CN103489818A - Silicon wafer pre-alignment device - Google Patents
Silicon wafer pre-alignment device Download PDFInfo
- Publication number
- CN103489818A CN103489818A CN201310479044.2A CN201310479044A CN103489818A CN 103489818 A CN103489818 A CN 103489818A CN 201310479044 A CN201310479044 A CN 201310479044A CN 103489818 A CN103489818 A CN 103489818A
- Authority
- CN
- China
- Prior art keywords
- rotating shaft
- alignment device
- top plate
- locating wheel
- wafer pre
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract description 36
- 229910052710 silicon Inorganic materials 0.000 title abstract description 36
- 239000010703 silicon Substances 0.000 title abstract description 36
- 210000000078 claw Anatomy 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The invention relates to a silicon wafer pre-alignment device. The silicon wafer pre-alignment device comprises a horizontal top plate, a rotating shaft vertically arranged at one end of the horizontal top plate, a sucking disc clamped at the top end of the rotating shaft, a rotating shaft motor rotatably connected at the other end of the rotating shaft, a lower support frame clamped on the rotating shaft and located under the sucking disc, a stretching claw arranged at the edge of the lower support frame, a locating wheel rotatably connected at the tail end of the stretching claw, and an opposite-type sensor fixed at one end of the horizontal top plate through a connecting piece. The rotating shaft motor is connected with the rotating shaft; the locating wheel is composed of a cone at the top of the locating wheel, a reversed cone on the lower surface of the cone, a cylinder on the lower surface of the reversed cone, and a boss on the lower surface of the cylinder; the reversed cone, the cylinder and the boss form a ring-shaped groove, the diameter of the lower surface of the cone is equal to that of the upper surface of the reversed cone, the diameter of the lower surface of the reversed cone is equal to that of the cylinder, and the diameter of the boss is greater than that of the cylinder. The silicon wafer pre-alignment device has the advantages of low damage and low pollution to silicon wafers, high pre-alignment precision, and the like.
Description
Technical field
The present invention relates to a kind of prealignment device, particularly about a kind of wafer pre-alignment device.
Background technology
At present in the semi-conductor silicon chip manufacturing, usually arrange one at the edge of circular silicon chip in order to indicate the location notch of silicon chip direction, to facilitate integrated information needed on silicon chip, simultaneously, in order to facilitate integrated circuit on silicon chip to read in resetting and information in the course of processing repeatedly, also be carved with the corresponding information of silicon chip with respect to the fixed position of location notch, information can be wherein a kind of in numerical chracter, bar code or Quick Response Code.The wafer pre-alignment device is according to the location notch of silicon chip, it to be positioned, and the positioning precision of wafer pre-alignment device directly affects reading and follow-up machining accuracy of corresponding information on silicon chip.
Patent " a kind of silicon chip conveyer " by name discloses a kind of like this wafer pre-alignment device, and as shown in Fig. 1～4, it comprises a top board 53, and the front portion of top board 53 connects the rotating shaft 54 perpendicular to a hollow of top board 53 by bearing; Rotating shaft 54 upper ends of top board 53 tops are sealedly connected with a sucker 55, the aspiration hole on sucker 55 and rotating shaft 54 internal communication, and rotating shaft 54 bottoms of top board 53 tops connect a belt wheel 56.Top board 53 bottom surfaces are fixedly installed an air drain 57, and the lower end of rotating shaft 54 passes belt wheel 56 and is communicated with air drain 57, and its junction is by O RunddichtringO sealing, and the other end of air drain 57 is communicated with a vacuum pump by tracheae and vacuum solenoid.Top board 53 bottom surfaces of air drain 57 rear ends are fixedly connected with a rotating shaft electric motor 58, and the output of rotating shaft electric motor 58 is by the belt wheel 56 of tape handler connection rotating shaft 54 bottoms.Top board 53 end faces are fixedly connected with and are set in the outer bottom bracket 59 of rotating shaft 54, bottom bracket 59 marginating compartments are provided with four outside projected claws 60, the end of each projected claw 60 is all higher than bottom bracket 59 end faces, and the end face of each projected claw 60 end is rotationally connected 61, four locating wheel 61 centers of a locating wheel and is co-located on a concentrically ringed circumference of sucker 55.The top of each locating wheel 61 is conical 61-0, the cylindrical 61-1 in middle part, and the top of cylindrical 61-1 is a little more than the end face of sucker 55.Top board 53 front ends are provided with a pair of vertical photoelectric sensor 63 that is electrically connected to control system.Two vertical photoelectric sensors 63 are fixedly connected on top board 53 the place aheads by a connection piece 64 that is arranged on top board 53 bottom surfaces.
In above-mentioned wafer pre-alignment device, locating wheel 61 exists when getting silicon chip, easily damages silicon chip and causes the pollution to silicon chip.In addition, the output belt wheel 56 of rotating shaft electric motor 58 drives silicon slice rotating, and because the band driving error is larger, the positional information precision of the silicon chip that causes photoelectric sensor 63 to obtain is low, and the prealignment precision of silicon chip is low.
In sum, existing wafer pre-alignment device not only can produce infringement and pollute silicon chip, and the prealignment precision of silicon chip is low.
Summary of the invention
For the problems referred to above, the purpose of this invention is to provide a kind of to wafer contamination, damage wafer pre-alignment device low and that alignment precision is high.
For achieving the above object, the present invention takes following technical scheme: a kind of wafer pre-alignment device, it comprises a horizontal top plate, one is vertically set on the rotating shaft of described horizontal top plate one end, one is installed on the sucker on described rotating shaft top, one is rotationally connected with the rotating shaft electric motor of the described rotating shaft other end, one is installed in described rotating shaft and is positioned at the bottom bracket of described sucker below, some projected claws that are arranged on described bottom bracket edge, some locating wheels that are rotatably connected on described projected claw end, and one be fixed on an emission sensor of described horizontal top plate one end by a connection piece, it is characterized in that, the output shaft rotation of described rotating shaft electric motor connects described rotating shaft, each described locating wheel is all that the boss that cylinder and that the inverted cone, that is positioned at described cone lower surface by a cone, that is positioned at described locating wheel top is positioned at described inverted cone lower surface is positioned at described cylinder lower surface combines, and described inverted cone, cylinder and boss form an annular groove, the diameter of described cone lower surface equals the diameter of described inverted cone upper surface, and described inverted cone lower surface diameter equals described cylindrical diameter, and described boss diameter is greater than described cylinder diameter, the lower surface of described inverted cone exceeds the upper surface 1～3mm of described sucker, and the upper surface of described boss is lower than the upper surface 1～3mm of described sucker.
The centerline of described horizontal top plate one end upper surface is offered a through hole, described rotating shaft is located in through hole and is fixed on the upper surface of described horizontal top plate by bearing, a blind hole is offered along central axis in the upper surface of described rotating shaft, described rotating shaft also arranges a flange near upper end surface, described suction cup sealed is fastened on the upper surface of described rotating shaft flange, described sucker central axis offers one for air-breathing through hole, described through hole is communicated with the top of the blind hole of described rotating shaft, and the lower end of described rotating shaft is by the output shaft of a shaft coupling connection rotating shaft motor.
The bottom of described horizontal top plate arranges an air channel, and an end of described air channel is communicated with the bottom of described blind hole, and, by an O RunddichtringO sealing, the other end of described air channel is communicated with a vacuum pump by a tracheae and vacuum solenoid.
Described bottom bracket is fastened on the flange lower surface of described rotating shaft, the marginating compartment of described bottom bracket arranges four projected claws, the upper surface of each described projected claw end all is rotationally connected described locating wheel, four described locating wheels be centered close to one with the concentric circumference of described sucker on.
Described connector comprises a horizon bar and a U-shaped bar, and an end of described horizon bar is fastened on the centerline of described horizontal top plate one end lower surface, and the other end is fastenedly connected described U-shaped bar, and a described correlation sensor setting is at described U-shaped bar opening end.
The central axis place of described locating wheel bottom offers a ladder blind hole, and the end of each described projected claw is all installed a vertical bearing, and each described locating wheel is connected with the vertical bearing on projected claw by described ladder blind hole.
The present invention is owing to taking above technical scheme, it has the following advantages: 1, locating wheel of the present invention is comprised of cone, inverted cone, cylinder and boss, cone guarantees that silicon chip is concentric with sucker when placing silicon chip, inverted cone guarantees that silicon chip is not stuck when taking silicon chip away, the annular groove that inverted cone, cylinder and boss form guarantees with locating wheel, not rub in the silicon slice rotating process, therefore, in stability, can also reduce infringement and the pollution of prealignment operation to silicon chip in improving the silicon chip rotation process.2, adopt the direct connection rotating shaft of output of rotating shaft electric motor due to the present invention, thereby avoided the driving error of intermediate transmission mechanism, therefore can improve stability and the prealignment precision of silicon chip rotation process.
The accompanying drawing explanation
Fig. 1 is the superstructure schematic diagram of existing wafer pre-alignment device
Fig. 2 is the substructure schematic diagram of existing wafer pre-alignment device
Fig. 3 is the structural representation of locating wheel in existing wafer pre-alignment device
Fig. 4 is that the master of Fig. 3 looks schematic diagram
Fig. 5 is structural representation of the present invention
Fig. 6 is vertical cross-sectional schematic of Fig. 5
Fig. 7 is the structural representation of locating wheel in the present invention
Fig. 8 is that the master of Fig. 7 looks schematic diagram
Embodiment
Below in conjunction with drawings and Examples, to of the present invention, be described in detail.
As shown in Figure 5, Figure 6, the present invention includes a horizontal top plate 201, a rotating shaft 202, a sucker 203, a rotating shaft electric motor 204, an air channel 205, a bottom bracket 206, four projected claws 207, four locating wheels 208, a connection piece 209 and emission sensors 210.Wherein, the centerline of horizontal top plate 201 1 end upper surfaces is offered a through hole (not shown), rotating shaft 202 is plugged in through hole and is arranged on the upper surface of horizontal top plate 201 by bearing, a blind hole 202-1 is offered along central axis in the upper surface of rotating shaft 202, rotating shaft 202 also arranges a flange 202-2 near upper end surface, sucker 203 sealed cards are located at the upper surface of the flange 202-2 of rotating shaft 202, sucker 203 central axis offer one for air-breathing through hole 203-1, through hole 203-1 is communicated with the top of the blind hole 202-1 of rotating shaft 202, the lower end of rotating shaft 202 is by the output shaft of a shaft coupling connection rotating shaft motor 204.Air channel 205 is arranged on the bottom of horizontal top plate 201, one end of air channel 205 is communicated with the bottom of blind hole 202-1, and, by an O RunddichtringO (not shown) sealing, the other end of air channel 205 is communicated with (not shown) by a tracheae (not shown) and vacuum solenoid (not shown) with a vacuum pump.Bottom bracket 206 is fastened on the flange 202-2 lower surface of rotating shaft 202, the marginating compartment of bottom bracket 206 arranges four projected claws 207, the end of each projected claw 207 is all higher than bottom bracket 206 end faces, the upper surface of each projected claw 207 end all is rotationally connected locating wheel 208, all locating wheels 208 be centered close to the concentric circumference of a sucker 203 on.Connector 209 comprises a horizon bar 209-1 and a U-shaped bar 209-2, the end of horizon bar 209-1 is fastened on the centerline of horizontal top plate 201 1 end lower surfaces, the other end is fastenedly connected U-shaped bar 209-2, and an emission sensor 210 is symmetricly set on the opening end of U-shaped bar 209-2.
As shown in Figure 7, Figure 8, locating wheel 208 of the present invention can be considered by a cone 208-1, an inverted cone 208-2, a cylinder 208-3 and a boss 208-4 and forms, wherein cone 208-1 is positioned at the top of locating wheel 208, for guaranteeing that silicon chip is concentric with sucker 203 when placing silicon chip.The inverted cone 208-2 that the lower surface of cone 208-1 is one with it, and the lower surface diameter of the upper surface of inverted cone 208-2 and cone 208-1 is suitable, for guaranteeing that silicon chip is not stuck when taking out silicon chip.The cylinder 208-3 that the lower surface of inverted cone 208-2 is one with it, the boss 208-4 that the lower surface of cylinder 208-3 is one with it, and the lower surface diameter of the diameter of cylinder 208-3 and inverted cone 208-2 is suitable, the diameter of boss 208-4 is slightly larger than the upper surface diameter of inverted cone 208-2, form an annular groove at inverted cone 208-2, cylinder 208-3 and boss 208-4 like this, this annular groove is for guaranteeing when silicon slice rotating, and silicon chip does not rub with locating wheel 208.
As shown in Figure 5, Figure 6, the lower surface of inverted cone 208-2 exceeds the upper surface 1～3mm of sucker 203.The upper surface of boss 208-4 is lower than the upper surface 1～3mm of sucker 203.
In a preferred embodiment, the central axis place of locating wheel 208 bottoms offers a ladder blind hole 208-5, the end of each projected claw 207 is all installed a vertical bearing (not shown), and locating wheel 208 is connected with the vertical bearing on projected claw 207 by ladder blind hole 208-5.
The various embodiments described above are only for illustrating the present invention; wherein the structure of each parts, connected mode and manufacture craft etc. all can change to some extent; every equivalents of carrying out on the basis of technical solution of the present invention and improvement, all should not get rid of outside protection scope of the present invention.
Claims (10)
1. a wafer pre-alignment device, it comprises a horizontal top plate,
One is vertically set on the rotating shaft of described horizontal top plate one end,
One is installed on the sucker on described rotating shaft top,
One is rotationally connected with the rotating shaft electric motor of the described rotating shaft other end,
One is installed in described rotating shaft and is positioned at the bottom bracket of described sucker below,
Some projected claws that are arranged on described bottom bracket edge,
Some locating wheels that are rotatably connected on described projected claw end,
And one be fixed on an emission sensor of described horizontal top plate one end by a connection piece; It is characterized in that, the output shaft rotation of described rotating shaft electric motor connects described rotating shaft; Each described locating wheel is all that the boss that cylinder and that the inverted cone, that is positioned at described cone lower surface by a cone, that is positioned at described locating wheel top is positioned at described inverted cone lower surface is positioned at described cylinder lower surface combines, and described inverted cone, cylinder and boss form an annular groove; The diameter of described cone lower surface equals the diameter of described inverted cone upper surface, and described inverted cone lower surface diameter equals described cylindrical diameter, and described boss diameter is greater than described cylinder diameter; The lower surface of described inverted cone exceeds the upper surface 1～3mm of described sucker, and the upper surface of described boss is lower than the upper surface 1～3mm of described sucker.
2. a kind of wafer pre-alignment device as claimed in claim 1, it is characterized in that, the centerline of described horizontal top plate one end upper surface is offered a through hole, described rotating shaft is located in through hole and is fixed on the upper surface of described horizontal top plate by bearing, a blind hole is offered along central axis in the upper surface of described rotating shaft, described rotating shaft also arranges a flange near upper end surface, described suction cup sealed is fastened on the upper surface of described rotating shaft flange, described sucker central axis offers one for air-breathing through hole, described through hole is communicated with the top of the blind hole of described rotating shaft, the lower end of described rotating shaft is by the output shaft of a shaft coupling connection rotating shaft motor.
3. a kind of wafer pre-alignment device as claimed in claim 1, it is characterized in that, the bottom of described horizontal top plate arranges an air channel, one end of described air channel is communicated with the bottom of described blind hole, and, by an O RunddichtringO sealing, the other end of described air channel is communicated with a vacuum pump by a tracheae and vacuum solenoid.
4. a kind of wafer pre-alignment device as claimed in claim 2, it is characterized in that, the bottom of described horizontal top plate arranges an air channel, one end of described air channel is communicated with the bottom of described blind hole, and, by an O RunddichtringO sealing, the other end of described air channel is communicated with a vacuum pump by a tracheae and vacuum solenoid.
5. a kind of wafer pre-alignment device as claimed in claim 1 or 2 or 3 or 4, it is characterized in that, described bottom bracket is fastened on the flange lower surface of described rotating shaft, the marginating compartment of described bottom bracket arranges four projected claws, the upper surface of each described projected claw end all is rotationally connected described locating wheel, four described locating wheels be centered close to one with the concentric circumference of described sucker on.
6. a kind of wafer pre-alignment device as claimed in claim 1 or 2 or 3 or 4, it is characterized in that, described connector comprises a horizon bar and a U-shaped bar, one end of described horizon bar is fastened on the centerline of described horizontal top plate one end lower surface, the other end is fastenedly connected described U-shaped bar, and a described correlation sensor setting is at described U-shaped bar opening end.
7. a kind of wafer pre-alignment device as claimed in claim 5, it is characterized in that, described connector comprises a horizon bar and a U-shaped bar, one end of described horizon bar is fastened on the centerline of described horizontal top plate one end lower surface, the other end is fastenedly connected described U-shaped bar, and a described correlation sensor setting is at described U-shaped bar opening end.
8. as claim 1 or 2 or 3 or 4 or 7 described a kind of wafer pre-alignment devices, it is characterized in that, the central axis place of described locating wheel bottom offers a ladder blind hole, the end of each described projected claw is all installed a vertical bearing, and each described locating wheel is connected with the vertical bearing on projected claw by described ladder blind hole.
9. a kind of wafer pre-alignment device as claimed in claim 5, it is characterized in that, the central axis place of described locating wheel bottom offers a ladder blind hole, the end of each described projected claw is all installed a vertical bearing, and each described locating wheel is connected with the vertical bearing on projected claw by described ladder blind hole.
10. a kind of wafer pre-alignment device as claimed in claim 6, it is characterized in that, the central axis place of described locating wheel bottom offers a ladder blind hole, the end of each described projected claw is all installed a vertical bearing, and each described locating wheel is connected with the vertical bearing on projected claw by described ladder blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479044.2A CN103489818B (en) | 2013-10-14 | 2013-10-14 | A kind of silicon wafer pre-alignment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479044.2A CN103489818B (en) | 2013-10-14 | 2013-10-14 | A kind of silicon wafer pre-alignment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103489818A true CN103489818A (en) | 2014-01-01 |
| CN103489818B CN103489818B (en) | 2016-04-20 |
Family
ID=49829951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310479044.2A Active CN103489818B (en) | 2013-10-14 | 2013-10-14 | A kind of silicon wafer pre-alignment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103489818B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103777478A (en) * | 2014-02-20 | 2014-05-07 | 江阴长电先进封装有限公司 | Wafer calibration level device of noncontact photoetching machine and application of wafer calibration level device |
| CN104103559B (en) * | 2014-07-23 | 2017-01-04 | 济南晶博电子有限公司 | Clipping silicon chip coating whirler |
| CN106449500A (en) * | 2016-09-27 | 2017-02-22 | 天津华海清科机电科技有限公司 | Positioning assembly |
| WO2017092720A1 (en) * | 2015-11-30 | 2017-06-08 | 上海微电子装备（集团）股份有限公司 | Workpiece platform substrate contact device and prealignment method |
| CN110943021A (en) * | 2018-09-21 | 2020-03-31 | 上海微电子装备（集团）股份有限公司 | Pre-alignment device and method |
| CN115831846A (en) * | 2023-02-15 | 2023-03-21 | 河北博特半导体设备科技有限公司 | Wafer pre-alignment device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030053904A1 (en) * | 2001-09-14 | 2003-03-20 | Naofumi Kirihata | Wafer aligner |
| JP2005086049A (en) * | 2003-09-10 | 2005-03-31 | Yaskawa Electric Corp | Wafer-holding device |
| CN203644747U (en) * | 2013-10-14 | 2014-06-11 | 北京自动化技术研究院 | Silicon wafer pre-alignment device |
-
2013
- 2013-10-14 CN CN201310479044.2A patent/CN103489818B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030053904A1 (en) * | 2001-09-14 | 2003-03-20 | Naofumi Kirihata | Wafer aligner |
| JP2005086049A (en) * | 2003-09-10 | 2005-03-31 | Yaskawa Electric Corp | Wafer-holding device |
| CN203644747U (en) * | 2013-10-14 | 2014-06-11 | 北京自动化技术研究院 | Silicon wafer pre-alignment device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103777478A (en) * | 2014-02-20 | 2014-05-07 | 江阴长电先进封装有限公司 | Wafer calibration level device of noncontact photoetching machine and application of wafer calibration level device |
| CN104103559B (en) * | 2014-07-23 | 2017-01-04 | 济南晶博电子有限公司 | Clipping silicon chip coating whirler |
| WO2017092720A1 (en) * | 2015-11-30 | 2017-06-08 | 上海微电子装备（集团）股份有限公司 | Workpiece platform substrate contact device and prealignment method |
| CN106449500A (en) * | 2016-09-27 | 2017-02-22 | 天津华海清科机电科技有限公司 | Positioning assembly |
| CN110943021A (en) * | 2018-09-21 | 2020-03-31 | 上海微电子装备（集团）股份有限公司 | Pre-alignment device and method |
| CN110943021B (en) * | 2018-09-21 | 2022-05-31 | 上海微电子装备（集团）股份有限公司 | Pre-alignment device and method |
| CN115831846A (en) * | 2023-02-15 | 2023-03-21 | 河北博特半导体设备科技有限公司 | Wafer pre-alignment device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103489818B (en) | 2016-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103489818B (en) | A kind of silicon wafer pre-alignment device | |
| CN106028251B (en) | Loudspeaker vibrating diaphragm rotation type dispensing quality detection equipment | |
| US7274452B2 (en) | Alignment apparatus | |
| KR102459402B1 (en) | Die ejecting apparatus | |
| CN204857695U (en) | High -efficient wafer prealignment controlling means | |
| EP3306397B1 (en) | Silicon wafer transportation system | |
| CN203644747U (en) | Silicon wafer pre-alignment device | |
| TWI619586B (en) | Substrate transfer robot and substrate detection method | |
| CN103732047B (en) | A kind of automatic aligning many station parts mount mechanism | |
| CN104111595B (en) | Pre-alignment method for the prealignment device of lithographic equipment | |
| CN103376673A (en) | Pre-alignment device and pre-alignment method | |
| CN110534464B (en) | Double-end die bonder | |
| KR102512045B1 (en) | Die ejecting apparatus | |
| CN109037129B (en) | Rotatory handling device of chip | |
| JP2010283280A (en) | Position recognition device and position recognition method, and alignment device and alignment method | |
| TWI566308B (en) | High accuracy die bonding apparatus with high yield | |
| CN210805728U (en) | Positioning and calibrating device for small-gap wafer of exposure machine | |
| CN107799433A (en) | Semiconductor- fabricating device and its grinding module | |
| TWM472310U (en) | Segmented chip bonding device | |
| CN212810241U (en) | OF aligning device suitable for transparent wafer | |
| KR102141201B1 (en) | Die ejecting apparatus | |
| KR102594541B1 (en) | Die ejecting apparatus | |
| CN114746993A (en) | Substrate processing apparatus | |
| CN114566445B (en) | Wafer three-dimensional integration-oriented high-precision micro-assembly equipment | |
| CN109524319B (en) | Die table unit and die bonding device with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170606 Address after: In Beijing economic and Technological Development Zone, two street 100176 Daxing District 8 Beijing City Hospital No. 14 building A block 101, 201, 401, 501 Patentee after: Beijing Jingyi automation equipment Technology Co. Ltd. Address before: 100009 No. 41 West Tower Street, Beijing, Xicheng District Patentee before: Beijing Automation Technical Research Institute |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Silicon wafer prealigning device Effective date of registration: 20200721 Granted publication date: 20160420 Pledgee: Beijing first financing Company limited by guarantee Pledgor: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. Registration number: Y2020990000810 |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 100176 block a, 14th floor, yard 8, Liangshuihe 2nd Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi automation equipment Technology Co.,Ltd. Address before: 100176 101, 201, 401, 501, building a, building 14, yard 8, Liangshuihe Second Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211018 Granted publication date: 20160420 Pledgee: Beijing first financing Company limited by guarantee Pledgor: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. Registration number: Y2020990000810 |