CN103489818B - A kind of silicon wafer pre-alignment device - Google Patents
A kind of silicon wafer pre-alignment device Download PDFInfo
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- CN103489818B CN103489818B CN201310479044.2A CN201310479044A CN103489818B CN 103489818 B CN103489818 B CN 103489818B CN 201310479044 A CN201310479044 A CN 201310479044A CN 103489818 B CN103489818 B CN 103489818B
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- rotating shaft
- sucker
- inverted cone
- locating wheel
- diameter
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 52
- 239000010703 silicon Substances 0.000 title claims abstract description 52
- 210000000078 claw Anatomy 0.000 claims abstract description 23
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a kind of silicon wafer pre-alignment device, it comprises horizontal top, be vertically set on the rotating shaft of horizontal top one end, be installed on the sucker on rotating shaft top, be rotationally connected with the rotating shaft electric motor of the rotating shaft other end, to be installed in rotating shaft and the bottom bracket be positioned at below sucker, to be arranged on the projected claw at bottom bracket edge, to be rotatably connected on the locating wheel of projected claw end and to be fixed on an emission sensor of horizontal top one end by connector.Rotating shaft electric motor is rotationally connected rotating shaft, locating wheel is by being positioned at the cone at locating wheel top, the inverted cone being positioned at cone lower surface, the cylinder being positioned at inverted cone lower surface and the boss that is positioned at cylinder lower surface forms, inverted cone, cylinder and boss form an annular groove, the equal diameters of cone lower surface and inverted cone upper surface, inverted cone lower surface diameter equals cylindrical diameter, and boss diameter is greater than cylinder diameter.The present invention have to silicon chip infringement, pollute little, prealignment precision advantages of higher.
Description
Technical field
The present invention relates to a kind of prealignment device, particularly about a kind of silicon wafer pre-alignment device.
Background technology
At present in semi-conductor silicon chip manufacturing, usually one is arranged at the edge of circular silicon chip in order to indicate the location notch in silicon chip direction, to facilitate integrated information needed on silicon chip, simultaneously, the resetting of integrated circuit conveniently on silicon chip in the repeatedly course of processing and information read, also be carved with the corresponding information of silicon chip relative to the fixed position of location notch, information can be the wherein one in numerical chracter, bar code or Quick Response Code.Silicon wafer pre-alignment device positions it according to the location notch of silicon chip, and the positioning precision of silicon wafer pre-alignment device directly affects the reading of corresponding information on silicon chip and follow-up machining accuracy.
Patent " a kind of silicon chip conveyer " by name discloses so a kind of silicon wafer pre-alignment device, and as shown in figures 1-4, it comprises a top board 53, and the front portion of top board 53 is by the rotating shaft 54 of bearing connection perpendicular to a hollow of top board 53; Rotating shaft 54 upper end above top board 53 is sealedly connected with a sucker 55, and the aspiration hole on sucker 55 is communicated with rotating shaft 54 inside, and rotating shaft 54 bottom above top board 53 connects a belt wheel 56.Top board 53 bottom surface is fixedly installed an air drain 57, and the lower end of rotating shaft 54 passes belt wheel 56 and is communicated with air drain 57, and its junction is sealed by O RunddichtringO, and the other end of air drain 57 is communicated with a vacuum pump with vacuum solenoid by tracheae.Top board 53 bottom surface of air drain 57 rear end is fixedly connected with a rotating shaft electric motor 58, and the output of rotating shaft electric motor 58 passes through the belt wheel 56 of tape handler connection rotating shaft 54 bottom.Top board 53 end face is fixedly connected with the bottom bracket 59 be set in outside rotating shaft 54, bottom bracket 59 marginating compartment is provided with four outside projected claws 60, the end of each projected claw 60 is all higher than bottom bracket 59 end face, and the center that the end face of each projected claw 60 end is rotationally connected a locating wheel 61, four locating wheels 61 is co-located at the circumferentially concentrically ringed of sucker 55.The top conically 61-0 of each locating wheel 61, the cylindrical 61-1 in middle part, and the top of cylindrical 61-1 is a little more than the end face of sucker 55.Top board 53 front end is provided with a pair vertical photoelectric sensor 63 of electrical connection control system.Two vertical photoelectric sensors 63 are fixedly connected on top board 53 front by a connection piece 64 being arranged on top board 53 bottom surface.
In above-mentioned silicon wafer pre-alignment device, locating wheel 61 exists when getting silicon chip, easily damages silicon chip and causes the pollution to silicon chip.In addition, the output belt wheel 56 of rotating shaft electric motor 58 drives silicon slice rotating, and because V belt translation error is comparatively large, the positional information precision of the silicon chip causing photoelectric sensor 63 to obtain is low, and namely the prealignment precision of silicon chip is low.
In sum, existing silicon wafer pre-alignment device not only can produce infringement to silicon chip and pollute, and the prealignment precision of silicon chip is low.
Summary of the invention
For the problems referred to above, the object of this invention is to provide a kind of to wafer contamination, damage low and that alignment precision is high silicon wafer pre-alignment device.
For achieving the above object, the present invention takes following technical scheme: a kind of silicon wafer pre-alignment device, it comprises a horizontal top, one rotating shaft being vertically set on described horizontal top one end, one sucker being installed on described rotating shaft top, one rotating shaft electric motor being rotationally connected with the described rotating shaft other end, one to be installed in described rotating shaft and the bottom bracket be positioned at below described sucker, some projected claws being arranged on described bottom bracket edge, some locating wheels being rotatably connected on described projected claw end, and one is fixed on an emission sensor of described horizontal top one end by a connection piece, it is characterized in that, the output shaft rotation of described rotating shaft electric motor connects described rotating shaft, locating wheel described in each is all that the boss that cylinder and that the inverted cone, being positioned at described cone lower surface by a cone, being positioned at described locating wheel top is positioned at described inverted cone lower surface is positioned at described cylinder lower surface combines, and described inverted cone, cylinder and boss form an annular groove, the diameter of described cone lower surface equals the diameter of described inverted cone upper surface, and described inverted cone lower surface diameter equals described cylindrical diameter, and described boss diameter is greater than described cylinder diameter, the lower surface of described inverted cone exceeds the upper surface 1 ~ 3mm of described sucker, and the upper surface of described boss is lower than the upper surface 1 ~ 3mm of described sucker.
The centerline of described horizontal top one end upper surface offers a through hole, described rotating shaft to be located in through hole and to be fixed on the upper surface of described horizontal top by bearing, a blind hole is offered in the upper surface of described rotating shaft centrally axis, described rotating shaft also arranges a flange near upper end surface, described suction cup sealed is fastened on the upper surface of described rotating shaft flange, described sucker central axis offers one for the through hole of air-breathing, described through hole is communicated with the top of the blind hole of described rotating shaft, and the output shaft of a shaft coupling connection rotating shaft motor is passed through in the lower end of described rotating shaft.
The bottom of described horizontal top arranges an air channel, and one end of described air channel is communicated with the bottom of described blind hole, and by an O RunddichtringO sealing, the other end of described air channel is communicated with a vacuum pump with vacuum solenoid by a tracheae.
Described bottom bracket is fastened on the flange lower surface of described rotating shaft, the marginating compartment of described bottom bracket arranges four projected claws, described in each, the upper surface of projected claw end is all rotationally connected described locating wheel, and being centrally located at of four described locating wheels is one circumferentially concentric with described sucker.
Described connector comprises a horizon bar and a U-shaped bar, and one end of described horizon bar is fastened on the centerline of described horizontal top one end lower surface, and the other end is fastenedly connected described U-shaped bar, and a described correlation sensor setting is at described U-shaped bar opening end.
Central axis place bottom described locating wheel offers a ladder blind hole, and the end of projected claw described in each all installs a vertical bearing, and locating wheel described in each is connected with the vertical bearing on projected claw by described ladder blind hole.
The present invention is owing to taking above technical scheme, it has the following advantages: 1, locating wheel of the present invention is made up of cone, inverted cone, cylinder and boss, cone ensures that silicon chip is concentric with sucker when placing silicon chip, inverted cone ensures that silicon chip is not stuck when taking silicon chip away, the annular groove that inverted cone, cylinder and boss are formed ensures not rub with locating wheel in silicon slice rotating process, therefore, in raising silicon chip rotation process while stability, prealignment operation can also be reduced to the infringement of silicon chip and pollution.2, because the present invention adopts the direct connection rotating shaft of the output of rotating shaft electric motor, thus the driving error of intermediate transmission mechanism is avoided, therefore, it is possible to improve stability and the prealignment precision of silicon chip rotation process.
Accompanying drawing explanation
Fig. 1 is the superstructure schematic diagram of existing silicon wafer pre-alignment device
Fig. 2 is the substructure schematic diagram of existing silicon wafer pre-alignment device
Fig. 3 is the structural representation of locating wheel in existing silicon wafer pre-alignment device
Fig. 4 is the schematic front view of Fig. 3
Fig. 5 is structural representation of the present invention
Fig. 6 is longitudinal cross-sectional schematic of Fig. 5
Fig. 7 is the structural representation of locating wheel in the present invention
Fig. 8 is the schematic front view of Fig. 7
Embodiment
Be described in detail of the present invention below in conjunction with drawings and Examples.
As shown in Figure 5, Figure 6, the present invention includes horizontal top 201, rotating shaft 202, sucker 203, rotating shaft electric motor 204, air channel 205, bottom bracket 206, four projected claws 207, four locating wheels 208, a connection piece 209 and an emission sensor 210.Wherein, the centerline of horizontal top 201 one end upper surface offers a through hole (not shown), rotating shaft 202 to be plugged in through hole and to be arranged on the upper surface of horizontal top 201 by bearing, a blind hole 202-1 is offered in the upper surface of rotating shaft 202 centrally axis, rotating shaft 202 also arranges a flange 202-2 near upper end surface, sucker 203 sealed card is located at the upper surface of the flange 202-2 of rotating shaft 202, sucker 203 central axis offers one for the through hole 203-1 of air-breathing, through hole 203-1 is communicated with the top of the blind hole 202-1 of rotating shaft 202, the output shaft of a shaft coupling connection rotating shaft motor 204 is passed through in the lower end of rotating shaft 202.Air channel 205 is arranged on the bottom of horizontal top 201, one end of air channel 205 is communicated with the bottom of blind hole 202-1, and by an O RunddichtringO (not shown) sealing, the other end of air channel 205 is communicated with (not shown) with vacuum solenoid (not shown) with a vacuum pump by a tracheae (not shown).Bottom bracket 206 is fastened on the flange 202-2 lower surface of rotating shaft 202, the marginating compartment of bottom bracket 206 arranges four projected claws 207, the end of each projected claw 207 is all higher than bottom bracket 206 end face, the upper surface of each projected claw 207 end is all rotationally connected locating wheel 208, and being centrally located at a sucker 203 of all locating wheels 208 is circumferentially concentric.Connector 209 comprises an a horizon bar 209-1 and U-shaped bar 209-2, one end of horizon bar 209-1 is fastened on the centerline of horizontal top 201 one end lower surface, the other end is fastenedly connected U-shaped bar 209-2, and an emission sensor 210 is symmetricly set on the opening end of U-shaped bar 209-2.
As shown in Figure 7, Figure 8, locating wheel 208 of the present invention can be considered and is made up of a cone 208-1, an inverted cone 208-2, a cylinder 208-3 and a boss 208-4, wherein cone 208-1 is positioned at the top of locating wheel 208, for ensureing that silicon chip is concentric with sucker 203 when placing silicon chip.The lower surface of cone 208-1 is the inverted cone 208-2 of one with it, and the lower surface diameter of the upper surface of inverted cone 208-2 and cone 208-1 is suitable, for ensureing that silicon chip is not stuck when taking out silicon chip.The lower surface of inverted cone 208-2 is the cylinder 208-3 of one with it, the lower surface of cylinder 208-3 is the boss 208-4 of one with it, and the lower surface diameter of the diameter of cylinder 208-3 and inverted cone 208-2 is suitable, the diameter of boss 208-4 is then slightly larger than the upper surface diameter of inverted cone 208-2, an annular groove is formed like this at inverted cone 208-2, cylinder 208-3 and boss 208-4, this annular groove is used for ensureing when silicon slice rotating, and silicon chip does not rub with locating wheel 208.
As shown in Figure 5, Figure 6, the lower surface of inverted cone 208-2 exceeds the upper surface 1 ~ 3mm of sucker 203.The upper surface of boss 208-4 is lower than the upper surface 1 ~ 3mm of sucker 203.
In a preferred embodiment, central axis place bottom locating wheel 208 offers a ladder blind hole 208-5, the end of each projected claw 207 all installs a vertical bearing (not shown), and locating wheel 208 is connected with the vertical bearing on projected claw 207 by ladder blind hole 208-5.
The various embodiments described above are only for illustration of the present invention; wherein the structure of each parts, connected mode and manufacture craft etc. all can change to some extent; every equivalents of carrying out on the basis of technical solution of the present invention and improvement, all should not get rid of outside protection scope of the present invention.
Claims (6)
1. a silicon wafer pre-alignment device, it comprises a horizontal top,
One rotating shaft being vertically set on described horizontal top one end,
One sucker being installed on described rotating shaft top,
One rotating shaft electric motor being rotationally connected with the described rotating shaft other end,
One is installed on the flange lower surface of described rotating shaft and the bottom bracket be positioned at below described sucker,
Four projected claws being disposed on described bottom bracket edge,
Four locating wheels being rotatably connected on described projected claw end upper surface respectively,
And one is fixed on an emission sensor of described horizontal top one end by a connection piece; It is characterized in that, the output shaft rotation of described rotating shaft electric motor connects described rotating shaft; Being centrally located at of four described locating wheels is one circumferentially concentric with described sucker, and the boss that the cylinder and that locating wheel described in each is all the inverted cones, being positioned at described cone lower surface by a cone, being positioned at described locating wheel top is positioned at described inverted cone lower surface is positioned at described cylinder lower surface combines, described inverted cone, cylinder and boss form an annular groove; The diameter of described cone lower surface equals the diameter of described inverted cone upper surface, and described inverted cone lower surface diameter equals described cylindrical diameter, and described boss diameter is greater than described cylinder diameter; The lower surface of described inverted cone exceeds the upper surface 1 ~ 3mm of described sucker, and the upper surface of described boss is lower than the upper surface 1 ~ 3mm of described sucker.
2. a kind of silicon wafer pre-alignment device as claimed in claim 1, it is characterized in that, the centerline of described horizontal top one end upper surface offers a through hole, described rotating shaft to be located in through hole and to be fixed on the upper surface of described horizontal top by bearing, a blind hole is offered in the upper surface of described rotating shaft centrally axis, described rotating shaft also arranges a flange near upper end surface, described suction cup sealed is fastened on the upper surface of described rotating shaft flange, described sucker central axis offers one for the through hole of air-breathing, described through hole is communicated with the top of the blind hole of described rotating shaft, the output shaft of a shaft coupling connection rotating shaft motor is passed through in the lower end of described rotating shaft.
3. a kind of silicon wafer pre-alignment device as claimed in claim 2, it is characterized in that, the bottom of described horizontal top arranges an air channel, one end of described air channel is communicated with the bottom of described blind hole, and by an O RunddichtringO sealing, the other end of described air channel is communicated with a vacuum pump with vacuum solenoid by a tracheae.
4. a kind of silicon wafer pre-alignment device as described in claim 1 or 2 or 3, it is characterized in that, described connector comprises a horizon bar and a U-shaped bar, one end of described horizon bar is fastened on the centerline of described horizontal top one end lower surface, the other end is fastenedly connected described U-shaped bar, and a described correlation sensor setting is at described U-shaped bar opening end.
5. a kind of silicon wafer pre-alignment device as described in claim 1 or 2 or 3, it is characterized in that, central axis place bottom described locating wheel offers a ladder blind hole, the end of projected claw described in each all installs a vertical bearing, and locating wheel described in each is connected with the vertical bearing on projected claw by described ladder blind hole.
6. a kind of silicon wafer pre-alignment device as claimed in claim 4, it is characterized in that, central axis place bottom described locating wheel offers a ladder blind hole, the end of projected claw described in each all installs a vertical bearing, and locating wheel described in each is connected with the vertical bearing on projected claw by described ladder blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479044.2A CN103489818B (en) | 2013-10-14 | 2013-10-14 | A kind of silicon wafer pre-alignment device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479044.2A CN103489818B (en) | 2013-10-14 | 2013-10-14 | A kind of silicon wafer pre-alignment device |
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| CN103489818A CN103489818A (en) | 2014-01-01 |
| CN103489818B true CN103489818B (en) | 2016-04-20 |
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| CN201310479044.2A Active CN103489818B (en) | 2013-10-14 | 2013-10-14 | A kind of silicon wafer pre-alignment device |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103777478B (en) * | 2014-02-20 | 2015-12-30 | 江阴长电先进封装有限公司 | Wafer calibration level device of non-contact lithography machine and application thereof |
| CN106814550B (en) * | 2015-11-30 | 2018-08-24 | 上海微电子装备（集团）股份有限公司 | Work stage substrate delivery/reception device and pre-alignment method |
| CN106449500A (en) * | 2016-09-27 | 2017-02-22 | 天津华海清科机电科技有限公司 | Positioning assembly |
| CN110943021B (en) * | 2018-09-21 | 2022-05-31 | 上海微电子装备（集团）股份有限公司 | Pre-alignment device and method |
| CN115831846B (en) * | 2023-02-15 | 2023-06-27 | 河北博特半导体设备科技有限公司 | Wafer pre-alignment device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20030053904A1 (en) * | 2001-09-14 | 2003-03-20 | Naofumi Kirihata | Wafer aligner |
| JP4189663B2 (en) * | 2003-09-10 | 2008-12-03 | 株式会社安川電機 | Wafer gripping device |
| CN203644747U (en) * | 2013-10-14 | 2014-06-11 | 北京自动化技术研究院 | Silicon wafer pre-alignment device |
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Effective date of registration: 20170606 Address after: In Beijing economic and Technological Development Zone, two street 100176 Daxing District 8 Beijing City Hospital No. 14 building A block 101, 201, 401, 501 Patentee after: Beijing Jingyi automation equipment Technology Co. Ltd. Address before: 100009 No. 41 West Tower Street, Beijing, Xicheng District Patentee before: Beijing Automation Technical Research Institute |
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Denomination of invention: Silicon wafer prealigning device Effective date of registration: 20200721 Granted publication date: 20160420 Pledgee: Beijing first financing Company limited by guarantee Pledgor: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. Registration number: Y2020990000810 |
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Address after: 100176 block a, 14th floor, yard 8, Liangshuihe 2nd Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi automation equipment Technology Co.,Ltd. Address before: 100176 101, 201, 401, 501, building a, building 14, yard 8, Liangshuihe Second Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. |
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Date of cancellation: 20211018 Granted publication date: 20160420 Pledgee: Beijing first financing Company limited by guarantee Pledgor: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. Registration number: Y2020990000810 |