SG10201905834QA - Substrate holder and plating apparatus - Google Patents
Substrate holder and plating apparatusInfo
- Publication number
- SG10201905834QA SG10201905834QA SG10201905834QA SG10201905834QA SG10201905834QA SG 10201905834Q A SG10201905834Q A SG 10201905834QA SG 10201905834Q A SG10201905834Q A SG 10201905834QA SG 10201905834Q A SG10201905834Q A SG 10201905834QA SG 10201905834Q A SG10201905834Q A SG 10201905834QA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate holder
- plating apparatus
- plating
- holder
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018119875A JP7003005B2 (en) | 2018-06-25 | 2018-06-25 | Board holder and plating equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201905834QA true SG10201905834QA (en) | 2020-01-30 |
Family
ID=68968512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201905834QA SG10201905834QA (en) | 2018-06-25 | 2019-06-24 | Substrate holder and plating apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US11535949B2 (en) |
JP (1) | JP7003005B2 (en) |
KR (1) | KR20200000801A (en) |
CN (1) | CN110629276B (en) |
SG (1) | SG10201905834QA (en) |
TW (1) | TWI810320B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7132135B2 (en) * | 2019-01-23 | 2022-09-06 | 上村工業株式会社 | Work holding jig and electroplating device |
PT3854915T (en) | 2020-01-21 | 2022-08-12 | Semsysco Gmbh | Substrate holding and locking system for chemical and/or electrolytic surface treatment |
JP7398292B2 (en) * | 2020-02-10 | 2023-12-14 | 株式会社荏原製作所 | Plating method |
TWI788155B (en) * | 2021-12-23 | 2022-12-21 | 敔泰企業有限公司 | Clamping device for wafer |
CN114752985B (en) * | 2022-05-06 | 2024-06-14 | 吉姆西半导体科技(无锡)股份有限公司 | Novel vacuum electroplating hanger |
TWI800413B (en) | 2022-06-22 | 2023-04-21 | 頎邦科技股份有限公司 | Clamp assembly |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7211170B2 (en) * | 2001-04-02 | 2007-05-01 | Lam Research Corporation | Twist-N-Lock wafer area pressure ring and assembly |
US20120305404A1 (en) * | 2003-10-22 | 2012-12-06 | Arthur Keigler | Method and apparatus for fluid processing a workpiece |
US8646767B2 (en) * | 2010-07-23 | 2014-02-11 | Lam Research Ag | Device for holding wafer shaped articles |
US8900425B2 (en) * | 2011-11-29 | 2014-12-02 | Applied Materials, Inc. | Contact ring for an electrochemical processor |
JP5643239B2 (en) * | 2012-01-30 | 2014-12-17 | 株式会社荏原製作所 | Substrate holder and plating apparatus |
US20130333616A1 (en) * | 2012-06-18 | 2013-12-19 | Tel Solar Ag | Plasma processing system with movable chamber housing parts |
US9418883B2 (en) * | 2013-07-03 | 2016-08-16 | Lam Research Ag | Device for holding wafer shaped articles |
JP6545585B2 (en) * | 2014-10-16 | 2019-07-17 | 株式会社荏原製作所 | Substrate holder and plating apparatus |
PT3034657T (en) * | 2014-12-19 | 2019-05-31 | Atotech Deutschland Gmbh | Substrate holder for vertical galvanic metal deposition |
JP6799395B2 (en) | 2016-06-30 | 2020-12-16 | 株式会社荏原製作所 | Substrate holders, transfer systems that convey substrates in electronic device manufacturing equipment, and electronic device manufacturing equipment |
US10573541B2 (en) * | 2016-11-28 | 2020-02-25 | Axcelis Technologies, Inc. | System for semiconductor wafer retention and sensing in a vacuum load lock |
-
2018
- 2018-06-25 JP JP2018119875A patent/JP7003005B2/en active Active
-
2019
- 2019-06-13 KR KR1020190070012A patent/KR20200000801A/en not_active Application Discontinuation
- 2019-06-19 CN CN201910532201.9A patent/CN110629276B/en active Active
- 2019-06-19 TW TW108121171A patent/TWI810320B/en active
- 2019-06-24 SG SG10201905834QA patent/SG10201905834QA/en unknown
- 2019-06-25 US US16/451,387 patent/US11535949B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW202001004A (en) | 2020-01-01 |
KR20200000801A (en) | 2020-01-03 |
JP7003005B2 (en) | 2022-01-20 |
TWI810320B (en) | 2023-08-01 |
JP2020002389A (en) | 2020-01-09 |
US11535949B2 (en) | 2022-12-27 |
US20190390359A1 (en) | 2019-12-26 |
CN110629276B (en) | 2023-11-14 |
CN110629276A (en) | 2019-12-31 |
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