SG10202000998WA - Polishing apparatus and polishing method - Google Patents

Polishing apparatus and polishing method

Info

Publication number
SG10202000998WA
SG10202000998WA SG10202000998WA SG10202000998WA SG10202000998WA SG 10202000998W A SG10202000998W A SG 10202000998WA SG 10202000998W A SG10202000998W A SG 10202000998WA SG 10202000998W A SG10202000998W A SG 10202000998WA SG 10202000998W A SG10202000998W A SG 10202000998WA
Authority
SG
Singapore
Prior art keywords
polishing
polishing apparatus
polishing method
Prior art date
Application number
SG10202000998WA
Inventor
Akira Nakamura
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202000998WA publication Critical patent/SG10202000998WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10202000998WA 2019-02-18 2020-02-04 Polishing apparatus and polishing method SG10202000998WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019026255A JP7155035B2 (en) 2019-02-18 2019-02-18 Polishing device and polishing method

Publications (1)

Publication Number Publication Date
SG10202000998WA true SG10202000998WA (en) 2020-09-29

Family

ID=72042681

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202000998WA SG10202000998WA (en) 2019-02-18 2020-02-04 Polishing apparatus and polishing method

Country Status (3)

Country Link
US (1) US11517999B2 (en)
JP (1) JP7155035B2 (en)
SG (1) SG10202000998WA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023177421A (en) * 2022-06-02 2023-12-14 株式会社荏原製作所 Polishing device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3226933A1 (en) 1982-07-19 1984-01-19 Gold- und Silber-Scheideanstalt Oberstein Franz Reischauer, 6580 Idar-Oberstein IRON AND METHOD FOR THE PRODUCTION THEREOF
JPS5920106U (en) * 1982-07-29 1984-02-07 三菱重工業株式会社 displacement transducer
US5275055A (en) 1992-08-31 1994-01-04 Honeywell Inc. Resonant gauge with microbeam driven in constant electric field
JPH06320416A (en) 1993-03-15 1994-11-22 Toshiba Corp Polishing method and polishing device
US6046111A (en) * 1998-09-02 2000-04-04 Micron Technology, Inc. Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates
US6645050B1 (en) * 1999-02-25 2003-11-11 Applied Materials, Inc. Multimode substrate carrier
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6494765B2 (en) 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
US6741913B2 (en) * 2001-12-11 2004-05-25 International Business Machines Corporation Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system
JP4471613B2 (en) 2002-10-10 2010-06-02 株式会社ハーモニック・ドライブ・システムズ Tactile information detection method and tactile information detection system
JP4764825B2 (en) 2003-10-31 2011-09-07 アプライド マテリアルズ インコーポレイテッド Polishing end point detection system and method using friction sensor
US7727049B2 (en) * 2003-10-31 2010-06-01 Applied Materials, Inc. Friction sensor for polishing system
US9862070B2 (en) 2011-11-16 2018-01-09 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement
EP3384261B1 (en) * 2015-11-30 2020-11-25 Link Engineering Company Instrumented spindle or load cell for high load, high resolution
JP6357260B2 (en) 2016-09-30 2018-07-11 株式会社荏原製作所 Polishing apparatus and polishing method
KR102591906B1 (en) * 2017-10-31 2023-10-20 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus and polishing method

Also Published As

Publication number Publication date
US20200262027A1 (en) 2020-08-20
JP7155035B2 (en) 2022-10-18
JP2020131329A (en) 2020-08-31
US11517999B2 (en) 2022-12-06

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