SG10201705522TA - Substrate holder and plating apparatus using the same - Google Patents
Substrate holder and plating apparatus using the sameInfo
- Publication number
- SG10201705522TA SG10201705522TA SG10201705522TA SG10201705522TA SG10201705522TA SG 10201705522T A SG10201705522T A SG 10201705522TA SG 10201705522T A SG10201705522T A SG 10201705522TA SG 10201705522T A SG10201705522T A SG 10201705522TA SG 10201705522T A SG10201705522T A SG 10201705522TA
- Authority
- SG
- Singapore
- Prior art keywords
- same
- substrate holder
- plating apparatus
- plating
- holder
- Prior art date
Links
- 238000007747 plating Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016093993A JP6747859B2 (en) | 2016-05-09 | 2016-05-09 | Substrate holder and plating apparatus using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201705522TA true SG10201705522TA (en) | 2017-12-28 |
Family
ID=60242581
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201703595XA SG10201703595XA (en) | 2016-05-09 | 2017-05-03 | Substrate holder and plating apparatus using the same |
SG10201705522TA SG10201705522TA (en) | 2016-05-09 | 2017-07-05 | Substrate holder and plating apparatus using the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201703595XA SG10201703595XA (en) | 2016-05-09 | 2017-05-03 | Substrate holder and plating apparatus using the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US10738390B2 (en) |
JP (1) | JP6747859B2 (en) |
SG (2) | SG10201703595XA (en) |
TW (1) | TWI719199B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7264780B2 (en) | 2019-09-10 | 2023-04-25 | 株式会社荏原製作所 | Substrate holder, substrate plating device with same, and electrical contact |
CN111560593A (en) * | 2020-06-23 | 2020-08-21 | 惠州市祺光科技有限公司 | Fixing jig for coating of small-size optical lens and coating method thereof |
EP4219800A1 (en) * | 2022-01-31 | 2023-08-02 | Semsysco GmbH | Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7022211B2 (en) * | 2000-01-31 | 2006-04-04 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
DE19962170A1 (en) * | 1999-12-22 | 2001-07-12 | Steag Micro Tech Gmbh | Sub-beam holder |
JP2001323397A (en) * | 2000-05-12 | 2001-11-22 | Shin Etsu Polymer Co Ltd | Thin film forming device and method for manufacturing its contact jig |
JP2002363794A (en) * | 2001-06-01 | 2002-12-18 | Ebara Corp | Substrate holder and plating device |
JP2002363797A (en) * | 2001-06-01 | 2002-12-18 | Ebara Corp | Electrical contact, method of producing the same, and plating device |
JP4162440B2 (en) * | 2002-07-22 | 2008-10-08 | 株式会社荏原製作所 | Substrate holder and plating apparatus |
JP4124327B2 (en) * | 2002-06-21 | 2008-07-23 | 株式会社荏原製作所 | Substrate holder and plating apparatus |
TWI316097B (en) | 2002-06-21 | 2009-10-21 | Ebara Corp | Substrate holder and plating apparatus |
JP2005220414A (en) * | 2004-02-06 | 2005-08-18 | Ebara Corp | Plating apparatus |
CN103874790A (en) * | 2011-10-19 | 2014-06-18 | 株式会社Jcu | Substrate electroplating jig |
US8900425B2 (en) * | 2011-11-29 | 2014-12-02 | Applied Materials, Inc. | Contact ring for an electrochemical processor |
JP2015071802A (en) * | 2013-10-02 | 2015-04-16 | 株式会社荏原製作所 | Plating apparatus and cleaning device used in the same |
JP6508935B2 (en) | 2014-02-28 | 2019-05-08 | 株式会社荏原製作所 | Substrate holder, plating apparatus and plating method |
-
2016
- 2016-05-09 JP JP2016093993A patent/JP6747859B2/en active Active
-
2017
- 2017-04-25 TW TW106113751A patent/TWI719199B/en active
- 2017-05-03 SG SG10201703595XA patent/SG10201703595XA/en unknown
- 2017-05-08 US US15/589,888 patent/US10738390B2/en active Active
- 2017-07-05 SG SG10201705522TA patent/SG10201705522TA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20170321343A1 (en) | 2017-11-09 |
TWI719199B (en) | 2021-02-21 |
TW201740477A (en) | 2017-11-16 |
JP6747859B2 (en) | 2020-08-26 |
SG10201703595XA (en) | 2017-12-28 |
US10738390B2 (en) | 2020-08-11 |
JP2017203178A (en) | 2017-11-16 |
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