HK1246371A1 - Electroplating device and method for wafer - Google Patents

Electroplating device and method for wafer

Info

Publication number
HK1246371A1
HK1246371A1 HK18105944.6A HK18105944A HK1246371A1 HK 1246371 A1 HK1246371 A1 HK 1246371A1 HK 18105944 A HK18105944 A HK 18105944A HK 1246371 A1 HK1246371 A1 HK 1246371A1
Authority
HK
Hong Kong
Prior art keywords
wafer
electroplating device
electroplating
Prior art date
Application number
HK18105944.6A
Other languages
Chinese (zh)
Inventor
Lee Junho
Liu Zhiyu
Leung Cheung Kai
Original Assignee
Pico Inst Of Smart Chip Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pico Inst Of Smart Chip Shenzhen Co Ltd filed Critical Pico Inst Of Smart Chip Shenzhen Co Ltd
Publication of HK1246371A1 publication Critical patent/HK1246371A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
HK18105944.6A 2017-05-09 2018-05-08 Electroplating device and method for wafer HK1246371A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710321069 2017-05-09

Publications (1)

Publication Number Publication Date
HK1246371A1 true HK1246371A1 (en) 2018-09-07

Family

ID=60293073

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18105944.6A HK1246371A1 (en) 2017-05-09 2018-05-08 Electroplating device and method for wafer

Country Status (3)

Country Link
CN (2) CN207210560U (en)
HK (1) HK1246371A1 (en)
WO (1) WO2018205404A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018205404A1 (en) * 2017-05-09 2018-11-15 创弘智能芯片研究院（深圳）有限公司 Electroplating apparatus and electroplating method for wafer
CN108118377A (en) * 2017-12-27 2018-06-05 德淮半导体有限公司 Reduce the equipment and method of empty wafer defect
CN115058756B (en) * 2022-06-08 2024-05-03 昆山鑫益泉机械设备有限公司 Energy-saving double-flying-target oxidation tank suitable for 3C electronic product oxidation process

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5024746A (en) * 1987-04-13 1991-06-18 Texas Instruments Incorporated Fixture and a method for plating contact bumps for integrated circuits
US6352623B1 (en) * 1999-12-17 2002-03-05 Nutool, Inc. Vertically configured chamber used for multiple processes
CN1534112A (en) * 2003-04-02 2004-10-06 联华电子股份有限公司 Device for avoiding hole forming on electroplating deposited copper film and its use method
CN1536101A (en) * 2003-04-08 2004-10-13 微视科技股份有限公司 Electric plating equipment for wafer
US7837841B2 (en) * 2007-03-15 2010-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof
CN103451694B (en) * 2013-09-04 2016-03-23 山东大学 Brush plating machine plating solution separation and recovery system and control method
CN204237882U (en) * 2014-11-12 2015-04-01 中国科学院苏州纳米技术与纳米仿生研究所 Many size compatibilities single-wafer electroplating clamp
WO2018205404A1 (en) * 2017-05-09 2018-11-15 创弘智能芯片研究院（深圳）有限公司 Electroplating apparatus and electroplating method for wafer

Also Published As

Publication number Publication date
CN107354496A (en) 2017-11-17
WO2018205404A1 (en) 2018-11-15
CN207210560U (en) 2018-04-10

Similar Documents

Publication Publication Date Title
PL3592037T3 (en) Method and device for switching
SG11201708695PA (en) Pre-alignment device and method for wafer
GB2569404B (en) Positioning method and apparatus
SG11201704323XA (en) Wafer processing device and method therefor
GB201713415D0 (en) Method and device
SG10202101083TA (en) Service implementation method and device
SG11201802520YA (en) Wafer inspection method and wafer inspection device
SG10201605928TA (en) Test wafer and using method therefor
SG11201802518XA (en) Wafer inspection device and wafer inspection method
SG10201603036VA (en) Method and device for cutting wafers
SG11202002184TA (en) Method and device for selecting resources
SG10202009481XA (en) Method and apparatus for task scheduling
PL3554041T3 (en) Method and device for sequence determination
SG11201808637XA (en) Methods and apparatus for cleaning semiconductor wafers
EP3611294A4 (en) Electroplating method and device
SG10201908830SA (en) Pre-alignment apparatus and method
IL273501A (en) Metrology method and device
HK1246371A1 (en) Electroplating device and method for wafer
GB201810879D0 (en) Semiconductor device and method for producing semiconductor device
FI3715933T3 (en) Wafer inspection method and wafer
SG11202006091UA (en) Deposition method and deposition apparatus
GB201715774D0 (en) Method and device
GB201715634D0 (en) Mounting apparatus and method
ZA202000407B (en) Device and method for treating must
GB2546799B (en) Mounting method and apparatus