SG11201702213YA - Polishing apparatus and wafer polishing method - Google Patents

Polishing apparatus and wafer polishing method

Info

Publication number
SG11201702213YA
SG11201702213YA SG11201702213YA SG11201702213YA SG11201702213YA SG 11201702213Y A SG11201702213Y A SG 11201702213YA SG 11201702213Y A SG11201702213Y A SG 11201702213YA SG 11201702213Y A SG11201702213Y A SG 11201702213YA SG 11201702213Y A SG11201702213Y A SG 11201702213YA
Authority
SG
Singapore
Prior art keywords
polishing
wafer
polishing apparatus
polishing method
wafer polishing
Prior art date
Application number
SG11201702213YA
Inventor
Michito Sato
Junichi Ueno
Kaoru Ishii
Hiromi Kishida
Yuya Nakanishi
Ryosuke Yoda
Yosuke Kanai
Original Assignee
Shinetsu Handotai Kk
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk, Fujikoshi Machinery Corp filed Critical Shinetsu Handotai Kk
Publication of SG11201702213YA publication Critical patent/SG11201702213YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B25/00—Grinding machines of universal type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG11201702213YA 2014-10-21 2015-09-25 Polishing apparatus and wafer polishing method SG11201702213YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014214798A JP6093741B2 (en) 2014-10-21 2014-10-21 Polishing apparatus and wafer polishing method
PCT/JP2015/004874 WO2016063457A1 (en) 2014-10-21 2015-09-25 Polishing device and wafer polishing method

Publications (1)

Publication Number Publication Date
SG11201702213YA true SG11201702213YA (en) 2017-04-27

Family

ID=55760518

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702213YA SG11201702213YA (en) 2014-10-21 2015-09-25 Polishing apparatus and wafer polishing method

Country Status (8)

Country Link
US (1) US10532442B2 (en)
JP (1) JP6093741B2 (en)
KR (1) KR102344217B1 (en)
CN (1) CN107073675B (en)
DE (1) DE112015004419T5 (en)
SG (1) SG11201702213YA (en)
TW (1) TWI607501B (en)
WO (1) WO2016063457A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6765503B2 (en) * 2016-07-29 2020-10-07 モレキュラー インプリンツ， インコーポレイテッドＭｏｌｅｃｕｌａｒ Ｉｍｐｒｉｎｔｓ，Ｉｎｃ． Substrate loading in microlithography
CN108838868A (en) * 2018-05-23 2018-11-20 长江存储科技有限责任公司 Grinding wafer equipment and its operating method
JP7463142B2 (en) 2020-03-13 2024-04-08 株式会社東京精密 Polishing pad thickness measuring device
CN111906694A (en) * 2020-08-13 2020-11-10 蚌埠中光电科技有限公司 Online trimming device of glass grinding pad
CN112571238B (en) * 2020-12-03 2021-10-29 北京理工大学 Special grinding and polishing composite grinding tool fast switching device for robot

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3824345B2 (en) 1996-04-26 2006-09-20 東京エレクトロン株式会社 Polishing method and polishing apparatus
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
KR100565913B1 (en) * 2001-09-10 2006-03-31 가부시키가이샤 니콘 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method
JP4597634B2 (en) * 2004-11-01 2010-12-15 株式会社荏原製作所 Top ring, substrate polishing apparatus and polishing method
TWI451488B (en) * 2007-01-30 2014-09-01 Ebara Corp Polishing apparatus
US8870625B2 (en) * 2007-11-28 2014-10-28 Ebara Corporation Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
US20110104997A1 (en) * 2009-11-03 2011-05-05 Jeong In-Kwon Apparatuses and methods for polishing and cleaning semiconductor wafers
US9138860B2 (en) * 2010-04-20 2015-09-22 Applied Materials, Inc. Closed-loop control for improved polishing pad profiles
CN101934496B (en) * 2010-08-05 2012-02-15 清华大学 Chemical mechanical polishing machine and chemical mechanical polishing equipment with same
JP5898420B2 (en) * 2011-06-08 2016-04-06 株式会社荏原製作所 Polishing pad conditioning method and apparatus
JP5956287B2 (en) * 2012-08-23 2016-07-27 株式会社ディスコ Grinding equipment
CN103909466B (en) 2012-12-31 2016-06-22 中芯国际集成电路制造(上海)有限公司 Many cushions chemical mechanical polishing device
CN203245721U (en) * 2013-05-14 2013-10-23 中芯国际集成电路制造(北京)有限公司 Grinding adjusting device and chemical-mechanical grinding device

Also Published As

Publication number Publication date
CN107073675B (en) 2019-06-07
WO2016063457A1 (en) 2016-04-28
CN107073675A (en) 2017-08-18
KR20170072883A (en) 2017-06-27
JP6093741B2 (en) 2017-03-08
TW201630687A (en) 2016-09-01
KR102344217B1 (en) 2021-12-28
US20170304992A1 (en) 2017-10-26
US10532442B2 (en) 2020-01-14
DE112015004419T5 (en) 2017-08-10
JP2016082174A (en) 2016-05-16
TWI607501B (en) 2017-12-01

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