SG11201708029SA - Film-thickness measuring method, film-thickness measuring apparatus, polishing method, and polishing apparatus - Google Patents
Film-thickness measuring method, film-thickness measuring apparatus, polishing method, and polishing apparatusInfo
- Publication number
- SG11201708029SA SG11201708029SA SG11201708029SA SG11201708029SA SG11201708029SA SG 11201708029S A SG11201708029S A SG 11201708029SA SG 11201708029S A SG11201708029S A SG 11201708029SA SG 11201708029S A SG11201708029S A SG 11201708029SA SG 11201708029S A SG11201708029S A SG 11201708029SA
- Authority
- SG
- Singapore
- Prior art keywords
- film
- thickness measuring
- polishing
- measuring apparatus
- measuring method
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000005498 polishing Methods 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015079459A JP6404172B2 (en) | 2015-04-08 | 2015-04-08 | Film thickness measuring method, film thickness measuring apparatus, polishing method, and polishing apparatus |
PCT/JP2016/061100 WO2016163352A1 (en) | 2015-04-08 | 2016-04-05 | Film thickness measuring method, film thickness measuring device, polishing method, and polishing device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201708029SA true SG11201708029SA (en) | 2017-10-30 |
Family
ID=57072616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201708029SA SG11201708029SA (en) | 2015-04-08 | 2016-04-05 | Film-thickness measuring method, film-thickness measuring apparatus, polishing method, and polishing apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US10256104B2 (en) |
JP (1) | JP6404172B2 (en) |
KR (1) | KR102283692B1 (en) |
CN (1) | CN107429989B (en) |
SG (1) | SG11201708029SA (en) |
TW (1) | TWI661174B (en) |
WO (1) | WO2016163352A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6404172B2 (en) * | 2015-04-08 | 2018-10-10 | 株式会社荏原製作所 | Film thickness measuring method, film thickness measuring apparatus, polishing method, and polishing apparatus |
CN107036539B (en) * | 2017-06-14 | 2018-07-13 | 深圳中科飞测科技有限公司 | Membrane thickness measuring system and method |
JP7023062B2 (en) * | 2017-07-24 | 2022-02-21 | 株式会社荏原製作所 | Substrate polishing equipment and method |
JP6912045B2 (en) * | 2018-07-17 | 2021-07-28 | 株式会社システムロード | Film thickness measurement method and its equipment |
KR102091419B1 (en) * | 2018-07-19 | 2020-03-20 | 주식회사 케이씨텍 | System of polishing substrate with light transmitting layer |
US20200033723A1 (en) * | 2018-07-30 | 2020-01-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor Manufacturing Apparatus and Method Thereof |
JP7210200B2 (en) * | 2018-09-21 | 2023-01-23 | 株式会社ディスコ | Thickness measuring device and grinding device equipped with thickness measuring device |
JP7403998B2 (en) * | 2019-08-29 | 2023-12-25 | 株式会社荏原製作所 | Polishing equipment and polishing method |
WO2021181545A1 (en) * | 2020-03-11 | 2021-09-16 | 株式会社日立ハイテク | Plasma processing device or plasma processing method |
KR20230048655A (en) * | 2021-10-05 | 2023-04-12 | 삼성전자주식회사 | Method of inspecting a wafer and apparatus for performing the same |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000292128A (en) | 1999-04-12 | 2000-10-20 | Sumitomo Electric Ind Ltd | Device and method for measuring film thickness of semiconductor thin film, semiconductor wafer, and its manufacturing method |
JP2002071319A (en) * | 2000-09-01 | 2002-03-08 | Seiko Epson Corp | Detection method and control system for cell thickness, and manufacturing method for liquid crystal device |
JP2002277220A (en) * | 2001-03-19 | 2002-09-25 | Hitachi Ltd | Method for determining point of measurement for measuring film thickness and method and device for manufacturing membrane device using the same |
JP4551035B2 (en) | 2001-08-22 | 2010-09-22 | 新日本製鐵株式会社 | Conductor thickness measuring device |
JP3941863B2 (en) * | 2002-03-27 | 2007-07-04 | 株式会社トプコン | Surface inspection method and surface inspection apparatus |
KR100568703B1 (en) * | 2004-08-10 | 2006-04-07 | 삼성전자주식회사 | Thickness measurement method of metal layer and thickness measurement apparatus using the same |
CN1877298A (en) * | 2006-07-05 | 2006-12-13 | 中国科学院上海光学精密机械研究所 | Real-time measuring device and method for film spectrum |
JP4834847B2 (en) * | 2007-10-05 | 2011-12-14 | 大塚電子株式会社 | Multilayer film analysis apparatus and multilayer film analysis method |
US7649634B2 (en) * | 2007-10-30 | 2010-01-19 | Mountain View Optical Consultant Corp. | Methods and systems for white light interferometry and characterization of films |
JP5309359B2 (en) * | 2008-06-20 | 2013-10-09 | 大塚電子株式会社 | Film thickness measuring apparatus and film thickness measuring method |
JP6005467B2 (en) | 2011-10-26 | 2016-10-12 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
JP2013222856A (en) * | 2012-04-17 | 2013-10-28 | Ebara Corp | Polishing device and polishing method |
JP6105371B2 (en) * | 2013-04-25 | 2017-03-29 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
JP5903135B2 (en) * | 2014-08-04 | 2016-04-13 | 株式会社東京精密 | Polishing end point detection device and polishing end point detection method |
JP6404172B2 (en) | 2015-04-08 | 2018-10-10 | 株式会社荏原製作所 | Film thickness measuring method, film thickness measuring apparatus, polishing method, and polishing apparatus |
-
2015
- 2015-04-08 JP JP2015079459A patent/JP6404172B2/en active Active
-
2016
- 2016-04-05 SG SG11201708029SA patent/SG11201708029SA/en unknown
- 2016-04-05 CN CN201680018290.XA patent/CN107429989B/en active Active
- 2016-04-05 KR KR1020177031870A patent/KR102283692B1/en active IP Right Grant
- 2016-04-05 WO PCT/JP2016/061100 patent/WO2016163352A1/en active Application Filing
- 2016-04-05 US US15/564,182 patent/US10256104B2/en active Active
- 2016-04-07 TW TW105110866A patent/TWI661174B/en active
Also Published As
Publication number | Publication date |
---|---|
JP2016200459A (en) | 2016-12-01 |
TW201640074A (en) | 2016-11-16 |
KR102283692B1 (en) | 2021-08-02 |
TWI661174B (en) | 2019-06-01 |
JP6404172B2 (en) | 2018-10-10 |
CN107429989B (en) | 2020-05-12 |
CN107429989A (en) | 2017-12-01 |
US20180130667A1 (en) | 2018-05-10 |
US10256104B2 (en) | 2019-04-09 |
WO2016163352A1 (en) | 2016-10-13 |
KR20170134622A (en) | 2017-12-06 |
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