SG11201701152WA - End point detection method, polishing apparatus, and polishing method - Google Patents
End point detection method, polishing apparatus, and polishing methodInfo
- Publication number
- SG11201701152WA SG11201701152WA SG11201701152WA SG11201701152WA SG11201701152WA SG 11201701152W A SG11201701152W A SG 11201701152WA SG 11201701152W A SG11201701152W A SG 11201701152WA SG 11201701152W A SG11201701152W A SG 11201701152WA SG 11201701152W A SG11201701152W A SG 11201701152WA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- end point
- point detection
- detection method
- polishing apparatus
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000001514 detection method Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
- G01S13/50—Systems of measurement based on relative movement of target
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014177742A JP6377463B2 (en) | 2014-09-02 | 2014-09-02 | End point detection method and polishing apparatus |
JP2015099643A JP6727761B2 (en) | 2015-05-15 | 2015-05-15 | Polishing apparatus and polishing method |
PCT/JP2015/074254 WO2016035673A1 (en) | 2014-09-02 | 2015-08-27 | End point detection method, polishing device, and polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201701152WA true SG11201701152WA (en) | 2017-04-27 |
Family
ID=55439738
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201803908SA SG10201803908SA (en) | 2014-09-02 | 2015-08-27 | End point detection method, polishing apparatus, and polishing method |
SG11201701152WA SG11201701152WA (en) | 2014-09-02 | 2015-08-27 | End point detection method, polishing apparatus, and polishing method |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201803908SA SG10201803908SA (en) | 2014-09-02 | 2015-08-27 | End point detection method, polishing apparatus, and polishing method |
Country Status (6)
Country | Link |
---|---|
US (2) | US10759019B2 (en) |
KR (1) | KR102388170B1 (en) |
CN (1) | CN106604802B (en) |
SG (2) | SG10201803908SA (en) |
TW (1) | TWI678259B (en) |
WO (1) | WO2016035673A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201803908SA (en) | 2014-09-02 | 2018-06-28 | Ebara Corp | End point detection method, polishing apparatus, and polishing method |
US10744617B2 (en) * | 2015-10-16 | 2020-08-18 | Ebara Corporation | Polishing endpoint detection method |
JP6775354B2 (en) | 2015-10-16 | 2020-10-28 | 株式会社荏原製作所 | Polishing equipment and polishing method |
JP6357260B2 (en) * | 2016-09-30 | 2018-07-11 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
JP6989317B2 (en) * | 2017-08-04 | 2022-01-05 | キオクシア株式会社 | Polishing equipment, polishing methods, and programs |
JP7098311B2 (en) * | 2017-12-05 | 2022-07-11 | 株式会社荏原製作所 | Polishing equipment and polishing method |
JP2022066034A (en) * | 2020-10-16 | 2022-04-28 | 新東工業株式会社 | Automatic polishing system and automatic polishing device |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3807979A (en) * | 1972-05-08 | 1974-04-30 | Philadelphia Quartz Co | Quaternary ammonium silicate for polishing silicon metal |
US5846882A (en) | 1996-10-03 | 1998-12-08 | Applied Materials, Inc. | Endpoint detector for a chemical mechanical polishing system |
JPH10180625A (en) | 1996-12-26 | 1998-07-07 | Toshiba Corp | Polishing method and polishing device |
JPH1187286A (en) * | 1997-09-05 | 1999-03-30 | Lsi Logic Corp | Two-staged mechanical and chemical polishing method and system for semiconductor wafer |
US6190494B1 (en) * | 1998-07-29 | 2001-02-20 | Micron Technology, Inc. | Method and apparatus for electrically endpointing a chemical-mechanical planarization process |
JP2001198813A (en) | 2000-01-13 | 2001-07-24 | Toshiba Corp | Polishing device and its polishing method |
US6547637B1 (en) * | 2000-10-05 | 2003-04-15 | Momentum Technical Consulting Inc. | Chemical/mechanical polishing endpoint detection device and method |
JP4370789B2 (en) * | 2002-07-12 | 2009-11-25 | 東京エレクトロン株式会社 | Plasma processing apparatus and variable impedance means calibration method |
DE10345381B4 (en) * | 2003-09-30 | 2013-04-11 | Advanced Micro Devices, Inc. | A method and system for controlling chemical mechanical polishing using a sensor signal from a pad conditioner |
US20070131561A1 (en) * | 2003-12-17 | 2007-06-14 | Acm Research, Inc. | Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |
EP1708848B1 (en) * | 2004-01-26 | 2009-03-18 | TBW Industries, Inc | Chemical mechanical planarization process control utilizing in-situ conditioning process |
JP2005288664A (en) * | 2004-04-05 | 2005-10-20 | Ebara Corp | Polishing device and method for detecting completion of polishing pad standing |
JP2005034992A (en) | 2004-10-29 | 2005-02-10 | Ebara Corp | Detection method of polishing endpoint |
US20070108066A1 (en) * | 2005-10-28 | 2007-05-17 | Applied Materials, Inc. | Voltage mode current control |
JP5060755B2 (en) | 2006-09-29 | 2012-10-31 | Sumco Techxiv株式会社 | Semiconductor wafer rough polishing method and semiconductor wafer polishing apparatus |
CN101523565B (en) * | 2006-10-06 | 2012-02-29 | 株式会社荏原制作所 | Machining end point detecting method, grinding method, and grinder |
US8870625B2 (en) * | 2007-11-28 | 2014-10-28 | Ebara Corporation | Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method |
JP6046933B2 (en) * | 2012-07-10 | 2016-12-21 | 株式会社荏原製作所 | Polishing method |
JP6196858B2 (en) * | 2012-09-24 | 2017-09-13 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
JP5990074B2 (en) | 2012-09-28 | 2016-09-07 | 株式会社荏原製作所 | Polishing equipment |
JP5863614B2 (en) * | 2012-09-28 | 2016-02-16 | 株式会社荏原製作所 | Polishing equipment |
TWI530360B (en) * | 2012-09-28 | 2016-04-21 | 荏原製作所股份有限公司 | Polishing apparatus |
JP6030041B2 (en) * | 2013-11-01 | 2016-11-24 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
JP6327958B2 (en) * | 2014-06-03 | 2018-05-23 | 株式会社荏原製作所 | Polishing equipment |
SG10201803908SA (en) | 2014-09-02 | 2018-06-28 | Ebara Corp | End point detection method, polishing apparatus, and polishing method |
US10744617B2 (en) * | 2015-10-16 | 2020-08-18 | Ebara Corporation | Polishing endpoint detection method |
-
2015
- 2015-08-27 SG SG10201803908SA patent/SG10201803908SA/en unknown
- 2015-08-27 KR KR1020177006188A patent/KR102388170B1/en active IP Right Grant
- 2015-08-27 US US15/508,034 patent/US10759019B2/en active Active
- 2015-08-27 WO PCT/JP2015/074254 patent/WO2016035673A1/en active Application Filing
- 2015-08-27 CN CN201580047764.9A patent/CN106604802B/en active Active
- 2015-08-27 SG SG11201701152WA patent/SG11201701152WA/en unknown
- 2015-08-31 TW TW104128583A patent/TWI678259B/en active
-
2020
- 2020-07-21 US US16/934,329 patent/US20200346318A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20170048397A (en) | 2017-05-08 |
TW201620669A (en) | 2016-06-16 |
WO2016035673A1 (en) | 2016-03-10 |
KR102388170B1 (en) | 2022-04-19 |
CN106604802A (en) | 2017-04-26 |
US20170282325A1 (en) | 2017-10-05 |
TWI678259B (en) | 2019-12-01 |
US10759019B2 (en) | 2020-09-01 |
US20200346318A1 (en) | 2020-11-05 |
SG10201803908SA (en) | 2018-06-28 |
CN106604802B (en) | 2019-05-31 |
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