SG10201803908SA - End point detection method, polishing apparatus, and polishing method - Google Patents

End point detection method, polishing apparatus, and polishing method

Info

Publication number
SG10201803908SA
SG10201803908SA SG10201803908SA SG10201803908SA SG10201803908SA SG 10201803908S A SG10201803908S A SG 10201803908SA SG 10201803908S A SG10201803908S A SG 10201803908SA SG 10201803908S A SG10201803908S A SG 10201803908SA SG 10201803908S A SG10201803908S A SG 10201803908SA
Authority
SG
Singapore
Prior art keywords
polishing
end point
point detection
drive
detection method
Prior art date
Application number
SG10201803908SA
Inventor
Taro Takahashi
Yuta Suzuki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014177742A external-priority patent/JP6377463B2/en
Priority claimed from JP2015099643A external-priority patent/JP6727761B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201803908SA publication Critical patent/SG10201803908SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
    • G01S13/50—Systems of measurement based on relative movement of target

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

END POINT DETECTION METHOD, POLISHING APPARATUS, AND POLISHING METHOD To improve accuracy of polishing end point detection, provided is an end point detection method of detecting and end point based on a drive current supplied to a drive unit (first electric motor or second electric motor) that rotates and drives one of a polishing table that holds a polishing pad and a holding unit (top ring) that holds a polishing target and presses the polishing target against a polishing pad. The end point detection method includes: a step (S102) of determining whether a polishing condition of a polishing process to be executed coincides with a preset specific polishing condition; a step (S103) of adjusting a current control parameter in a drive control unit (motor driver) that controls the drive current, the current control parameter related to a change in the drive current with respect to a change in a driving load of the drive unit, if it is determined that the polishing condition coincides with the specific polishing condition; and a step (S105) of detecting the drive current supplied to the drive unit based on the adjusted current control parameter and detecting an end point of polishing based on the detected drive current. Figure 8
SG10201803908SA 2014-09-02 2015-08-27 End point detection method, polishing apparatus, and polishing method SG10201803908SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014177742A JP6377463B2 (en) 2014-09-02 2014-09-02 End point detection method and polishing apparatus
JP2015099643A JP6727761B2 (en) 2015-05-15 2015-05-15 Polishing apparatus and polishing method

Publications (1)

Publication Number Publication Date
SG10201803908SA true SG10201803908SA (en) 2018-06-28

Family

ID=55439738

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201803908SA SG10201803908SA (en) 2014-09-02 2015-08-27 End point detection method, polishing apparatus, and polishing method
SG11201701152WA SG11201701152WA (en) 2014-09-02 2015-08-27 End point detection method, polishing apparatus, and polishing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201701152WA SG11201701152WA (en) 2014-09-02 2015-08-27 End point detection method, polishing apparatus, and polishing method

Country Status (6)

Country Link
US (2) US10759019B2 (en)
KR (1) KR102388170B1 (en)
CN (1) CN106604802B (en)
SG (2) SG10201803908SA (en)
TW (1) TWI678259B (en)
WO (1) WO2016035673A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201803908SA (en) * 2014-09-02 2018-06-28 Ebara Corp End point detection method, polishing apparatus, and polishing method
JP6775354B2 (en) 2015-10-16 2020-10-28 株式会社荏原製作所 Polishing equipment and polishing method
US10744617B2 (en) * 2015-10-16 2020-08-18 Ebara Corporation Polishing endpoint detection method
JP6357260B2 (en) * 2016-09-30 2018-07-11 株式会社荏原製作所 Polishing apparatus and polishing method
JP6989317B2 (en) * 2017-08-04 2022-01-05 キオクシア株式会社 Polishing equipment, polishing methods, and programs
JP7098311B2 (en) * 2017-12-05 2022-07-11 株式会社荏原製作所 Polishing equipment and polishing method
JP2022066034A (en) * 2020-10-16 2022-04-28 新東工業株式会社 Automatic polishing system and automatic polishing device

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JPH1187286A (en) * 1997-09-05 1999-03-30 Lsi Logic Corp Two-staged mechanical and chemical polishing method and system for semiconductor wafer
US6190494B1 (en) * 1998-07-29 2001-02-20 Micron Technology, Inc. Method and apparatus for electrically endpointing a chemical-mechanical planarization process
JP2001198813A (en) 2000-01-13 2001-07-24 Toshiba Corp Polishing device and its polishing method
US6547637B1 (en) * 2000-10-05 2003-04-15 Momentum Technical Consulting Inc. Chemical/mechanical polishing endpoint detection device and method
JP4370789B2 (en) * 2002-07-12 2009-11-25 東京エレクトロン株式会社 Plasma processing apparatus and variable impedance means calibration method
DE10345381B4 (en) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. A method and system for controlling chemical mechanical polishing using a sensor signal from a pad conditioner
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KR101357290B1 (en) * 2006-10-06 2014-01-28 가부시끼가이샤 도시바 Processing end point detection method, polishing method, and polishing apparatus
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US10744617B2 (en) * 2015-10-16 2020-08-18 Ebara Corporation Polishing endpoint detection method

Also Published As

Publication number Publication date
KR102388170B1 (en) 2022-04-19
SG11201701152WA (en) 2017-04-27
TW201620669A (en) 2016-06-16
US20200346318A1 (en) 2020-11-05
CN106604802B (en) 2019-05-31
CN106604802A (en) 2017-04-26
US20170282325A1 (en) 2017-10-05
WO2016035673A1 (en) 2016-03-10
TWI678259B (en) 2019-12-01
US10759019B2 (en) 2020-09-01
KR20170048397A (en) 2017-05-08

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