SG10201912536RA - Polishing apparatus and polishing member dressing method - Google Patents

Polishing apparatus and polishing member dressing method

Info

Publication number
SG10201912536RA
SG10201912536RA SG10201912536RA SG10201912536RA SG10201912536RA SG 10201912536R A SG10201912536R A SG 10201912536RA SG 10201912536R A SG10201912536R A SG 10201912536RA SG 10201912536R A SG10201912536R A SG 10201912536RA SG 10201912536R A SG10201912536R A SG 10201912536RA
Authority
SG
Singapore
Prior art keywords
polishing
dressing method
polishing apparatus
member dressing
polishing member
Prior art date
Application number
SG10201912536RA
Inventor
Keita Yagi
Yasumasa Hiroo
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2018240102A external-priority patent/JP7113737B2/en
Priority claimed from JP2018243656A external-priority patent/JP7113742B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201912536RA publication Critical patent/SG10201912536RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201912536RA 2018-12-21 2019-12-18 Polishing apparatus and polishing member dressing method SG10201912536RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018240102A JP7113737B2 (en) 2018-12-21 2018-12-21 Polishing device and dressing method for polishing member
JP2018243656A JP7113742B2 (en) 2018-12-26 2018-12-26 Polishing device and dressing method for polishing member

Publications (1)

Publication Number Publication Date
SG10201912536RA true SG10201912536RA (en) 2020-07-29

Family

ID=71099099

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201912536RA SG10201912536RA (en) 2018-12-21 2019-12-18 Polishing apparatus and polishing member dressing method

Country Status (4)

Country Link
US (2) US11458589B2 (en)
KR (1) KR102524816B1 (en)
SG (1) SG10201912536RA (en)
TW (1) TWI819138B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11279001B2 (en) * 2019-02-22 2022-03-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for monitoring chemical mechanical polishing process
CN112247846B (en) * 2020-10-21 2022-09-27 黑格智能科技(嘉兴)有限公司 Full-automatic numerical control grinding wheel finishing machine and full-automatic numerical control grinding wheel finishing method
JP2022108789A (en) * 2021-01-14 2022-07-27 株式会社荏原製作所 Polishing device, polishing method, and method for outputting visualized information on film thickness distribution of base plate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6113462A (en) 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Feedback loop for selective conditioning of chemical mechanical polishing pad
JP3788035B2 (en) 1998-06-15 2006-06-21 松下電器産業株式会社 Polishing cloth dressing method
US7082345B2 (en) * 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US8221193B2 (en) 2008-08-07 2012-07-17 Applied Materials, Inc. Closed loop control of pad profile based on metrology feedback
JP5415735B2 (en) * 2008-09-26 2014-02-12 株式会社荏原製作所 Dressing method, dressing condition determining method, dressing condition determining program, and polishing apparatus
DK177641B1 (en) 2010-04-29 2014-01-20 Hilti Ag A power tool
JP5898420B2 (en) 2011-06-08 2016-04-06 株式会社荏原製作所 Polishing pad conditioning method and apparatus
JP5976522B2 (en) * 2012-05-31 2016-08-23 株式会社荏原製作所 Polishing apparatus and polishing method
JP5927083B2 (en) 2012-08-28 2016-05-25 株式会社荏原製作所 Dressing process monitoring method and polishing apparatus
JP6034717B2 (en) 2013-02-22 2016-11-30 株式会社荏原製作所 Method for obtaining sliding distance distribution on polishing member of dresser, method for obtaining sliding vector distribution on polishing member of dresser, and polishing apparatus
JP5964262B2 (en) * 2013-02-25 2016-08-03 株式会社荏原製作所 Method for adjusting profile of polishing member used in polishing apparatus, and polishing apparatus
JP2015125444A (en) 2013-12-27 2015-07-06 キヤノン株式会社 Cartridge
JP6293519B2 (en) * 2014-03-05 2018-03-14 株式会社荏原製作所 Polishing apparatus and polishing method
JP6444785B2 (en) 2015-03-19 2018-12-26 株式会社荏原製作所 Polishing apparatus, control method therefor, and dressing condition output method

Also Published As

Publication number Publication date
TWI819138B (en) 2023-10-21
US20220410345A1 (en) 2022-12-29
US11945075B2 (en) 2024-04-02
US20200198094A1 (en) 2020-06-25
CN111496668A (en) 2020-08-07
TW202031389A (en) 2020-09-01
KR20200078375A (en) 2020-07-01
US11458589B2 (en) 2022-10-04
KR102524816B1 (en) 2023-04-24

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