SG10201908830SA - Pre-alignment apparatus and method - Google Patents
Pre-alignment apparatus and methodInfo
- Publication number
- SG10201908830SA SG10201908830SA SG10201908830SA SG10201908830SA SG10201908830SA SG 10201908830S A SG10201908830S A SG 10201908830SA SG 10201908830S A SG10201908830S A SG 10201908830SA SG 10201908830S A SG10201908830S A SG 10201908830SA SG 10201908830S A SG10201908830S A SG 10201908830SA
- Authority
- SG
- Singapore
- Prior art keywords
- alignment apparatus
- alignment
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811110623.9A CN110943021B (en) | 2018-09-21 | 2018-09-21 | Pre-alignment device and method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201908830SA true SG10201908830SA (en) | 2020-04-29 |
Family
ID=69905509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201908830SA SG10201908830SA (en) | 2018-09-21 | 2019-09-23 | Pre-alignment apparatus and method |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN110943021B (en) |
SG (1) | SG10201908830SA (en) |
TW (1) | TWI707426B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111785659B (en) * | 2020-05-25 | 2021-04-06 | 杭州长川科技股份有限公司 | Wafer pre-alignment and wafer ID reading method and device and computer equipment |
WO2022153774A1 (en) * | 2021-01-15 | 2022-07-21 | 東レエンジニアリング株式会社 | Wafer holding device |
CN115140549A (en) * | 2022-03-14 | 2022-10-04 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Transfer mechanism and equipment |
CN117012691A (en) * | 2022-04-29 | 2023-11-07 | 上海微电子装备(集团)股份有限公司 | Sucker assembly, silicon wafer adsorption device, exposure equipment and warpage silicon wafer adsorption method |
CN117471865B (en) * | 2023-11-03 | 2024-04-30 | 江苏雷博微电子设备有限公司 | Silicon wafer placement device for prealignment system of photoetching machine |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1059540A (en) * | 1996-05-13 | 1998-03-03 | Ebara Corp | Substrate clamping device |
JP4552222B2 (en) * | 2001-09-21 | 2010-09-29 | ムラテックオートメーション株式会社 | Wafer aligner |
JP2003303876A (en) * | 2002-04-10 | 2003-10-24 | Seiko Instruments Inc | Semiconductor wafer holding mechanism of sample stage |
JP2008103544A (en) * | 2006-10-19 | 2008-05-01 | Yaskawa Electric Corp | Aligner apparatus |
US8911554B2 (en) * | 2010-01-05 | 2014-12-16 | Applied Materials, Inc. | System for batch processing of magnetic media |
CN103199033B (en) * | 2012-01-05 | 2016-03-23 | 沈阳新松机器人自动化股份有限公司 | For the whirligig of prealignment machine |
CN103811388A (en) * | 2012-11-08 | 2014-05-21 | 沈阳新松机器人自动化股份有限公司 | Two-station wafer pre-alignment device |
CN103489818B (en) * | 2013-10-14 | 2016-04-20 | 北京自动化技术研究院 | A kind of silicon wafer pre-alignment device |
CN105336654B (en) * | 2014-07-29 | 2017-12-29 | 上海微电子装备(集团)股份有限公司 | A kind of prealignment device for adapting to kinds of processes type silicon chip |
US10276418B2 (en) * | 2013-12-31 | 2019-04-30 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Silicon wafer pre-alignment device and method therefor |
CN105632971B (en) * | 2014-11-26 | 2019-06-25 | 上海微电子装备(集团)股份有限公司 | A kind of silicon wafer processing unit and method |
CN108461440B (en) * | 2018-03-30 | 2024-04-05 | 上海新创达半导体设备技术有限公司 | Wafer centering device and method |
-
2018
- 2018-09-21 CN CN201811110623.9A patent/CN110943021B/en active Active
-
2019
- 2019-09-23 SG SG10201908830SA patent/SG10201908830SA/en unknown
- 2019-09-23 TW TW108134274A patent/TWI707426B/en active
Also Published As
Publication number | Publication date |
---|---|
TW202013579A (en) | 2020-04-01 |
CN110943021B (en) | 2022-05-31 |
CN110943021A (en) | 2020-03-31 |
TWI707426B (en) | 2020-10-11 |
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