KR102637833B1 - Carrier head of chemical mechanical apparatus and membrane used therein - Google Patents

Abstract

The present invention relates to a carrier head of a chemical mechanical polishing device and a membrane used therein, comprising a first fixing flap extending laterally from the upper end of the side of the membrane and a second fixing flap extending upward from the upper end of the side of the membrane. In addition, a membrane of a carrier head for a polishing device is provided, in which a first inclined portion and a second inclined portion are provided on the second fixing flap, and a third extended portion is formed in close contact with the bottom of the base.

Description

Carrier head for polishing device and membrane used therefor {CARRIER HEAD OF CHEMICAL MECHANICAL APPARATUS AND MEMBRANE USED THEREIN}

The present invention relates to a carrier head for a polishing device and a membrane used therein, and more specifically, to a carrier head for a polishing device that maintains polishing quality by applying a uniform pressing force to the edge of the substrate even when the wear state of the retainer ring etc. varies. and membranes used therefor.

The chemical mechanical polishing (CMP) device is used for wide-area planarization and circuit formation to eliminate the height difference between the cell area and the surrounding circuit area due to irregularities on the wafer surface generated while repeatedly performing masking, etching, and wiring processes during the semiconductor device manufacturing process. This is a device used to precisely polish the surface of a wafer to improve the wafer surface roughness due to contact/wiring film separation and high-integration deviceization.

In this CMP device, the carrier head performs the polishing process by pressing the wafer with the polishing surface of the wafer facing the polishing pad before and after the polishing process, and at the same time, when the polishing process is completed, the wafer is directly and indirectly Move to the next process while holding it by vacuum adsorption.

1A and 1B are diagrams showing the configuration of a general polishing device. As shown in the figure, the polishing device 9 includes a polishing plate 10 that rotates (10r) with a polishing pad 11 applied to its upper surface, and a polishing surface of the substrate in contact with the polishing pad 11. A carrier head 2 that rotates (2r) while being pressed downward (Pc), a slurry supply unit (3) that supplies slurry for chemical polishing of the substrate (W), and a polishing pad (11) during the polishing process of the substrate. It is configured to include a conditioner (4) that improves the state of.

The polishing surface of the substrate W is rotated 2r by the carrier head 2 while being pressed against the polishing pad 11, and a mechanical polishing process is performed by friction with the polishing pad 11, and at the same time, the substrate W A chemical polishing process is simultaneously performed on the polished surface while slurry is supplied from the slurry supply port 31. The present invention can be applied when a mechanical polishing process and a chemical polishing process are performed together, and can also be applied when only a mechanical polishing process is performed.

During the polishing process of the substrate, the conditioner 4 places the conditioning disk at the end of the arm 41, rotates it (4r) while pressing it downward, and performs a reciprocating rotational movement (4d) in a predetermined angle range. As a result, a modification process is performed over the entire area of the polishing pad 11.

As shown in Figure 2, the carrier head 2 includes a main body 2x and a base 22 that rotate by receiving a rotational driving force from the outside, a membrane 21 fixed to the base 22, and a membrane bottom. It consists of a retainer ring 23 that is spaced apart in a ring shape around the plate 211 and whose bottom adheres to the polishing pad 11 during the polishing process to prevent the substrate from being separated. Here, the main body 2x and the base 22 may be formed as one piece, or may be separated from each other and connected by a connecting member.

Here, the membrane 21 includes a membrane bottom plate 211 formed in the shape of the substrate W and in close contact with the non-polished surface of the substrate, and a membrane side plate 212 extending upward from the edge of the membrane bottom plate 211. ) and a partition flap 213 extending from the membrane bottom plate 211 and fixed to the base 22. The end of the partition flap 213 is fixed in the gap while the coupling member 22a is coupled to the base 22, and through this, the partition flap 213 is fixed to the base 22.

In addition, the first fixing flap 2121 extends radially inward from the upper end of the membrane side 212, is inserted into the gap while the coupling member 22a is fixed to the base 22, and its end is fixed to the base ( 22). The second fixing flap 2122 extends upward from the upper end of the membrane and is then bent to extend radially inward. Likewise, the second fixing flap 2122 is also fixed to the base 22 by fixing the end thereof in the gap while the coupling member 22a is fixed to the base 22.

In this specification, the 'coupling member 22a' coupled to the base 22 throughout is considered to be included as a part of the base 22.

Accordingly, when pneumatic pressure is supplied from the pressure control unit 25, a plurality of main pressure chambers (C1, C2, C3, C4) partitioned by the partition flap 213 are formed between the membrane bottom plate 211 and the base 22. , C5) expands, the force (P) pressing the bottom plate 211, which is the bottom surface of the main pressure chamber (C1, C2, C3, C4, C5), is adjusted independently for each chamber, and the substrate (W) is moved to the area. Not very pressurized. In addition, an auxiliary pressure chamber (Cx) is formed at the upper end of the outermost main pressure chamber (C5) by the first fixing flap 2121, the second fixing flap 2122, and the base 22, and the auxiliary pressure chamber (Cx) ) pressure (Px) is transmitted downward through the membrane side 212 to pressurize the edge portion of the substrate (W).

And, the retainer ring 23 is formed in a ring shape surrounding the periphery of the membrane bottom plate 211. The retainer ring 23 may be provided with a separate pneumatic chamber on its upper side and may be configured to move in the up and down direction by the pressure of the pneumatic chamber, and may be formed integrally with the main body 2x as shown in the drawing. It may be possible.

The carrier head 2 configured as described above must uniformly pressurize the substrate W for each polishing process to achieve uniform polishing quality of the substrate.

However, when the polishing process is repeated, the retainer ring 23 and the polishing pad 11 are worn, thereby causing the vertical position of the membrane to fluctuate. That is, if the retainer ring 23 is worn as an example, the distance between the membrane bottom plate 211 and the bottom of the retainer ring 23 during the polishing process is constant as the thickness (tw) of the substrate, so the retainer ring 23 ) As the amount of wear increases, the membrane is displaced upward (99).

For convenience, Figure 3a illustrates the state in which the membrane 21 is in a predetermined shape during the polishing process as the reference position of the membrane, and Figure 3b shows the state in which the membrane is lifted upward due to wear of the retainer ring 23. Here, the state in which the membrane is lifted upward means that the distance between the membrane bottom plate 211 and the polishing pad 11 is assumed to be that the substrate W is not positioned on the carrier head 2 introduced in the polishing process. This means that the floor plate separation distance (y) has been reduced. Hereinafter, the explanation will simply be based on the 'floor plate separation distance (y)'.

As described above, when the membrane 21 moves up and down depending on the amount of wear of the polishing pad or the retainer ring 23, a subtle difference occurs in the shape of the flap of the membrane depending on the up and down movement of the membrane 21.

For this reason, if the polishing process variables such as pneumatic pressure and rotation speed are appropriately adjusted while the flaps of the membrane 21 are in a predetermined shape, as shown in the polishing profile indicated by Si in Figure 6, the edge ( The shape of the polishing surface (polishing profile) up to the edge can be uniformly adjusted throughout.

However, as the amount of wear of the retainer ring 23 increases, the displacement 99 by which the membrane 21 is lifted and moved upward increases, and accordingly, the pressing force pressing the substrate changes in the edge area of the substrate.

That is, when the amount of wear of the retainer ring 23 increases and the floor plate separation distance (y) decreases to y', the membrane 21 as a whole is lifted upward and moves, and the membrane side 212 that moved upward is Since the upper bent portion (Vx) of the 'L' shaped second fixing flap 2122 extending from the upper end is blocked on the bottom of the base 22, the membrane side 212 is moved upward due to displacement 99. The reaction force is transmitted downward along the side. Accordingly, compared to the pressing force (Fe) transmitted downward along the side 212 when the membrane 21 is at the reference position (FIG. 3a), the position at which the membrane 21 is lifted upward and moves (FIG. 3b) In the case where the pressing force (Fe') transmitted downward along the side 212 becomes larger.

Therefore, even if the polishing process parameters are set to obtain the uniform polishing profile shown in Si in FIG. 6 at the reference position shown in FIG. 3A, the membrane side 212 is lifted upward and moves due to wear of the retainer ring 23. It was experimentally found that in one state, the amount of polishing at the edge of the substrate is greater, so that the polishing profile indicated by S1 in Figure 6 is obtained.

Meanwhile, a method may be sought to lower the pressure of the auxiliary pressure chamber (Cx) according to the wear amount of the retainer ring 23, but the pressure of the auxiliary pressure chamber (Cx) may be adjusted according to the wear amount measurement value of the retainer ring 23 during the polishing process. It is very difficult to accurately change , so it is not desirable.

Meanwhile, the membrane 21' of another type of carrier head 2' shown in FIG. 4 may be configured without the auxiliary pressure chamber Cx. This configuration of the membrane 21' has a limitation in that the rigidity of the membrane side 212' is low, and as the pressure in the outermost pressure chamber increases, the bottom plate 21a at the edge is lifted, making it difficult to introduce sufficient pressing force to the edge of the substrate. There is. Therefore, even if the polishing process variables are appropriately controlled with the membrane 21' shown in FIG. 6, the polishing profile indicated by Si in FIG. 6 cannot be obtained due to low polishing quality at the edge of the substrate, and the polishing profile indicated by S3 in FIG. 6 is not obtained. It is undesirable because it is inevitable to obtain .

Even if the auxiliary pressure chamber (Cx) is formed on the upper side of the other type of carrier head 2' shown in FIG. 4, the rigidity of the membrane side 212' is low, so the pressure (Px) in the auxiliary pressure chamber (Cx) ) cannot be transmitted downward along the side surface 212', making it difficult to obtain the polishing profile indicated by Si in FIG. 6.

Meanwhile, in relation to the membrane 21 shown in Figure 3b, when the amount of wear of the retainer ring 23 increases and a displacement 99 that causes the membrane side 212 to be lifted upward occurs, the second fixing flap 2122 ), there was a problem that as the tip of the upper extension part (Vx) contacted the bottom surface (Sb) of the base 22, the force pushing the membrane side 212 downward due to the reaction force became larger.

As a solution to this problem, it is possible to explore a method of forming the second fixing flap 2122" into a shape including a wrinkle portion 88, as shown in Figure 5. The second fixing flap 2122" ), when the wrinkles 88 are formed, even if the membrane side 212 is lifted upward depending on the amount of wear of the retainer ring 23, the wrinkles 88 of the second fixing flap 2122" are aligned with the membrane side 212. ), it is possible to prevent the problem of an increase in the size of the pressing force (Fe") applied to the edge of the substrate through the membrane side 212.

However, in the structure where the corrugated portion 88 is formed on the second fixing flap 2122" and the end thereof is fixed to the bottom of the base 22, the centrifugal force generated as the carrier head 2" rotates during the polishing process There is a problem in that twisting deformation occurs at the edge of the membrane due to the second fixing flap 2122", which is formed long to the fixed end due to the wrinkles 88. Due to this, the side of the membrane fluctuates. As it gets worse, fluctuations occur in the pressing force pressing the edge of the substrate, causing a problem that deteriorates the polishing quality of the edge of the substrate.

In addition, due to the centrifugal force caused by high-speed rotation during the polishing process, the upper region extending in the horizontal direction between the wrinkles 88 and the end is spaced (c) from the bottom surface Sb of the base 22. . Accordingly, even if the forces acting on the surface of the wrinkles 88 cancel each other in the vertical direction, the upward lifting force Fd acts on the upper area of the second fixing flap, so that the upper part of the auxiliary pressure chamber Cx 2The fixing flap (2122") causes a force (Fr) to lift the membrane side 212 upward, causing the displacement of the membrane side 212 moving upward as the wear amount of the retainer ring 23 increases. (99). Accordingly, when the membrane is in the reference position, the pressing force (Fe) that presses the edge of the substrate through the membrane side 212 with the pressure (Px) of the auxiliary pressure chamber (Cx) In comparison, a rather lower pressing force (Fe") is applied.

Therefore, even if the polishing process parameters are set to have the Si polishing profile of FIG. 6 with the membrane 21" shown in FIG. 5, as the polishing process is repeated and the amount of wear on the bottom of the retainer ring 23 increases, the edge portion of the substrate becomes more worn. It was experimentally confirmed that the pressing force (Fe") gradually decreased to obtain the polishing profile indicated by S2 in Figure 6.

In this way, the polishing process variables such as the rotation speed of the carrier head, the pressure of the main pressure chamber and the auxiliary pressure chamber, and the rotation speed of the polishing platen are adjusted so that the polishing profile of the substrate (W) is a uniform profile (Si) from the center to the edge. Even if set, the polishing quality of the edge portion of the substrate varies as the bottom plate separation distance (y) between the membrane bottom plate 211 and the polishing pad 11 changes as the polishing process progresses.

In addition, when centrifugal force due to the rotation of the carrier head 2 acts, distortion occurs on the membrane side 212 and the second fixing flap 2122", making it impossible to accurately press the edge of the substrate, thereby reducing the polishing quality. This problem of deterioration occurs.

Therefore, even if the settings of the polishing process variables are not changed during the polishing process or for each polishing process, the amount of polishing at the edge of the substrate is maintained uniformly, and a constant pressing force is applied to the edge of the substrate regardless of the amount of wear of the retainer ring and polishing pad. There is an urgent need for a membrane structure that can

In addition, there is a need for a method to solve the problem that the pressing force is not sufficiently applied to the edge of the substrate due to distortion of the membrane during the polishing process or the polishing quality is degraded due to fluctuations in the applied pressing force.

The above background technology describes other forms of configuration obtained in the process of deriving the present invention to aid understanding of the present invention, and does not mean prior art known before the filing date of the present invention.

The present invention was created under the above-described technical background, and provides a membrane with a structure that uniformly maintains the pressing force applied to the edge of the substrate, regardless of the amount of wear of the retainer ring or polishing pad, without separately adjusting the variables of the polishing device, and the same. The purpose is to provide a carrier head provided.

In addition, the present invention aims to minimize distortion of the membrane and apply a constant pressing force to the edge of the substrate despite the centrifugal force of the carrier head rotating at high speed during the polishing process.

In order to achieve the above object, the present invention is provided with a first fixing flap extending laterally from the upper end of the membrane side, and a second fixing flap extending upward from the upper end of the membrane side, and the second fixing flap has a second fixing flap. It provides a membrane of a carrier head for a polishing device, which is provided with a first inclined portion and a second inclined portion, and a third extended portion is formed to be in close contact with the bottom of the base.

As used herein and in the claims, “outer” or similar terms are defined to refer to a radial direction (r) outward from the center of the membrane bottom plate. Similarly, as used herein and in the claims, “inner” or similar terms are defined to refer to a radial inward direction from the center of the membrane sole.

Terms such as “top” or similar “upward” as used in the specification and claims are defined to refer to the direction (z) away from the membrane bottom plate toward the base.

As used herein and in the claims, “horizontal distance” and similar terms are defined to refer to the separation distance in a direction parallel to the membrane bottom plate.

“Horizontal plane” as used in the specification and claims refers to a virtual horizontal plane and is defined to refer to any horizontal plane parallel to the membrane bottom plate.

The "outermost main chamber" described in the present specification and patent claims is the main pressure chamber located at the outermost radius based on the center of the membrane bottom plate, and includes a part of the membrane bottom plate as a pressure surface for pressing the substrate. Defined as referring to the main pressure chamber.

The “auxiliary pressure chamber” described in the present specification and claims is defined as referring to a ring-shaped pressure chamber located on the upper side of the outermost main chamber with the first fixing flap as a boundary.

The “bottom plate separation distance (y)” described in the specification and claims refers to the state in which the carrier head 2 is located at the position where the polishing process is performed, and the substrate W is not located below the carrier head. Assuming that a constant pressure (P) is supplied to the pressure chamber of the carrier head, it is defined to refer to “the separation distance between the bottom surface of the membrane bottom plate and the top surface of the polishing pad.”

Accordingly, when the substrate is positioned and the retainer ring is fixed to the carrier head and the wear amount of the retainer ring increases, the distance between the bottom plates decreases and a displacement that lifts the membrane occurs. When the substrate is positioned, the retainer ring can move up and down on the carrier head, and the height of the carrier head where the polishing process is performed is fixed. If the amount of wear on the polishing pad increases, the separation distance between the bottom plates increases, causing the membrane to move downward. Displacement occurs.

The “reference position” described in this specification and patent claims is “a position arbitrarily determined to prepare for before and after wear of the retainer ring as a state before wear” or “a carrier in which the retainer ring can move up and down on the carrier head and where the polishing process is performed. It is defined as “a position arbitrarily determined to prepare for before and after wear of the polishing pad as it is the state before wear of the polishing pad while the height of the head is fixed.”

In other words, it is intended to relatively compare the state before and after wear of the retainer ring or polishing pad, and the state before wear of the retainer ring or polishing pad is defined as the 'reference position'. Therefore, the 'reference position' can be determined arbitrarily, and for convenience of explanation, in the embodiment of the present invention, 'the state in which the fixed flap of the membrane maintains its original shape (FIG. 9a)' is used as an example.

According to the present invention, even if wear of the polishing pad or retainer ring progresses while repeating the polishing process, resulting in displacement of the membrane side moving in the vertical direction, a uniform pressing force is applied to the edge of the substrate to maintain the polishing profile of the substrate. There is an advantageous effect of implementing a polishing process that uniformly forms.

In other words, the present invention achieves the effect of applying a uniform pressing force to the edge of the substrate even if the bottom plate separation distance (y) between the membrane bottom plate and the polishing pad changes only by the membrane shape without changing the polishing process variables during the polishing process. You can.

Through this, the present invention can achieve the effect of reliably maintaining the polishing quality of the substrate.

1A is a front view showing the configuration of a general substrate polishing device;
Figure 1B is a plan view of Figure 1A,
Figure 2 is a half cross-sectional view showing the configuration of the carrier head of Figure 1A;
Figure 3 is an enlarged view of part 'A' of Figure 2,
Figure 4 is an enlarged view showing the configuration of the edge portion of another type of carrier head;
Figure 5 is an enlarged view showing the configuration of the edge portion of another type of carrier head;
Figure 6 is a graph showing the polishing profile of the substrate according to the membrane structure;
Figure 7 is a cross-sectional view showing the membrane of the carrier head of the substrate polishing apparatus according to the first embodiment of the present invention;
Figure 8 is an enlarged view of part 'B' of Figure 7,
Figure 9a is a configuration corresponding to part 'A' of Figure 2, and is a diagram showing the state of pressing force during the polishing process when the membrane of Figure 7 is mounted on the carrier head;
Figure 9b is a diagram showing the application of pressing force transmitted through the side of the membrane during the polishing process when the membrane of Figure 7 is mounted on the carrier head in a state where the bottom plate separation distance is reduced and the side of the membrane moves upward;
Figure 9c is a diagram illustrating the application of pressing force transmitted through the side of the membrane during the polishing process when the membrane of Figure 7 is mounted on the carrier head in a state in which the side of the membrane moves downward due to an increase in the separation distance from the bottom plate;
Figure 10 is an enlarged view of part 'C' of Figure 9b,
Figure 11 shows a state in which the membrane of the carrier head of the substrate polishing apparatus according to the second embodiment of the present invention is mounted on the carrier head and the pressing force transmitted through the side of the membrane during the polishing process is shown in a state in which the bottom plate separation distance is reduced. floor plan,
Figure 12 shows a state in which the membrane of the carrier head of the substrate polishing device according to the third embodiment of the present invention is mounted on the carrier head and the pressing force transmitted through the side of the membrane during the polishing process is shown in a state in which the bottom plate separation distance is reduced. floor plan,
Figure 13 shows a state in which the membrane of the carrier head of the substrate polishing device according to the fourth embodiment of the present invention is mounted on the carrier head and the pressing force transmitted through the side of the membrane during the polishing process is shown in a state in which the bottom plate separation distance is reduced. floor plan,
Figure 14 is an enlarged view of the edge portion of the membrane of the carrier head of the substrate polishing apparatus according to the fifth embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in this description, the same numbers refer to substantially the same elements, and under these rules, the description can be made by citing the content shown in other drawings, and content that is judged to be obvious to those skilled in the art or that is repeated can be omitted.

The carrier head 201 for a substrate polishing apparatus according to the first embodiment of the present invention is formed similarly to the configuration of the carrier head 2 described with reference to FIG. 2. That is, the carrier head 201 includes a main body 2x that is connected to a drive shaft (not shown) and driven to rotate, a base 22 that is connected to the main body 2x and rotates together, and the main body 2x and the base 22. ) A retainer ring 23 in the form of a ring that is connected and fixed to one or more of the two and rotates together, and a main pressure chamber (C1, C2, C3, C4, C5) fixed to the base 22 and between the base 22. and a membrane 101 that forms an auxiliary pressure chamber (Cx) and is made of a flexible material that easily undergoes at least one of stretching and bending deformation, the main pressure chambers (C1,...,C4, C5), and the auxiliary It consists of a pressure control unit 25 that supplies pneumatic pressure to the pressure chamber Cx to control the pressure.

Although the overall shape is not shown in the drawing, it is formed by rotating the shape as shown in the half-sectional view shown in FIG. 2 by 360 degrees.

The base 22 is formed integrally with the main body 2x or is connected to a connecting member (not shown), and rotates together during the polishing process by a rotational driving force transmitted from the outside. Accordingly, the membrane 101 and the retainer ring 23 fixed to one or more of the base 22 and the main body 2x also rotate.

The retainer ring 23 is formed in a ring shape surrounding the circumference of the bottom plate 110 of the membrane 101. The retainer ring 23 remains in close contact with the polishing pad 11 during the polishing process, so that the substrate located on the lower side of the membrane bottom plate 110 does not fall out of the carrier head 201 despite the frictional force. prevent it from happening.

The retainer ring 23 is formed integrally with the main body 2x of the carrier head 201, and its bottom surface is attached to the polishing pad 11 by the vertical movement of the carrier head 201 or the vertical movement of the polishing plate 10. It can be configured to remain in close contact. Alternatively, a separate pneumatic chamber is formed on the upper side of the retainer ring 23, and when positive pressure is supplied to the pneumatic chamber, the retainer ring 23 moves downward and its bottom surface is in close contact with the upper surface of the polishing pad 11. It may be configured as such. In this case, since the retainer ring 23 is provided with a drive mechanism that moves in the up and down direction and comes into close contact with the polishing pad 11 for the polishing process, the carrier head 201 typically moves relative to the polishing pad 11. The polishing process is performed at a specified height.

As shown in FIG. 7, the membrane 101 includes a membrane bottom plate 110 that positions the substrate W in close contact with the bottom surface during the polishing process, and an edge edge of the membrane bottom plate 110 extending upward. Extended membrane side 120 and a plurality of ring-shaped partition flaps extending upward from the bottom plate 110 between the center of the membrane bottom plate 110 and the membrane side 120 and coupled to the base 22 ( 131, 132, 133, 134; 130, which extend inward from the upper end of the membrane side 120, and whose end 121e is fixed to the base 22 of the carrier head 201 to form a membrane bottom plate 110. and a first fixing flap 121 forming a main pressure chamber (C1, C2, C3, C4, C5) partially surrounded by the membrane side 120, the upper end of the membrane side 120 and the first fixing flap 121 ) and forms an auxiliary pressure chamber (Cx) on the upper side of the main pressure chamber (C5) with the first fixing flap 121, and the membrane is formed with a positive pressure applied to the auxiliary pressure chamber (Cx). It is configured to include a second fixing flap 122 that applies a compensation force (Fr) to the vertical displacements 99 and 99' of the side 120.

A plurality of partition flaps (131, 132, 133, 134; 130) extending from the upper surface of the membrane bottom plate 110 have their ends fixed to the base 22 via the base 22 and the coupling member 22a. . Accordingly, the main pressure chamber is divided into a plurality of main pressure chambers (C1,..., C4, C5) between the base 22 and the membrane bottom plate 110. As shown in Figure 7, the partition flap 130 may be formed to extend from the bottom plate 110 in a ring shape concentric with the center line.

And, at the upper end of the membrane side 120, a first fixing flap 121 extends inward, and as shown in Figure 9a, the end 121e of the first fixing flap 121 is connected to the coupling members 22a and 22x. ) is fixed to the base 22, and a second fixing flap 122 extends upward at the upper end of the membrane side 120.

The membrane bottom plate 110 is entirely made of a flexible material and is freely stretched or deformed depending on the pressure of the main pressure chambers C1, C2, C3, C4, and C5 above it. In the absence of a substrate, when positive pressure is applied to the main pressure chambers (C1, C2, C3, C4, C5), the membrane bottom plate 110 moves downward as a whole, and the main pressure chambers (C1, C2, C3, C4, C5) ) When negative pressure is applied, the membrane bottom plate 110 moves upward as a whole.

The membrane partition flap 130 is also made of a flexible material and is freely stretched or bent depending on the pressure of the pressure chambers C1,...,C5. The membrane side 120 is formed of a flexible material except for the ring-shaped fixtures 120i and 120o, and the portion where the ring-shaped fixtures 120i and 120o are not formed is located at the outermost pressure chamber C5 and its upper side. It is freely stretched or bent depending on the pressure of the auxiliary pressure chamber (Cx). Here, the ring-shaped fixtures 120i and 120o are made of a material with higher stiffness than the flexible material forming the bottom plate 110 or the partition wall 112, for example, plastic or resin. , may be formed of one or more materials such as metal.

In general, all flexible materials are integrally molded from the same material, but the present invention is not limited thereto, and may be formed of two or more different flexible materials depending on the location. Here, the flexible material may be selected from a variety of materials such as polyurethane series and rubber series.

In this way, when the ring-shaped fixtures 120i and 120o are coupled to the membrane side 120, the bending rigidity of the membrane side being convex in the horizontal direction is strengthened. Accordingly, the side area where the ring-shaped fixtures 120i and 120o are combined has higher rigidity than the area formed only of flexible material, so even if the pressure in the outermost pressure chamber C5 and the upper chamber Cx increases, the ring-shaped Since the bending deformation is restricted by the fixtures 120i and 120o, it serves to induce a larger bending deformation in the area around the ring-shaped fixtures 120i and 120o made of a flexible material.

As shown in Figures 8 and 9a, the first fixing flap 121 made of flexible material extends from the upper end of the membrane side 120 inward toward the base 22, and extends from the upper end of the membrane side 120. A second fixing flap 122 made of a flexible material extends upward and has an inclined portion (i.e., a wrinkle portion). The first fixing flap 121 and the second fixing flap 122 are preferably made of a flexible material. And, the ends 121e and 122e of the first fixing flap 121 and the second fixing flap 122 are respectively fixed to the base 22, so that the first fixing flap 121 and the second fixing flap 122 The space surrounded by the base 22 forms an auxiliary pressure chamber Cx.

Here, the second fixing flap 122 includes a first inclined portion (A1) formed to be inclined radially inward as it goes upward from the membrane bottom plate 110, and a second inclined portion (A2) formed to be inclined outwardly as it goes upward, It includes a third extension part (A3) connected to the second inclined part (A2) and extending inward so that it can be fixed to the bottom surface (Sb) of the base 22.

The third extension portion A3 has a fixed end 122e fixed more inward than the outer surface Sa of the base 22. For example, the fixed end 122e formed on the third extension portion A3 is fixed to the bottom of the base 22. Accordingly, an auxiliary pressure chamber (Cx) is formed in the space surrounded by the first fixing flap 121 and the second fixing flap 122, and the auxiliary pressure chamber (Cx) is located on the upper side of the outermost main pressure chamber (C5). It is located.

In the embodiment illustrated in the drawing, a configuration in which the first inclined portion A1 and the second inclined portion A2 are formed in a straight plane is illustrated, but according to another embodiment of the present invention, the first inclined portion A1 ) and the second inclined portion A2 may be formed as either a flat surface or a curved surface.

During the polishing process, the pressure regulator is configured to pneumatically apply a predetermined pressure (Px) to the auxiliary pressure chamber (Cx). Here, the predetermined pressure (Px) may be a fixed value fixed to one value, a variable value that changes in a predetermined pattern during the polishing process, or a value that is controlled and varied according to a measured value during the polishing process.

When pneumatic pressure is supplied to the auxiliary pressure chamber (Cx), a force in a direction perpendicular to the inner wall surface of the auxiliary pressure chamber (Cx) is applied. Accordingly, as shown in FIG. 9A, the force indicated by F1 acts in an upward slanting manner on the first inclined portion A1, and the force indicated by F2 acts in a downward slanting manner on the second inclined portion A2. And, when the membrane side 120 moves in the vertical direction, the first force (F1) and the second force (F1) acting on the surface according to the rotational displacement of the first inclined portion (A1) and the second inclined portion (A2) ( F2) changes, and the compensation force (Fr) acts upward or downward due to the vertical component of the changes in the first force (F1) and the second force (F2).

However, even at the reference position, there may be a force acting upward or downward due to the first force (F1) and second force (F2) acting on the first inclined portion (A1) and the second inclined portion (A2). The compensating force (Fr) described in the specification and claims is defined to refer to a force acting upward or downward in addition to the force acting at the reference position.

For example, the forces (F1, F2) acting on the first inclined portion (A1) and the second inclined portion (A2) at the 'reference position', which is the state before wear of the retainer ring (23) or the polishing pad (11) The vertical component can be set to '0'. Differently, considering the magnitude of the pressing force (Fe) transmitted to the edge of the substrate through the membrane side 120 by the pressure (Px) of the auxiliary pressure chamber (Cx), the first inclined portion (A1) and the first inclined portion (A1) at the reference position 2. The vertical component of the forces (F1, F2) acting on the inclined portion (A2) may be set to a value other than '0'.

The 'state before wear' of the retainer ring 23 or the polishing pad 11 is not limited to the state in which the retainer ring or polishing pad is first installed, and refers to an arbitrary state to contrast with the 'state after wear'. For convenience, the reference position of the membrane 101 shown in FIG. 9A is shown with the first fixing flap 121 extended horizontally, but the present invention is not limited thereto.

Hereinafter, for convenience of explanation, the case where the vertical component of the forces (F1, F2) acting on the first inclined portion (A1) and the second inclined portion (A2) at the 'reference position' is '0' will be described. I decided to do it.

Above all, the third extension portion A3 remains in close contact with the bottom surface Sb of the base 22. For this purpose, the third extension portion A3 is formed in a shape that is in close contact with the bottom surface Sb of the base 22. For example, when the bottom Sb of the base 22 is a flat surface, the third extension portion A3 is formed as a flat surface identical to the shape of the bottom of the base 22. Although not shown in the drawing, when the bottom surface Sb of the base 22 is a curved or curved surface, the third extension portion A3 is also formed with the same curved or curved surface as the bottom shape of the base 22.

Above all, the third extended portion A3 is formed to have sufficiently higher bending rigidity than the second inclined portion A2. That is, the third extension portion (A3) is formed to have sufficiently high bending rigidity compared to the second inclined portion (A2), so that even if the membrane side 120 moves in the vertical direction, the third extension portion (A3) bends. Deformation is suppressed to maintain close contact with the bottom surface (Sb) of the base 22, and the vertical displacement of the membrane side 120 is accommodated by deformation of the second inclined portion A2.

To this end, the third extension portion A3 may be formed of a different material from the second extension portion A2 or may be formed of a material with higher rigidity. Briefly, as shown in FIGS. 8 and 9A, the third extension portion A3 may be formed of the same material as the second extension portion A2, but may also be formed of a thicker material. For example, the third extended portion A3 may be formed of a material having a bending rigidity of 1.5 to 15 times that of the second inclined portion (A2), and preferably has a bending rigidity of 3 to 10 times that of the second inclined portion (A2). have

In this way, as the third extension portion A3 has high bending rigidity and remains in close contact with the bottom surface of the base 20, even if centrifugal force is generated as the carrier head 201 rotates at high speed during the polishing process, In Figure 5, as the force (Fd) acting to push the second fixing flap 122 upward is removed, the membrane side 120 and the second fixing flap 122 are twisted by the rotation of the carrier head 201. As the rigidity to resist deformation increases, distortion of the side portion of the membrane 101 can be further reduced.

Therefore, during the polishing process, the twisting deformation of the portion adjacent to the membrane side 120 is suppressed, and the problem of the membrane bottom plate of the side portion being in unstable contact with the edge portion of the substrate can be solved, and the pressing force ( By continuously applying Fe), the effect of uniform distribution of the polishing profile at the edge of the substrate in the circumferential direction can be obtained.

In particular, as the third extension portion A3 has high bending rigidity and remains in close contact with the bottom surface of the base 20, the third extension portion A3 forming the ceiling surface of the auxiliary pressure chamber Cx is , Not only when displacement 99' occurs in which the membrane 101 moves entirely upward, but also when displacement 99' occurs in which the membrane 101 moves entirely downward, most of the Maintain close contact.

Therefore, even if the pressure Px acting on the auxiliary pressure chamber Cx uniformly presses the inner wall of the chamber Cx as a whole and thus presses the third extension portion A3 forming the ceiling surface upward, the first 3 The extension part (A3) maintains a state in close contact with the bottom surface (Sb) of the base 22 so that all or most of the force is transmitted to the bottom surface of the base 22, so that the third extension part (A3) The force that lifts the second fixing flap 122 does not work.

Accordingly, the compensating forces (Fr, Fr') acting on the membrane side 120 by the second fixing flap 122 are mostly the forces ( It is determined by F1, F2).

delete

Referring to Figure 9b, when the retainer ring 23 is integrally fixed to the carrier head 201, as the amount of wear of the retainer ring 23 increases, the membrane bottom plate 110 and the polishing pad 11 The distance between the floor plates (y) decreases to the y' value compared to y in Figure 9a. Accordingly, when the substrate is placed below the membrane for the polishing process, a displacement 99 is generated in which the membrane 101 moves upward from the reference position in FIG. 9A (FIG. 9B).

Meanwhile, when the retainer ring is formed to be movable up and down and the carrier head performs the polishing process at a predetermined height, as the amount of wear of the polishing pad 11 increases, the membrane bottom plate 110, as shown in FIG. 9B. The bottom plate separation distance (y) between the bottom plate and the polishing pad 11 increases with the y" value compared to y in Figure 9a. Accordingly, the membrane 101 with the substrate positioned below the membrane for the polishing process is A displacement 99' moving downward from the reference position in FIG. 9A is generated (FIG. 9C).

In this way, in the case where the retainer ring is integrally fixed to the carrier head, as the wear of the retainer ring 23 progresses, the upward displacement 99 of the membrane 101 including the membrane side 120 gradually increases. It increases, and accordingly, the compensation force (Fr) generated by the second fixing flap 122 gradually acts downward toward the bottom plate 110. In the case where the retainer ring is installed to be movable up and down with respect to the carrier head, as wear of the polishing pad 11 progresses, the membrane 101 including the membrane side 120 moves downward (displacement 99'). gradually increases, and accordingly, the compensation force (Fr) generated by the second fixing flap 122 acts increasingly upward toward the bottom plate 110.

As the membrane side 120 moves upward or downward, the amount of change in the forces F1 and F2 acting on the first inclined portion A1 and the second inclined portion A2 of the second fixing flap 122 The compensation force (Fr) acting on the membrane side 120 is determined by the resultant force of the vertical component of .

That is, when displacement occurs in which the membrane side 120 moves in the up and down direction, the posture of the first inclined portion A1 and the second inclined portion A2 changes according to the moving displacement of the membrane side 120, Due to this change in posture, the increase in the vertical component of the first force (F1) acting on the first inclined portion (A1) and the increase in the vertical component of the second force (F2) acting on the second inclined portion (A2) Due to the difference, the compensation force (Fr) is introduced upward or downward.

Preferably, when a displacement 99 in which the membrane side 120 moves upward occurs, the compensating force Fr acts downward, and when a displacement 99' in which the membrane side 120 moves downward occurs, the compensation force Fr acts downward. Compensatory force (Fr) acts upward. In addition, as the size of the movement displacement 99, 99' on the side of the membrane increases, it is desirable that the compensation force Fr also increases accordingly.

To this end, when displacement occurs in which the membrane side 120 moves in the vertical direction, the second inclined portion A2 of the second fixing flap 122 has a larger rotational displacement than the first inclined portion A1. It can be configured to occur.

For example, the second inclined portion A2 may be formed to have lower bending rigidity than the first inclined portion A1. Accordingly, when a displacement causing the membrane side 120 to move up and down occurs, a larger rotational displacement is generated in the second inclined portion A2 than in the first inclined portion A1. Here, the difference in bending rigidity between the first slanted portion A1 and the second slanted portion A2 is caused by the fact that they are made of different materials, or a material with high rigidity is formed into the second slanted portion A2, or This can be implemented by being formed in different thicknesses.

In this configuration, when an upward displacement 99 occurs on the membrane side 120 due to an increase in the amount of wear of the retainer ring 23, the second inclined portion A2 is attached to the first inclined portion A1. Compared to this, greater rotational displacement or deflection occurs closer to the horizontal plane. This may be expressed as the reduction rate of the approximate angle (b) formed by the second inclined portion (A2) with the horizontal plane is greater than the decrease rate of the angle (a) formed by the first inclined portion (A1) with the horizontal plane.

Accordingly, the increase in the second force (F2) acting on the second inclined portion (A2) is greater than the increase in the first force (F1) acting on the first inclined portion (A1), so the second fixing flap ( 122) introduces a downward compensation force (Fr) to the membrane side 120. At this time, since the size of the downward compensation force (Fr) of the second fixing flap 122 is linked to the amount of upward displacement of the membrane side 120, the pressing force that presses the edge of the substrate as the membrane side 120 moves upward The decrease in (Fe') is compensated by the downward compensation force (Fr) of the second fixing flap 122, and a constant pressing force is introduced to the edge portion of the substrate.

Specifically, when the displacement 99 in which the membrane side 120 is lifted upward occurs as the floor plate separation distance (y) decreases due to an increase in the amount of wear of the retainer ring 23, the first inclined portion ( While the angle (a) formed by A1) with the horizontal plane is generally maintained as is, the angle (b) formed by the second inclined portion (A2) with the horizontal plane is modified to become smaller.

That is, as shown in Figure 10, the angle (a) with respect to the horizontal plane of the first inclined portion (A1) remains almost unchanged from ai to ao, and the angle of the second inclined portion (A2) with respect to the horizontal plane is maintained almost without change. (b) greatly decreases from bi to bo. A1i, an unexplained symbol in the drawing, represents the outline of the first inclined portion at the reference position, and A2i, an unexplained symbol in the drawing, represents the outline of the second inclined portion at the reference position.

Then, even if the same force acts on the first inclined portion (A1) and the second inclined portion (A2), the vertical component of the force (F2) acting on the second inclined portion (A2) is applied to the first inclined portion (A1). This results in a greater increase compared to the vertical component of the acting force (F1). That is, the increase in the vertical component of the force F2 acting on the second inclined portion A2 is greater than the increase in the vertical component of the force F1 acting on the first inclined portion A1. Therefore, the compensation force (Fr) acting on the second fixing flap 122 always acts downward, and the size of the compensation force (Fr) increases as the upward movement displacement 99 of the membrane side 120 increases. has a tendency to increase.

Therefore, based on the state before wear of the membrane in the reference position, if the amount of wear of the retainer ring 23 increases and the displacement 99 that causes the membrane side 120 to be lifted upward increases, the second inclined portion A2 As the downward pressing force (vertical component of F2) becomes greater than the upward lifting force (vertical component of F1) from the first inclined portion (A1), the downward force of the second fixing flap (122) increases. Since the compensation force (Fr) cancels out the upward displacement (99) of the membrane side 120 in proportion to the upward displacement (99) of the membrane side 120, the pressing force (Fe') pressing the edge portion of the substrate is offset by the upward displacement (99) of the membrane side 120. ) can remain constant even if the size changes.

This also applies when displacement occurs in which the membrane side 120 moves downward. When the retainer ring 23 can move up and down and the carrier head is polished at a predetermined height, the displacement 99' moving downward as the wear amount of the polishing pad 11 increases is the membrane side 120. It occurs in Accordingly, the second inclined portion A2 has a greater rotational displacement or deflection away from the horizontal plane than the first inclined portion A1. This may be expressed as an increase rate of the approximate angle (b) formed by the second inclined portion (A2) with the horizontal plane is greater than the increase rate of the angle (a) formed by the first inclined portion (A1) with the horizontal plane.

Accordingly, the decrease in the vertical component of the second force (F2) acting on the second inclined portion (A2) is greater than the decrease in the vertical component of the first force (F1) acting on the first inclined portion (A1). , the second fixing flap 122 introduces an upward compensation force (Fr') to the membrane side 120. At this time, since the size of the upward compensation force (Fr') of the second fixing flap 122 is linked to the amount of downward displacement of the membrane side 120, as the membrane side 120 moves downward, the edge of the substrate is pressed. The increase in pressing force Fe' is compensated by the upward compensation force Fr' of the second fixing flap 122, and a constant pressing force is introduced to the edge portion of the substrate.

Specifically, in a state in which the carrier head 201 performs a polishing process at a predetermined height and the retainer ring 23 is installed to be movable in the vertical direction by the retainer chamber, as the amount of wear of the polishing pad 11 increases, the bottom plate decreases. The separation distance (y) increases. That is, as shown in Figure 9c, when the floor plate separation distance (y) increases (y"), a displacement (99') is generated in which the membrane side (120) is pressed downward. In this case, the bending of the bending connection portion Since the rigidity is smaller than the bending rigidity of the first connection portion (122c), the angle (a) formed by the first inclined portion (A1) with the horizontal plane is maintained as is, while the angle formed by the second inclined portion (A2) with the horizontal plane is maintained as is. (b) is transformed to become larger.

If the angle (a) of the first inclined portion (A1) with respect to the horizontal plane remains the same and the angle (b) of the second inclined portion (A2) with respect to the horizontal plane decreases, the same force is applied to the first inclined portion (A1) and Even if it acts on the second inclined portion (A2), the vertical component of the force (F1) acting on the second inclined portion (A1) is smaller than the vertical component of the force (F2) acting on the first inclined portion (A1). It results in losing. Therefore, the compensation force (Fr) acting on the second fixing flap 122 acts upward, and the size of the compensation force (Fr) increases as the downward movement displacement 99 of the membrane side 120 increases. have a tendency to do so.

Therefore, when the retainer ring moves up and down by a separate chamber and the position of the carrier head during the polishing process is performed at a fixed position, the amount of wear on the polishing pad increases and the membrane side 120 is gradually pressed downward. As (99') increases, the downward pressing force (F2) on the second inclined portion (A2) becomes smaller and smaller compared to the upward lifting force (F1) on the first inclined portion (A1), so that the second inclined portion (A2) increases. Since the downward compensation force (Fr) of the fixing flap 122 acts upward and offsets the downward displacement of the membrane side 120 in proportion to the downward displacement of the membrane side 120, the pressing force pressing the edge of the substrate is applied to the side of the membrane 120. It can be maintained constant regardless of downward displacement.

In this way, based on the state before wear of the membrane in the reference position, the amount of wear of the retainer ring 23 or the polishing pad 11 changes, and the displacement 99 in which the membrane side 120 is lifted upward and moves is increased. As the displacement 99' increases or the membrane side 120 moves downward, the variation of the vertical component of the force F2 pressing downward at the second inclined portion A2 increases at the first inclined portion A1. It becomes increasingly larger compared to the variation in the vertical component of the upward lifting force (F1).

That is, the compensation force (Fr) generated by the second fixing flap 122 acts in a direction opposite to the direction of the moving displacement of the membrane side 120 and acts in proportion to the magnitude of the moving displacement of the membrane side 120. Therefore, as the variation in the pressing force (Fe') pressing the edge portion of the substrate due to the moving displacement of the membrane side 120 is offset by the compensation force (Fr) by the second fixing flap 122, the membrane side 120 Even if vertical displacement (99, 99') of ) occurs, polishing quality can be improved by applying a constant pressing force to the edge of the substrate.

Similarly, the bending connection portion where the first inclined portion A1 and the second inclined portion A2 of the second fixing flap 122 are connected is formed to have lower bending rigidity than the first connecting portion 122c, When a displacement causing the membrane side 120 to move up and down occurs, the first inclined portion A1 may be configured to generate a larger rotational displacement than the second inclined portion A2.

Through this, when displacement 99 occurs in which the membrane side 120 moves upward, the compensation force (Fr) by the second fixing flap 122 acts downward, and the membrane side 120 moves downward. When the displacement 99' occurs, the compensation force Fr' caused by the second fixing flap 122 can be allowed to act upward.

On the other hand, when the bending rigidity of the first inclined portion (A1) and the second inclined portion (A2) is very low, the second inclined portion (A2) excessively moves downward while static pressure is applied to the auxiliary pressure chamber (Cx). This may cause concave bending deformation, and as a result, there is a possibility that the size of the intended compensation force (Fr, Fr') may be distorted. Therefore, when the bending rigidity of the first inclined portion (A1) and the second inclined portion (A2) is very low, the bending rigidity of the bending connection portion of the first inclined portion (A1) and the second inclined portion (A2) is set to 1. It may be formed to be higher than the average stiffness of the inclined portion (A1) and the second inclined portion (A2).

Meanwhile, as shown in Figure 8, the length L1 of the first inclined portion A1 of the second fixing flap 122 is formed to be longer than the length L2 of the second inclined portion A2. desirable.

Through this, even if the force acting on the first inclined portion (A1) and the second inclined portion (A2) in the vertical direction due to the pressure acting on the auxiliary pressure chamber (Cx) at the reference position is balanced with each other in the vertical direction, , When the amount of wear of the retainer ring 23 increases and the upward displacement of the membrane side 120 from the reference position increases, the downward movement occurs in the inclined portion consisting of the first inclined portion (A1) and the second inclined portion (A2). generates a compensation force (Fr).

More specifically, when the wear amount of the retainer ring 23 increases and the amount of upward movement displacement of the membrane side 120 from the reference position increases, the amount of displacement at the first inclined portion A1 and the second inclined portion A2 increases. Even if the rotational displacement is the same, as the length L2 of the second inclined portion A2 is formed longer than that of the first inclined portion A21, the vertical force F2 acting on the second inclined portion A2 The amount of increase in the direction component is greater than the amount of increase in the vertical component of the force F1 acting on the first inclined portion A1.

Through this, the second inclined portion A2 of the second fixing flap 122 opposes the moving direction of the membrane side 120, similar to generating a larger rotational displacement than the first inclined portion A1. The effect of applying compensation power in the desired direction can be achieved.

Meanwhile, in order to further increase the effect as described above, the first inclined portion A1 of the second fixing flap 122 is at an angle a formed with the horizontal plane (for example, the horizontally extending first fixing flap). In comparison, it is preferable that the angle b between the second inclined portion A2 and the horizontal plane is formed to be smaller.

Through this, even if the force acting on the first inclined portion (A1) and the second inclined portion (A2) in the vertical direction due to the pressure acting on the auxiliary pressure chamber (Cx) at the reference position is balanced with each other in the vertical direction, , When the amount of wear of the retainer ring 23 increases and the amount of upward movement displacement of the membrane side 120 from the reference position increases, the angle b formed with the horizontal plane of the second inclined portion A2 and the first inclined portion ( Even if the angle (a) formed with the horizontal plane of A1) decreases by the same amount, the increase in the cos component of the force (F2) acting on the second inclined portion (A) becomes larger, so the downward force (Fr) from the wrinkle portion ) can be generated larger.

Meanwhile, the first connection portion 122c, where the first inclined portion A1 and the upper end of the membrane side 120 are connected, has an average stiffness of at least one of the first inclined portion A1 and the second inclined portion A2. It can be formed into a form with greater rigidity.

Through this, when the force Fr acting on the second fixing flap 122 acts downward, instead of bending the upper end of the membrane side 120 and the first connection portion of the first inclined portion A1, the first connection portion is bent. It acts reliably as a force to push the membrane side 120 downward while maintaining the shape of the connection portion 122c.

Here, in order to increase the rigidity of the first connection portion 122c, as shown in the drawing, it may be formed thicker than the average thickness of one or more of the first inclined portion A1 and the second inclined portion A2. , Although not shown in the drawing, rigidity may be increased by forming a material with high rigidity in the first connection portion 122c.

In the drawing, the configuration of the second fixing flap 122 is given as an example in which the first inclined portion (A1) extends obliquely upward and inward toward the upper side, and the second inclined portion (A2) extends obliquely upward and outward toward the upper portion. It may be configured by changing the connection order of the first inclined portion (A1) and the second inclined portion (A2).

Hereinafter, with reference to Figure 11, the carrier head 202 and the membrane 102 used therein of the polishing device according to the second embodiment of the present invention will be described in detail. However, in order to clarify the gist of the second embodiment of the present invention, descriptions of the same or similar structures and operations as those of the above-described first embodiment will be omitted.

The membrane 102 of the carrier head 202 shown in Figure 11 has a second fixing flap 222 extending from the first fixing flap 121 instead of extending from the upper end of the membrane side 120. There is a difference from the configuration of the first embodiment. Likewise, the fixed end 222e formed on the third extension portion A3 is fixed to the bottom of the base 22.

That is, the first fixing flap 121 extends inward at the upper end of the membrane side 120, and its end 121e is fixed to the base 22 by the coupling member 22a, and the upper end of the membrane side 120 The second fixing flap 222 extends upward from the first fixing flap 121 spaced inwardly by Le.

Here, the second fixing flap 222 includes a first inclined portion (A1) formed to be inclined radially inward as it goes upward from the membrane bottom plate 110, and a second inclined portion (A2) formed to be inclined outwardly as it goes upward, It includes a third extension part (A3) connected to the second inclined part (A2) so that it can be fixed to the side of the base 22 and extending horizontally in close contact with the flat bottom surface (Sb) of the base 22.

As the second fixing flap 222 extends from the first fixing flap 121, the first slanted portion A1 is formed to have a shorter length than the second slanted portion A2. And, similar to the configuration of the above-described first embodiment, the angle formed by the first inclined portion A1 with the horizontal plane is formed to be larger than the angle formed by the second inclined portion A1 with the horizontal plane. In addition, the first connection portion 122c between the first inclined portion A1 and the first fixing flap 121 is formed to have higher rigidity than the average rigidity of the first fixing flap 121.

Similar to the above-described first embodiment, when a displacement occurs in which the membrane side 120 moves in the vertical direction compared to the second fixing flap A2, the first fixing flap A1 is moved to the second fixing flap 222. The second inclined portion A2 may be configured to generate a larger rotational displacement than the first inclined portion A1. In addition, similar to the above-described first embodiment, the length of the second inclined portion A2 of the second fixing flap 222 may be configured to be longer than the length of the first inclined portion A1.

The fixed end 222e formed on the third extension portion A3 is fixed to the bottom surface Sb of the base 22, and the third extension portion A3 is formed to have sufficiently high bending rigidity to be attached to the bottom surface of the base 22. By maintaining close contact with (Sb), it does not affect the compensation force (Fr) in the vertical direction by the second fixing flap 222 and resists torsional deformation of the membrane even when the carrier head 202 rotates at high speed. .

Accordingly, when the wear amount of the retainer ring 23 increases compared to the wear state of the retainer ring 23 at the reference position and the bottom plate separation distance (y') decreases, and accordingly, the wear amount of the retainer ring 23 increases. When the displacement 99 that causes the membrane side 120 to move upward occurs, it acts on the second inclined portion A2 compared to the increase in the vertical component of the force F1 acting on the first inclined portion A1. Since the increase in the vertical component of the force F2 becomes larger, a downward compensating force Fr is applied by the second fixing flap 222.

Likewise, although not shown in the drawing, if the wear amount of the polishing pad 11 increases compared to the wear state of the polishing pad 11 at the reference position and the bottom plate separation distance increases, and accordingly, the wear state of the polishing pad 11 increases. When a displacement occurs in which the membrane side 120 moves downward by the amount of wear, the force acting on the second inclined portion A2 is compared to the decrease in the vertical component of the force F1 acting on the first inclined portion A1. Since the amount of decrease in the vertical component of (F2) becomes larger, an upward compensating force is applied by the second fixing flap 222.

Therefore, even if the wear of the retainer ring 23 or the polishing pad 11 progresses as the polishing process is repeated and displacement 99 that lifts the membrane side 120 upward or moves downward occurs, the edge of the substrate The pressing force Fe' acting on the portion is compensated by the compensation force Fr acting downward by the second fixing flap 222 and is kept constant. Through this, it is possible to achieve the effect of maintaining the polishing quality of the edge of the substrate at the polishing profile indicated by Si in FIG. 6 regardless of the wear state of the retainer ring 23.

Hereinafter, with reference to Figure 12, the carrier head 203 and the membrane 103 used therein of the polishing device according to the third embodiment of the present invention will be described in detail. However, in order to clarify the gist of the third embodiment of the present invention, descriptions of the same or similar structures and operations as those of the above-described first embodiment will be omitted.

The carrier head 203 shown in FIG. 12 has a coupling member 22x' that secures the third extension portion A3 of the second fixing flap 322 of the membrane 103 at the bottom of the third extension portion A3. It is different from the configuration of the first embodiment in that it is formed to cover a sufficient length and restrains the displacement of the third extension portion A3. Likewise, the fixed end 322e formed on the third extension portion A3 is fixed to the bottom of the base 22.

Accordingly, the third extended portion (A3) of the second fixing flap (A2) of the membrane 103 may be formed to have higher bending rigidity than the second inclined portion (A2), as in the first embodiment. , It may be formed to have the same or lower bending rigidity as the second inclined portion (A2). Here, the bending rigidity of the third extension portion A3 may be reduced as the length over which the coupling member 22x' covers the third extension portion A3 increases.

Preferably, when the rigidity of the third extension portion (A3) has the same bending rigidity as that of the second inclined portion (A2), the covering length of the engaging member (22x') covering the third extension portion (A3) is The third extension part (A3) is set in a form that covers the end of the third extension part (A3) up to a separation distance (E2) of about 10 mm or less. And, here, the separation distance E2 may be set to 0, so that the entire third extension portion A3 is covered by the coupling member 22x' so that the displacement is restricted.

Accordingly, even when the membrane side 120 moves downward, most of the ceiling surface of the auxiliary pressure chamber Cx is covered by the coupling member 22x', so that the force acting on the third extension portion A3 The upward force has little effect on the compensation force (Fr) that compensates for the moving displacement of the membrane side 120.

The coupling member 22x' covering the third extension portion A3 is formed to cover all areas except the second connection portion ck connecting the third extension portion A3 and the second inclined portion A2. , the influence of the third extension portion (A3) on the compensation force (Fr) that compensates for the movement displacement of the membrane side 120 due to lifting may be completely excluded.

Meanwhile, the carrier head 203 of the third embodiment has a coupling member 22x' that covers most of the third extension portion A3, and, as in the second embodiment, the second fixing flap is attached to the membrane side ( It may be configured to extend from the first fixing flap 121 spaced inward by Le from the upper end of 120).

Like the above-described embodiment, the second fixing flap 322 has a first inclined portion A1 formed to be inclined toward the inner radius as it goes upward from the membrane bottom plate 110, and a second inclined portion formed to be inclined outward than the radius as it goes upward from the membrane bottom plate 110. Includes (A2).

Here, the first connection portion 122c of the first inclined portion A1 and the first fixing flap 121 is formed to have higher rigidity than the average rigidity of the first fixing flap 121, and the first inclined portion ( The bending connection portion of A1) and the second inclined portion A2 is formed to have lower bending rigidity than the first connection portion 122c.

Similar to the above-described first embodiment, when a displacement occurs in which the membrane side 120 moves in the vertical direction compared to the second fixing flap A2, the first fixing flap A1 is moved to the second fixing flap 622. The second inclined portion A2 may be configured to generate a larger rotational displacement than the first inclined portion A1. In addition, similar to the above-described first embodiment, the length of the second inclined portion A2 of the second fixing flap 622 may be configured to be longer than the length of the first inclined portion A1.

In addition, since the third extension portion (A3) is restrained by the coupling member (22x'), the compensation force (Fr) in the vertical direction by the second fixing flap 222 is applied to the first inclined portion (A1) and the second inclined portion (A1). It is determined by the shape of the inclined portion A2, and torsional deformation of the membrane is suppressed even when the carrier head 202 rotates at high speed.

Accordingly, when the wear amount of the retainer ring 23 increases compared to the wear state of the retainer ring 23 at the reference position and the bottom plate separation distance (y') decreases, and accordingly, the wear amount of the retainer ring 23 increases. Displacement 99 is generated by which the membrane side 120 moves upward, and acts on the second inclined portion A2 compared to the increase in the vertical component of the force F1 acting on the first inclined portion A1. Since the increase in the vertical component of the force F2 becomes larger, a downward compensatory force Fr is applied by the second fixing flap 322.

Likewise, although not shown in the drawing, if the wear amount of the polishing pad 11 increases compared to the wear state of the polishing pad 11 at the reference position and the bottom plate separation distance increases, and accordingly, the wear state of the polishing pad 11 increases. When a displacement occurs in which the membrane side 120 moves downward by the amount of wear, the force acting on the second inclined portion A2 is compared to the decrease in the vertical component of the force F1 acting on the first inclined portion A1. Since the amount of decrease in the vertical component of (F2) becomes larger, an upward compensating force is applied by the second fixing flap 222.

Therefore, even if the wear of the retainer ring 23 progresses as the polishing process is repeated and the displacement 99 that lifts the membrane side 120 upward occurs, the pressing force (Fe') acting on the edge of the substrate remains constant. 2 It is compensated by the compensation force (Fr) acting downward by the fixing flap 322 and is kept constant. Through this, it is possible to achieve the effect of maintaining the polishing quality of the edge of the substrate at the polishing profile indicated by Si in FIG. 6 regardless of the wear state of the retainer ring 23.

Hereinafter, with reference to Figure 13, the carrier head 204 and the membrane 104 used therein of the polishing device according to the fourth embodiment of the present invention will be described in detail. However, in order to clarify the gist of the fourth embodiment of the present invention, descriptions of the same or similar structures and operations as those of the above-described first and third embodiments will be omitted.

The membrane 104 of the carrier head 204 shown in Figure 13 has a base with a second connection portion ck where the second inclined portion A2 and the third extension portion A3 of the second fixing flap 422 are connected. It is different from the configuration of the third embodiment in that it is exposed to the outside compared to the outer surface (Sa) of (22). Likewise, the fixed end 422e formed on the third extension portion A3 is fixed to the bottom of the base 22.

In this way, when the third extension part (A3) extends to the outside of the outer surface (Sa) of the base 22, it acts on the third extension part (A3) located outside the outer surface (Sa) of the base 22. Although the upward force exerted may affect the compensation force, the length (L2) of the second extension portion (A2) becomes longer by the length of the third extension portion (A3), and the second extension portion (A2) becomes longer. The vertical component of the force acting on cancels out the upward force according to the extension length of the third extension portion (A3). Therefore, even if the third extension portion A3 is exposed outward compared to the outer surface Sa of the base 22, it has little effect on the compensation force Fr.

Therefore, as the polishing process is repeated, wear of the retainer ring 23 and the polishing pad 11 progresses, resulting in a displacement 99 that lifts the membrane side 120 upward or a displacement 99 that moves downward the membrane side 120. Even if it gradually increases, the pressing force (Fe') acting on the edge of the substrate remains constant by being compensated by the compensation force (Fr) as the compensation force (Fr) acting downward by the second fixing flap 322 gradually increases. do. Through this, it is possible to achieve the effect of maintaining the polishing quality of the edge of the substrate at the polishing profile indicated by Si in FIG. 6 regardless of the wear state of the retainer ring 23.

Hereinafter, with reference to Figure 14, the carrier head 205 and the membrane 105 used therein of the polishing device according to the fifth embodiment of the present invention will be described in detail. However, in order to clarify the gist of the fifth embodiment of the present invention, the description of the configuration and operation that is the same or similar to that of the above-described first embodiment will be omitted.

Meanwhile, in the fifth embodiment of the present invention, as shown in Figure 14, the membrane 105 of the carrier head is formed with two or more first inclined portions A1 and A5 of the second fixing flap 522. It is characterized in that the second inclined portions A2 and A6 of the second fixing flap 522 are formed of two or more and have a wrinkle shape. Likewise, the fixed end 522e formed on the third extension portion A3 is fixed to the bottom of the base 22.

That is, in the second fixing flap 522, first inclined portions A1 and A5, which are inclined radially inward as they go upward from the membrane bottom plate 110, are formed in two places and extend upward from the membrane bottom plate 110. Since the second inclined portions (A2, A6), which are inclined outward toward the radius, are formed in two places, the first force (F1) is determined as the resultant force of the forces acting on the two first inclined portions (A1, A5). And, the second force (F2) is determined as the resultant force of the forces acting on the two second inclined parts (A2, A6).

Here, in a state where the retainer ring 23 is integrally fixed to the main body 2x of the carrier head, if the amount of wear of the retainer ring 23 increases and the upward displacement 99 of the membrane side 120 increases, Compared to the increase in the vertical component of the resultant force of the forces acting on the first inclined portion (A1) and the fifth inclined portion (A5), the forces acting on the second inclined portion (A2) and the sixth inclined portion (A6) respectively The shape of the second fixed flap 522 is determined to be larger than the increase in the vertical component of the resultant force.

Similar to the above-described first embodiment, the first fixing flaps (A1, A5) are displaced when the membrane side 120 moves in the vertical direction compared to the second fixing flaps (A2, A6). The second inclined portion A2 of the flap 522 may be configured to generate a larger rotational displacement than the first inclined portion A1.

In addition, like the first embodiment described above, the sum of the lengths of the second inclined portions (A2, A6) of the second fixing flap 522 is formed to be longer than the sum of the lengths of the first inclined portions (A1, A5) It can be configured as follows.

Through this, the wear amount of the retainer ring 23 increases compared to the wear state of the retainer ring 23 at the reference position, and a displacement occurs in which the membrane side 120 moves upward by the amount of wear of the retainer ring 23. If so, the resultant force of the downward force acting on the surface of the second inclined portion (A2, A6) is greater than the increase in the vertical component of the resultant force of the upward force acting on the surface of the first inclined portion (A1, A5). Since the increase in the vertical component becomes larger, a downward compensation force (Fr) is applied by the second fixing flap 122'.

Similarly, when the amount of wear increases compared to the wear state of the polishing pad 11 at the reference position, and displacement occurs in which the membrane side 120 moves downward, wear occurs on the surface of the first inclined portions A1 and A5. Since the amount of decrease in the vertical component of the resultant force of the downward force acting on the surfaces of the second inclined portions A2 and A6 is smaller than the amount of decrease in the vertical component of the resultant force of the upward force acting, the second An upward compensating force (Fr) is applied by the fixing flap 122'.

Through this, the wear condition of the consumables such as the retainer ring 23 and the polishing pad 11 progresses through repeated polishing processes, and as a result, even if the membrane side 120 is gradually moved upward or downward, the displacement occurs. , the compensation force provided by the second fixing flap 122' compensates for the pressing force acting on the edge of the substrate, so that a constant pressing force is applied to the edge of the substrate to polish the edge of the substrate with the polishing profile indicated by Si in Figure 6. This can achieve the effect of improving polishing quality.

Meanwhile, although the drawing shows a configuration in which the second fixing flap 622 extends from the upper end of the membrane side 120, the second fixing flap 622 is positioned at a position spaced inward from the side 120. It may also be formed extending from the fixing flap 120.

Meanwhile, the drawing illustrates a configuration in which ring-shaped fixtures 120i and 120o, which have higher rigidity than the bottom plate 110, are combined only on the inner peripheral surface of the membrane side 120, but the present invention is not limited thereto, and the present invention According to another embodiment, the ring-shaped fixtures 120i and 120o may be coupled only to the outer peripheral surface of the membrane side 120, or may be coupled to both the inner and outer peripheral surfaces of the membrane side 120.

Although not shown in the drawings, according to another embodiment of the present invention, the membrane is entirely formed of a flexible material, and the bottom plate 110 and the side plate 120 according to the pressure of the pressure chamber (..., C5, Cx). ) and the partition flap 130 may be freely deformed or formed to expand and contract. However, the membrane side 120 is formed to have higher rigidity by including a different material or forming a thicker thickness than the first fixing flap 121 or the second fixing flap 122.

Although the drawing illustrates a configuration in which the first inclined portion A1 extends directly from the upper end of the membrane side 120, the present invention is not limited thereto, and according to another embodiment of the present invention, the membrane side 120 A separate connection part connecting the upper part and the first inclined part (A1) may be additionally provided. Here, the connection portion preferably has sufficiently high bending rigidity comparable to that of the first connection portion 122c.

Although the drawing illustrates a configuration in which the first inclined portion A1 and the second inclined portion A2 are directly connected by a bending connection portion bk, the present invention is not limited thereto, and according to another embodiment of the present invention, A separate connection portion may be additionally provided between the first inclined portion (A1) and the second inclined portion (A2).

Although the drawing illustrates a configuration in which the first inclined portion (A1) and the second inclined portion (A2) have one continuous inclination degree, the present invention is not limited thereto, and according to another embodiment of the present invention, the first inclined portion (A1) and the second inclined portion (A2) have a continuous slope. At least one of the inclined portion (A1) and the second inclined portion (A2) may be formed to be inclined only in some sections, and at least one of the first inclined portion (A1) and the second inclined portion (A2) may have different slopes. It may be formed including a section having .

In the drawing, the configuration of the second fixing flap 122 is given as an example in which the first inclined portion (A1) extends obliquely upward and inward toward the upper side, and the second inclined portion (A2) extends obliquely upward and outward toward the upper portion. It may be configured by changing the connection order of the first inclined portion (A1) and the second inclined portion (A2).

Although the present invention has been illustratively described above through preferred embodiments, the present invention is not limited to these specific embodiments and can be used in various forms within the scope of the technical idea presented in the present invention, specifically the scope of the patent claims. It may be modified, changed, or improved.

W: Substrate Cx: Secondary pressure chamber
C5: Outermost main pressure chamber
101, 102, 103, 104, 105: Membrane
110: Membrane bottom plate
120: Membrane side 121: First fixing flap
122, 222, 322: 2nd fixed flap A1: 1st inclined area
A2: Second slope area A3: Third extension area
23: retainer ring 22: base

Claims (30)

A membrane of a carrier head for a polishing device, comprising:
a bottom plate formed of a flexible material and pressing the plate surface of the substrate;
a side formed of a flexible material and extending from an edge of the bottom plate;
a first fixed flap extending from an upper end of the side, the end of which is fixed to the carrier head, and forming a part of the main pressure chamber together with the side;
It extends from one of the side surface and the first fixing flap to form an auxiliary pressure chamber located above the main pressure chamber together with the first fixing flap, and is formed to be radially inclined inward as it moves upward from the bottom plate. A first inclined portion and a second inclined portion formed to be radially inclined outward as it goes upward, and a fixed end are provided and are fixed more inward than the outer surface of the base of the carrier head and are attached to the first inclined portion and the second inclined portion. a second fixed flap made of a flexible material that is formed to have higher bending rigidity and includes a third extension portion that is maintained in close contact with the bottom surface of the base;
A polishing device comprising: a polishing device, wherein even if the side moves in the vertical direction, bending deformation of the third extension portion is suppressed, and the vertical displacement of the side is accommodated by deformation of the second inclined portion. Membrane of the carrier head.
According to clause 1,
The membrane of the carrier head for a polishing device, wherein the fixed end of the third extension portion is fixed to the bottom of the base.
According to clause 2,
The membrane of the carrier head for a polishing device, characterized in that the third extension part is in close contact with the bottom surface of the base.
delete According to clause 1,
The membrane of the carrier head for a polishing device, wherein the third extended portion is formed to have a greater thickness than the second inclined portion.
According to clause 1,
The membrane of the carrier head for a polishing device, wherein the third extended portion is formed to have a bending rigidity of 1.5 to 15 times that of the second inclined portion.
According to clause 1,
A membrane of a carrier head for a polishing device, wherein the second inclined portion is formed to be inclined at least in some sections.
According to clause 1,
The contact length by which the coupling member of the carrier head brings the third extension part including the fixed end into close contact with the base maintains the third extension part in contact with the bottom surface of the base even when the side moves up and down. A membrane of a carrier head for a polishing device, characterized in that it is designed to do so.
delete delete delete delete delete delete According to any one of claims 1 to 3 or any one of claims 5 to 8,
The first connection portion where one of the side and the second fixing flap and the first fixing flap are connected is formed to be larger than the average stiffness of one or more of the first inclined portion and the second inclined portion. Membrane of the carrier head for polishing devices.
According to clause 15,
The membrane of the carrier head for a polishing device, wherein the first connection portion is formed to be thicker than the average thickness of any one of the first inclined portion and the second inclined portion.
According to any one of claims 1 to 3 or any one of claims 5 to 8,
A membrane of a carrier head for a polishing device, wherein when a displacement occurs in which the side moves in the vertical direction, a larger rotational displacement is generated in the second inclined portion than in the first inclined portion.
According to any one of claims 1 to 3 or any one of claims 5 to 8,
A membrane of a carrier head for a polishing device, characterized in that the thickness of the second inclined portion is thinner than the first inclined portion.
According to any one of claims 1 to 3 or any one of claims 5 to 8,
A membrane of a carrier head for a polishing device, characterized in that the length of the second inclined portion is longer than the length of the first inclined portion.
According to any one of claims 1 to 3 or any one of claims 5 to 8,
A membrane of a carrier head for a polishing device, wherein the second fixing flap is formed to have lower rigidity than the side surface.

delete A carrier head for a polishing device, comprising:
a base that rotates with the substrate placed on the lower side during the polishing process;
A membrane according to any one of claims 1 to 3 or any one of claims 5 to 8;
a retainer ring formed in a ring shape spaced apart from the bottom plate and maintained in contact with the polishing pad;
Carrier head for polishing devices comprising:
delete According to clause 22,
The first connection portion where one of the side and the second fixing flap and the first fixing flap are connected is formed to be larger than the average stiffness of one or more of the first inclined portion and the second inclined portion. Carrier head for polishing devices.
According to clause 24,
A carrier head for a polishing device, wherein the first connection portion is formed to be thicker than the average thickness of any one of the first inclined portion and the second inclined portion.
According to clause 24,
A carrier head for a polishing device, wherein when a displacement occurs in which the side moves in the vertical direction, a larger rotational displacement is generated in the second inclined portion than in the first inclined portion.
According to clause 26,
A carrier head for a polishing device, wherein the second inclined portion has a thinner thickness than the first inclined portion.
delete According to clause 22,
The third extension part is coupled to the base by a coupling member being coupled to the base, wherein the coupling member fixes the third extension part in a form that covers a position spaced up to 10 mm from the outer surface of the base. A carrier head for a polishing device, characterized in that.
According to clause 22,
The third extension part is coupled to the base by a coupling member being coupled to the base, wherein the coupling member is a third extension part excluding the second connection part connecting the third extension part and the second inclined part. A carrier head for a polishing device, characterized in that it is formed to cover the entire remaining area.

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