SG10201801305PA - Polishing Apparatus And Polishing Method - Google Patents

Polishing Apparatus And Polishing Method

Info

Publication number
SG10201801305PA
SG10201801305PA SG10201801305PA SG10201801305PA SG10201801305PA SG 10201801305P A SG10201801305P A SG 10201801305PA SG 10201801305P A SG10201801305P A SG 10201801305PA SG 10201801305P A SG10201801305P A SG 10201801305PA SG 10201801305P A SG10201801305P A SG 10201801305PA
Authority
SG
Singapore
Prior art keywords
polishing
polishing apparatus
polishing method
Prior art date
Application number
SG10201801305PA
Inventor
Taro Takahashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201801305PA publication Critical patent/SG10201801305PA/en

Links

SG10201801305PA 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method SG10201801305PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014223293 2014-10-31
JP2015168088A JP2016087780A (en) 2014-10-31 2015-08-27 Polishing device and polishing method

Publications (1)

Publication Number Publication Date
SG10201801305PA true SG10201801305PA (en) 2018-03-28

Family

ID=56015959

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201508881RA SG10201508881RA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method
SG10201801305PA SG10201801305PA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201508881RA SG10201508881RA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method

Country Status (2)

Country Link
JP (1) JP2016087780A (en)
SG (2) SG10201508881RA (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064899A (en) * 2015-10-01 2017-04-06 株式会社荏原製作所 Polishing device
JP6779633B2 (en) * 2016-02-23 2020-11-04 株式会社荏原製作所 Polishing equipment
JP7140760B2 (en) 2016-10-21 2022-09-21 アプライド マテリアルズ インコーポレイテッド Core configuration of in-situ electromagnetic induction monitor system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001041828A (en) * 1999-07-27 2001-02-16 Tokyo Gas Co Ltd Temperature measuring device and measuring method using the same
WO2003066284A1 (en) * 2002-02-06 2003-08-14 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing with an eddy current monitoring system
JP2004014999A (en) * 2002-06-11 2004-01-15 Hitachi Chem Co Ltd Cmp polishing device and polishing method
KR100506942B1 (en) * 2003-09-03 2005-08-05 삼성전자주식회사 Chemical mechanical polishing apparatus
JP4451111B2 (en) * 2003-10-20 2010-04-14 株式会社荏原製作所 Eddy current sensor
JP2009125825A (en) * 2007-11-20 2009-06-11 Ebara Corp Electrolytic composite polishing method and electrolytic composite polishing device
US8523429B2 (en) * 2009-10-19 2013-09-03 Tsi Technologies Llc Eddy current thermometer

Also Published As

Publication number Publication date
SG10201508881RA (en) 2016-05-30
JP2016087780A (en) 2016-05-23

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