SG10202010318TA - Polishing method and polishing apparatus - Google Patents

Polishing method and polishing apparatus

Info

Publication number
SG10202010318TA
SG10202010318TA SG10202010318TA SG10202010318TA SG10202010318TA SG 10202010318T A SG10202010318T A SG 10202010318TA SG 10202010318T A SG10202010318T A SG 10202010318TA SG 10202010318T A SG10202010318T A SG 10202010318TA SG 10202010318T A SG10202010318T A SG 10202010318TA
Authority
SG
Singapore
Prior art keywords
polishing
polishing apparatus
polishing method
Prior art date
Application number
SG10202010318TA
Inventor
Ishii Yu
Togawa Tetsuji
Yoshida Atsushi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202010318TA publication Critical patent/SG10202010318TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10202010318TA 2019-10-25 2020-10-19 Polishing method and polishing apparatus SG10202010318TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019194182A JP7374710B2 (en) 2019-10-25 2019-10-25 Polishing method and polishing device

Publications (1)

Publication Number Publication Date
SG10202010318TA true SG10202010318TA (en) 2021-05-28

Family

ID=74701360

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202010318TA SG10202010318TA (en) 2019-10-25 2020-10-19 Polishing method and polishing apparatus

Country Status (7)

Country Link
US (1) US11618123B2 (en)
EP (1) EP3812094B1 (en)
JP (1) JP7374710B2 (en)
KR (1) KR20210049683A (en)
CN (1) CN112706002B (en)
SG (1) SG10202010318TA (en)
TW (1) TW202128351A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7443169B2 (en) 2020-06-29 2024-03-05 株式会社荏原製作所 A storage medium storing a substrate processing apparatus, a substrate processing method, and a program for causing a computer of the substrate processing apparatus to execute the substrate processing method.
CN115943016A (en) * 2020-07-14 2023-04-07 应用材料公司 Method for detecting an unqualified substrate processing event during chemical mechanical polishing
KR20240024919A (en) * 2021-06-22 2024-02-26 가부시키가이샤 에바라 세이사꾸쇼 Polishing method and polishing device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3637977B2 (en) * 1995-01-19 2005-04-13 株式会社荏原製作所 Polishing end point detection method
WO1997010613A1 (en) * 1995-09-13 1997-03-20 Hitachi, Ltd. Grinding method of grinding device
JP3033488B2 (en) 1996-03-27 2000-04-17 日本電気株式会社 Polishing end point detecting apparatus and method
US8353738B2 (en) * 1998-11-06 2013-01-15 Semcon Tech, Llc Advanced finishing control
US7097534B1 (en) * 2000-07-10 2006-08-29 Applied Materials, Inc. Closed-loop control of a chemical mechanical polisher
US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2003318140A (en) 2002-04-26 2003-11-07 Applied Materials Inc Polishing method and device thereof
JP4838614B2 (en) * 2006-03-29 2011-12-14 株式会社岡本工作機械製作所 Semiconductor substrate planarization apparatus and planarization method
JP2008091698A (en) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd Substrate treating device, and substrate treating method
JP5009101B2 (en) 2006-10-06 2012-08-22 株式会社荏原製作所 Substrate polishing equipment
JP5057892B2 (en) * 2007-08-30 2012-10-24 株式会社東京精密 Polishing end point detection method and apparatus using torque change
US8616935B2 (en) * 2010-06-02 2013-12-31 Applied Materials, Inc. Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing
JP5980476B2 (en) * 2010-12-27 2016-08-31 株式会社荏原製作所 Polishing apparatus and polishing method
JP2013219248A (en) * 2012-04-10 2013-10-24 Ebara Corp Polishing device and polishing method
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
JP6113552B2 (en) * 2013-03-29 2017-04-12 株式会社荏原製作所 Polishing apparatus and wear detection method
JP6145342B2 (en) * 2013-07-12 2017-06-07 株式会社荏原製作所 Film thickness measuring apparatus, film thickness measuring method, and polishing apparatus equipped with film thickness measuring apparatus
JP6030041B2 (en) * 2013-11-01 2016-11-24 株式会社荏原製作所 Polishing apparatus and polishing method
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
TW201822953A (en) * 2016-09-16 2018-07-01 美商應用材料股份有限公司 Overpolishing based on electromagnetic inductive monitoring of trench depth
JP6357260B2 (en) * 2016-09-30 2018-07-11 株式会社荏原製作所 Polishing apparatus and polishing method
CN110352115A (en) * 2017-03-06 2019-10-18 应用材料公司 It is mobile for the spiral and concentric circles of the position CMP particular abrasive (LSP) design
JP6989317B2 (en) * 2017-08-04 2022-01-05 キオクシア株式会社 Polishing equipment, polishing methods, and programs

Also Published As

Publication number Publication date
JP2021065990A (en) 2021-04-30
US20210170541A1 (en) 2021-06-10
CN112706002A (en) 2021-04-27
EP3812094B1 (en) 2024-05-29
KR20210049683A (en) 2021-05-06
CN112706002B (en) 2024-05-14
US11618123B2 (en) 2023-04-04
EP3812094A1 (en) 2021-04-28
JP7374710B2 (en) 2023-11-07
TW202128351A (en) 2021-08-01

Similar Documents

Publication Publication Date Title
SG10201907132SA (en) Apparatus for polishing and method for polishing
GB201911577D0 (en) Method and apparatus
SG10201906330YA (en) Polishing apparatus and polishing method
SG10202010318TA (en) Polishing method and polishing apparatus
SG10201912536RA (en) Polishing apparatus and polishing member dressing method
GB201912887D0 (en) Apparatus and method
SG10201907130YA (en) Apparatus for polishing and method for polishing
GB201910690D0 (en) Recognitaton apparatus and method
SG10202012033VA (en) Polishing method and polishing apparatus
GB202018312D0 (en) Method and apparatus
GB202001647D0 (en) Apparatus and method
GB201916079D0 (en) Apparatus and method
GB201905795D0 (en) Apparatus and method
SG10202005366QA (en) Polishing method and polishing apparatus
SG10202004630TA (en) Polishing apparatus and polishing method
SG10202001455RA (en) Polishing method and polishing apparatus
SG10202000998WA (en) Polishing apparatus and polishing method
SG10201912259TA (en) Polishing apparatus and polishing method
GB202008510D0 (en) Apparatus and method
GB2582825B (en) Apparatus and method
GB201910463D0 (en) Apparatus and method
GB202018583D0 (en) Method and apparatus
GB202016920D0 (en) Method and apparatus
GB201918308D0 (en) Apparatus and method
GB201917418D0 (en) Apparatus and method