02 | 许昌学院 | Semiconductor grinding device based on photoelectric detection |
JP2022061077A (en) * | 2020-10-06 | 2022-04-18 | 株式会社荏原製作所 | Optical film thickness measurement device and polishing device |
US20230011748A1 (en) * | 2021-07-12 | 2023-01-12 | Applied Materials, Inc. | System and method to map thickness variations of substrates inmanufacturing systems |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1507747A (en) * | 1975-08-21 | 1978-04-19 | Standard Telephones Cables Ltd | Immiscible liquids measurement |
JPS61126427A (en) * | 1984-11-26 | 1986-06-13 | Toshiba Corp | Optical detecting device |
JPH11204473A (en) * | 1998-01-19 | 1999-07-30 | Hitachi Ltd | Abrasive processing method and device therefor |
JP3717340B2 (en) | 1999-07-27 | 2005-11-16 | シャープ株式会社 | Electronic component manufacturing equipment |
JP2000254860A (en) * | 1999-03-08 | 2000-09-19 | Nikon Corp | Polishing device |
TW200421444A (en) * | 2002-12-10 | 2004-10-16 | Nippon Kogaku Kk | Optical device and projecting exposure apparatus using such optical device |
US20040242121A1 (en) * | 2003-05-16 | 2004-12-02 | Kazuto Hirokawa | Substrate polishing apparatus |
JP2005243985A (en) * | 2004-02-27 | 2005-09-08 | Canon Inc | Method for pattern imaging in high-refractive-index liquid |
JP2005288572A (en) * | 2004-03-31 | 2005-10-20 | Ebara Corp | Overhang system cmp in-situ monitoring device having dewatering mechanism |
US7226339B2 (en) | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
JP2007178188A (en) * | 2005-12-27 | 2007-07-12 | Moritex Corp | Liquid detecting optical waveguide type sensor and optical waveguide type liquid detector |
JP2007222965A (en) * | 2006-02-21 | 2007-09-06 | Ebara Corp | Polishing plate manufacturing method of polishing table, polishing table and polisher |
TWI422798B (en) * | 2006-10-06 | 2014-01-11 | Ebara Corp | Processing end point detecting method, grinding method and grinding device |
JP2009050944A (en) | 2007-08-24 | 2009-03-12 | Disco Abrasive Syst Ltd | Substrate thickness measuring method and substrate processing device |
JP5339791B2 (en) * | 2008-06-30 | 2013-11-13 | 株式会社東京精密 | Polishing end point detection method and polishing apparatus |
KR20110120893A (en) * | 2009-01-16 | 2011-11-04 | 어플라이드 머티어리얼스, 인코포레이티드 | Polishing pad and system with window support |
KR101042316B1 (en) * | 2009-08-12 | 2011-06-17 | 세메스 주식회사 | Substrate treating apparatus and method |
JP5050024B2 (en) | 2009-09-28 | 2012-10-17 | 株式会社荏原製作所 | Substrate polishing apparatus and substrate polishing method |
JP5728239B2 (en) | 2010-03-02 | 2015-06-03 | 株式会社荏原製作所 | Polishing monitoring method, polishing method, polishing monitoring apparatus, and polishing apparatus |
JP5731806B2 (en) * | 2010-12-02 | 2015-06-10 | 株式会社ディスコ | Grinding equipment |
JP6005467B2 (en) | 2011-10-26 | 2016-10-12 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
JP2013222856A (en) | 2012-04-17 | 2013-10-28 | Ebara Corp | Polishing device and polishing method |
CN103624673B (en) | 2012-08-21 | 2016-04-20 | 中芯国际集成电路制造(上海)有限公司 | The method of chemical mechanical polishing apparatus and chemico-mechanical polishing |
US20140141696A1 (en) * | 2012-11-21 | 2014-05-22 | Applied Materials, Inc. | Polishing System with In-Sequence Sensor |
JP6027454B2 (en) * | 2013-02-05 | 2016-11-16 | 株式会社荏原製作所 | Polishing equipment |
JP6215602B2 (en) * | 2013-07-11 | 2017-10-18 | 株式会社荏原製作所 | Polishing apparatus and polishing state monitoring method |
TWI675721B (en) | 2013-07-11 | 2019-11-01 | 日商荏原製作所股份有限公司 | Polishing apparatus and polished-state monitoring method |
JP6145342B2 (en) * | 2013-07-12 | 2017-06-07 | 株式会社荏原製作所 | Film thickness measuring apparatus, film thickness measuring method, and polishing apparatus equipped with film thickness measuring apparatus |
JP6266493B2 (en) * | 2014-03-20 | 2018-01-24 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
WO2015163164A1 (en) * | 2014-04-22 | 2015-10-29 | 株式会社 荏原製作所 | Polishing method and polishing apparatus |
US10898987B2 (en) * | 2015-06-01 | 2021-01-26 | Ebara Corporation | Table for holding workpiece and processing apparatus with the table |
JP6473050B2 (en) | 2015-06-05 | 2019-02-20 | 株式会社荏原製作所 | Polishing equipment |
CN204988999U (en) | 2015-08-04 | 2016-01-20 | 天津融冠颢业科技发展有限公司 | Wide spectrum optic fibre water quality monitoring system |
JP6659332B2 (en) * | 2015-12-07 | 2020-03-04 | 株式会社荏原製作所 | Substrate processing apparatus, method for detaching substrate from vacuum suction table of substrate processing apparatus, and method for mounting substrate on vacuum suction table of substrate processing apparatus |
CN205520892U (en) | 2016-01-05 | 2016-08-31 | 天津华海清科机电科技有限公司 | Polishing dish subassembly and have its burnishing machine |
-
2017
- 2017-07-24 JP JP2017142578A patent/JP6948868B2/en active Active
-
2018
- 2018-07-13 SG SG10201806039QA patent/SG10201806039QA/en unknown
- 2018-07-13 SG SG10202101299QA patent/SG10202101299QA/en unknown
- 2018-07-16 TW TW111144496A patent/TW202313252A/en unknown
- 2018-07-16 TW TW107124475A patent/TWI788383B/en active
- 2018-07-18 US US16/039,065 patent/US11911867B2/en active Active
- 2018-07-19 KR KR1020180083850A patent/KR102549750B1/en active IP Right Grant
- 2018-07-19 CN CN201810796740.9A patent/CN109290940B/en active Active
- 2018-07-19 CN CN202210133260.0A patent/CN114434314A/en active Pending
-
2021
- 2021-09-21 JP JP2021153009A patent/JP2022002870A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN109290940A (en) | 2019-02-01 |
CN109290940B (en) | 2022-03-15 |
SG10201806039QA (en) | 2019-02-27 |
TWI788383B (en) | 2023-01-01 |
US20190022820A1 (en) | 2019-01-24 |
US11911867B2 (en) | 2024-02-27 |
JP6948868B2 (en) | 2021-10-13 |
TW201909268A (en) | 2019-03-01 |
KR20190011206A (en) | 2019-02-01 |
TW202313252A (en) | 2023-04-01 |
JP2019024036A (en) | 2019-02-14 |
JP2022002870A (en) | 2022-01-11 |
KR102549750B1 (en) | 2023-06-30 |
CN114434314A (en) | 2022-05-06 |
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