SG10201707093XA - Grinding wheel and grinding apparatus - Google Patents

Grinding wheel and grinding apparatus

Info

Publication number
SG10201707093XA
SG10201707093XA SG10201707093XA SG10201707093XA SG10201707093XA SG 10201707093X A SG10201707093X A SG 10201707093XA SG 10201707093X A SG10201707093X A SG 10201707093XA SG 10201707093X A SG10201707093X A SG 10201707093XA SG 10201707093X A SG10201707093X A SG 10201707093XA
Authority
SG
Singapore
Prior art keywords
grinding
wheel
grinding wheel
grinding apparatus
Prior art date
Application number
SG10201707093XA
Inventor
Qiu Xiaoming
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201707093XA publication Critical patent/SG10201707093XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B24B41/0475—Grinding heads for working on plane surfaces equipped with oscillating abrasive blocks, e.g. mounted on a rotating head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
SG10201707093XA 2016-09-20 2017-08-30 Grinding wheel and grinding apparatus SG10201707093XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016182512A JP6814579B2 (en) 2016-09-20 2016-09-20 Grinding wheel and grinding equipment

Publications (1)

Publication Number Publication Date
SG10201707093XA true SG10201707093XA (en) 2018-04-27

Family

ID=61618310

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201707093XA SG10201707093XA (en) 2016-09-20 2017-08-30 Grinding wheel and grinding apparatus

Country Status (6)

Country Link
US (1) US10639761B2 (en)
JP (1) JP6814579B2 (en)
KR (1) KR102260927B1 (en)
CN (1) CN107838767B (en)
SG (1) SG10201707093XA (en)
TW (1) TWI731145B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10685863B2 (en) * 2018-04-27 2020-06-16 Semiconductor Components Industries, Llc Wafer thinning systems and related methods
JP2020015105A (en) * 2018-07-23 2020-01-30 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
CN110355621B (en) * 2019-07-17 2021-03-16 大连理工大学 Combined grinding wheel for ultrasonic machining and design method thereof
CN110682166B (en) * 2019-09-05 2021-01-22 上海工程技术大学 Ultrasonic generating device for ultrasonic vibration grinding machine
CN110722406B (en) * 2019-09-17 2021-04-20 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Profile grinding chamfering method for special-shaped tellurium-zinc-cadmium wafer
TWI739684B (en) * 2020-12-01 2021-09-11 李慧玲 Ultrasonic Conduction Grinding Module
JP2022117116A (en) * 2021-01-29 2022-08-10 株式会社ディスコ Peeling device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2939251A (en) * 1957-02-18 1960-06-07 Micromatic Hone Corp High frequency honing
JPH0722876B2 (en) * 1987-06-24 1995-03-15 新技術事業団 Work table device for grinding
US6264532B1 (en) * 2000-03-28 2001-07-24 Speedfam-Ipec Corporation Ultrasonic methods and apparatus for the in-situ detection of workpiece loss
US6467321B2 (en) * 2000-05-30 2002-10-22 Integrity Testing Laboratory, Inc. Device for ultrasonic peening of metals
JP2003057027A (en) * 2001-08-10 2003-02-26 Ebara Corp Measuring instrument
JP5020963B2 (en) * 2006-10-17 2012-09-05 一正 大西 Disc-shaped cutting tool and cutting device
JPWO2008108463A1 (en) * 2007-03-07 2010-06-17 大西　一正 Polishing tool and polishing apparatus
JP5049095B2 (en) * 2007-10-30 2012-10-17 株式会社ディスコ Grinding wheel
JP2013031887A (en) * 2009-11-25 2013-02-14 Kazumasa Onishi Grinding tool
CN101947749B (en) * 2010-09-14 2011-11-16 西安理工大学 Numerical control machine tool capable of grinding two sides of plane by dislocation self-rotation and ultrasonic vibration
WO2014111973A1 (en) * 2013-01-16 2014-07-24 三重電子株式会社 Machining device
JP2015013321A (en) * 2013-07-03 2015-01-22 株式会社ディスコ Grinding wheel
JP6192525B2 (en) * 2013-12-13 2017-09-06 株式会社ディスコ Abrasive embedding method
JP2015202545A (en) * 2014-04-16 2015-11-16 株式会社ディスコ Grinding device
TW201632272A (en) * 2015-03-04 2016-09-16 中原大學 System of detection and transmission of ultrasonic manufacturing

Also Published As

Publication number Publication date
US20180079046A1 (en) 2018-03-22
JP6814579B2 (en) 2021-01-20
CN107838767B (en) 2021-10-15
CN107838767A (en) 2018-03-27
TWI731145B (en) 2021-06-21
KR102260927B1 (en) 2021-06-03
JP2018047508A (en) 2018-03-29
KR20180031574A (en) 2018-03-28
US10639761B2 (en) 2020-05-05
TW201817544A (en) 2018-05-16

Similar Documents

Publication Publication Date Title
SG10201707291RA (en) Polishing apparatus and polishing method
IL261131A (en) Roasting and grinding system
SG10201502022QA (en) Polishing device and polishing method
SG10201705676VA (en) Grinding apparatus
SG10201707093XA (en) Grinding wheel and grinding apparatus
SG10201501574SA (en) Polishing apparatus and polishing method
SG10201506731PA (en) Buffing apparatus, and substrate processing apparatus
SG10201501986YA (en) Grinding wheel and cleaning method for grinding chamber
SG11201701946PA (en) Travel path grinding device and travel path grinding method
SG10201600958UA (en) Grinding wheel, grinding apparatus, and method of grinding wafer
SG10201701239TA (en) Polishing apparatus
EP3417997A4 (en) Grinding apparatus
HUP1600491A2 (en) Method and apparatus for grinding and final smoothing
GB201616152D0 (en) Well apparatus and associated methods
GB201413522D0 (en) Steering apparatus and housing for steering apparatus
EP3108998A4 (en) Polishing apparatus and polishing method
SG10201508329UA (en) Buffing apparatus and substrate processing apparatus
SG11201703396YA (en) Polishing device and polishing method
SG10201608243QA (en) Polishing apparatus and polishing method
SG10202101299QA (en) Polishing apparatus and polishing method
SG10201601410RA (en) Grinding wheel
SG11201702213YA (en) Polishing apparatus and wafer polishing method
PL3493948T3 (en) Grinding device and method for operating the grinding device
SG11201707991SA (en) Polishing apparatus and polishing method
SG11201709068RA (en) Grinding wheel