CN203644747U - Silicon wafer pre-alignment device - Google Patents
Silicon wafer pre-alignment device Download PDFInfo
- Publication number
- CN203644747U CN203644747U CN201320633269.4U CN201320633269U CN203644747U CN 203644747 U CN203644747 U CN 203644747U CN 201320633269 U CN201320633269 U CN 201320633269U CN 203644747 U CN203644747 U CN 203644747U
- Authority
- CN
- China
- Prior art keywords
- rotating shaft
- alignment device
- diameter
- top plate
- inverted cone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a silicon wafer pre-alignment device comprising a horizontal top plate, a rotating shaft vertically disposed on one end of the top plate, a suction disc disposed on the top end of the rotating shaft in a clamped manner, a rotating shaft motor rotatably connected with the other end of the rotating shaft, a lower bracket disposed on the rotating shaft in a clamped manner and under the suction disc, an extension claw disposed on the edge of the lower bracket, a positioning wheel rotatably connected with the end of the extension claw, and an opposite-type sensor fixedly disposed on one end of the top plate by a connecting member. The rotating shaft motor is rotatably connected with the rotating shaft. The positioning wheel is constituted by a cone body disposed on the top part of the positioning wheel, an inverted cone body disposed on the lower surface of the cone body, a cylinder disposed on the lower surface of the inverted cone body, and a boss disposed on the lower surface of the cylinder. The inverted cone body, the cylinder, and the boss can be used to form an annular-shaped groove. The diameter of the lower surface of the cone body is equal to the diameter of the upper surface of the inverted cone body, and the diameter of the lower surface of the inverted cone body is equal to the diameter of the cylinder, and the diameter of the boss is larger than the diameter of the cylinder. The silicon wafer pre-alignment device has advantages of small pollution, high pre-alignment accuracy, and less damage on silicon wafers.
Description
Technical field
The utility model relates to a kind of prealignment device, particularly about a kind of wafer pre-alignment device.
Background technology
At present in semi-conductor silicon chip manufacturing, conventionally arrange one at the edge of circular silicon chip in order to indicate the location notch of silicon chip direction, to facilitate integrated information needed on silicon chip, simultaneously, in order to facilitate integrated circuit on silicon chip to read in resetting and information in the course of processing repeatedly, also be carved with the corresponding information of silicon chip with respect to the fixed position of location notch, information can be the wherein one in numerical chracter, bar code or Quick Response Code.Wafer pre-alignment device is according to the location notch of silicon chip, it to be positioned, and the positioning precision of wafer pre-alignment device directly affects reading and follow-up machining accuracy of corresponding information on silicon chip.
Patent " a kind of silicon chip conveyer " by name discloses so a kind of wafer pre-alignment device, and as shown in Fig. 1～4, it comprises a top board 53, and the front portion of top board 53 connects the rotating shaft 54 perpendicular to a hollow of top board 53 by bearing; Rotating shaft 54 upper ends of top board 53 tops are sealedly connected with a sucker 55, the aspiration hole on sucker 55 and rotating shaft 54 internal communication, and rotating shaft 54 bottoms of top board 53 tops connect a belt wheel 56.Top board 53 bottom surfaces are fixedly installed an air drain 57, and the lower end of rotating shaft 54 passes belt wheel 56 and is communicated with air drain 57, and its junction seals by O RunddichtringO, and the other end of air drain 57 is communicated with a vacuum pump by tracheae and vacuum solenoid.Top board 53 bottom surfaces of air drain 57 rear ends are fixedly connected with a rotating shaft electric motor 58, and the output of rotating shaft electric motor 58 is by the belt wheel 56 of tape handler connection rotating shaft 54 bottoms.Top board 53 end faces are fixedly connected with the bottom bracket 59 being set in outside rotating shaft 54, bottom bracket 59 marginating compartments are provided with four outside projected claws 60, the end of each projected claw 60 is all higher than bottom bracket 59 end faces, and the end face of each projected claw 60 end is rotationally connected 61, four locating wheel 61 centers of a locating wheel and is co-located on a concentrically ringed circumference of sucker 55.The top of each locating wheel 61 is conical 61-0, the cylindrical 61-1 in middle part, and the top of cylindrical 61-1 is a little more than the end face of sucker 55.Top board 53 front ends are provided with a pair of vertical photoelectric sensor 63 of electrical connection control system.Two vertical photoelectric sensors 63 are fixedly connected on top board 53 fronts by being arranged on a connection piece 64 of top board 53 bottom surfaces.
In above-mentioned wafer pre-alignment device, locating wheel 61 exists in the time getting silicon chip, easily damages silicon chip and causes the pollution to silicon chip.In addition, the output belt wheel 56 of rotating shaft electric motor 58 drives silicon slice rotating, because band driving error is larger, causes the positional information precision of the silicon chip that photoelectric sensor 63 obtains low, and the prealignment precision of silicon chip is low.
In sum, existing wafer pre-alignment device not only can produce infringement and pollute silicon chip, and the prealignment precision of silicon chip is low.
Summary of the invention
For the problems referred to above, the purpose of this utility model be to provide a kind of to wafer contamination, damage wafer pre-alignment device low and that alignment precision is high.
For achieving the above object, the utility model is taked following technical scheme: a kind of wafer pre-alignment device, it comprises a horizontal top plate, one is vertically set on the rotating shaft of described horizontal top plate one end, one is installed on the sucker on described rotating shaft top, one is rotationally connected with the rotating shaft electric motor of the described rotating shaft other end, one is installed in described rotating shaft and is positioned at the bottom bracket of described sucker below, some projected claws that are arranged on described bottom bracket edge, some locating wheels that are rotatably connected on described projected claw end, and one be fixed on the emission sensor of described horizontal top plate one end by a connection piece, it is characterized in that, the output shaft rotation of described rotating shaft electric motor connects described rotating shaft, described in each, locating wheel is all that the boss that cylinder and that the inverted cone, that is positioned at described cone lower surface by a cone, that is positioned at described locating wheel top is positioned at described inverted cone lower surface is positioned at described cylinder lower surface combines, and described inverted cone, cylinder and boss form an annular groove, the diameter of described cone lower surface equals the diameter of described inverted cone upper surface, and described inverted cone lower surface diameter equals described cylindrical diameter, and described boss diameter is greater than described cylinder diameter, the lower surface of described inverted cone exceeds the upper surface 1～3mm of described sucker, and the upper surface of described boss is lower than the upper surface 1～3mm of described sucker.
The centerline of described horizontal top plate one end upper surface is offered a through hole, described rotating shaft is located in through hole and is fixed on the upper surface of described horizontal top plate by bearing, a blind hole is offered along central axis in the upper surface of described rotating shaft, described rotating shaft also arranges a flange near upper end surface, described suction cup sealed is fastened on the upper surface of described rotating shaft flange, described sucker central axis offers one for air-breathing through hole, described through hole is communicated with the top of the blind hole of described rotating shaft, and the lower end of described rotating shaft is by the output shaft of a shaft coupling connection rotating shaft motor.
The bottom of described horizontal top plate arranges an air channel, and one end of described air channel is communicated with the bottom of described blind hole, and by an O RunddichtringO sealing, the other end of described air channel is communicated with a vacuum pump by a tracheae and vacuum solenoid.
Described bottom bracket is fastened on the flange lower surface of described rotating shaft, the marginating compartment of described bottom bracket arranges four projected claws, described in each, the upper surface of projected claw end is all rotationally connected described locating wheel, four described locating wheels be centered close to one with the concentric circumference of described sucker on.
Described connector comprises a horizon bar and a U-shaped bar, and one end of described horizon bar is fastened on the centerline of described horizontal top plate one end lower surface, and the other end is fastenedly connected described U-shaped bar, and a described correlation sensor setting is at described U-shaped bar opening end.
The central axis place of described locating wheel bottom offers a ladder blind hole, and described in each, the end of projected claw is all installed a vertical bearing, and described in each, locating wheel is connected with the vertical bearing on projected claw by described ladder blind hole.
The utility model is owing to taking above technical scheme, it has the following advantages: 1, locating wheel of the present utility model is made up of cone, inverted cone, cylinder and boss, cone ensures that silicon chip is concentric with sucker in the time placing silicon chip, inverted cone ensures that silicon chip is not stuck in the time taking silicon chip away, the annular groove that inverted cone, cylinder and boss form ensures not rub with locating wheel in silicon slice rotating process, therefore, in raising silicon chip rotation process, in stability, can also reduce prealignment and operate infringement and the pollution to silicon chip.2, adopt the direct connection rotating shaft of output of rotating shaft electric motor due to the utility model, thereby avoided the driving error of intermediate transmission mechanism, therefore can improve stability and the prealignment precision of silicon chip rotation process.
Brief description of the drawings
Fig. 1 is the superstructure schematic diagram of existing wafer pre-alignment device
Fig. 2 is the substructure schematic diagram of existing wafer pre-alignment device
Fig. 3 is the structural representation of locating wheel in existing wafer pre-alignment device
Fig. 4 is that the master of Fig. 3 looks schematic diagram
Fig. 5 is structural representation of the present utility model
Fig. 6 is longitudinal cross-sectional schematic of Fig. 5
Fig. 7 is the structural representation of locating wheel in the utility model
Fig. 8 is that the master of Fig. 7 looks schematic diagram
Embodiment
Be described in detail of the present utility model below in conjunction with drawings and Examples.
As shown in Figure 5, Figure 6, the utility model comprises a horizontal top plate 201, a rotating shaft 202, a sucker 203, a rotating shaft electric motor 204, an air channel 205, a bottom bracket 206, four projected claws 207, four locating wheels 208, a connection piece 209 and emission sensors 210.Wherein, the centerline of horizontal top plate 201 one end upper surfaces is offered a through hole (not shown), rotating shaft 202 is plugged in through hole and is arranged on the upper surface of horizontal top plate 201 by bearing, a blind hole 202-1 is offered along central axis in the upper surface of rotating shaft 202, rotating shaft 202 also arranges a flange 202-2 near upper end surface, sucker 203 sealed cards are located at the upper surface of the flange 202-2 of rotating shaft 202, sucker 203 central axis offer one for air-breathing through hole 203-1, through hole 203-1 is communicated with the top of the blind hole 202-1 of rotating shaft 202, the lower end of rotating shaft 202 is by the output shaft of a shaft coupling connection rotating shaft motor 204.Air channel 205 is arranged on the bottom of horizontal top plate 201, one end of air channel 205 is communicated with the bottom of blind hole 202-1, and by an O RunddichtringO (not shown) sealing, the other end of air channel 205 is communicated with (not shown) by a tracheae (not shown) and vacuum solenoid (not shown) with a vacuum pump.Bottom bracket 206 is fastened on the flange 202-2 lower surface of rotating shaft 202, the marginating compartment of bottom bracket 206 arranges four projected claws 207, the end of each projected claw 207 is all higher than bottom bracket 206 end faces, the upper surface of each projected claw 207 end is all rotationally connected locating wheel 208, all locating wheels 208 be centered close to the concentric circumference of a sucker 203 on.Connector 209 comprises a horizon bar 209-1 and a U-shaped bar 209-2, one end of horizon bar 209-1 is fastened on the centerline of horizontal top plate 201 one end lower surfaces, the other end is fastenedly connected U-shaped bar 209-2, and an emission sensor 210 is symmetricly set on the opening end of U-shaped bar 209-2.
As shown in Figure 7, Figure 8, locating wheel 208 of the present utility model can be considered by a cone 208-1, an inverted cone 208-2, a cylinder 208-3 and a boss 208-4 and forms, wherein cone 208-1 is positioned at the top of locating wheel 208, be used for ensureing that silicon chip is concentric with sucker 203 in the time placing silicon chip.The lower surface of cone 208-1 is the inverted cone 208-2 of one with it, and the lower surface diameter of the upper surface of inverted cone 208-2 and cone 208-1 is suitable, for ensureing that silicon chip is not stuck in the time taking out silicon chip.The lower surface of inverted cone 208-2 is the cylinder 208-3 of one with it, the lower surface of cylinder 208-3 is the boss 208-4 of one with it, and the lower surface diameter of the diameter of cylinder 208-3 and inverted cone 208-2 is suitable, the diameter of boss 208-4 is slightly larger than the upper surface diameter of inverted cone 208-2, form an annular groove at inverted cone 208-2, cylinder 208-3 and boss 208-4 like this, this annular groove is used for ensureing in the time of silicon slice rotating, and silicon chip does not rub with locating wheel 208.
As shown in Figure 5, Figure 6, the lower surface of inverted cone 208-2 exceeds the upper surface 1～3mm of sucker 203.The upper surface of boss 208-4 is lower than the upper surface 1～3mm of sucker 203.
In a preferred embodiment, the central axis place of locating wheel 208 bottoms offers a ladder blind hole 208-5, the end of each projected claw 207 is all installed a vertical bearing (not shown), and locating wheel 208 is connected with the vertical bearing on projected claw 207 by ladder blind hole 208-5.
The various embodiments described above are only for illustrating the utility model; wherein the structure of each parts, connected mode and manufacture craft etc. all can change to some extent; every equivalents of carrying out on the basis of technical solutions of the utility model and improvement, all should not get rid of outside protection range of the present utility model.
Claims (9)
1. a wafer pre-alignment device, it comprises a horizontal top plate,
One is vertically set on the rotating shaft of described horizontal top plate one end,
One is installed on the sucker on described rotating shaft top,
One is rotationally connected with the rotating shaft electric motor of the described rotating shaft other end,
One is installed in described rotating shaft and is positioned at the bottom bracket of described sucker below,
Some projected claws that are arranged on described bottom bracket edge,
Some locating wheels that are rotatably connected on described projected claw end,
And one be fixed on the emission sensor of described horizontal top plate one end by a connection piece; It is characterized in that, the output shaft rotation of described rotating shaft electric motor connects described rotating shaft; Described in each, locating wheel is all that the boss that cylinder and that the inverted cone, that is positioned at described cone lower surface by a cone, that is positioned at described locating wheel top is positioned at described inverted cone lower surface is positioned at described cylinder lower surface combines, and described inverted cone, cylinder and boss form an annular groove; The diameter of described cone lower surface equals the diameter of described inverted cone upper surface, and described inverted cone lower surface diameter equals described cylindrical diameter, and described boss diameter is greater than described cylinder diameter; The lower surface of described inverted cone exceeds the upper surface 1～3mm of described sucker, and the upper surface of described boss is lower than the upper surface 1～3mm of described sucker.
2. wafer pre-alignment device as claimed in claim 1, it is characterized in that, the centerline of described horizontal top plate one end upper surface is offered a through hole, described rotating shaft is located in through hole and is fixed on the upper surface of described horizontal top plate by bearing, a blind hole is offered along central axis in the upper surface of described rotating shaft, described rotating shaft also arranges a flange near upper end surface, described suction cup sealed is fastened on the upper surface of described rotating shaft flange, described sucker central axis offers one for air-breathing through hole, described through hole is communicated with the top of the blind hole of described rotating shaft, the lower end of described rotating shaft is by the output shaft of a shaft coupling connection rotating shaft motor.
3. wafer pre-alignment device as claimed in claim 2, it is characterized in that, the bottom of described horizontal top plate arranges an air channel, one end of described air channel is communicated with the bottom of described blind hole, and by an O RunddichtringO sealing, the other end of described air channel is communicated with a vacuum pump by a tracheae and vacuum solenoid.
4. wafer pre-alignment device as described in claim 1 or 2 or 3, it is characterized in that, described bottom bracket is fastened on the flange lower surface of described rotating shaft, the marginating compartment of described bottom bracket arranges four projected claws, described in each, the upper surface of projected claw end is all rotationally connected described locating wheel, four described locating wheels be centered close to one with the concentric circumference of described sucker on.
5. the wafer pre-alignment device as described in claim 1 or 2 or 3, it is characterized in that, described connector comprises a horizon bar and a U-shaped bar, one end of described horizon bar is fastened on the centerline of described horizontal top plate one end lower surface, the other end is fastenedly connected described U-shaped bar, and a described correlation sensor setting is at described U-shaped bar opening end.
6. wafer pre-alignment device as claimed in claim 4, it is characterized in that, described connector comprises a horizon bar and a U-shaped bar, one end of described horizon bar is fastened on the centerline of described horizontal top plate one end lower surface, the other end is fastenedly connected described U-shaped bar, and a described correlation sensor setting is at described U-shaped bar opening end.
7. the wafer pre-alignment device as described in claim 1 or 2 or 3 or 6, it is characterized in that, the central axis place of described locating wheel bottom offers a ladder blind hole, described in each, the end of projected claw is all installed a vertical bearing, and described in each, locating wheel is connected with the vertical bearing on projected claw by described ladder blind hole.
8. wafer pre-alignment device as claimed in claim 4, it is characterized in that, the central axis place of described locating wheel bottom offers a ladder blind hole, described in each, the end of projected claw is all installed a vertical bearing, and described in each, locating wheel is connected with the vertical bearing on projected claw by described ladder blind hole.
9. wafer pre-alignment device as claimed in claim 5, it is characterized in that, the central axis place of described locating wheel bottom offers a ladder blind hole, described in each, the end of projected claw is all installed a vertical bearing, and described in each, locating wheel is connected with the vertical bearing on projected claw by described ladder blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320633269.4U CN203644747U (en) | 2013-10-14 | 2013-10-14 | Silicon wafer pre-alignment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320633269.4U CN203644747U (en) | 2013-10-14 | 2013-10-14 | Silicon wafer pre-alignment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203644747U true CN203644747U (en) | 2014-06-11 |
Family
ID=50875973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320633269.4U Withdrawn - After Issue CN203644747U (en) | 2013-10-14 | 2013-10-14 | Silicon wafer pre-alignment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203644747U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489818A (en) * | 2013-10-14 | 2014-01-01 | 北京自动化技术研究院 | Silicon wafer pre-alignment device |
| CN106558526A (en) * | 2016-05-24 | 2017-04-05 | 陈百捷 | It is a kind of to carry the manipulator that wafer seeks side sensor |
-
2013
- 2013-10-14 CN CN201320633269.4U patent/CN203644747U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489818A (en) * | 2013-10-14 | 2014-01-01 | 北京自动化技术研究院 | Silicon wafer pre-alignment device |
| CN106558526A (en) * | 2016-05-24 | 2017-04-05 | 陈百捷 | It is a kind of to carry the manipulator that wafer seeks side sensor |
| CN106558526B (en) * | 2016-05-24 | 2019-09-13 | 芯导精密(北京)设备有限公司 | A kind of included wafer seeks the manipulator of side sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103489818B (en) | A kind of silicon wafer pre-alignment device | |
| CN204857695U (en) | High -efficient wafer prealignment controlling means | |
| CN203644747U (en) | Silicon wafer pre-alignment device | |
| CN103199044B (en) | Silicon slice conveying device | |
| CN103732047B (en) | A kind of automatic aligning many station parts mount mechanism | |
| CN110534464B (en) | Double-end die bonder | |
| CN104111595B (en) | Pre-alignment method for the prealignment device of lithographic equipment | |
| CN103953754B (en) | Vehicle-mounted particle concentration detector sampling distributing valve | |
| CN108603786B (en) | Sensor and control method thereof | |
| CN108172541B (en) | Chip mounting device | |
| TWI566308B (en) | High accuracy die bonding apparatus with high yield | |
| CN210805728U (en) | Positioning and calibrating device for small-gap wafer of exposure machine | |
| CN102024727B (en) | Loader | |
| CN109958689A (en) | A kind of full joint tool of high-precision | |
| CN209043569U (en) | Installation positioning mechanism in the detection device of 8 high performance-price ratio MCU chips | |
| CN102183880A (en) | Quick pre-locating device for base plate of light emitting diode (LED) automatic exposure machine | |
| KR20200086952A (en) | Die ejecting apparatus | |
| CN209979707U (en) | Probe card | |
| CN212810241U (en) | OF aligning device suitable for transparent wafer | |
| CN203085495U (en) | A bonding machine platform device | |
| CN202087567U (en) | Chucking device for washing photo-mask | |
| CN104749710A (en) | Optical fiber and chip aimed packaging structure and optical fiber aiming method | |
| CN114566445B (en) | Wafer three-dimensional integration-oriented high-precision micro-assembly equipment | |
| CN102254851A (en) | Vacuum type chuck device having nitrogen protection | |
| CN203641532U (en) | Installation structure of radial seal valve parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140611 Effective date of abandoning: 20160420 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |