SG11201607115QA - Manufacturing method of carrier for double-side polishing apparatus,carrier for double-side polishing apparatus, and double-side polishing method - Google Patents

Manufacturing method of carrier for double-side polishing apparatus,carrier for double-side polishing apparatus, and double-side polishing method

Info

Publication number
SG11201607115QA
SG11201607115QA SG11201607115QA SG11201607115QA SG11201607115QA SG 11201607115Q A SG11201607115Q A SG 11201607115QA SG 11201607115Q A SG11201607115Q A SG 11201607115QA SG 11201607115Q A SG11201607115Q A SG 11201607115QA SG 11201607115Q A SG11201607115Q A SG 11201607115QA
Authority
SG
Singapore
Prior art keywords
double
side polishing
carrier
polishing apparatus
manufacturing
Prior art date
Application number
SG11201607115QA
Inventor
Kazuya Sato
Yuki Tanaka
Syuichi Kobayashi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201607115QA publication Critical patent/SG11201607115QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201607115QA 2014-03-14 2015-02-13 Manufacturing method of carrier for double-side polishing apparatus,carrier for double-side polishing apparatus, and double-side polishing method SG11201607115QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014051332A JP6056793B2 (en) 2014-03-14 2014-03-14 Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method
PCT/JP2015/000662 WO2015136840A1 (en) 2014-03-14 2015-02-13 Method for manufacturing double-sided polishing device carrier, double-sided polishing device carrier, and double-sided polishing method

Publications (1)

Publication Number Publication Date
SG11201607115QA true SG11201607115QA (en) 2016-10-28

Family

ID=54071303

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201607115QA SG11201607115QA (en) 2014-03-14 2015-02-13 Manufacturing method of carrier for double-side polishing apparatus,carrier for double-side polishing apparatus, and double-side polishing method

Country Status (8)

Country Link
US (1) US20170069502A1 (en)
JP (1) JP6056793B2 (en)
KR (1) KR20160133437A (en)
CN (1) CN106061679B (en)
DE (1) DE112015000878T5 (en)
SG (1) SG11201607115QA (en)
TW (1) TWI593512B (en)
WO (1) WO2015136840A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6707831B2 (en) * 2015-10-09 2020-06-10 株式会社Sumco Grinding device and grinding method
JP6424809B2 (en) * 2015-12-11 2018-11-21 信越半導体株式会社 Double sided polishing method of wafer
JP6443370B2 (en) * 2016-03-18 2018-12-26 信越半導体株式会社 Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer
JP6665827B2 (en) * 2017-04-20 2020-03-13 信越半導体株式会社 Wafer double-side polishing method
CN107584407B (en) * 2017-07-08 2019-02-19 合肥嘉东光学股份有限公司 A kind of laser crystal double-sided polisher
JP6935635B2 (en) * 2017-09-06 2021-09-15 スピードファム株式会社 Carrier for holding objects to be polished for double-sided polishing equipment
JP7088522B2 (en) * 2017-09-27 2022-06-21 スピードファム株式会社 Work carrier manufacturing method and widening member for polishing work carrier
JP6937428B2 (en) * 2018-03-30 2021-09-22 積水化成品工業株式会社 Hydrogel
JP7070010B2 (en) * 2018-04-16 2022-05-18 株式会社Sumco Carrier manufacturing method and semiconductor wafer polishing method
JP7425411B2 (en) * 2020-10-12 2024-01-31 株式会社Sumco Carrier measurement device, carrier measurement method, and carrier management method
JP7435436B2 (en) * 2020-12-24 2024-02-21 株式会社Sumco How to polish carrier plate

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000153453A (en) * 1998-11-19 2000-06-06 Ngk Insulators Ltd Glass substrate polishing method
JP2001030161A (en) * 1999-07-16 2001-02-06 Toshiro Doi Carrier for polishing device
JP3791302B2 (en) * 2000-05-31 2006-06-28 株式会社Ｓｕｍｃｏ Semiconductor wafer polishing method using a double-side polishing apparatus
JP2004058201A (en) * 2002-07-29 2004-02-26 Hoya Corp Work polishing method and manufacturing method of substrate for electronic device
JP4241164B2 (en) * 2003-04-23 2009-03-18 日立電線株式会社 Semiconductor wafer polishing machine
JP2005014178A (en) * 2003-06-27 2005-01-20 Kyocera Kinseki Corp Double carrier used for polishing device
JP4154526B2 (en) * 2003-08-26 2008-09-24 株式会社村田製作所 Lap processing carrier thickness processing method
KR101193406B1 (en) * 2005-02-25 2012-10-24 신에쯔 한도타이 가부시키가이샤 Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method
KR100898821B1 (en) * 2007-11-29 2009-05-22 주식회사 실트론 Method for manufacturing wafer carrier
JP4985451B2 (en) * 2008-02-14 2012-07-25 信越半導体株式会社 Double-head grinding apparatus for workpiece and double-head grinding method for workpiece
JP2009285768A (en) * 2008-05-28 2009-12-10 Sumco Corp Method and device for grinding semiconductor wafer
JP2010023217A (en) * 2008-07-24 2010-02-04 Kyocera Chemical Corp Carrier disc for retaining article to be polished
JP5233888B2 (en) * 2009-07-21 2013-07-10 信越半導体株式会社 Method for manufacturing carrier for double-side polishing apparatus, carrier for double-side polishing apparatus and double-side polishing method for wafer
KR101209271B1 (en) * 2009-08-21 2012-12-06 주식회사 엘지실트론 Apparatus for double side polishing and Carrier for double side polishing apparatus
JP2011143477A (en) * 2010-01-12 2011-07-28 Shin Etsu Handotai Co Ltd Carrier for double-sided polishing device, double-sided polishing device using the same, and double-sided polishing method
JP5056961B2 (en) * 2010-02-01 2012-10-24 旭硝子株式会社 Glass substrate for magnetic recording medium and method for manufacturing the same
DE102010063179B4 (en) * 2010-12-15 2012-10-04 Siltronic Ag Method for simultaneous material-removing machining of both sides of at least three semiconductor wafers

Also Published As

Publication number Publication date
CN106061679A (en) 2016-10-26
US20170069502A1 (en) 2017-03-09
CN106061679B (en) 2017-07-21
WO2015136840A1 (en) 2015-09-17
JP6056793B2 (en) 2017-01-11
TWI593512B (en) 2017-08-01
JP2015174168A (en) 2015-10-05
TW201544245A (en) 2015-12-01
KR20160133437A (en) 2016-11-22
DE112015000878T5 (en) 2016-11-10

Similar Documents

Publication Publication Date Title
SG10201707291RA (en) Polishing apparatus and polishing method
IL250577B (en) Inspection apparatus, inspection method and manufacturing method
EP3637930B8 (en) Scheduling method and apparatus for d2d communication
SG11201607115QA (en) Manufacturing method of carrier for double-side polishing apparatus,carrier for double-side polishing apparatus, and double-side polishing method
PL3140945T3 (en) Efficient communication method and apparatus
SG11201608004XA (en) Polishing pad and process for producing same
GB201420603D0 (en) Manufacturing method, manufacturing apparatus, data processing metgod, data processing apparatus, data carrier
SG10201501574SA (en) Polishing apparatus and polishing method
SG11201607359XA (en) Polishing composition, polishing method, and method for producing substrate
GB201420730D0 (en) Filter, and apparatus and method for filter manufacture
EP3095556A4 (en) Double-head surface-grinding apparatus and grinding method
SG10201506731PA (en) Buffing apparatus, and substrate processing apparatus
EP3145105A4 (en) Radio resource scheduling method and apparatus
GB201420886D0 (en) Manufacturing method and manufacturing apparatus
SG11201702215RA (en) Polishing composition, method for manufacturing same, and polishing method
SG10201407353UA (en) Substrate holder, polishing apparatus, polishing method, and retaining ring
SG10201600958UA (en) Grinding wheel, grinding apparatus, and method of grinding wafer
GB2541575B (en) Additive manufacturing system, modeling-data providing apparatus and providing method
EP3108998A4 (en) Polishing apparatus and polishing method
SG11201703375WA (en) Substrate cleaning roll, substrate cleaning apparatus, and substrate cleaning method
SG11201703087WA (en) Communication apparatus and communication method
SG11201607807WA (en) Apparatus and method for reverse osmosis
SG10201608243QA (en) Polishing apparatus and polishing method
SG10201608558XA (en) Substrate holding device, substrate polishing apparatus, and method of manufacturing the substrate holding device
GB201412252D0 (en) Apparatus and methods for wireless communication