SG10201407984XA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10201407984XA
SG10201407984XA SG10201407984XA SG10201407984XA SG10201407984XA SG 10201407984X A SG10201407984X A SG 10201407984XA SG 10201407984X A SG10201407984X A SG 10201407984XA SG 10201407984X A SG10201407984X A SG 10201407984XA SG 10201407984X A SG10201407984X A SG 10201407984XA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
polishing
Prior art date
Application number
SG10201407984XA
Inventor
Hiroyuki Shinozaki
Nobuyuki Takahashi
Toru Maruyama
Suguru Sakugawa
Osamu Nabeya
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013248945A external-priority patent/JP6092086B2/en
Priority claimed from JP2014003237A external-priority patent/JP6232295B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201407984XA publication Critical patent/SG10201407984XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
SG10201407984XA 2013-12-02 2014-12-01 Polishing apparatus SG10201407984XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013248945A JP6092086B2 (en) 2013-12-02 2013-12-02 Polishing equipment
JP2014003237A JP6232295B2 (en) 2014-01-10 2014-01-10 Polishing equipment

Publications (1)

Publication Number Publication Date
SG10201407984XA true SG10201407984XA (en) 2015-07-30

Family

ID=53264257

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201407984XA SG10201407984XA (en) 2013-12-02 2014-12-01 Polishing apparatus

Country Status (5)

Country Link
US (1) US9662761B2 (en)
KR (1) KR101812839B1 (en)
CN (1) CN104669107B (en)
SG (1) SG10201407984XA (en)
TW (1) TWI609741B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6225088B2 (en) * 2014-09-12 2017-11-01 株式会社荏原製作所 Polishing method and polishing apparatus
SG10201606197XA (en) * 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
US9962805B2 (en) * 2016-04-22 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
US10155297B2 (en) * 2016-07-08 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing head
TWI623381B (en) * 2017-03-09 2018-05-11 台灣積體電路製造股份有限公司 Support carrier, system and method for leakage test
CN108573887B (en) * 2017-03-09 2021-02-09 台湾积体电路制造股份有限公司 Support carrier, leak testing system and method
JP6757696B2 (en) * 2017-04-21 2020-09-23 株式会社荏原製作所 A computer-readable recording medium that records a leak inspection method and a program for executing this leak inspection method.
CN107932254A (en) * 2017-11-01 2018-04-20 福建晶安光电有限公司 A kind of method of ultra-thin wafers planarization processing clamping
JP7074606B2 (en) * 2018-08-02 2022-05-24 株式会社荏原製作所 Top ring and board processing equipment for holding the board
JP2021041485A (en) * 2019-09-10 2021-03-18 キオクシア株式会社 Polishing device
CN111413237A (en) * 2020-04-14 2020-07-14 山东钢铁集团日照有限公司 Method for testing wear resistance of steel
CN115106927A (en) * 2022-06-28 2022-09-27 东莞市盈鑫半导体材料有限公司 Negative pressure heat laminating process for wax-free polishing adsorption pad

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW375556B (en) 1997-07-02 1999-12-01 Matsushita Electric Ind Co Ltd Method of polishing the wafer and finishing the polishing pad
JP2851839B1 (en) 1997-07-02 1999-01-27 松下電子工業株式会社 Wafer polishing method and polishing pad dressing method
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US6293849B1 (en) * 1997-10-31 2001-09-25 Ebara Corporation Polishing solution supply system
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
JP2001105298A (en) 1999-10-04 2001-04-17 Speedfam Co Ltd Inner pressure stabilizing device for fluid pressurization type carrier
US6666756B1 (en) * 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
JP3816297B2 (en) * 2000-04-25 2006-08-30 株式会社荏原製作所 Polishing equipment
KR100437456B1 (en) * 2001-05-31 2004-06-23 삼성전자주식회사 Polishing head of a chemical mechanical polishing machine and polishing method using the polishing head
JP3970561B2 (en) * 2001-07-10 2007-09-05 株式会社荏原製作所 Substrate holding device and substrate polishing device
US6712670B2 (en) * 2001-12-27 2004-03-30 Lam Research Corporation Method and apparatus for applying downward force on wafer during CMP
AU2003252687A1 (en) * 2002-07-26 2004-02-16 Nikon Corporation Polishing device
US6772784B1 (en) * 2003-04-11 2004-08-10 Mac Valves, Inc. Proportional pressure regulator having positive and negative pressure delivery capability
JP2005011977A (en) * 2003-06-18 2005-01-13 Ebara Corp Device and method for substrate polishing
AU2003250921A1 (en) 2003-07-09 2005-01-28 Peter Wolters Surface Technologies Gmbh And Co. Kg Holder for flat workpieces, in particular semiconductor wafers for mechanochemical polishing
JP4108023B2 (en) * 2003-09-09 2008-06-25 株式会社荏原製作所 Pressure control system and polishing apparatus
WO2005123335A1 (en) * 2004-06-21 2005-12-29 Ebara Corporation Polishing apparatus and polishing method
KR101958874B1 (en) * 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
JP5744382B2 (en) 2008-07-24 2015-07-08 株式会社荏原製作所 Substrate processing apparatus and substrate processing method
JP5390807B2 (en) * 2008-08-21 2014-01-15 株式会社荏原製作所 Polishing method and apparatus
JP5408790B2 (en) * 2009-03-06 2014-02-05 エルジー・ケム・リミテッド Float glass polishing system
JP5306065B2 (en) * 2009-06-04 2013-10-02 株式会社荏原製作所 Dressing apparatus and dressing method
JP5905359B2 (en) 2012-07-23 2016-04-20 株式会社荏原製作所 Pressure control apparatus and polishing apparatus provided with the pressure control apparatus

Also Published As

Publication number Publication date
KR101812839B1 (en) 2017-12-27
US20150151401A1 (en) 2015-06-04
CN104669107A (en) 2015-06-03
US9662761B2 (en) 2017-05-30
CN104669107B (en) 2019-03-12
KR20150063931A (en) 2015-06-10
TWI609741B (en) 2018-01-01
TW201529229A (en) 2015-08-01

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