TWI707426B - Pre-alignment device and method - Google Patents

Abstract

The present invention discloses a pre-alignment device and method. The pre-alignment device includes a bottom plate, a lifting shaft, a compensation shaft, and an opto-mechanical component arranged on the bottom plate, and further includes a rotating shaft component, a claw plate, and a ring sucker. The rotating shaft assembly includes a rotating shaft arranged on the lifting shaft and an extension rod connected to the rotating shaft; the claw plate is connected with the extension rod, and a plurality of first suction components are arranged on it at intervals; the ring sucker is connected with the compensation shaft, on which A plurality of second suction components are provided, the diameter of the circular suction cup is smaller than the diameter of the distribution circle of the claw plate, and the circular suction cup is sleeved on the outside of the rotating shaft assembly, there is a gap between the circular suction cup and the rotating shaft assembly, and the claw plate is provided There is a transfer gap, which is used for the second suction component to pass through when the claw disk and the ring sucker are transferred. The above-mentioned pre-alignment device realizes the adsorption, positioning and flattening of the large warped sheet, and improves the pre-alignment accuracy of the large warped sheet. Correspondingly, the present invention further provides a pre-alignment method.

Description

Pre-alignment device and method

The present invention relates to the field of integrated circuit manufacturing, for example, to a pre-alignment device and method.

In the production process of semiconductor devices, in order to ensure that the silicon wafer can be exposed in a fixed posture, the silicon wafer needs to be transferred to the workpiece table with high centering and orientation accuracy during the transmission process. Because when the silicon wafer is placed in the wafer slot, its position and direction are uncertain. Therefore, before the silicon wafer is transferred to the work stage, the silicon wafer needs to be pre-aligned with a certain precision. Specifically, by measuring the silicon wafer The center of the wafer is used to determine the current position of the wafer, and the direction of the wafer is determined by measuring the direction of the wafer gap.

With the development of the semiconductor industry, there are more and more types of silicon wafers. In order to meet the positioning needs of warped wafers, ultra-thin wafers and other process wafers, the invention patent of China Patent Publication No. CN105336654A discloses a kind of silicon wafers suitable for multiple process types. Pre-alignment device. This device uses ceramic suction cups and half-moon suction cups to perform multi-point adsorption and positioning of silicon wafers to meet the positioning requirements of different types of process wafers, and can adapt to pre-alignment of various process suction cups. However, in recent years, the emergence of large warped sheets has put forward new requirements for the adaptability of pre-alignment equipment. When pre-aligning the large warped sheet, in order to ensure the accuracy of the pre-alignment, the warped sheet needs to be flattened, and in order to realize the flattening process of the warped sheet, the area near the edge of the warped sheet needs to be adsorbed and warped The curved piece is used to flatten the warped piece, so that the diameter of the distribution circle of the ceramic suction cup needs to be increased. The half moon suction cup of the above device is arranged around the outside of the ceramic suction cup. If the distribution circle diameter of the ceramic suction cup is increased, in order to avoid the ceramic suction cup and the half moon When the suction cup interferes, the diameter of the distribution circle of the half moon suction cup needs to be increased accordingly. However, if the diameter of the distribution circle of the half-moon suction cup increases, the diameter of the distribution circle of the half-moon suction cup will be larger than the diameter of the warped sheet, resulting in a situation where the half-moon suction cup is located outside the distribution area of the warped sheet and cannot absorb the warped sheet. Therefore, the prior silicon wafer pre-alignment device cannot meet the pre-alignment and positioning requirements of large warped wafers.

Previous silicon wafer pre-alignment devices cannot meet the pre-alignment and positioning requirements of large warped wafers. The purpose of the embodiments of the present invention is to provide a pre-alignment device and method that can perform adsorption positioning and flattening processing on large warped sheets, meet the pre-alignment and positioning requirements of large warped sheets, and improve the pre-alignment of large warped sheets. Quasi-precision.

To achieve this goal, on the one hand, the embodiments of the present invention adopt the following technical means:

A pre-alignment device includes: a bottom plate, a lifting shaft, a compensation shaft and an optomechanical component arranged on the bottom plate, and further includes:

The rotating shaft assembly includes a rotating shaft and an extension rod, the rotating shaft is arranged on the lifting shaft, and one end of the extension rod is connected with the rotating shaft;

The claw plate is connected to the other end of the extension rod, and a plurality of first suction components are arranged on the claw plate at intervals in the circumferential direction;

The ring sucker is connected to the compensation shaft, and a plurality of second suction components are arranged on it. The diameter of the ring sucker is smaller than the diameter of the distribution circle of the claw plate, and the ring sucker is sleeved on the outside of the rotating shaft assembly. There is a gap between the shaft components;

The rotating shaft assembly can drive the claw plate to rotate, the lifting shaft can drive the claw plate to move up and down in the vertical direction, and the compensation shaft can drive the ring sucker to move in the horizontal direction. The claw plate is provided with a connection gap for the claw plate and the ring The second suction component passes through the suction cup when the silicon wafer is transferred.

In an embodiment, each first suction component and/or each second suction component includes a rigid support and a rubber suction cup, the rigid support is provided with a first vent hole, the rubber suction cup is connected to the rigid support, and the rubber suction cup is connected to the rigid support The first vent is connected.

In one embodiment, each first suction component and/or each second suction component includes: a rigid pillar, an elastic member, an elastic pillar, and a rubber suction cup. The elastic member is arranged inside the rigid pillar, and the elastic pillar is provided with a first Two vents, one end of the elastic support is arranged in the rigid support to be sleeved with the elastic member, and the other end is arranged outside the rigid support to be connected to the rubber suction cup, and the rubber suction cup is connected to the second ventilation hole.

In an embodiment, a plurality of third suction components are further provided on the claw plate, and the center of each third suction component is collinear with the center of the corresponding first suction component and the center of the claw plate, and the first suction component The three suction components are arranged between the corresponding first suction component and the center of the claw plate.

In one embodiment, each third suction component includes a rigid pillar and a rubber suction cup, the rigid pillar is provided with a first vent hole, the rubber suction cup is connected to the rigid pillar, and the rubber suction cup communicates with the first vent hole.

In one embodiment, each third suction component includes: a rigid support, an elastic member, an elastic support, and a rubber suction cup. The elastic member is arranged inside the rigid support, the elastic support is provided with a second vent hole, and one end of the elastic support is set on the rigid The inside of the pillar is sleeved with the elastic member, and the other end is arranged outside the rigid pillar to connect with a rubber suction cup, and the rubber suction cup communicates with the second vent hole.

In one embodiment, the pre-alignment device further includes a position adjustment component, and the position adjustment component includes a sliding rail, a sliding block, and a driving member. The sliding rail is connected with the bottom plate, the sliding block can slide on the sliding rail, and the optical machine component is installed on the sliding block, and the driving part is connected with the sliding block.

In one embodiment, the pre-alignment device further includes an air slip ring, the air slip ring is sleeved inside the extension rod, and the air slip ring is respectively communicated with the plurality of first suction components and the plurality of third suction components.

In one embodiment, the pre-alignment device further includes a sensor and a stopper, the sensor is arranged on the ring suction cup or the second suction assembly, and the stopper is arranged on the claw plate; or, the sensor is arranged on the claw On the disk, the baffle is arranged on the ring suction cup or the second suction assembly; when the plurality of first suction components and the plurality of second suction components overlap in the radial position, the baffle triggers the sensor.

In an embodiment, the claw plate includes at least a plurality of claw rods, and the plurality of claw rods are distributed outwardly from the center of the claw plate, and a communication gap is formed between the adjacent claw rods, and each first suction component is arranged in a corresponding The end of the claw rod.

In an embodiment, a reinforcing rib is provided between two adjacent claw rods.

In an embodiment, a rigid support block is provided at the center of the claw plate.

In one embodiment, when the claw plate and the ring sucker are connected to the silicon wafer, if the plurality of first suction components and the plurality of second suction components overlap in the radial position, the rotating shaft drives the claw plate to rotate by a predetermined angle so that the The positions of the first suction components and the plurality of second suction components are staggered, wherein the preset angle is less than 1/3 of the included angle between two adjacent first suction components.

On the other hand, an embodiment of the present invention further provides a pre-alignment method based on any one of the above-mentioned pre-alignment devices, including the following steps:

The claw plate receives the silicon wafer;

The rotating shaft drives the claw plate to rotate, and the opto-mechanical component collects the edge information of the silicon wafer and sends the collected edge information of the silicon wafer to the controller;

The controller calculates the eccentricity of the silicon wafer according to the received silicon edge information, and controls the rotation of the rotating shaft according to the eccentricity, and rotates the direction of the largest silicon eccentricity to the compensation axis movement direction;

The lifting shaft is lowered to the transfer station, and the silicon wafer is transferred from the claw plate to the ring suction cup;

The lifting shaft drives the claw plate to continue to descend to the transfer low position, and the compensation shaft drives the ring sucker to move to compensate for the eccentricity of the silicon wafer;

The lifting shaft drives the claw plate up to the transfer station, and the silicon wafer is transferred from the ring sucker to the claw plate;

The lifting shaft drives the claw plate to continue to rise to the pre-alignment position, and the rotating shaft drives the claw plate to rotate. The opto-mechanical component collects silicon chip gap information and silicon chip edge information, and sends the collected silicon chip gap information and silicon chip edge information To the controller

The controller calculates the eccentricity margin of the silicon wafer according to the wafer gap information and the wafer edge information. When the eccentricity margin of the silicon wafer meets the preset conditions, the rotation axis rotates to rotate the wafer gap below the optomechanical component;

The rotation axis rotates back and forth at a small angle. The opto-mechanical component collects the wafer gap information and sends it to the controller. The controller calculates the wafer gap position error according to the wafer gap information. The rotation axis rotates according to the compensation gap position error to complete the wafer orientation .

In one embodiment, the lifting shaft is lowered to the transfer station, and the silicon wafer is transferred from the claw plate to the ring sucker before the step includes: when the first suction component and the second suction component overlap in the radial position, the rotating shaft drives the claw The disc rotates at a preset angle so that the positions of the first suction component and the second suction component are staggered;

After the step that the lifting shaft drives the claw plate to continue to descend to the transfer low position includes: the rotating shaft drives the claw plate to continue to rotate in the same direction by a preset angle;

The lifting shaft drives the claw plate up to the transfer station, and the step of transferring the silicon wafer from the ring sucker to the claw plate includes: the rotating shaft drives the claw plate to reversely rotate a preset angle.

In one embodiment, the preset angle is less than 1/3 of the included angle between two adjacent first suction components.

In one embodiment, the step of receiving the silicon wafer by the claw plate includes: placing the silicon wafer on the claw plate by the wafer fork, and the first suction component is vacuumed to adsorb the silicon wafer.

In one embodiment, the step of receiving the silicon wafer by the claw plate includes:

The lifting shaft drives the claw plate down to the loading station, the wafer fork places the silicon wafer on the circular suction cup, and the second suction assembly opens the vacuum to adsorb the silicon wafer;

The lifting shaft drives the claw plate up to the transfer station, the first suction component opens the vacuum to suck the silicon wafer, the second suction component closes the vacuum, and the lifting shaft drives the claw plate to the pre-alignment station.

In one of the embodiments, the step of receiving the silicon wafer by the claw plate includes the following steps: adjusting the position adjustment component according to the size of the silicon wafer, and adjusting the opto-mechanical component to a position corresponding to the size of the silicon wafer.

The above-mentioned pre-alignment device includes a claw plate and a ring suction cup. The diameter of the ring suction cup is smaller than the diameter of the distribution circle of the claw plate. An extension rod is arranged on the rotating shaft. The claw plate is connected with the extension rod. The ring suction cup is sleeved on the rotating shaft. There is a gap between the ring sucker and the rotating shaft assembly on the outside of the assembly. The diameter of the distribution circle of the claw plate is larger than the diameter of the ring sucker, and the first suction component arranged on the claw plate can absorb the large warping piece at the edge area of the large warping piece to flatten the large warping piece, thereby achieving large warpage Flattening the film. At the same time, when the claw plate and the circular suction cup are connected to the silicon wafer, the claw plate is lowered in the vertical direction, the first suction assembly and the second suction assembly are staggered with each other, and the second suction assembly is located between two adjacent first suction assemblies The first suction component and the second suction component do not interfere with each other in the connecting gap. In addition, there is a gap between the ring sucker and the rotating shaft assembly, which provides movement space for the horizontal movement of the ring sucker, and the ring sucker will not interfere with the rotating shaft assembly when it moves horizontally with the compensation shaft. Therefore, compared with the previous silicon wafer alignment device, the above-mentioned pre-alignment device realizes the adsorption positioning and flattening treatment of the large warped sheet, which can meet the pre-aligned positioning requirements of the large warped sheet and improve the large warpage Film pre-alignment accuracy.

The pre-alignment method based on the above-mentioned pre-alignment device can perform adsorption positioning and flattening treatment on the large warped sheet, and improve the pre-alignment accuracy of the large warped sheet.

The purpose of the embodiments of the present invention is to provide a pre-alignment device and method that can perform adsorption positioning and flattening processing on large warped sheets, meet the pre-alignment and positioning requirements of large warped sheets, and improve the pre-alignment of large warped sheets. Quasi-precision.

10‧‧‧Bottom plate

20‧‧‧Lift shaft

30‧‧‧Compensation axis

40‧‧‧Optical Machine Components

41‧‧‧Optical Machine Support

42‧‧‧First light source

43‧‧‧Lens

44‧‧‧CCD camera

45‧‧‧Second light source

50‧‧‧Rotating shaft assembly

51‧‧‧Rotation axis

52‧‧‧Extension Rod

60‧‧‧Claw plate

61‧‧‧Claw lever

62‧‧‧First suction assembly

63‧‧‧Air pipe joint

64‧‧‧Rigid support block

65‧‧‧Third suction assembly

66‧‧‧Reinforcing rib

70‧‧‧Ring Suction Cup

71‧‧‧Second suction assembly

80‧‧‧Position adjustment components

81‧‧‧Slide rail

82‧‧‧Slider

83‧‧‧Drive

200‧‧‧Sensor

300‧‧‧Block

621‧‧‧rigid pillar

622‧‧‧Elastic Parts

623‧‧‧Elastic pillar

624‧‧‧Rubber Suction Cup

625‧‧‧Second vent

626‧‧‧First vent

[Figure 1] is a schematic structural diagram of a pre-alignment device in an embodiment of the present invention.

[Figure 2] is a cross-sectional view of the connection between the first suction component and the tracheal joint in an embodiment of the present invention.

[Fig. 3] is a schematic structural diagram of a pre-alignment device in another embodiment of the present invention.

[Figure 4] is a cross-sectional view of the structure of the first suction component in another embodiment of the present invention.

[Fig. 5] is a schematic structural diagram of a pre-alignment device in another embodiment of the present invention.

[Figure 6] is a flow chart of a method of pre-aligning a device in an embodiment of the present invention.

The technical means of the present invention will be further described below in conjunction with the drawings and specific implementations.

In the description of the present invention, it should be understood that the words "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", " The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply the device or The components must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

Please refer to FIG. 1, the pre-alignment device of an embodiment includes: a bottom plate 10, a lifting shaft 20 arranged on the bottom plate 10, a compensation shaft 30, and an optomechanical component 40, and further includes a rotating shaft component 50, a claw plate 60, and a ring吸盘70. The rotating shaft assembly 50 includes a rotating shaft 51 and an extension rod 52. The rotating shaft 51 is arranged on the lifting shaft 20. One end of the extension rod 52 is connected to the rotating shaft 51; the claw plate 60 is connected to the other end of the extension rod 52 on the claw plate 60 A plurality of first suction components 62 are arranged at intervals along the circumferential direction; the annular suction cup 70 is connected to the compensation shaft 30, and a plurality of second suction components 71 are arranged thereon. The diameter of the annular suction cup 70 is smaller than the distribution circle diameter of the claw disk 60 , And the annular sucker 70 is sleeved on the outside of the rotating shaft assembly 50, and there is a gap between the annular sucker 70 and the rotating shaft assembly 50.

The rotating shaft assembly 50 can drive the claw plate 60 to rotate, the lifting shaft 20 can drive the claw plate 60 to move up and down in the vertical direction, and the compensation shaft 30 can drive the ring sucker 70 to move in the horizontal direction. The claw plate 60 is provided with a transfer gap. The transfer gap is used to allow the second suction assembly 71 to pass through when the turntable (60) and the circular sucker 70 are transferring silicon wafers.

Specifically, the opto-mechanical component 40 is arranged adjacent to the lifting shaft 20, which is used to collect the edge information and notch information of the large warped silicon wafer during the movement of the claw plate 60 and the ring sucker 70 and send the collected information to the control The controller is used to calculate the edge information and gap information of the large warpage silicon wafer to obtain the center and direction of the large warpage silicon wafer. The specific controller can be a control module integrated in the lithography machine controller, or It may be a controller independently provided for the pre-alignment device, which is not specifically limited in this embodiment.

Further, as shown in FIG. 1, the optomechanical assembly 40 includes an optomechanical support base 41, a first light source 42, a lens 43, a CCD camera 44, and a second light source 45. The optomechanical support base 41 is installed on the base plate 10, and the CCD camera 44 is installed on the optomechanical support base 41, the first light source 42 and the lens 43 are both installed on the CCD camera 44, and the second light source 45 is installed on the optomechanical support base 41. The CCD camera 44 collects the image of the large warped silicon wafer through the lens 43, obtains the edge information and notch information of the large warped silicon wafer and sends it to the controller.

The above-mentioned pre-alignment device includes a claw plate 60 and a circular suction cup 70. The diameter of the circular suction cup 70 is smaller than the distribution circle diameter of the claw plate 60. An extension rod 52 is provided on the rotating shaft 51, and the claw plate 60 is connected to the extension rod 52. The annular sucker 70 is sleeved on the outside of the rotating shaft assembly 50, and there is a gap between the annular sucker 70 and the rotating shaft assembly 50. The diameter of the distribution circle of the claw plate 60 is larger than the diameter of the ring suction plate 70, and the plurality of first suction components 62 arranged on the claw plate 60 can warp The edge area of the sheet absorbs the large warped sheet to flatten the large warped sheet and realize the flattening treatment of the large warped sheet. At the same time, when the claw plate 60 and the ring suction plate 70 are handed over the silicon wafer, the claw plate 60 descends in the vertical direction, and the plurality of first suction components 62 and the plurality of second suction components 71 are staggered to each other, and each second suction component 71 Located in the connecting gap between two adjacent first suction components 62, the plurality of first suction components 62 and the plurality of second suction components 71 do not interfere with each other. In addition, there is a gap between the annular sucker 70 and the rotating shaft assembly 50 to provide a movement space for the annular sucker 70 to move horizontally. When the annular sucker 70 moves horizontally with the compensation shaft 30, it will not interfere with the rotating shaft 51 assembly. Therefore, compared with the previous silicon wafer alignment device, the above-mentioned pre-alignment device realizes the adsorption positioning and flattening treatment of the large warped sheet, which can meet the pre-aligned positioning requirements of the large warped sheet and improve the large warpage Film pre-alignment accuracy.

In one embodiment, the claw plate 60 includes at least a plurality of claw rods 61, and the plurality of claw rods 61 are divergently distributed from the center of the claw plate, and a communication gap is formed between two adjacent claw rods. The assembly 62 is provided at the end of the corresponding claw rod 61. Specifically, as shown in FIG. 1, the claw plate 60 includes a plurality of claw rods 61, and the plurality of claw rods 61 are distributed outwardly from the center of the claw plate, and the plurality of claw rods 61 are arranged at equal intervals along the circumferential direction, and two adjacent ones A communication gap is formed between the two claw rods 61, and the end of each claw rod 61 is provided with a first suction assembly 62. When the claw plate 60 and the ring suction cup 70 are connected with silicon wafers, the plurality of claw rods 61 and the plurality of second suction components 71 are staggered to drive the plurality of first suction components 62 and the plurality of second suction components 71 The staggered arrangement allows the plurality of second suction components 71 to pass through the handover gap. In this embodiment, the claw plate 60 includes a plurality of claw rods 61 arranged at intervals to form a communication gap between two adjacent claw rods 61. In other embodiments, the claw plate 60 can also be positioned adjacent to each other. The two first suction components 62 are provided with a through hole through which the corresponding second suction component 71 can pass as a handover gap, which is not done in this embodiment Specific restrictions.

As shown in FIG. 2, in one embodiment, each first suction component 62 includes a rigid support 621, an elastic member 622, an elastic support 623, and a rubber suction cup 624. The elastic member 622 is disposed inside the rigid support 621, and the elastic support 623 A second vent hole 625 is opened on the upper side. One end of the elastic support 623 is set in the rigid support 621 to be sleeved with the elastic member 622, and the other end is set outside the rigid support 621 to connect to the rubber suction cup 624, and the rubber suction cup 624 is connected to the second vent 625 . Furthermore, the second vent hole 625 is connected to a gas source through a tracheal joint 63. In this embodiment, the rubber suction cup 624 is connected to the rigid support 621 through the elastic support 623, and an elastic member 622 is arranged between the elastic support 623 and the rigid support 621. The elastic member 622 is made of the elastic support 623. The rubber suction cup 624 is used to adapt to The amount of warpage of the warped piece in the suction area corresponding to the rigid pillar 621, the elastic movement of the elastic member 622 supporting the elastic pillar 623 adapts to the amount of warpage of the warped piece between the plurality of first suction components 62, which can effectively increase the amount of warpage. The suction precision and leveling processing precision of the first suction component 62. Specifically, in this embodiment, the elastic member 622 adopts a spring. In other embodiments, the elastic member 622 may further adopt other elastic components, which is not specifically limited in this embodiment.

Specifically, the difference between each second adsorption assembly 71 and the first adsorption assembly 62 is only that the two are different in size. The height of the second adsorption assembly 71 is greater than the height of the first adsorption assembly 62, and its specific structural composition and principle are the same as those described above. The structural composition and principle of a suction assembly 62 are the same, and will not be repeated here. Specifically, the height difference between the second suction component 71 and the first suction component 62 can satisfy that when the claw plate 60 is handed over to the annular suction cup 70, the suction surface of the first suction component 62 and the suction surface of the second suction component 71 are coplanar. Moreover, when the height of the second suction assembly 71 is sufficient for the claw plate 60 to complete the handover with the circular suction cup 70, after the claw plate continues to move downward, the second suction The suction surface of the component 71 may be higher than the suction surface of the first suction component 62, and the specific height difference between the second suction component 71 and the first suction component 62 is not specifically limited in this embodiment.

As shown in Figures 3 and 4, in another embodiment, each first suction assembly 62 includes a rigid support 621 and a rubber suction cup 624. The rigid support 621 is provided with a first vent 626, the rubber suction cup 624 and the rigid support 621 is connected, and the rubber suction cup 624 is in communication with the first vent 626. Further, the first vent hole 626 can be connected to an air source through an air guide component such as a tracheal joint. Specifically, the difference between each second suction component 71 and the first suction component 62 is only that they are different in size, and their specific structure and composition are the same as those of the first suction component 62 in this embodiment. Do not repeat it. The first suction component 62 of the present embodiment performs vacuum suction on the warped sheet by adapting to the warping amount of the warped sheet, so as to realize the suction positioning and flattening treatment of the warped sheet, because the elastic member 622 and the elastic support 623 are omitted. In this embodiment, the first adsorption assembly 62 and the second adsorption assembly 71 are beneficial to save device cost. Specifically, in practical applications, suitable first adsorption assembly 62 and second adsorption assembly 71 can be selected according to specific process requirements and cost requirements. In addition, the first suction assembly 62 and the second suction assembly 71 may adopt the same structure or different structures, and the foregoing embodiment does not specifically limit it.

In one embodiment, the above-mentioned pre-alignment device further includes a sensor 200 and a stopper 300, the sensor 200 is arranged on the ring suction cup 70 or the second suction assembly 71, and the stopper 300 is arranged on the claw plate 60 Or, the sensor 200 is set on the claw plate 60, and the baffle 300 is set on the ring suction cup 70 or the second suction assembly 71; when each first suction assembly 62 and the corresponding second suction assembly 71 are in the radial direction When the direction overlaps, the barrier 300 triggers the sensor 200. Specifically, as shown in FIGS. 1 and 3, six claw rods 61 are provided on the claw plate 60, and three second suction assemblies 71 are provided on the ring suction plate 70. Correspondingly, the number of sensors 200 is 3. The number of the blocking pieces 300 is six, the three sensors 200 are respectively arranged on the second suction assembly 71, and the six blocking pieces 300 are correspondingly arranged on the six claw rods 61, when the claw rod 61 and the second When the position of the suction component 71 overlaps (that is, the position of the first suction component 62 and the second suction component 71 overlap in the radial direction), the stopper 300 triggers the sensor 200. At this time, the claw rod 61 and the second suction component 71 There is interference between the positions of the two, which causes the claw plate 60 to not be directly lowered. At this time, it is necessary to rotate the rotating shaft 51 to drive the claw plate 60 to rotate, so that the claw plate 60 rotates to a certain angle and the position of the second suction assembly 71 is mutually offset. Then the lifting shaft 20 drives the claw plate 60 down. In the above-mentioned embodiment, the sensor 200 is arranged on the second suction assembly 71, and the baffle 300 is arranged on the claw rod 61. In other embodiments, the sensor 200 may be further arranged on the ring suction cup 70, or, Further, the baffle 300 can be arranged on the ring suction cup 70 or the second suction assembly, and the sensor 200 can be arranged on the claw rod, as long as it can be ensured that each first suction assembly 62 and the corresponding second suction assembly 71 are in contact with each other. When the positions in the radial direction overlap, the stopper 300 can trigger the sensor 200. This embodiment does not limit the specific positions of the sensor 200 and the stopper 300.

Further, in one embodiment, when the claw plate 60 and the ring suction cup 70 are connected to the silicon wafer, if the plurality of first suction components 62 and the plurality of second suction components 71 overlap in the radial direction, the rotation The shaft 51 drives the claw plate 60 to rotate at a predetermined angle so that the positions of the plurality of first suction components 62 and the plurality of second suction components 71 are staggered, wherein the predetermined angle is smaller than the included angle between two adjacent first suction components 62 1/3 times. Specifically, when it is necessary to transfer the warped piece on the claw plate 60 to the annular suction plate 70, the lifting shaft 20 drives the claw plate 60 to descend in the vertical direction. If the positions of the first suction assembly 62 and the second suction assembly 71 overlap , That is, the positions of the plurality of claw rods 61 and the plurality of second suction components 71 overlap, and the claw plate 60 must be rotated to make the plurality of claw rods 61 And the positions of the plurality of second suction components 71 are staggered. However, because the claw plate 60 performs a rotating operation before descending, the claw plate 60 rotates with the warping piece, which makes the warping piece rotate a certain angle relative to the original detection position, and when the warping piece is transferred back by the ring sucker 70 When the claw plate 60 is raised again to continue the detection, it is necessary to ensure that the warped piece maintains the original detection orientation, so that rotation compensation is required. If the rotation compensation is directly performed, multiple claw rods 61 and multiple second suction components 71 The positions overlap and interfere with the ascent of the claw plate 60. In order to prevent the claw plate 60 from interfering during the ascent process, when the claw plate 60 is lowered and the warping piece is transferred to the ring sucker 70, continue to rotate the claw plate 60 in the same direction at the same angle before descending. After the warping piece is transferred back to the claw plate 60 by the ring suction cup 70, the claw plate 60 is rotated in the reverse direction by the same angle to ensure that the warping piece returns to the original detection position. Therefore, in this embodiment, the preset angle is set to be less than 1/3 of the included angle between two adjacent first suction components 62, that is, 1/3 of the included angle between two adjacent claw rods 61. To ensure that the claw plate 60 rotates in the same direction twice without interference with the second suction assembly 71.

In one embodiment, as shown in FIGS. 1 and 3, a rigid support block 64 is provided at the center of the claw plate 60. Specifically, the upper surface of the rigid support block 64 is coplanar with the upper surface of the rigid pillar 621 of the first suction assembly 62. The rigid support block 64 is arranged at the center of the claw plate 60. The six claw rods 61 are centered on the center of the claw plate 60 and distributed at equal intervals in the circumferential direction. The six first suction components 62 are respectively arranged at the ends of the six claw rods 61, The upper surface of the rigid support block 64 is coplanar with the upper surface of the rigid support 621 of each first suction component 62, when the six first suction components 62 suction the edge of the warped sheet and pull down the edge of the warped sheet to flatten the warped sheet , The rigid support block 64 provides coplanar support at the center of the warped sheet, which can further improve the flattening accuracy of the warped sheet.

In the above embodiment, six claw rods 61 are provided on the claw plate 60, and correspondingly, the number of the plurality of first suction assemblies 62 is six. However, this embodiment is not used for the claw rod 61 and The number of multiple first suction components 62 is specifically limited. In actual applications, the number of multiple claw rods 61 and the number of first suction components 62 can be set according to actual needs, as long as the numbers of the two are equal, and can be more than six , Can be less than six. Similarly, in this embodiment, the number of the plurality of second suction components 71 is three, and the number of the plurality of second suction components 71 can be correspondingly set according to the number of the plurality of claw rods 61 in practical applications. Further, in order to ensure the suction positioning and leveling effect, the number of the plurality of claw rods 61 and the plurality of second suction components 71 is preferably not less than three.

As shown in FIG. 5, in another embodiment, a plurality of third suction components 65 are further provided on the claw rod 61, and each third suction component 65 is spaced apart from the corresponding first suction component 62. In this embodiment, the claw rod 61 is provided with two sets of suction components. The third suction component 65 and the first suction component 62 can perform two-level flattening treatment on the warped sheet, which helps to improve the flattening of the warped sheet. Accuracy. In addition, the two sets of suction components can be further used to suck and flatten warped sheets of different sizes, which can improve the versatility of the pre-alignment device. For example, the first suction component 62 can be used to suction warped sheets with a larger flat size (such as 12-inch warped silicon wafers), and the third suction component 65 can be used to suction warped sheets with a smaller flat size (such as 8-inch warped silicon wafers). Silicon). When the 12-inch warped silicon wafer is adsorbed, the third suction assembly 65 first opens the vacuum suction, and then the first suction assembly 62 opens the vacuum suction again, which can realize the two-stage adsorption of the silicon wafer and improve the leveling accuracy.

As shown in FIG. 5, in one embodiment, the above-mentioned pre-alignment device further includes a position adjustment component 80. The position adjustment component 80 includes a sliding rail 81, a sliding block 82, and a driving member 83. The sliding rail 81 is connected to the bottom plate 10, The sliding block 82 slides on the sliding rail 81, and the optical-mechanical assembly 40 is installed on the sliding block 82, and the driving member 83 is connected with the sliding block 82. In this embodiment, the optomechanical component 40 is installed on the position adjusting component 80, and the position of the optomechanical component 40 can be adjusted by adjusting the position adjusting component 80, so that the position of the optomechanical component 40 can be warped with different sizes.片 corresponding. specifically, When the station of the optomechanical assembly 40 needs to be adjusted, the drive 83 drives the sliding block 82 to slide on the slide rail 81 to drive the optomechanical assembly 40 to move. When the optomechanical assembly 40 moves to the target station, the driver is turned off 83. Just stop the sliding of the slider 82. Specifically, the driving member 83 includes a driving component and a transmission mechanism. The driving component is connected to the slider 82 through the transmission mechanism. The driving component may be any of a motor, a pneumatic cylinder or a hydraulic cylinder, and the transmission mechanism may be a gear transmission mechanism or a wire. The lever transmission mechanism, etc., are not specifically limited in this embodiment.

As shown in FIG. 5, in one embodiment, the above-mentioned pre-alignment device further includes an air slip ring (not shown in the figure), the air slip ring is sleeved inside the extension rod, and the air slip ring is connected to a plurality of first A suction assembly 62 and a plurality of third suction assemblies 65 are in communication. In this embodiment, an air slip ring is used to provide air passages for the first adsorption assembly 62 and the third adsorption assembly 65 to separately supply air. Specifically, the air slip ring is an air slip ring with two inlets and two outlets.

In one embodiment, a reinforcing rib 66 is provided between two adjacent claw rods 61. In this embodiment, the reinforcing rib 66 is provided between two adjacent claw rods 61 to improve the structural strength of the claw plate 60. As shown in FIG. 5, in this embodiment, the reinforcing rib 66 is connected to the end of the claw rod 61. In other embodiments, the reinforcing rib 66 can be connected to any position of the claw rod 61, as long as the reinforcing rib and the second suction assembly are ensured No interference between 71 is enough.

Further, as shown in FIG. 5, in this embodiment, the number of the sensor 200 is one, the number of the baffle 300 is six, and the sensor 200 is arranged on the ring suction cup 70 and the plurality of second suction components 71 is staggered, the baffle 300 is set on the reinforcing rib and the multiple first suction components 62 are staggered. As long as one of the baffles 300 triggers the sensor 200, it means that there are multiple claw rods 61 and multiple second suction components. 71 has positional overlap in the radial direction. In this embodiment, only one sensor 200 can be provided to achieve interference between multiple claw rods 61 and multiple second suction components 71 Detection can effectively save the cost of the sensor.

In one embodiment, each third suction assembly 65 includes a rigid pillar and a rubber suction cup, the rigid pillar is provided with a first vent hole, the rubber suction cup is connected to the rigid pillar, and the rubber suction cup communicates with the vent hole. In another embodiment, each third suction component 65 includes: a rigid support, an elastic member, an elastic support, and a rubber suction cup. The elastic member is arranged inside the rigid support, the elastic support is provided with a second vent hole, and one end of the elastic support is provided The rigid pillar is sleeved with the elastic member, and the other end is arranged on the outside of the rigid pillar and connected with the rubber sucker, and the rubber sucker is connected with the second vent hole. Specifically, the structural composition and structural principle of each third suction component 65 are the same as the structural composition and principle of the first suction component 62 in the foregoing embodiment, and will not be repeated here. In addition, in actual applications, the first adsorption assembly 62, the second adsorption assembly 71, and the third adsorption assembly 65 may all adopt the same structure or different structures.

As shown in FIG. 6, based on the above-mentioned pre-alignment device, the present invention further provides a pre-alignment method, including the following steps:

Step S11: The claw plate 60 receives the silicon wafer.

In one embodiment, when the height of the first suction assembly 62 on the claw plate 60 can meet the movement space required by the fork to pick and place the silicon wafer, the silicon wafer can be directly placed on the claw plate 60. Specifically, the step S11 includes: the wafer fork places the silicon wafer on the claw plate 60, and the first suction component 62 opens a vacuum to suck the silicon wafer. If the silicon wafer is a warped wafer, the first suction component 62 suctions the silicon wafer and flattens it.

In one embodiment, when the height of the plurality of first suction components 62 on the claw plate 60 cannot satisfy the movement space required by the wafer fork to pick and place the silicon wafer, it is necessary to first receive the silicon wafer by the ring suction cup 70, and then The silicon wafer is transferred to the claw plate 60. Specifically, step S11, the claw plate receives the silicon wafer The steps include: the lifting shaft 20 drives the claw plate 60 down to the loading station, the chip fork places the silicon wafer on the ring suction plate 70, the plurality of second suction components 71 turn on the vacuum to adsorb the silicon wafer; the lifting shaft 20 drives the claw plate 60 rises to the handover station, the first suction unit 62 opens the vacuum to suck the silicon wafer, if the silicon wafer is a warped piece, the first suction unit 62 sucks and flattens the silicon wafer, after which the second suction unit 71 closes the vacuum, The lifting shaft 20 drives the claw plate 60 to rise to the pre-alignment station.

Specifically, the above-mentioned loading station is the distance between the top surface of the rubber suction cup 624 on the first suction assembly 62 and the top support surface of the rigid support 621 of the second suction assembly 71, which can meet the requirements for picking and placing silicon wafers by the fork. Sports space.

The above-mentioned transfer station is that the top supporting surface of the rigid pillar 621 of the first suction assembly 62 and the top supporting surface of the rigid pillar 621 of the second suction assembly 71 are coplanar.

The above-mentioned pre-alignment station is the distance between the top surface of the rubber suction cup 624 of the second suction assembly 71 and the bottom surface of the claw plate 60, which is the safety of the rubber suction cup 624 on the second suction assembly 71 and the claw plate 60 in the vertical direction. space.

Step S12: The rotating shaft 51 drives the claw plate 60 to rotate, and the opto-mechanical component 40 collects the edge information of the silicon wafer, and sends the collected edge information of the silicon wafer to the controller.

Step S13: The controller calculates the eccentricity of the silicon wafer according to the received wafer edge information, and controls the rotation axis to rotate 50 according to the eccentricity, and rotates the direction of the largest eccentricity of the silicon wafer to the movement direction of the compensation axis 30.

Step S14: the lifting shaft 20 drives the claw disk 60 to descend to the transfer station, and the silicon wafer is transferred from the claw disk 60 to the ring sucker 70. Specifically, after the lifting shaft 20 drives the claw plate 60 down to the transfer station, the second suction assembly 71 opens the vacuum, the first suction assembly 62 closes the vacuum, and the silicon wafer is transferred from the claw plate 60 to the ring suction plate 70.

Step S15: The lifting shaft 20 drives the claw plate 60 to continue to descend to the transfer low position, and the compensation shaft 30 drives the ring sucker 70 to move to compensate for the eccentricity of the silicon wafer.

Specifically, the transfer low position is the distance between the top surface of the rubber suction cup 624 on the first suction assembly 62 and the bottom surface of the ring suction cup 70, and the distance is the vertical edge between the rubber suction cup 624 on the first suction assembly 62 and the ring suction cup 70 Direction of the safe space.

Step S16: The lifting shaft 20 drives the claw plate 60 to rise to the transfer station, and the silicon wafer is transferred from the ring sucker 70 to the claw plate 60. Specifically, after the lifting shaft 20 drives the claw plate 60 up to the transfer station, the first suction assembly 62 turns on the vacuum, the second suction assembly 71 turns off the vacuum, and the silicon wafer is transferred from the ring suction cup 70 to the claw plate 60.

Step S17: The lifting shaft 20 drives the claw plate 60 to continue to rise to the pre-alignment position, the rotating shaft 51 drives the claw plate 60 to rotate, and the optomechanical assembly 40 collects silicon chip notch information and silicon chip edge information, and then collects the silicon chip Notch messages and silicon edge messages are sent to the controller.

Step S18: The controller calculates the eccentricity margin of the silicon wafer according to the wafer gap information and the wafer edge information. When the eccentricity margin of the silicon wafer meets the preset condition, the rotating shaft 51 rotates to rotate the wafer gap to the optomechanical component Below 40.

Specifically, when the eccentricity margin of the silicon wafer satisfies the preset condition, the center of the silicon wafer circle is determined, and the notch of the silicon wafer is rotated to below the optomechanical component 40 to perform step S19. When the eccentricity margin does not meet the preset condition, steps S12 to S17 are repeated until the eccentricity margin of the silicon wafer meets the preset condition.

Step S19: The rotating shaft 51 rotates back and forth at a small angle. The opto-mechanical component 40 collects the wafer gap information and sends it to the controller. The controller calculates the wafer gap position error according to the wafer gap information, and the rotation axis 51 rotates according to the compensation gap position error , Complete the orientation of the silicon wafer.

In one embodiment, before step S14, it includes: when the first suction component 62 and the second suction component 71 overlap in the radial direction, the rotating shaft 51 drives the claw plate 60 to rotate a preset angle so that the first suction component 62 and The position of the second suction assembly 71 is staggered. Further, in step S15, after the lifting shaft 20 continues to descend to the transfer low position, it includes: the rotating shaft 51 drives the claw plate 60 to continue to rotate the predetermined angle in the same direction. Furthermore, after step S16, it includes: the rotating shaft 51 drives the claw plate 60 to reversely rotate by a predetermined angle. Specifically, the rotating shaft 51 drives the claw plate 60 to reversely rotate by a preset angle before performing step S17. Specifically, in this embodiment, in order to prevent the claw plate 60 from interfering with the second suction assembly 71 during the descending process, the claw plate 60 is first rotated by a preset angle, and further, in order to make the claw plate 60 in the ascending process Without interference, when the claw plate 60 is lowered and the silicon wafer is transferred to the ring sucker 70, the claw plate 60 continues to rotate in the same direction at the same angle before descending. Finally, after the silicon wafer is transferred back to the claw plate 60 by the ring sucker 70, the claw plate 60 is rotated in the reverse direction by the same angle to return the silicon wafer to the original detection position. Specifically, in one embodiment, the preset angle is less than 1/3 times the included angle between two adjacent first suction components 62

In one embodiment, the step of receiving the silicon wafer by the claw plate includes the following steps: adjusting the position adjustment component 80 according to the size of the silicon wafer, and adjusting the opto-mechanical component 40 to a position corresponding to the size of the silicon wafer. Specifically, when the pre-alignment device shown in FIG. 5 is used, before the claw plate 60 receives the silicon wafer, the optomechanical assembly 40 is adjusted to the corresponding station according to the size of the silicon wafer. Furthermore, when the pre-alignment device shown in FIG. 5 is used, according to the size of the silicon wafer, in the above step for the silicon wafer transfer step, the third adsorption 65 may be turned on or off, or the third adsorption 65 may be turned on or off at the same time. The suction component 65 is used to complete the transfer operation of the silicon wafer between the claw plate 60 and the ring suction plate 70.

The above-mentioned pre-alignment device realizes the adsorption positioning and flattening processing of the large warped sheet, can meet the pre-alignment positioning requirements of the large warped sheet, and improve the pre-alignment accuracy of the large warped sheet. The pre-alignment method based on the above-mentioned pre-alignment device can perform adsorption positioning and flattening treatment on the large warped sheet, and improve the pre-alignment accuracy of the large warped sheet.

The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, if there is no contradiction in the combination of these technical features , Should be regarded as the scope of this specification.

10‧‧‧Bottom plate

20‧‧‧Lift shaft

30‧‧‧Compensation axis

40‧‧‧Optical Machine Components

51‧‧‧Rotation axis

52‧‧‧Extension Rod

60‧‧‧Claw plate

61‧‧‧Claw lever

62‧‧‧First suction assembly

65‧‧‧Third suction assembly

66‧‧‧Reinforcing rib

70‧‧‧Ring Suction Cup

71‧‧‧Second suction assembly

80‧‧‧Position adjustment components

81‧‧‧Slide rail

82‧‧‧Slider

83‧‧‧Drive

200‧‧‧Sensor

300‧‧‧Block

Claims (19)

A pre-alignment device, characterized by: Bottom plate (10); The lifting shaft (20), the compensation shaft (30) and the opto-mechanical assembly (40) are arranged on the aforementioned bottom plate (10); the rotating shaft assembly (50) includes a rotating shaft (51) and an extension rod (52), the aforementioned rotating The shaft (51) is arranged on the aforementioned lifting shaft (20), and one end of the aforementioned extension rod (52) is connected with the aforementioned rotating shaft (51); The claw plate (60) is connected to the other end of the aforementioned extension rod (52), and the aforementioned claw plate (60) is provided with a plurality of first suction components (62) at intervals in the circumferential direction; and The annular sucker (70) is connected with the aforementioned compensation shaft (30), and a plurality of second suction components (71) are arranged on it. The diameter of the aforementioned annular sucker (70) is smaller than the diameter of the distribution circle of the aforementioned claw disc (60) , And the aforementioned annular sucker (70) is sleeved on the outside of the aforementioned rotating shaft assembly (50), and there is a gap between the aforementioned annular sucker (70) and the aforementioned rotating shaft assembly (50); The rotating shaft assembly (50) can drive the claw plate (60) to rotate, the lifting shaft (20) can drive the claw plate (60) to move vertically, and the compensation shaft (30) can drive the ring sucker (70) Move in the horizontal direction, the claw plate (60) is provided with a transfer gap, and the transfer gap is used for the second suction when the claw plate (60) and the ring sucker (70) are transferred to silicon wafers The assembly (71) passes through. As the pre-alignment device described in item 1 of the scope of patent application, each of the aforementioned first suction components (62) and/or each of the aforementioned second suction components (71) includes a rigid support (621) and a rubber suction cup ( 624), the rigid pillar (621) is provided with a first vent (626), the rubber suction cup (624) is connected to the rigid pillar (621), and the rubber suction cup (624) is connected to the first vent (626) ) Connected. The pre-alignment device described in item 1 of the scope of patent application, wherein each of the aforementioned first suction components (62) and/or each of the aforementioned second suction components (71) includes: a rigid support (621) and an elastic member (622), an elastic pillar (623) and a rubber suction cup (624), the elastic member (622) is arranged inside the rigid pillar (621), the elastic pillar (623) is provided with a second vent (625), One end of the elastic support (623) is set in the aforementioned rigid support (621) to be sleeved with the aforementioned elastic member (622), and the other end is set outside the aforementioned rigid support (621) to be connected to the aforementioned rubber suction cup (624), the aforementioned rubber suction cup (624) ) Communicates with the aforementioned second vent hole (625). As the pre-alignment device described in item 1 of the scope of patent application, wherein the claw plate (60) is further provided with a plurality of third suction components (65), and the center of each third suction component (65) is The center of the corresponding first suction assembly (62) and the center of the claw plate (60) are collinear, and the third suction assembly is arranged between the centers of the corresponding first suction assembly and the claw plate (60) between. As the pre-alignment device described in item 4 of the scope of patent application, each of the aforementioned third suction components (65) includes a rigid pillar (621) and a rubber suction cup (624), and the rigid pillar (621) is provided with a A vent (626), the rubber suction cup (624) is connected with the rigid support (621), and the rubber suction cup (624) is connected with the first vent (626). As the pre-alignment device described in item 4 of the scope of patent application, each of the aforementioned third suction components (65) includes: a rigid support (621), an elastic member (622), an elastic support (623) and a rubber suction cup ( 624), the elastic member (622) is arranged inside the rigid pillar (621), the elastic pillar (623) is provided with a second vent (625), and one end of the elastic pillar (623) is arranged on the rigid pillar (621) ) Is sleeved with the aforementioned elastic member (622), and the other end is arranged outside the aforementioned rigid pillar (621) to connect with the aforementioned rubber suction cup (624), and the aforementioned rubber suction cup (624) communicates with the aforementioned second vent hole (625). The pre-alignment device described in item 4 of the scope of patent application, wherein the pre-alignment device further includes a position adjustment component, and the position adjustment component includes a slide rail (81), a slider (82), and a driving member (83) The slide rail (81) is connected to the bottom plate (10), the slider (82) can slide on the slide rail (81), and the optical-mechanical assembly (40) is mounted on the slider (82), The aforementioned driving member (83) is connected with the aforementioned slider (82). The pre-alignment device described in item 4 of the scope of patent application, wherein the pre-alignment device further includes an air slip ring, the air slip ring is sleeved inside the extension rod (52), and the air slip ring is respectively connected with The plurality of first suction components (62) and the plurality of third suction components (65) are in communication. The pre-alignment device described in item 1 or 4 of the scope of patent application, wherein the pre-alignment device further includes a sensor (200) and a baffle (300), and the sensor (200) is arranged on the circle On the ring sucker (70) or the aforementioned second suction assembly (71), the aforementioned baffle (300) is arranged on the aforementioned claw plate (60); or, the aforementioned sensor (200) is arranged on the aforementioned claw plate (60) , The aforementioned baffle (300) is arranged on the aforementioned annular suction cup (70) or the aforementioned second adsorption assembly (71); when the aforementioned multiple first adsorption assemblies (62) and the aforementioned multiple second adsorption assemblies (71) are along When the radial positions overlap, the shutter (300) triggers the sensor (200). The pre-alignment device described in the first item of the scope of patent application, wherein the claw plate (60) includes at least a plurality of claw rods (61), and the claw rods (61) extend from the center of the claw plate (60) outward Divergent distribution, the aforementioned handover gap is formed between two adjacent claw rods (61), and each of the aforementioned first suction components (62) is arranged at the end of the corresponding aforementioned claw rod (61). For the pre-alignment device described in item 10 of the scope of patent application, a reinforcing rib (66) is provided between two adjacent claw rods (61). For the pre-alignment device described in item 1 or 4 of the scope of patent application, a rigid support block (64) is provided at the center of the aforementioned claw plate (60). For example, the pre-alignment device described in item 1 or 4 of the scope of patent application, wherein, when the claw plate (60) and the ring sucker (70) are transferred to silicon wafers, if the plurality of first suction components (62) ) Overlaps with the aforementioned plurality of second suction components (71) in the radial position, the aforementioned rotating shaft (51) drives the aforementioned claw plate (60) to rotate a preset angle so that the aforementioned plurality of first suction components (62) and the aforementioned multiple The positions of the two second suction components (71) are staggered, wherein the predetermined angle is less than 1/3 of the included angle between two adjacent first suction components (62). A pre-alignment method based on the pre-alignment device described in any one of items 1 to 13 in the scope of the patent application, which is characterized by including the following steps: The claw plate (60) receives the silicon wafer; The rotating shaft (51) drives the claw plate (60) to rotate, and the opto-mechanical component (40) collects the edge information of the silicon wafer, and sends the collected edge information of the silicon wafer to the controller; The controller calculates the eccentricity of the silicon wafer according to the received wafer edge information, and controls the rotation of the rotating shaft (51) according to the eccentricity, and rotates the direction of the largest eccentricity of the silicon wafer to the movement direction of the compensation axis (30); The lifting shaft (20) is lowered to the transfer station, and the silicon wafer is transferred from the claw plate (60) to the ring sucker (70); The lifting shaft (20) drives the claw plate (60) to continue to descend to the transfer low position, and the compensation shaft (30) drives the ring sucker (70) to move to compensate for the eccentricity of the silicon wafer; The lifting shaft (20) drives the claw plate (60) up to the transfer station, and the silicon wafer is transferred from the ring sucker (70) to the claw plate (60); The lifting shaft (20) drives the claw plate (60) to continue to rise to the pre-alignment position, the rotating shaft (51) drives the claw plate (60) to rotate, and the optomechanical component (40) collects silicon chip notch information and silicon edge information, And send the collected silicon gap information and silicon edge information to the controller; The controller calculates the eccentricity margin of the silicon wafer according to the wafer gap information and the wafer edge information. When the eccentricity margin of the silicon wafer meets the preset condition, the rotating shaft (51) rotates to rotate the wafer gap to the optomechanical component ( 40) Below; The rotating shaft (51) rotates back and forth at a small angle. The opto-mechanical component (40) collects the wafer gap information and sends it to the controller. The controller calculates the wafer gap position error according to the wafer gap information, and the rotation axis (51) compensates for the gap The position error rotates to complete the orientation of the silicon wafer. Such as the pre-alignment method described in item 14 of the scope of patent application, where: The lifting shaft (20) is lowered to the transfer station, and the silicon wafer is transferred from the claw plate (60) to the ring suction cup (70) before the step includes: when the first suction assembly (62) and the second suction assembly (71) When the positions overlap in the radial direction, the rotating shaft (51) drives the claw plate (60) to rotate a preset angle so that the positions of the first suction assembly (62) and the second suction assembly (71) are staggered; After the step of the lifting shaft (20) driving the claw plate (60) to continue to descend to the transfer low position, the step includes: the rotating shaft (51) drives the claw plate (60) to continue to rotate at a predetermined angle in the same direction; The lifting shaft (20) drives the claw plate (60) up to the transfer station, and the step of transferring the silicon wafer from the ring sucker (70) to the claw plate (60) includes: the rotating shaft (51) drives the claw plate (60) ) Reverse rotation by preset angle. The pre-alignment method described in item 15 of the scope of patent application, wherein the predetermined angle is less than 1/3 of the included angle between two adjacent first suction components (62). For example, the pre-alignment method described in item 14 of the scope of patent application, wherein the step of receiving the silicon wafer by the claw plate (60) includes: placing the silicon wafer on the claw plate (60) by a fork, and the first suction assembly (62) ) Turn on the vacuum to absorb the silicon wafer. Such as the pre-alignment method described in item 14 of the scope of patent application, wherein the step of receiving the silicon wafer by the claw plate (60) includes: The lifting shaft (20) drives the claw plate (60) down to the wafer loading station, the wafer fork places the silicon wafer on the ring suction cup (70), the second suction assembly (71) opens a vacuum to adsorb the silicon wafer; The lifting shaft (20) drives the claw plate (60) up to the transfer station, the first suction assembly (62) opens the vacuum to suck the silicon wafer, the second suction assembly (71) closes the vacuum, and the lifting shaft (20) drives the claw plate ( 60) Ascend to the pre-alignment station. For example, the pre-alignment method described in item 14 of the scope of patent application, wherein, before the step of receiving the silicon wafer by the claw plate (60), it includes the following steps: adjusting the position adjustment component according to the size of the silicon wafer, and adjusting the optomechanical component (40 ) To the station corresponding to the size of the silicon wafer.

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