CN218447865U - Automatic turnover device for semiconductor wafer - Google Patents
Automatic turnover device for semiconductor wafer Download PDFInfo
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- CN218447865U CN218447865U CN202222638171.XU CN202222638171U CN218447865U CN 218447865 U CN218447865 U CN 218447865U CN 202222638171 U CN202222638171 U CN 202222638171U CN 218447865 U CN218447865 U CN 218447865U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model relates to a machine-building's technical field discloses an automatic turning device for semiconductor wafer, its characterized in that: the device comprises a rotating mechanism, a clamping mechanism and a wafer, wherein the rotating mechanism is arranged on a base and used for driving the clamping mechanism and the wafer to rotate between 0 and 180 degrees; the clamping mechanism is connected with the rotating mechanism, adopts pneumatic drive and is used for clamping or releasing the wafer; and the limit detection mechanism is arranged beside the rotating mechanism and used for limiting and detecting the 0-degree position and the 180-degree position of the rotating mechanism. The whole device is simple in structure, simple to assemble, low in maintenance difficulty and convenient to popularize and apply.
Description
Technical Field
The utility model relates to a machine-building's technical field, concretely relates to an automatic turning device for semiconductor wafer.
Background
With the rapid development of high-end technologies such as integrated circuit semiconductor wafer transportation, manufacturing and packaging, higher technical requirements are put on semiconductor process equipment used in these fields.
As an integrated subsystem in the whole set of system of semiconductor process Equipment, EFEM (electronic Front End Module) is mainly applied to manual or automatic loading and unloading of semiconductor wafers, is a transition Module for transferring wafers from an atmospheric state to a vacuum process chamber, is mainly butted with the semiconductor process Equipment, and generally comprises main components such as a loading device, a semiconductor robot, a pre-alignment device, a filter unit, an automatic turnover device and the like. Therefore, the capacity of the whole system of semiconductor processing equipment is influenced not only by the capacity of the processing equipment, but also by the capacity of the equipment.
Generally, before entering a processing device, a semiconductor wafer needs to be subjected to double-sided inspection and front-back side entry adjustment, and if an automatic turnover device cannot rapidly and accurately turn over the wafer, the productivity and quality of the device are seriously affected, and further the productivity and quality of the whole system of the semiconductor processing device are affected.
At present, the hollow motor is mainly adopted in the industry to realize the turnover of the wafer, and in the actual use process, the following problems are found to be not well solved:
1. the hollow motor is integrated with a stepping motor, the control precision is not high, and the position can be detected in real time by frequently resetting zero;
2. only two control angles can be realized, and the turning position and speed cannot be flexibly and diversely controlled;
3. due to the adoption of the hollow motor, the cable and the air pipe which can pass through are limited to the size of the central hole of the hollow motor.
SUMMERY OF THE UTILITY MODEL
The utility model provides an automatic turnover device for semiconductor wafers.
The utility model discloses the following technical scheme of accessible realizes:
an automatic turnover device for semiconductor wafer comprises
The rotating mechanism is arranged on the base and is used for driving the clamping mechanism and the wafer to rotate between 0 and 180 degrees;
the clamping mechanism is connected with the rotating mechanism, adopts pneumatic drive and is used for clamping or releasing the wafer;
and the limit detection mechanism is arranged beside the rotating mechanism and used for limiting and detecting the 0-degree position and the 180-degree position of the rotating mechanism.
Further, the base includes the bottom plate be provided with the hollow square body on the bottom plate the inside of square body is provided with rotary mechanism, spacing detection mechanism, is provided with the through-hole on one of them curb plate, fixture sets up in the outside of square body, links to each other with rotary mechanism via the through-hole another curb plate of square body is provided with a plurality of pneumatic interfaces, electrical interface, rotational speed adjust knob, pneumatic valve.
Further, the rotating mechanism comprises a motor, an output shaft of the motor is connected with a driving belt wheel, the driving belt wheel is connected with a driven belt wheel through a belt, a center hole of the driven belt wheel is matched with the transmission shaft, one end of the transmission shaft penetrates through the through hole to be connected with the clamping mechanism, the motor is used for driving the driving belt wheel to rotate, the driven belt wheel is driven by the belt to rotate together with the transmission shaft, and therefore the clamping mechanism is driven to rotate.
Further, spacing detection mechanism sets up on the driven pulleys next door, detects the piece including setting up the L shape on the driven pulleys, both synchronous rotations 0 degree and 180 degrees positions of driven pulleys both sides respectively set up a U-shaped photoelectric sensor, every U-shaped photoelectric sensor all sets up the next door at the driven pulleys through the mount pad, and its U-shaped sense terminal detects the minor face cooperation of piece with the L shape, the mount pad detects the long limit cooperation of piece with the L shape.
Furthermore, the mounting seat is arranged on one side plate of the square body, and a plurality of long waist-shaped adjusting through holes are formed in the connecting position of the mounting seat and the side plate.
Furthermore, the motor is detachably arranged on one side plate of the square body through the mounting plate, and a plurality of long waist-shaped adjusting through holes are formed in the connecting position of the motor and the side plate.
Furthermore, a plurality of long waist-shaped adjusting through holes are formed in the bottom plate.
The utility model discloses profitable technological effect lies in:
1. the electric motor with an independent structure is used as a driver of the rotating mechanism, and compared with a hollow motor, the electric motor has stronger adaptability, can control the clamping mechanism to rotate to any angle between 0 and 180 degrees in practical need of a production process, has wider application range, does not need frequency zero calibration operation similar to a stepping motor, simplifies the operation process, and improves the position control precision of automatic turning of the semiconductor wafer;
2. in order to avoid the rotating interference of the clamping mechanism, the driving air pipe of the clamping mechanism needs to be hidden and extended into the base, a good extending channel can be provided by virtue of a hollow transmission shaft structure, and the diameter of the transmission shaft can be properly adjusted according to actual needs to adapt to air pipes with different outer diameters.
The invention has the advantages of strong compatibility, flexible control mode, convenient adjustment and wide application range of the industry, and can be applied to the IC industry and other semiconductor industries such as LED and the like.
Drawings
Fig. 1 is a schematic view of the general structure of the present invention;
FIG. 2 is a schematic view of the base structure of the present invention;
fig. 3 is a schematic structural view of the rotating mechanism of the present invention;
the device comprises a base 1, a bottom plate 101, a square body 102, a through hole 103, a clamping mechanism 2, a motor 3, a driving belt wheel 4, a belt 5, a driven belt wheel 6, a mounting plate 7, an L-shaped detection sheet 8, and a U-shaped photoelectric sensor 9.
Detailed Description
The following detailed description of the preferred embodiments of the present invention is provided in connection with the accompanying drawings.
As shown in fig. 1-3, the present invention provides an automatic turnover device for semiconductor wafers, which comprises a rotation mechanism disposed on a base 1 for driving a clamping mechanism 2 and a wafer to rotate between 0-180 degrees; the clamping mechanism 2 is connected with the rotating mechanism, adopts pneumatic drive and is used for clamping or releasing the wafer; and the limit detection mechanism is arranged beside the rotating mechanism and used for limiting and detecting the 0-degree position and the 180-degree position of the rotating mechanism. Therefore, the clamping mechanism and the wafer are driven to rotate between 0-180 degrees by the aid of the rotating mechanism, any rotating angle of the wafer can be accurately controlled, the wafer can be flexibly controlled, more operation requirements are met, meanwhile, the limiting monitoring mechanisms are arranged at the 0-degree position and the 180-degree position, so that specific positions can be monitored conveniently, basis is provided for other rotating angles, the wafer can be ensured to be accurately and smoothly detected, and operation efficiency and stability of process flow are improved.
The method comprises the following specific steps:
the base 1 comprises a bottom plate 101, a hollow square body 102 is arranged on the bottom plate 101, a rotating mechanism and a limiting detection mechanism are arranged inside the square body 102, a through hole 103 is formed in one side plate, the clamping mechanism 2 is arranged on the outer side of the square body 102 and is connected with the rotating mechanism through the through hole 103, a plurality of pneumatic interfaces, an electrical interface, a rotating speed adjusting knob and a pneumatic valve are arranged on the other side plate of the square body 102, and therefore the connection and the control of a circuit and a gas circuit of the rotating mechanism, the limiting detection mechanism and the clamping mechanism 2 are achieved through the connecting interfaces on the other side plate of the square body 102, the operation is more convenient, meanwhile, in order to adapt to the position adjustment of a wafer, a plurality of long-waist-shaped adjusting through holes can be formed in the bottom plate, and the position adjustment of the base is convenient.
In addition, the base 1 adopts a hollow square structure, and can provide more space for placing various cables, control circuit boards, air pipes adopting a pneumatically-driven clamping mechanism and the like.
The rotating mechanism comprises a motor 3, the motor 3 can adopt a servo motor, an output shaft of the motor is connected with a driving belt wheel 4, the driving belt wheel 4 is connected with a driven belt wheel 6 through a belt 5, a central hole of the driven belt wheel 6 is matched with a transmission shaft, one end part of the transmission shaft penetrates through a through hole 103 in a square body to be connected with the clamping mechanism 2, and the motor 3 is used for driving the driving belt wheel 4 to rotate, and the belt 5 drives the driven belt wheel 6 to rotate together with the transmission shaft, so that the clamping mechanism 2 is driven to rotate. The belt 5 can adopt a synchronous belt structure, the specific pitch setting is determined according to the precision of actual rotating speed control, and the synchronous belt drive with teeth can reduce the slippage and improve the control precision of the rotating mechanism.
In order to meet the installation requirement, the motor 3 can be installed on a side plate with a through hole 13, then the rotation control of the clamping mechanism is realized through the belt type transmission mechanism, meanwhile, in order to adjust the distance between the driving belt wheel 4 and the driven belt wheel 6 to change the tension degree of a belt, an installation plate is arranged at the installation position of the motor 3 and the side plate, the motor 3 is installed on the installation plate 7 firstly, the installation plate 7 is installed on the side plate, and the position adjustment requirement of the motor 3, namely the distance adjustment requirement between the driving belt wheel 4 and the driven belt wheel 6 can be met by arranging a plurality of long waist-shaped adjustment through holes on the installation plate 7.
In order to facilitate the arrangement of the driving structure of the pneumatic clamping mechanism 2, the transmission shaft can be set to be a hollow structure, the driving air pipe can conveniently extend into the base, the diameter of the transmission shaft can be comprehensively considered according to the rotating mechanism and the space required by the clamping mechanism, and the hollow motor has stronger adaptability and better practicability.
This spacing detection mechanism sets up beside driven pulley 6, including setting up the L shape on the driven pulley 6 and detecting piece 8, both synchronous rotations, 0 degree position and 180 degrees positions in driven pulley 6 both sides respectively set up a U-shaped photoelectric sensor 9, the sense terminal that can only require photoelectric sensor of course is the U-shaped structure, every U-shaped photoelectric sensor 9 all sets up the next door at driven pulley 6 through the mount pad, its U-shaped sense terminal and L shape detect the minor face cooperation of piece 8, this mount pad and L shape detect the long limit cooperation of piece 8. Like this, along with L shape detects piece 8 and follows driven pulley 6 and rotate together, when rotating 0 degree or 180 degrees, the L shape detects the U-shaped sense terminal that piece 8's minor face inserted U-shaped photoelectric sensor 9, the light path transmission between the photoelectric sensor has been obstructed, make sensor output detection signal, the control motor begins to brake, the long limit that L shape detected the piece simultaneously can support on the mount pad, the continuation rotation of having injectd L shape and detecting piece 8 is injectd driven pulley 6's rotation promptly, limiting displacement has been played.
Although specific embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these embodiments are merely illustrative and various changes or modifications may be made therein without departing from the principles and spirit of the invention, and therefore, the scope of the invention is defined by the appended claims.
Claims (7)
1. An automatic turnover device for a semiconductor wafer is characterized in that: comprises that
The rotating mechanism is arranged on the base and is used for driving the clamping mechanism and the wafer to rotate between 0 and 180 degrees;
the clamping mechanism is connected with the rotating mechanism, adopts pneumatic drive and is used for clamping or releasing the wafer;
and the limit detection mechanism is arranged beside the rotating mechanism and used for limiting and detecting the 0-degree position and the 180-degree position of the rotating mechanism.
2. The automatic flipping apparatus for semiconductor wafers of claim 1, wherein: the base comprises a bottom plate, a hollow square body is arranged on the bottom plate, a rotating mechanism and a limiting detection mechanism are arranged inside the square body, a through hole is formed in one side plate, the clamping mechanism is arranged on the outer side of the square body and connected with the rotating mechanism through the through hole, and a plurality of pneumatic interfaces, an electrical interface, a rotating speed adjusting knob and a pneumatic valve are arranged on the other side plate of the square body.
3. The automatic flipping apparatus for semiconductor wafers of claim 2, wherein: the rotating mechanism comprises a motor, an output shaft of the motor is connected with a driving belt wheel, the driving belt wheel is connected with a driven belt wheel through a belt, a center hole of the driven belt wheel is matched with a transmission shaft, one end of the transmission shaft penetrates through a through hole to be connected with the clamping mechanism, the motor is used for driving the driving belt wheel to rotate, and the driven belt wheel and the transmission shaft are driven to rotate through the belt so as to drive the clamping mechanism to rotate.
4. The automatic turn-over apparatus for semiconductor wafers as claimed in claim 3, wherein: the limiting detection mechanism is arranged beside the driven belt wheel and comprises an L-shaped detection sheet arranged on the driven belt wheel, the L-shaped detection sheet and the driven belt wheel synchronously rotate, a U-shaped photoelectric sensor is arranged at each of the 0-degree position and the 180-degree position of the two sides of the driven belt wheel, each U-shaped photoelectric sensor is arranged beside the driven belt wheel through a mounting seat, the U-shaped detection end of each U-shaped photoelectric sensor is matched with the short edge of the L-shaped detection sheet, and the mounting seat is matched with the long edge of the L-shaped detection sheet.
5. The automatic flipping apparatus for semiconductor wafer of claim 4, wherein: the mounting seat is arranged on one side plate of the square body, and a plurality of long waist-shaped adjusting through holes are formed in the connecting position of the mounting seat and the side plate.
6. The automatic flipping apparatus for semiconductor wafer of claim 3, wherein: the motor can be detachably arranged on one side plate of the square body through the mounting plate, and a plurality of long waist-shaped adjusting through holes are formed in the connecting position of the motor and the side plate.
7. The automatic flipping apparatus for semiconductor wafers of claim 2, wherein: the bottom plate is provided with a plurality of long waist-shaped adjusting through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222638171.XU CN218447865U (en) | 2022-10-09 | 2022-10-09 | Automatic turnover device for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222638171.XU CN218447865U (en) | 2022-10-09 | 2022-10-09 | Automatic turnover device for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218447865U true CN218447865U (en) | 2023-02-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222638171.XU Active CN218447865U (en) | 2022-10-09 | 2022-10-09 | Automatic turnover device for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218447865U (en) |
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2022
- 2022-10-09 CN CN202222638171.XU patent/CN218447865U/en active Active
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