CN205520892U - Polishing dish subassembly and have its burnishing machine - Google Patents
Polishing dish subassembly and have its burnishing machine Download PDFInfo
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- CN205520892U CN205520892U CN201620015694.0U CN201620015694U CN205520892U CN 205520892 U CN205520892 U CN 205520892U CN 201620015694 U CN201620015694 U CN 201620015694U CN 205520892 U CN205520892 U CN 205520892U
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- 238000005498 polishing Methods 0.000 title claims abstract description 69
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 5
- 239000012788 optical film Substances 0.000 abstract 3
- 239000012528 membrane Substances 0.000 abstract 2
- 238000010276 construction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model discloses a polishing dish subassembly and have its burnishing machine, polishing dish subassembly includes: the polishing dish, be provided with on the polishing dish and run through the through -hole of polishing dish thickness, optical film thickness detection device, the through -hole does optical film thickness detection device's optics passageway. Through set up the through -hole on the polishing dish, can be so that optical film thickness detection device detects the thick value of the membrane of wafer to can be so that the thick value of the membrane of wafer meets the requirements and then the at least yield that can improve the wafer to a certain extent. In addition, be provided with the polishing dish simple structure and the easily processing of through -hole.
Description
Technical field
This utility model relates to buffing machine technical field, particularly relates to a kind of polishing disk assembly and has this polishing disk assembly
Buffing machine.
Background technology
Along with the development of semiconductor manufacturing, device density is increasing, and the wiring number of plies gets more and more.When the number of plies gets more and more,
Ensureing that the flatness of crystal column surface is the most important, chemically mechanical polishing solves this problem.Meanwhile, need accurately
Know the material eliminating how many or how much thickness in polishing process, it is to avoid cross throw or owe throw.
Utility model content
One of technical problem that this utility model is intended to solve in correlation technique the most to a certain extent.To this end, this practicality is new
Type proposes the polishing disk assembly of a kind of buffing machine, and this polishing disk assembly can be so that blooming detection device detects the film of wafer
Thick value.
This utility model proposes a kind of buffing machine further.
Polishing disk assembly according to buffing machine of the present utility model, including: polishing disk, described polishing disk is provided through institute
State the through hole of polishing disk thickness；Blooming thickness detector, described through hole is the optical channel of described blooming thickness detector.
Polishing disk assembly according to buffing machine of the present utility model, by arranging through hole on polishing disk, can be so that blooming
The film thickness value of thickness detector detection wafer, so that the film thickness value of wafer meets the requirements, and then the most to a certain degree
On can improve the yield rate of wafer.It addition, be provided with the polishing disk simple in construction of through hole and be prone to processing.
It addition, can also have a following distinguishing feature according to the polishing disk assembly of buffing machine of the present utility model:
In examples more of the present utility model, described through hole includes: the first sub-through hole and the second sub-through hole, described first son
Through hole is arranged on the top of described second sub-through hole and is connected with described second sub-through hole, and described blooming thickness detector is suitable to
It is placed in described second sub-through hole.
In examples more of the present utility model, the cross-sectional area of described first sub-through hole is less than the horizontal stroke of described second sub-through hole
Area of section.
In examples more of the present utility model, described first sub-through hole is circular, rectangle or ellipse.
According to buffing machine of the present utility model, including above-mentioned polishing disk assembly.Due to the polishing disk in above-mentioned polishing disk assembly
On be provided with through hole, through hole can be as the optical channel of blooming thickness detector, thus blooming thickness detector is permissible
Effectively detect the film thickness value of wafer, the yield rate of wafer can be improved the most to a certain extent.It addition, be provided with the throwing of through hole
Compact disk structure is simple and is prone to processing.
Accompanying drawing explanation
Fig. 1 is the sectional view of the polishing disk assembly according to this utility model embodiment；
Fig. 2 is the front view of the polishing disk in the polishing disk assembly according to first embodiment of this utility model；
Fig. 3 is the front view of the polishing disk in the polishing disk assembly according to second embodiment of this utility model；
Fig. 4 is the front view of the polishing disk in the polishing disk assembly according to the 3rd embodiment of this utility model；
Fig. 5 is the front view of the polishing disk in the polishing disk assembly according to the 4th embodiment of this utility model.
Reference:
Polishing disk assembly 100；
Polishing disk 10；Through hole 20；First sub-through hole 21；Second sub-through hole 22；
Blooming thickness detector 30；Wafer 40；Polishing turntable 50.
Detailed description of the invention
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings.Below with reference to
The embodiment that accompanying drawing describes is exemplary, it is intended to be used for explaining this utility model, and it is not intended that to of the present utility model
Limit.
Below with reference to the accompanying drawings the polishing disk assembly 100 of buffing machine according to this utility model embodiment is described in detail.
Polishing disk assembly 100 according to this utility model embodiment includes: polishing disk 10 and blooming thickness detector 30.As
Shown in Fig. 1, polishing disk 10 being provided through the through hole 20 of polishing disk 10 thickness, through hole 20 can be blooming inspection
Survey the optical channel of device 30.As it is shown in figure 1, wafer 40 is placed on polishing disk 10, polishing disk 10 is arranged on polishing
On turntable 50, when polishing turntable 50 and driving polishing disk 10 synchronous axial system, wafer 40 can be polished by polishing disk 10
Process.In polishing process, the light that blooming thickness detector 30 is launched can be irradiated by the through hole 20 on polishing disk 10
On wafer 40, then light is reflected back on optics film thickness detecting device 30, such that it is able to calculate the film of now wafer 40
Thickness is worth, and then buffing machine can judge whether to need to continue polishing according to this film thickness value or end polishes.
Thus, according to the polishing disk assembly 100 of the buffing machine of this utility model embodiment, logical by arranging on polishing disk 10
Hole 20, can be so that blooming detection device 30 detects the film thickness value of wafer 40, so that the film of wafer 40
Thick value meets the requirements, and then can improve the yield rate of wafer 40 the most to a certain extent.It addition, be provided with through hole 20
Polishing disk 10 simple in construction and be prone to processing.
In examples more of the present utility model, as it is shown in figure 1, through hole 20 may include that the first sub-through hole 21 and second
Sub-through hole 22, the first sub-through hole 21 is arranged on the top of the second sub-through hole 22, and the first sub-through hole 21 and the second son are logical
Hole 22 is connected, and blooming thickness detector 30 is adapted for placement in the second sub-through hole 22.By arranging the second sub-through hole 22,
Can be so that blooming detects the placement of device 30, it is also possible to avoid the change to polishing turntable 50, polishing can be reduced
The change degree of machine.
Alternatively, as it is shown in figure 1, the cross-sectional area of the first sub-through hole 21 can be less than the cross section of the second sub-through hole 22
Area.Owing to the second sub-through hole 22 needs to place blooming thickness detector 30, so the second sub-through hole 22 is suitable to design greatly
Some, the first sub-through hole 21 ensures that light passes, so the cross-sectional area of the first sub-through hole 21 is suitable to design smaller.
Thus, it is possible to ensure the structural strength of polishing disk 10, the impact that polishing disk 10 is produced by through hole 20 can be reduced.
Wherein, the shape of the first sub-through hole 21 can have multiple, as in figure 2 it is shown, the first sub-through hole 21 can be circular,
As shown in Figure 3 and Figure 4, the first sub-through hole 21 can be rectangle, as it is shown in figure 5, the first sub-through hole 21 can be oval
Shape.
According to the buffing machine of this utility model embodiment, including the polishing disk assembly 100 of above-described embodiment.Due to above-mentioned polishing disk
Being provided with through hole 20 on polishing disk 10 in assembly 100, through hole 20 can be as the optics of blooming thickness detector 30
Passage, thus blooming thickness detector 30 can effectively detect the film thickness value of wafer 40, can carry the most to a certain extent
The yield rate of high wafer 40.It addition, be provided with polishing disk 10 simple in construction of through hole 20 and be prone to processing.
In description of the present utility model, it is to be understood that term " " center ", " thickness ", " on ", D score, " axle
To ", " radially ", the orientation of the instruction such as " circumferential " or position relationship be based on orientation shown in the drawings or position relationship, be only
Must have specific for the ease of describing this utility model and simplification description rather than instruction or the device of hint indication or element
Orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed
Or implicitly include at least one this feature.In description of the present utility model, " multiple " are meant that at least two, example
Such as two, three etc., unless otherwise expressly limited specifically.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show
Example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material or
Feature is contained at least one embodiment of the present utility model or example.In this manual, schematic to above-mentioned term
Statement is necessarily directed to identical embodiment or example.And, the specific features of description, structure, material or feature
Can be so that one or more embodiments in office or example to combine in an appropriate manner.Additionally, in the case of the most conflicting,
Those skilled in the art can be by the different embodiments described in this specification or example and different embodiment or the spy of example
Levy and be combined and combine.
Although above it has been shown and described that embodiment of the present utility model, it is to be understood that above-described embodiment is example
Property, it is impossible to being interpreted as restriction of the present utility model, those of ordinary skill in the art can in the range of this utility model
Above-described embodiment be changed, revise, to replace and modification.
Claims (5)
1. the polishing disk assembly of a buffing machine, it is characterised in that including: polishing disk, described polishing disk is provided through
The through hole of described polishing disk thickness；
Blooming thickness detector, described through hole is the optical channel of described blooming thickness detector.
The polishing disk assembly of buffing machine the most according to claim 1, it is characterised in that described through hole includes: the first son
Through hole and the second sub-through hole, described first sub-through hole be arranged on described second sub-through hole top and with described second sub-through hole phase
Even, described blooming thickness detector is adapted for placement in described second sub-through hole.
The polishing disk assembly of buffing machine the most according to claim 2, it is characterised in that described first sub-through hole transversal
Face area is less than the cross-sectional area of described second sub-through hole.
The polishing disk assembly of buffing machine the most according to claim 2, it is characterised in that described first sub-through hole be circular,
Rectangle or ellipse.
5. a buffing machine, it is characterised in that include the polishing disk according to the buffing machine according to any one of claim 1-4
Assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620015694.0U CN205520892U (en) | 2016-01-05 | 2016-01-05 | Polishing dish subassembly and have its burnishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620015694.0U CN205520892U (en) | 2016-01-05 | 2016-01-05 | Polishing dish subassembly and have its burnishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205520892U true CN205520892U (en) | 2016-08-31 |
Family
ID=56763440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620015694.0U Active CN205520892U (en) | 2016-01-05 | 2016-01-05 | Polishing dish subassembly and have its burnishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205520892U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109290940A (en) * | 2017-07-24 | 2019-02-01 | 株式会社荏原制作所 | Grinding device and grinding method |
-
2016
- 2016-01-05 CN CN201620015694.0U patent/CN205520892U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109290940A (en) * | 2017-07-24 | 2019-02-01 | 株式会社荏原制作所 | Grinding device and grinding method |
| CN109290940B (en) * | 2017-07-24 | 2022-03-15 | 株式会社荏原制作所 | Polishing apparatus and polishing method |
| US11911867B2 (en) | 2017-07-24 | 2024-02-27 | Ebara Corporation | Polishing apparatus and polishing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Polishing dish subassembly and have its burnishing machine Effective date of registration: 20180206 Granted publication date: 20160831 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Registration number: 2018120000004 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191022 Granted publication date: 20160831 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Registration number: 2018120000004 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee after: TSINGHUA University Patentee after: Huahaiqingke Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee before: TSINGHUA University Patentee before: TSINGHUA University |
|
| CP01 | Change in the name or title of a patent holder |