CN203245721U - Grinding adjusting device and chemical-mechanical grinding device - Google Patents
Grinding adjusting device and chemical-mechanical grinding device Download PDFInfo
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- CN203245721U CN203245721U CN 201320260008 CN201320260008U CN203245721U CN 203245721 U CN203245721 U CN 203245721U CN 201320260008 CN201320260008 CN 201320260008 CN 201320260008 U CN201320260008 U CN 201320260008U CN 203245721 U CN203245721 U CN 203245721U
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- grinding
- adjusting device
- disc
- disc brush
- pad
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Abstract
The utility model provides a grinding adjusting device and a chemical-mechanical grinding device. The chemical-mechanical grinding device comprises a grinding pad and the grinding adjusting device, and the grinding adjusting device is located above the grinding pad. The grinding adjusting device comprises a grinding adjusting arm and a diamond disk located at one end of the grinding adjusting arm and further comprises a disk brush located on the grinding adjusting arm, and the grinding adjusting arm drives the disk brush to move along with the diamond disk. After the chemical-mechanical grinding device is adopted, the grinding adjusting effect can be effectively improved, and the service life of the grinding pad can be prolonged.
Description
Technical field
The utility model relates to the ic manufacturing technology field, particularly a kind of grinding adjusting device and chemical mechanical polishing device.
Background technology
Planarization has become with photoetching and etching is of equal importance and one of complementary indispensable key technology in the IC manufacturing process.And chemically mechanical polishing (CMP) technique is effective, the most ripe present planarization.Chemical machinery polishing system is the chemical-mechanical planarization technology that integrates the technology such as cleaning, drying, online detection, end point determination.That integrated circuit (IC) is to the product of miniaturization, multiple stratification, planarization, slimming development.
Figure 1 shows that the top view of current main-stream CMP device, CMP device 100 comprises grinding head (Polishinghead) 101, places grinding pad (Pad) 102, slurry conveyer (Slurrydelivery) 103 and polishing pad adjusting device (PadConditioner) 104 above the grinding plate.Wherein, the wafer for the treatment of cmp is housed on the grinding head 101, under the effect of certain downforce, wafer surface film and grinding pad 102 and slurry interact and realize chemically mechanical polishing, and grinding head 101 relative grinding pads 102 are done rectilinear motion and the circular motion of self in the radial direction at it; Slurry conveyer 103 is used for providing needed slurry when grinding, and wherein slurry is the material of a kind of key in the chemical mechanical planarization process, grinds different films and selects different slurries, and it has a great impact speed, the quality of finish of CMP; Grinding pad 102 is made by porous, resilient polymer usually, has certain degree of hardness, durability, recyclability, porous and fillibility, can be transported to wafer surface under absorption ground slurry and the pressure at anchor clamps.In grinding pad 102 and grinding head 101 interactional use procedures, the surface of grinding pad 102 can absorb some residual slurries and particle and become level and smooth, and the grinding pad 102 after level and smooth can cause the grinding rate of wafer is descended.In order to keep the roughness of grinding pad 102, utilize polishing pad adjusting device 104 to readjust the surface of grinding pad 102, remove residual slurry and particle in the process of lapping, and the new slurry that slurry conveyer 103 provides is redistributed evenly.
The top view of grinding adjusting device 104 as described in such as Fig. 2 being, the surface of described slurry conveyer is diamond disc, by the effect between diamond disc and the grinding pad, the residual slurry and the particle polishing that are filled in the grinding pad surface are got rid of, make the certain roughness of surface recovery of grinding pad, thereby keep that wafer is had certain grinding rate.But the above-mentioned grinding adjusting device that comprises diamond disc stays residual slurry in the middle of the grinding pad and the particle effect is unsatisfactory removing, and the residual slurry and the particle that not have to remove can be in defectives such as wafer film surface formation scratch, surface particles.Usually, to grind the adjustment effect in order improving, can to adjust the effect between diamond disc and the grinding pad by adjusting the downforce of grinding adjusting device in the course of the work, thereby the effect of grinding adjustment is improved.But the method that applies downforce by reinforcement is optimized residual slurry and particle in the removal grinding pad, can cause the reduction of useful time of grinding pad.
Therefore, be necessary to develop a kind of grinding adjusting device raising and effect adjusted in the grinding of grinding pad, the life-span that can not reduce grinding pad simultaneously.
The utility model content
The purpose of this utility model is to provide a kind of grinding adjusting device and chemical mechanical polishing device, the problem that shortens to solve the service-life of grinding pad that causes by the downforce that increases grinding adjusting device of the prior art, reduce the generation of scuffing and surface ion defective, and guaranteed simultaneously life-span of grinding pad, thereby reach the purpose that improves yield and reduce production costs.
For solving the problems of the technologies described above, the utility model provides a kind of grinding adjusting device, comprise that one grinds the diamond disc of adjusting arm and being positioned at described grinding adjustment arm one end, in addition, also comprise the disc brush that is positioned on the described grinding adjustment arm, it is mobile with described diamond disc that described grinding adjustment arm drives described disc brush.
Optionally, described grinding adjusting device also comprises the first motor that is connected with described disc brush, the described disc brush rotation of described the first motor driving.
Optionally, described grinding adjusting device also comprises the second motor that is connected with described disc brush, and the brachium direction that the described disc brush of described the second motor driving is adjusted arm along described grinding moves.
Optionally, described grinding adjusting device also comprises the 3rd motor that is connected with described diamond disc, the described diamond disc rotation of described the 3rd motor driving.
Optionally, described grinding adjusting device also comprises controller about in the of, adjusts arm with described grinding and is connected.
Optionally, described grinding adjusting device also comprises:
The first pressure regulator is connected with described diamond disc; And
The second pressure regulator is connected with described disc brush.
Accordingly, the utility model also provides a kind of chemical mechanical polishing device, comprising:
One grinding pad; And
One described grinding adjusting device, described grinding adjusting device is positioned at the top of described grinding pad.
Optionally, in described chemical mechanical polishing device, described up and down controller presses to Surface Contact with described grinding pad with described diamond disc and disc brush.
Optionally, described chemical mechanical polishing device also comprises:
Be positioned at the grinding head of described grinding pad top, fix a wafer to be ground on the described grinding head; And
Be positioned at the slurry conveyer of described grinding pad top.
Grinding adjusting device provided by the utility model, comprise that one grinds the diamond disc of adjusting arm and being positioned at described grinding adjustment arm one end, also comprise the disc brush that is positioned on the described grinding adjustment arm, it is mobile with described diamond disc that described grinding adjustment arm drives described disc brush.Adjust arm in described grinding and increased disc brush, and mobile with described diamond disc, disc brush can in time be got rid of the slurry and the particle that remain in the grinding pad surface, thereby reduces the generation of the defectives such as wafer surface in the chemical mechanical planarization process is scratched.In addition, because increased disc brush, improved effect has been adjusted in the grinding of grinding pad, accelerated the recovery of grinding pad surface roughness, therefore do not need to improve by the downforce that increases diamond disc again effect is adjusted in the grinding of grinding pad, also just avoided the excessive polishing of diamond disc to grinding pad, the service life of having improved grinding pad.Simultaneously, disc brush can be evenly distributed new slurry, guarantees the grinding effect of cmp.
Description of drawings
Fig. 1 is the top view of chemical mechanical polishing device of the prior art;
Fig. 2 is the top view of diamond disc of the prior art;
Fig. 3 is the structural representation of the grinding adjusting device of the utility model embodiment one;
Fig. 4 is the structural representation of the chemical mechanical polishing device of the utility model embodiment two;
Fig. 5 is the top view of the chemical mechanical polishing device of the utility model embodiment two.
The specific embodiment
Below in conjunction with the drawings and specific embodiments grinding adjusting device and the chemical mechanical polishing device that the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-accurately ratio, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
Embodiment one
As shown in Figure 3, the grinding adjusting device 200 of the present embodiment comprises: one grind to adjust arm 201, be positioned at described grinding and adjust the diamond disc 202 of arm 201 1 ends and be positioned at described grinding and adjust disc brush 203 on the arm 201, arm 201 is adjusted in described grinding, and to drive described disc brush 203 mobile with described diamond disc 202.In addition, described disc brush 203 also is connected with the first motor 204 and the second motor 205, and described the first motor 204 drives described disc brush 203 rotations, and the brachium direction that the described disc brush 203 of described the second motor 205 drives is adjusted arm 201 along described grinding moves; Described diamond disc 202 also connects the 3rd motor 206, and described the 3rd motor 206 drives described diamond disc 202 rotations.
Because increased disc brush 203 grind adjusting arm 201, the rotation by disc brush 203 and along with grinding the swing of adjusting arm 201, and improved the removing function of grinding adjusting device 200.In addition, grinding adjustment arm 201 can drive disc brush 203 and move with described diamond disc 202, therefore the residual slurry and the particle that are cleared out by diamond disc 202 polishings can be disposed by disc brush 203 timely, further improve the removing effect to residual slurry and particle of grinding adjusting device 200, thereby reduced the defective that in chemical mechanical planarization process, is formed at wafer surface.
Continuation is with reference to figure 3, and preferred, grinding adjusting device 200 also comprises controller 207 about in the of, the first pressure regulator 208 and the second pressure regulator 209.Wherein, described up and down controller 207 is adjusted arm 201 with described grinding and is connected, and can control by described up and down controller 207 and grind rising and the decline of adjusting arm 201; The first pressure regulator 208 is connected with described diamond disc 202, is used for the downforce of control diamond disc 202; The second pressure regulator 209 is connected with described disc brush 203, is used for the downforce of control disc brush 203.
Embodiment two
As shown in Figure 4, the chemical mechanical polishing device 300 of the present embodiment comprises a grinding pad 301, grinding head 302 and grinding adjusting device 200.Wherein, described grinding pad 301 is positioned on the rotation platform, and described rotation platform can drive described grinding pad 301 rotations; Described grinding adjusting device 200 is positioned at the top of described grinding pad 301; Described grinding head 302 is positioned at the top of described grinding pad 301, described grinding head 302 also connects a grinding head motor 304, described grinding head motor 304 can drive described grinding head 302 rotations, described grinding head 301 is used for fixing a wafer 400 to be ground, and described wafer 400 is compressed to grinding pad 301 surfaces with predetermined downforce; Described slurry conveyer 303 is positioned at described grinding pad 301 tops, and being used for provides cmp employed slurry to grinding pad 301.
Continuation is with reference to figure 4, when treating mill wafer 400 when grinding, grinding head 302 presses down and will wafer 400 be ground presses to Surface Contact with described grinding pad 301, described up and down controller 207 is adjusted arm 201 with described grinding and is pressed down, and drives described diamond disc 202 and disc brush 203 and press to Surface Contact with described grinding pad 301.The downforce of diamond disc 202 can be regulated by the first pressure regulator 208, the downforce of disc brush 203 can be adjusted by the second pressure regulator 209.
In conjunction with Fig. 4 and Fig. 5, described chemical mechanical polishing device 300 also comprises a slurry conveyer 303, and described slurry conveyer 303 can be sent to needed slurry in the chemical mechanical planarization process surface of grinding pad 301.When described chemical mechanical polishing device 300 work, described grinding pad 301, grinding head 302, described diamond disc 202 and disc brush 203 all begin rotation, simultaneous grinding is adjusted arm 201 and is waved in certain angle, and drives simultaneously diamond disc 202 and disc brush 203 swings together.Wherein, path R1 is the rotate path of grinding head 302, and path R2 is the rotate path of diamond disc 202, and path R3 is the rotate path of disc brush 203, diamond disc 202 and disc brush 203 are also followed grinding adjustment arm 201 and are swung in angle A in rotation.From Fig. 5, can find out, by having increased disc brush 203, so that can be disposed by disc brush 203 in time from the residual slurry and the particle that are cleared out by diamond disc 202 polishings, improved to grind and adjusted effect.Therefore do not need to improve grinding by the downforce that increases diamond disc 202 and adjust effect, reduced the excessive polishing of 202 pairs of grinding pads 201 of diamond disc, thus the service life of having improved grinding pad 201.In addition, disc brush 203 can also be pushed the new slurry of putting on the grinding pad 301 open and again evenly distribution timely, has improved the grinding effect between wafer 400 and the grinding pad 301.
In sum, in described grinding adjusting device, adjust arm in described grinding and increased disc brush, and mobile with described diamond disc, disc brush can in time be got rid of the slurry and the particle that remain in the grinding pad surface, thereby reduces the generation of the defectives such as wafer surface in the chemical mechanical planarization process is scratched.In addition, because increased disc brush, improved effect has been adjusted in the grinding of grinding pad, accelerated the recovery of grinding pad surface roughness, therefore do not need to improve by the downforce that increases diamond disc again effect is adjusted in the grinding of grinding pad, also just avoided the excessive polishing of diamond disc to grinding pad, the service life of having improved grinding pad.Simultaneously, disc brush can be evenly distributed new slurry, guarantees the grinding effect of cmp.
Foregoing description only is the description to the utility model preferred embodiment; it is not any restriction to the utility model scope; any change, modification that the those of ordinary skill in the utility model field is done according to above-mentioned disclosure all belong to the protection domain of claims.
Claims (9)
1. grinding adjusting device, comprise that one grinds the diamond disc of adjusting arm and being positioned at described grinding adjustment arm one end, it is characterized in that, also comprise the disc brush that is positioned on the described grinding adjustment arm, it is mobile with described diamond disc that described grinding adjustment arm drives described disc brush.
2. grinding adjusting device as claimed in claim 1 is characterized in that, also comprises the first motor that is connected with described disc brush, the described disc brush rotation of described the first motor driving.
3. grinding adjusting device as claimed in claim 1 or 2 is characterized in that, also comprises the second motor that is connected with described disc brush, and the brachium direction that the described disc brush of described the second motor driving is adjusted arm along described grinding moves.
4. such as each described grinding adjusting device in the claim 3, it is characterized in that, also comprise the 3rd motor that is connected with described diamond disc, the described diamond disc rotation of described the 3rd motor driving.
5. grinding adjusting device as claimed in claim 4 is characterized in that, also comprises controller about in the of, adjusts arm with described grinding and is connected.
6. grinding adjusting device as claimed in claim 5 is characterized in that, also comprises:
The first pressure regulator is connected with described diamond disc; And
The second pressure regulator is connected with described disc brush.
7. a chemical mechanical polishing device comprises a grinding pad, it is characterized in that, also comprises:
Such as each described grinding adjusting device in the claim 1 to 6, described grinding adjusting device is positioned at the top of described grinding pad.
8. chemical mechanical polishing device as claimed in claim 7 is characterized in that, described up and down controller presses to Surface Contact with described grinding pad with described diamond disc and disc brush.
9. chemical mechanical polishing device as claimed in claim 7 is characterized in that, also comprises:
Be positioned at the grinding head of described grinding pad top, fix a wafer to be ground on the described grinding head; And
Be positioned at the slurry conveyer of described grinding pad top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320260008 CN203245721U (en) | 2013-05-14 | 2013-05-14 | Grinding adjusting device and chemical-mechanical grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320260008 CN203245721U (en) | 2013-05-14 | 2013-05-14 | Grinding adjusting device and chemical-mechanical grinding device |
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| Publication Number | Publication Date |
|---|---|
| CN203245721U true CN203245721U (en) | 2013-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320260008 Expired - Fee Related CN203245721U (en) | 2013-05-14 | 2013-05-14 | Grinding adjusting device and chemical-mechanical grinding device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878688A (en) * | 2014-03-27 | 2014-06-25 | 上海华力微电子有限公司 | Grinding pad cleaning device |
| CN106475896A (en) * | 2015-08-31 | 2017-03-08 | 力晶科技股份有限公司 | Chemical mechanical polishing apparatus and method |
| CN107073675A (en) * | 2014-10-21 | 2017-08-18 | 信越半导体股份有限公司 | The Ginding process of lapping device and chip |
| CN107877284A (en) * | 2016-09-27 | 2018-04-06 | 邱瑛杰 | Full-automatic glass polishing machine |
| CN108237467A (en) * | 2016-12-23 | 2018-07-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of processing method of grinding pad |
| CN108621033A (en) * | 2017-03-21 | 2018-10-09 | 中芯国际集成电路制造(上海)有限公司 | The grinding method of grinding pad |
| CN112476243A (en) * | 2020-11-26 | 2021-03-12 | 华虹半导体(无锡)有限公司 | Chemical mechanical polishing device and chemical mechanical polishing process polishing pad cleaning device |
-
2013
- 2013-05-14 CN CN 201320260008 patent/CN203245721U/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878688A (en) * | 2014-03-27 | 2014-06-25 | 上海华力微电子有限公司 | Grinding pad cleaning device |
| CN103878688B (en) * | 2014-03-27 | 2017-06-06 | 上海华力微电子有限公司 | A kind of grinding pad clearing apparatus |
| CN107073675A (en) * | 2014-10-21 | 2017-08-18 | 信越半导体股份有限公司 | The Ginding process of lapping device and chip |
| CN107073675B (en) * | 2014-10-21 | 2019-06-07 | 信越半导体股份有限公司 | The grinding method of grinding device and chip |
| CN106475896A (en) * | 2015-08-31 | 2017-03-08 | 力晶科技股份有限公司 | Chemical mechanical polishing apparatus and method |
| CN106475896B (en) * | 2015-08-31 | 2018-12-14 | 力晶科技股份有限公司 | Chemical Mechanical Polishing Apparatus and Method |
| CN107877284A (en) * | 2016-09-27 | 2018-04-06 | 邱瑛杰 | Full-automatic glass polishing machine |
| CN108237467A (en) * | 2016-12-23 | 2018-07-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of processing method of grinding pad |
| CN108237467B (en) * | 2016-12-23 | 2020-10-02 | 中芯国际集成电路制造(上海)有限公司 | Method for processing grinding pad |
| CN108621033A (en) * | 2017-03-21 | 2018-10-09 | 中芯国际集成电路制造(上海)有限公司 | The grinding method of grinding pad |
| CN108621033B (en) * | 2017-03-21 | 2020-04-07 | 中芯国际集成电路制造(上海)有限公司 | Polishing method of polishing pad |
| CN112476243A (en) * | 2020-11-26 | 2021-03-12 | 华虹半导体(无锡)有限公司 | Chemical mechanical polishing device and chemical mechanical polishing process polishing pad cleaning device |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131023 Termination date: 20190514 |
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| CF01 | Termination of patent right due to non-payment of annual fee |