SG10201907132SA - Apparatus for polishing and method for polishing - Google Patents
Apparatus for polishing and method for polishingInfo
- Publication number
- SG10201907132SA SG10201907132SA SG10201907132SA SG10201907132SA SG10201907132SA SG 10201907132S A SG10201907132S A SG 10201907132SA SG 10201907132S A SG10201907132S A SG 10201907132SA SG 10201907132S A SG10201907132S A SG 10201907132SA SG 10201907132S A SG10201907132S A SG 10201907132SA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018147915A JP7083722B2 (en) | 2018-08-06 | 2018-08-06 | Polishing equipment and polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201907132SA true SG10201907132SA (en) | 2020-03-30 |
Family
ID=69228200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201907132SA SG10201907132SA (en) | 2018-08-06 | 2019-08-02 | Apparatus for polishing and method for polishing |
Country Status (6)
Country | Link |
---|---|
US (1) | US11465256B2 (en) |
JP (1) | JP7083722B2 (en) |
KR (1) | KR20200016184A (en) |
CN (1) | CN110802519B (en) |
SG (1) | SG10201907132SA (en) |
TW (1) | TWI808233B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109562505A (en) * | 2018-10-24 | 2019-04-02 | 长江存储科技有限责任公司 | With the chemical-mechanical polisher for scraping fixed device |
JP7152279B2 (en) * | 2018-11-30 | 2022-10-12 | 株式会社荏原製作所 | Polishing equipment |
JP7492854B2 (en) * | 2020-05-11 | 2024-05-30 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
CN111761516B (en) * | 2020-07-10 | 2021-09-21 | 浙江中晶科技股份有限公司 | Silicon wafer grinding disc correction equipment and correction process thereof |
CN112518573B (en) * | 2020-11-06 | 2022-06-07 | 西安奕斯伟硅片技术有限公司 | Polishing apparatus, polishing machine, and polishing method |
CN117300904B (en) * | 2023-11-28 | 2024-01-23 | 苏州博宏源机械制造有限公司 | Polishing pad dressing device |
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JP6843126B2 (en) * | 2016-04-21 | 2021-03-17 | 株式会社荏原製作所 | Board processing equipment |
KR102401388B1 (en) | 2016-06-24 | 2022-05-24 | 어플라이드 머티어리얼스, 인코포레이티드 | Slurry Dispensing Device for Chemical Mechanical Polishing |
US11094554B2 (en) * | 2017-03-31 | 2021-08-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing process for forming semiconductor device structure |
-
2018
- 2018-08-06 JP JP2018147915A patent/JP7083722B2/en active Active
-
2019
- 2019-08-02 TW TW108127446A patent/TWI808233B/en active
- 2019-08-02 SG SG10201907132SA patent/SG10201907132SA/en unknown
- 2019-08-05 KR KR1020190094722A patent/KR20200016184A/en not_active Application Discontinuation
- 2019-08-06 US US16/533,018 patent/US11465256B2/en active Active
- 2019-08-06 CN CN201910720309.0A patent/CN110802519B/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20200016184A (en) | 2020-02-14 |
TWI808233B (en) | 2023-07-11 |
US20200039029A1 (en) | 2020-02-06 |
TW202026106A (en) | 2020-07-16 |
JP2020024996A (en) | 2020-02-13 |
CN110802519B (en) | 2024-05-14 |
JP7083722B2 (en) | 2022-06-13 |
CN110802519A (en) | 2020-02-18 |
US11465256B2 (en) | 2022-10-11 |
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