CN115831846A - Wafer pre-alignment device - Google Patents
Wafer pre-alignment device Download PDFInfo
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- CN115831846A CN115831846A CN202310113020.9A CN202310113020A CN115831846A CN 115831846 A CN115831846 A CN 115831846A CN 202310113020 A CN202310113020 A CN 202310113020A CN 115831846 A CN115831846 A CN 115831846A
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- 238000001514 detection method Methods 0.000 claims abstract description 11
- 238000009966 trimming Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 28
- 230000005540 biological transmission Effects 0.000 claims description 14
- 239000013307 optical fiber Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 67
- 238000010586 diagram Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
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- 238000013459 approach Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides a wafer pre-alignment device, including: the platform is provided with a mounting surface, and a mounting position is arranged on the mounting surface; the platform core is provided with a first axis and is coaxially arranged with the mounting position, the platform core is rotationally connected with the platform around the first axis and is in sliding connection along a first direction, and the first direction is vertical to the mounting surface; the limiting mechanism is used for concentrically aligning the wafer and the mounting position and comprises a plurality of sliding pins, a driving disc and a first driving device, wherein the sliding pins are mounted on the mounting surface and are connected with the mounting surface in a sliding mode along the radial direction of the table core; the second driving device is used for driving the table core to rotate around the first axis; the driving assembly is used for driving the table core to slide along a first direction; and the detection mechanism is arranged on the mounting surface and used for controlling the second driving device to stop working after detecting the notch or the trimming of the wafer. The wafer pre-alignment device has the advantages of being simple and convenient to operate and high in pre-alignment efficiency.
Description
Technical Field
The present invention relates generally to the field of semiconductor technology, and more particularly to a wafer pre-alignment apparatus.
Background
The wafer pre-alignment mechanism is an important subsystem of a wafer processing system, and is used for positioning a wafer before the wafer is conveyed to a processing station, calculating the deviation between the wafer and a standard position, and then driving a motion platform to position the circle center and a notch (or a cut edge) of the wafer within a specific range. The wafer pre-alignment aims at two purposes, namely determining the circle center position of the wafer and determining the notch direction of the wafer. The position of the center of a circle of the wafer on the pre-alignment system is unknown before operation, the direction of the gap is random, and the pre-alignment aims to adjust the center of the circle of the wafer to a specified position and adjust the direction of the gap to a specified direction.
The traditional wafer pre-alignment device is complex in process when adjusting the position of a wafer, the position of the circle center of the wafer is not easy to determine, the operation is complex when adjusting the direction of a notch, and then the efficiency of wafer pre-alignment is not high, and the proceeding of subsequent work is influenced.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a wafer pre-alignment apparatus to solve the above-mentioned problems.
The application provides a wafer pre-alignment device, including:
the platform is provided with an installation surface, and an installation position is arranged on the installation surface;
the table core is provided with a first axis and is coaxially arranged with the mounting position, the table core is rotatably connected with the platform around the first axis and is in sliding connection along a first direction, and the first direction is perpendicular to the mounting surface;
the limiting mechanism is used for concentrically aligning the wafer and the mounting position and comprises a plurality of sliding pins, a driving disc and a first driving device, wherein the sliding pins are mounted on the mounting surface and are connected with the mounting surface in a sliding mode along the radial direction of the table core;
the second driving device is used for driving the table core to rotate around the first axis;
the driving assembly is used for driving the table core to slide along the first direction;
and the detection mechanism is arranged on the mounting surface and used for controlling the second driving device to stop working after detecting the notch or the trimming edge of the wafer.
According to the technical scheme that this application embodiment provided, stop gear still includes a plurality of spouts, a plurality of spouts are seted up just follow on the installation face the week side align to grid of platform core sets up, wherein, the spout corresponds the sliding pin sets up, the sliding pin with spout sliding connection.
According to the technical scheme that this application embodiment provided, have on the driving-disc and correspond a plurality of arc guide ways that the spout set up, the guide way with correspond sliding pin sliding connection, and with correspond the spout is in projection on the installation face is crossing, curved concave side orientation first axis setting.
According to the technical scheme provided by the embodiment of the application, the detection mechanism comprises:
the clamp base is embedded at the edge of the mounting position;
the clamp body is connected with the clamp base and suspended above the clamp base;
and the transmitting end and the receiving end of the optical fiber sensor are respectively arranged on the clamp base and the clamp body and are used for detecting the position of the notch or the trimming edge of the wafer.
According to the technical scheme provided by the embodiment of the application, the driving assembly comprises a sliding rail, a sliding seat fixedly connected with the second driving device and a third driving device used for driving the sliding seat to slide on the sliding rail along the direction parallel to the first direction.
According to the technical scheme that this application embodiment provided, a plurality of gas grooves have been seted up to the platform core top surface, and the platform core main part has seted up the air guide hole along the axial, air guide hole one end with the gas groove intercommunication, the other end and outside suction apparatus intercommunication.
According to the technical scheme provided by the embodiment of the application, the device further comprises a limiting block and a limiting sensor, wherein the limiting block is installed on the driving disc, and the limiting sensor is electrically connected with the first driving device and used for contacting with the limiting block and then controlling the first driving device to stop working.
According to the technical scheme that this application embodiment provided, still include toothed belt and tension sensor, the toothed belt is used for transmission between first drive arrangement and the driving-disc, tension sensor with first drive arrangement electricity is connected, is used for measuring when the tension value of toothed belt is greater than the settlement range control first drive arrangement rotates.
According to the technical scheme provided by the embodiment of the application, the installation position is provided with an observation line coaxial with the table core.
According to the technical scheme provided by the embodiment of the application, a plurality of toothed belt clamps are mounted on the driving disc.
Compared with the prior art, the beneficial effect of this application lies in: through the arrangement of the platform, the platform core and the detection mechanism, the platform core is rotatably mounted on the platform around the first axis and can slide along the first direction, so that the platform core is driven to move along the first direction to lift the platform core, and a manipulator can conveniently grab and place a wafer; the table core rotates around the first axis, so that the detection mechanism can detect a notch or a cut edge at the edge of the wafer in a rotating state conveniently, and when the notch or the cut edge is detected, the second driving device is controlled to stop working, and the positions of the notch and the cut edge can be determined conveniently; through the arrangement of the limiting mechanism, when the wafer is placed on the platform, the driving disc drives all the sliding pins to move towards the direction close to the first axis, so that the wafer and the platform core are driven to be arranged at the concentric position, the center of the wafer is conveniently determined, the operation is simple and convenient, and the pre-alignment efficiency of the wafer is ensured to be higher.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:
fig. 1 is a schematic structural diagram of a wafer pre-alignment apparatus according to the present disclosure;
FIG. 2 is a bottom view of the wafer pre-alignment apparatus shown in FIG. 1;
FIG. 3 is a schematic diagram illustrating an internal structure of the wafer pre-alignment apparatus shown in FIG. 1;
FIG. 4 is a schematic view of another perspective view of the interior of the wafer pre-alignment apparatus shown in FIG. 1;
FIG. 5 is a schematic diagram of a structure of a drive assembly of the wafer pre-alignment apparatus shown in FIG. 1;
description of the drawings: 1. a platform; 2. a table core; 3. a slide pin; 4. a drive disc; 5. a first driving device; 6. a second driving device; 7. a chute; 8. a guide groove; 9. a clamp base; 10. a clamp body; 11. an optical fiber sensor; 12. a slide rail; 13. a slide base; 14. a third driving device; 15. an air tank; 16. air holes; 17. a limiting block; 18. a limit sensor; 19. a toothed belt; 191. a first transmission unit; 192. a second transmission part; 20. a tension sensor; 21. observing the line; 22. a toothed belt clip; 23. mounting a plate; 24. a gas-guide tube; 25. a protective shell.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1 to 5, the present application provides a wafer pre-alignment apparatus, including:
the platform 1 is provided with an installation surface, and an installation position is arranged on the installation surface;
the table core 2 is provided with a first axis and is coaxially arranged with the installation position, the table core 2 is rotatably connected with the platform 1 around the first axis and is in sliding connection along a first direction, and the first direction is perpendicular to the installation surface;
the limiting mechanism is used for concentrically aligning the wafer and the mounting position and comprises a plurality of sliding pins 3 which are mounted on the mounting surface and are connected with the mounting surface in a sliding mode along the radial direction of the table core 2, a driving disc 4 used for driving all the sliding pins 3 to move simultaneously and a first driving device 5 used for driving the driving disc 4 to rotate;
a second driving device 6 for driving the table core 2 to rotate around the first axis;
the driving component is used for driving the table core 2 to slide along the first direction;
and the detection mechanism is arranged on the mounting surface and used for controlling the second driving device 6 to stop working after detecting the notch or the trimming of the wafer.
The working principle is as follows: by arranging the platform 1, the table core 2 and the detection mechanism, the table core 2 is rotatably mounted on the platform 1 around the first axis and can slide along the first direction, so that the table core 2 is lifted by driving the table core 2 to move along the first direction, and a manipulator can conveniently grab and place a wafer; the table core 2 rotates around the first axis, so that the detection mechanism can detect a notch or a cut edge at the edge of the wafer in a rotating state conveniently, and when the notch or the cut edge is detected, the second driving device 5 is controlled to stop working, and the positions of the notch and the cut edge can be determined conveniently; through the arrangement of the limiting mechanism, when the wafer is placed on the platform 1, the driving disc 4 drives all the sliding pins 3 to move towards the direction close to the first axis, so as to drive the wafer and the table core 2 to be arranged at the concentric position, the center of the wafer is conveniently determined, the operation is simple and convenient, and the pre-alignment efficiency of the wafer is ensured to be higher.
Specifically, platform 1 is inside to have an installation space, driving-disc 4 rotate install in the installation space and with the coaxial setting of core 2, first drive arrangement 5 fixed mounting in the installation space, the rotation axis of first drive arrangement 5 with driving-disc 4 transmission is connected.
Specifically, the second driving device 6 is slidably mounted on the driving assembly along a direction parallel to the first direction, an output shaft is fixedly connected with one end of the table core 2 far away from the mounting surface, and a protective shell 25 is arranged outside the second driving device 6 and the driving assembly.
Specifically, the connecting lines of a plurality of adjacent sliding pins 3 form a concentric circle which is coincident with the center of the table core 2.
Further, referring to fig. 1, the limiting mechanism further includes a plurality of sliding grooves 7, the sliding grooves 7 are disposed on the mounting surface and are uniformly arranged along the circumferential side of the table core 2, the stroke direction of the sliding grooves 7 is parallel to the radial direction of the table core 2, each sliding groove 7 is disposed corresponding to one sliding pin 3, the sliding pin 3 is located in the sliding groove 7 and is slidably connected with the sliding groove 7, one end of the sliding pin 3 extends out of the sliding groove 7, and the extended end is used for limiting the wafer; through setting up spout 7 for a plurality of sliding pin 3 can be steadily followed the radial direction of core 2 slides, and then conveniently carry out spacingly to the wafer.
Further, referring to fig. 3, a plurality of arc-shaped guide grooves 8 corresponding to the sliding grooves 7 are provided on the driving disc 4, each guide groove 8 is provided corresponding to one sliding pin 3, the guide groove 8 intersects with the projection of the corresponding sliding groove 7 on the mounting surface, one end of the sliding pin 3 away from the mounting surface extends into the guide groove 8 and is slidably connected with the guide groove 8, and the concave side of the arc is provided toward the first axis; guide way 8 has nearly heart-end and distal end, the heart-end distance is less than the distance of first axis the distal end distance the distance of first axis, works as sliding pin 3 is located spout 7 is kept away from when the one end of first axis, corresponds guide way 8 is located the distal end.
When the sliding pin 3 is in the process of limiting the wafer, the first driving device 5 drives the driving disc 4 to rotate anticlockwise, the sliding pin 3 approaches from the far end to the near end in the guide groove 8 along with the rotation of the driving disc 4, all the sliding pins 3 move towards the table core 2 in the slide groove 7 to be tightened through the cooperation of the guide groove 8 and the slide groove 7, shutter type cooperation is formed between the sliding pin 3 and the driving disc 4, when the sliding pin 3 is attached to the outer side wall of the wafer, the wafer can be limited, and the effect of determining the circle center of the wafer can be further achieved.
Further, referring to fig. 1, the detecting mechanism includes a clamp base 9, a clamp body 10 and an optical fiber sensor 11, the clamp base 9 is embedded at an edge of the installation position, the clamp body 10 is fixedly connected with the clamp base 9 and suspended above the clamp base 9, a transmitting end and a receiving end of the optical fiber sensor 11 are respectively installed on the clamp base 9 and the clamp body 10, and the edge of the wafer passes between the transmitting end and the receiving end in the rotating process; when the notch or the cut edge of the wafer is not detected, the edge of the wafer blocks the infrared signal transmitted by the transmitting end so that the infrared signal cannot be received by the receiving end, and when the notch or the cut edge of the wafer passes between the transmitting end and the receiving end, the infrared signal can be received by the receiving end due to the fact that the infrared signal is not blocked; the optical fiber sensor 11 generates a first marking signal if the receiving end suddenly changes from being unable to receive the infrared signal to being able to receive the infrared signal, and the receiving end suddenly changes from being able to receive the infrared signal to being unable to receive the infrared signal, and the optical fiber sensor 11 generates a second marking signal if the receiving end suddenly changes from being able to receive the infrared signal to being unable to receive the infrared signal.
Specifically, the detection mechanism further comprises a processing module and a first control module, wherein an input end of the processing module is electrically connected with an output end of the optical fiber sensor 11, an output end of the processing module is electrically connected with an input end of the first control module, and an output end of the first control module is electrically connected with an input end of the second driving device 6; when the processing module receives the second marking signal on the basis of receiving the first marking signal, a first time interval for receiving the second marking signal and the first marking signal is calculated, a first processing signal is generated and sent to the first control module, when the first control module receives the first processing signal, the second driving device 6 is controlled to stop rotating firstly, then the second driving device stops rotating after reversing by half of the first set rotating speed for the first time interval, and at the moment, the middle position of the notch or the trimming is located between the transmitting end and the receiving end, so that the notch or the trimming is positioned.
Further, referring to fig. 5, the driving assembly includes a sliding rail 12, a sliding seat 13 and a third driving device, the sliding rail 12 is fixedly installed on an installation plate 23, the installation plate 23 is perpendicular to the installation surface and is fixedly connected to one side of the platform 1 away from the installation surface, the sliding seat 13 is slidably connected to the sliding rail 12 and is fixedly connected to the second driving device 6, the third driving device 14 is fixedly installed on the installation plate 23, in a certain embodiment, the third driving device 14 is a push rod motor, an output end of the third driving device 14 is retractable along a direction parallel to the first direction, and an end of the output end of the third driving device 14 is fixedly connected to the second driving device 6, the third driving device 14 drives the second driving device 6 to move, so as to drive the table core 2 to move along the direction parallel to the first direction, and thus the table core 2 can freely lift on the installation surface.
Further, referring to fig. 5, a plurality of air grooves 15 are formed in the top surface of the table core 2, the plurality of air grooves 15 are uniformly distributed in an axial direction of the table core 2 and intersect at a point on the first axis, an air guide hole 16 is formed in the main body of the table core 2 in the axial direction, the air guide hole 16 penetrates through two ends of the table core 2, and one end of the air guide hole is communicated with the point where the plurality of air grooves 15 intersect; when a wafer is placed on the table core 2, an external air suction device provides suction to the air guide pipe 24, and finally the pressure in a first space formed between the wafer and the air groove 15 is reduced, so that the pressure at the other side of the wafer is higher than the pressure in the first space, the wafer is adsorbed on the table core 2, and the wafer is prevented from being deviated due to position movement when the table core 2 drives the wafer to rotate, and the positioning of the wafer is influenced.
Further, please refer to fig. 3, the device further includes a limit block 17 and a limit sensor 18, the limit block 17 is fixedly installed at an edge of one side of the driving disc 4 away from the installation surface, the limit sensor 18 is fixedly installed in the installation space, an output end of the limit sensor 18 is connected to a second control module, an output end of the second control module is electrically connected to an input end of the first driving device 5, in a certain embodiment, the limit sensor 18 is a contact sensor, the limit block 17 contacts the limit sensor 18 along with the rotation of the driving disc 4, the limit sensor generates a first termination signal and sends the first termination signal to the second control module, and the second control module controls the first driving device 5 to stop working after receiving the first termination signal; through the arrangement of the limiting block 17 and the limiting sensor 18, after the driving disc 4 drives the sliding pin 3 to limit the wafer, in order to not affect the sliding pin 3 to limit the next wafer, the sliding pin 3 needs to be reset to the end, far away from the first axis, of the sliding groove 7, the driving disc 4 is required to be inverted, when the limiting block 17 contacts the limiting sensor 18, the sliding pin 3 is located at the end, far away from the first axis, of the sliding groove 7, the sliding pin 3 is reset, and therefore the working efficiency is improved.
Further, please refer to fig. 3, further comprising a toothed belt 19 and a tension sensor 20, wherein the toothed belt 19 is connected to the driving shaft of the first driving device 5 and the driving disc 4, and is used for transmission therebetween, the toothed belt 19 has a first transmission portion 191 and a second transmission portion 192, the first transmission portion 191 is a portion of the toothed belt 19 moving to the driving disc 4 after passing through the first driving device 5, the second transmission portion 192 is a portion of the toothed belt 19 moving to the first driving device 5 after passing through a plurality of driving discs 4, the tension sensor 20 is fixedly installed in the installation space and measures the tension on the second transmission portion 192, an output end of the tension sensor 20 is connected to a third control module, and an output end of the third control module is electrically connected to an input end of the first driving device 5; after the sliding pins 3 contact with the edge of the wafer to position the wafer, movement of the sliding pins 3 is blocked, and rotation of the driving disc 4 is further blocked, if the first driving device 5 continues to rotate at this time, the sliding pins 3 may crush the wafer, by providing the tension sensor 20, when rotation of the driving disc 4 is blocked, the toothed belt 19 is blocked when passing through the driving disc 4 at this time, so that tension of the first transmission part 191 is reduced, because the axial distance between the first driving device 5 and the driving disc 4 is not changed, tension of the second transmission part 192 is increased, when the tension sensor 20 detects that tension on the second transmission part 192 is greater than a set range, a second termination signal is generated, and after the second control module receives the second termination signal, the first driving device 5 is controlled to stop working, so that the first driving device 5 continues to drive the driving disc 4 to rotate, and the sliding pins 3 are prevented from crushing the wafer.
Further, referring to fig. 1, the mounting position is provided with two observation lines 21 coaxial with the table core 2, in a certain embodiment, the observation lines 21 are provided with two concentric circles having the same shape as the top surface of the table core 2, and the two observation lines 21 respectively correspond to two wafers with different diameters in size; by providing the observation line 21, it is made easy to observe whether or not the position of the wafer is pre-aligned.
Further, referring to fig. 2, a plurality of toothed belt clips 22 are uniformly arranged on one side of the driving disc 4 away from the mounting surface along the circumferential direction, the toothed belt clips 22 are fixed on the driving disc 4 through bolts, and the angle can be changed by changing the locking degree of the bolts to rotate on the driving disc 4; by providing the toothed belt clip 22, the toothed belt 19 is prevented from being disengaged from the drive disc 4, avoiding an adverse effect on the working efficiency.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention according to the present application is not limited to the specific combination of the above-mentioned features, but also covers other embodiments where any combination of the above-mentioned features or their equivalents is made without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. A wafer prealignment device, comprising:
the platform (1) is provided with an installation surface, and the installation surface is provided with an installation position;
the table core (2) is provided with a first axis and is coaxially arranged with the mounting position, the table core (2) is rotatably connected with the platform (1) around the first axis and is in sliding connection along a first direction, and the first direction is perpendicular to the mounting surface;
the limiting mechanism is used for concentrically aligning the wafer and the mounting position and comprises a plurality of sliding pins (3) which are mounted on the mounting surface and are connected with the mounting surface in a sliding mode along the radial direction of the table core (2), a driving disc (4) used for driving all the sliding pins (3) to move simultaneously, and a first driving device (5) used for driving the driving disc (4) to rotate;
a second drive means (6) for driving the table core (2) in rotation about the first axis;
the driving assembly is used for driving the table core (2) to slide along the first direction;
and the detection mechanism is arranged on the mounting surface and used for controlling the second driving device (6) to stop working after detecting the notch or the trimming of the wafer.
2. The wafer prealignment device according to claim 1, wherein the limiting mechanism further comprises a plurality of sliding grooves (7), the sliding grooves (7) are formed on the mounting surface and are arranged along the peripheral side of the table core (2) in a uniform arrangement manner, wherein the sliding grooves (7) are arranged corresponding to the sliding pins (3), and the sliding pins (3) are connected with the sliding grooves (7) in a sliding manner.
3. The wafer prealignment device according to claim 2, characterized in that the driving disk (4) has a plurality of arc-shaped guide grooves (8) corresponding to the sliding grooves (7), the guide grooves (8) are slidably connected with the corresponding sliding pins (3) and intersect with the projection of the corresponding sliding grooves (7) on the mounting surface, and the concave side of the arc is disposed toward the first axis.
4. The wafer prealignment device of claim 1, wherein the detection mechanism comprises:
the clamp base (9), the clamp base (9) is embedded at the edge of the installation position;
a clamp body (10), the clamp body (10) being connected to the clamp base (9) and suspended above the clamp base (9);
the optical fiber sensor (11), the transmitting terminal and the receiving terminal of the optical fiber sensor (11) are respectively installed on the clamp base (9) and the clamp body (10) and are used for detecting the position of the notch or the trimming of the wafer.
5. Wafer pre-alignment apparatus according to claim 1, wherein the driving assembly comprises a slide rail (12), a slide (13) fixedly connected to the second driving device (6), and a third driving device (14) for driving the slide (13) to slide on the slide rail (12) in a direction parallel to the first direction.
6. The wafer prealignment device according to claim 1, characterized in that a plurality of air grooves (15) are opened on the top surface of the table core (2), and an air guide hole (16) is opened on the main body of the table core (2) along the axial direction, wherein one end of the air guide hole (16) is communicated with the air grooves (15), and the other end is communicated with an external suction device.
7. The wafer prealignment device according to claim 1, characterized by further comprising a limit block (17) and a limit sensor (18), wherein the limit block (17) is mounted on the driving disc (4), and the limit sensor (18) is electrically connected to the first driving device (5) for controlling the first driving device (5) to stop working after contacting the limit block (17).
8. The wafer pre-alignment device according to claim 1, further comprising a toothed belt (19) and a tension sensor (20), wherein the toothed belt (19) is used for transmission between the first driving device (5) and the driving disc (4), and the tension sensor (20) is electrically connected with the first driving device (5) and used for measuring a tension value of the toothed belt (19) and controlling the first driving device (5) to rotate when the tension value is greater than a set range.
9. Wafer pre-alignment device according to claim 1, wherein a viewing line (21) is provided on the mounting location coaxially with the core (2).
10. Wafer pre-alignment device according to claim 1, wherein the drive disc (4) has toothed belt clamps (22) mounted thereon.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310113020.9A CN115831846B (en) | 2023-02-15 | 2023-02-15 | Wafer pre-alignment device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310113020.9A CN115831846B (en) | 2023-02-15 | 2023-02-15 | Wafer pre-alignment device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117293055A (en) * | 2023-09-15 | 2023-12-26 | 江苏卓胜微电子股份有限公司 | Method, device and storage medium for monitoring wafer offset |
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| JP2015026750A (en) * | 2013-07-28 | 2015-02-05 | アテル株式会社 | Wafer positioning apparatus |
| CN103489818A (en) * | 2013-10-14 | 2014-01-01 | 北京自动化技术研究院 | Silicon wafer pre-alignment device |
| CN204857695U (en) * | 2015-07-16 | 2015-12-09 | 上海微松工业自动化有限公司 | High -efficient wafer prealignment controlling means |
| CN213042899U (en) * | 2020-09-04 | 2021-04-23 | 憬承光电科技(厦门)有限公司 | Automatic wafer pre-alignment device |
| CN114664719A (en) * | 2022-03-15 | 2022-06-24 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer prealignment device and wafer prealignment system |
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| CN117293055A (en) * | 2023-09-15 | 2023-12-26 | 江苏卓胜微电子股份有限公司 | Method, device and storage medium for monitoring wafer offset |
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