SG10201407353UA - Substrate holder, polishing apparatus, polishing method, and retaining ring - Google Patents

Substrate holder, polishing apparatus, polishing method, and retaining ring

Info

Publication number
SG10201407353UA
SG10201407353UA SG10201407353UA SG10201407353UA SG10201407353UA SG 10201407353U A SG10201407353U A SG 10201407353UA SG 10201407353U A SG10201407353U A SG 10201407353UA SG 10201407353U A SG10201407353U A SG 10201407353UA SG 10201407353U A SG10201407353U A SG 10201407353UA
Authority
SG
Singapore
Prior art keywords
polishing
retaining ring
substrate holder
polishing apparatus
polishing method
Prior art date
Application number
SG10201407353UA
Inventor
Satoru Yamaki
Hozumi Yasuda
Keisuke Namiki
Osamu Nabeya
Makoto Fukushima
Shingo Togashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201407353UA publication Critical patent/SG10201407353UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
SG10201407353UA 2013-11-13 2014-11-07 Substrate holder, polishing apparatus, polishing method, and retaining ring SG10201407353UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013235210 2013-11-13
JP2014093840A JP6403981B2 (en) 2013-11-13 2014-04-30 Substrate holding device, polishing device, polishing method, and retainer ring

Publications (1)

Publication Number Publication Date
SG10201407353UA true SG10201407353UA (en) 2015-06-29

Family

ID=53044185

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201407353UA SG10201407353UA (en) 2013-11-13 2014-11-07 Substrate holder, polishing apparatus, polishing method, and retaining ring

Country Status (6)

Country Link
US (1) US9815171B2 (en)
JP (1) JP6403981B2 (en)
KR (2) KR20150055566A (en)
CN (1) CN104625948B (en)
SG (1) SG10201407353UA (en)
TW (1) TWI614091B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016155188A (en) * 2015-02-24 2016-09-01 株式会社荏原製作所 Retainer ring, substrate holding device, polishing device, and maintenance method of retainer ring
US10293454B2 (en) * 2015-06-11 2019-05-21 Toshiba Memory Corporation Polishing head, polishing apparatus and polishing method
TWD179095S (en) 2015-08-25 2016-10-21 荏原製作所股份有限公司 Substrate retaining ring
JP6392193B2 (en) * 2015-10-14 2018-09-19 株式会社荏原製作所 Substrate holding device, substrate polishing device, and method of manufacturing substrate holding device
US10510563B2 (en) * 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
SG11201900152SA (en) 2016-07-25 2019-02-27 Applied Materials Inc Retaining ring for cmp
SG11202008881QA (en) * 2018-03-13 2020-10-29 Applied Materials Inc Consumable part monitoring in chemical mechanical polisher
TWI639486B (en) * 2018-05-31 2018-11-01 國立清華大學 Omni-directional integrated conditioner device
JP6446590B1 (en) * 2018-08-09 2018-12-26 国立大学法人 東京大学 Local polishing method, local polishing apparatus, and corrected polishing apparatus using the local polishing apparatus
JP6927617B1 (en) * 2020-11-19 2021-09-01 不二越機械工業株式会社 Resin mat body for work polishing equipment and top ring

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US5681215A (en) * 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5795215A (en) 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
JP3724911B2 (en) 1997-04-08 2005-12-07 株式会社荏原製作所 Polishing equipment
EP1327498B1 (en) * 1997-04-08 2013-06-12 Ebara Corporation Polishing apparatus
US5885135A (en) * 1997-04-23 1999-03-23 International Business Machines Corporation CMP wafer carrier for preferential polishing of a wafer
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
TW434095B (en) * 1997-08-11 2001-05-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6293858B1 (en) * 1998-04-06 2001-09-25 Ebara Corporation Polishing device
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6390904B1 (en) * 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
JP2000233363A (en) * 1999-02-16 2000-08-29 Ebara Corp Polishing device and method therefor
TW399007B (en) * 1999-03-04 2000-07-21 Vanguard Int Semiconduct Corp Floating ring of the chemical mechanical polishing head
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
JP3068086B1 (en) * 1999-05-07 2000-07-24 株式会社東京精密 Wafer polishing equipment
JP2002018709A (en) * 2000-07-05 2002-01-22 Tokyo Seimitsu Co Ltd Wafer polishing device
US6419567B1 (en) * 2000-08-14 2002-07-16 Semiconductor 300 Gmbh & Co. Kg Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method
JP2003197580A (en) * 2001-12-21 2003-07-11 Fujikoshi Mach Corp Wafer polishing apparatus
US6916226B2 (en) * 2002-05-28 2005-07-12 Ebara Technologies, Inc. Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof
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US7344434B2 (en) * 2003-11-13 2008-03-18 Applied Materials, Inc. Retaining ring with shaped surface
TWI280177B (en) 2004-02-02 2007-05-01 Powerchip Semiconductor Corp Dummy process of chemical mechanical polishing process and polishing pad conditioning method
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
US7094133B2 (en) * 2004-11-10 2006-08-22 Kabushiki Kaisha Toshiba Retainer and wafer polishing apparatus
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
JP4814677B2 (en) 2006-03-31 2011-11-16 株式会社荏原製作所 Substrate holding device and polishing device
JP2008023603A (en) * 2006-07-18 2008-02-07 Nippon Seimitsu Denshi Co Ltd Retainer ring of two-layer structure
US7789736B2 (en) * 2006-10-13 2010-09-07 Applied Materials, Inc. Stepped retaining ring
JP4534165B2 (en) * 2006-12-18 2010-09-01 エルピーダメモリ株式会社 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
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JP5199691B2 (en) 2008-02-13 2013-05-15 株式会社荏原製作所 Polishing equipment
US20100120335A1 (en) * 2008-11-07 2010-05-13 Novellus Systems, Inc. Partial Contact Wafer Retaining Ring Apparatus
US20120034848A1 (en) * 2010-08-06 2012-02-09 Hung Chih Chen Substrate edge tuning with retaining ring
US20130102152A1 (en) * 2011-10-20 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
JP5922965B2 (en) * 2012-03-29 2016-05-24 株式会社荏原製作所 Substrate holding apparatus, polishing apparatus, and polishing method

Also Published As

Publication number Publication date
JP6403981B2 (en) 2018-10-10
KR20150055566A (en) 2015-05-21
CN104625948A (en) 2015-05-20
JP2015116656A (en) 2015-06-25
US20150133038A1 (en) 2015-05-14
TW201524679A (en) 2015-07-01
CN104625948B (en) 2019-04-09
US9815171B2 (en) 2017-11-14
TWI614091B (en) 2018-02-11
KR20180101303A (en) 2018-09-12
KR102208160B1 (en) 2021-01-27

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