JP2003258495A - Component mounting head for component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting head for so holding components as to mount them on a circuit forming body, and a manufacturing method thereof wherein while the number of component holding members installed by the component mounting head is increased, the number of the component holding members installed in the unit area of the component mounting head is so increased as to further improve the component mounting efficiency of the component mounting head. <P>SOLUTION: In each of first and second sub-heads provided in the component mounting head, there are provided a plurality of component holding members disposed in a rotatable way around the rotation center of each sub-head. Thereby, in each sub-head, each component holding member can so rotate around the rotation center of each sub-head as to be able to dispose each component holding member in an arbitrary position present on the circumference whereon each component holding member moves in a rotational way. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting head for holding a plurality of components and mounting them on a circuit-formed body. Regarding the component mounting head.

[0002]

2. Description of the Related Art Conventionally, various types of component mounting heads for this type of component mounting apparatus are known. For example,
FIG. 30 is a schematic perspective view schematically showing the structure of a component mounting head 900 provided with ten suction nozzles 901 that are one example of a component holding member capable of sucking and holding the electronic component 2 as one example of the component. .

As shown in FIG. 30, a component mounting head 90
The component supply unit 906 accommodating the electronic components 2 to be supplied to 0 is provided with a plurality of component supply positions 906a, and the respective component supply positions 906a are arranged at regular intervals. Further, the ten suction nozzles 901 included in the component mounting head 900 are arranged at intervals of an integral multiple of the above-mentioned fixed interval of the component supply position 906a.

When the electronic component 2 is sucked and held by the component mounting head 900 as described above, a plurality of component nozzles 901 among the ten suction nozzles 901 supply a plurality of components in the component supply unit 910. Position 91
It is possible to pick up electronic components 2 from 1 at the same time,
As a result, the time required for picking up and picking up the electronic component 2 by the component mounting head 900 can be shortened, and the mounting efficiency of electronic components in the component mounting apparatus including the component mounting head 900 can be improved. Has become.

[0005]

In recent years, in an electronic component assembly incorporating an electronic circuit formed by mounting electronic components more and more, cost reduction is desired due to demands of the market, etc., and production cost reduction. Therefore, further improvement of production efficiency is required.

However, in the structure described above, the mounting efficiency of electronic components in the component mounting apparatus including the component mounting head 900 is simply increased by simply increasing the number of suction nozzles 901 in the component mounting head 900. In the case of trying to reduce the number of suction nozzles 901, the number of suction nozzles 901 is increased, so that the time required for sucking and picking up the electronic component 2 can be shortened. The head 900 becomes larger, the moving speed of the component mounting head decreases, and the component mounting apparatus becomes larger.
However, there is a problem in that the adverse effect of the increase in the number of equipments is increased, and it is not possible to improve the mounting efficiency of electronic components in the component mounting apparatus.

Therefore, an object of the present invention is to solve the above problems, and in the component mounting head that holds components and mounts them on the circuit-formed body, increases the number of component holding members equipped by the component mounting heads. At the same time, it is an object of the present invention to provide a component mounting head and a component mounting method for increasing the number of component holding members to be mounted per unit area in the component mounting head and further improving the component mounting efficiency of the component mounting head.

[0008]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the component supplied to the first component supply position of the component supply positions in the component supply unit in which a plurality of component supply positions are arranged at a constant interval is held. A plurality of component holding members to be mounted on the circuit forming body so as to be rotatably movable on the circumference around the center of rotation of the sub head, and a second component of the component supply positions of the component supply unit. A second sub head in which a plurality of component holding members for holding the components supplied to the supply position and mounting them on the circuit forming body are rotatably arranged on the circumference around the rotation center of the sub head; The arrangement direction of the rotation centers and the arrangement direction of the component supply positions are substantially parallel to each other, and the distance between the respective rotation centers of the sub heads is an integer multiple of 2 or more of the constant distance.
And the diameter dimension of the circumference around each of the sub-head rotation center is the same dimension of an integral multiple of the constant interval,
In each of the first sub head and the second sub head, a selection mechanism capable of selecting one or a plurality of the component holding members from the plurality of component holding members, and the one selected by the selection mechanism. Or a lifting mechanism for lifting and lowering a plurality of the component holding members, and each of the selection mechanisms has a plurality of recesses formed on the circumference around the sub head rotation center, through which an upper portion of the component holding member can be inserted. And a selection disc rotatable about the sub-head rotation center, and the upper part thereof can be inserted into the recess of the selection disc by rotational movement of the plurality of component holding members or the selection disc around the sub-head rotation center. The one or more component holding members except the positioned component holding members are brought into a selected state, and each of the lifting mechanisms lowers the selected disc. Then, the upper part of the component holding member positioned so that it can be inserted into the recess is inserted into the recess, and the upper part of the one or more component holding members selected by the selection mechanism is selected. There is provided a component mounting head for a component mounting apparatus, characterized in that the one or more component holding members are lowered by pushing down on the lower surface of the disk.

According to a second aspect of the present invention, in the selection mechanism of each of the first sub-head and the second sub-head, the sub-head rotation of the plurality of component holding members and the plurality of recesses in the selection disk is performed. A relative position fixing mechanism that releasably fixes a relative position with respect to the rotation direction around the center, and a disk fixing mechanism that releasably fixes the selected disk with respect to the rotation direction, and by the disk fixing mechanism, While fixing the selection disc, the rotational movement of the plurality of component holding members is performed, and the relative positions of the plurality of component holding members and the plurality of recesses of the upper machine selection disc are moved to obtain the above-mentioned 1 There is provided a component mounting head for a component mounting apparatus according to the first aspect, in which a book or a plurality of component holding members are selected.

According to the third aspect of the present invention, in the elevating mechanism of each of the first sub head and the second sub head, the rotation center and the rotation center in the direction substantially orthogonal to the direction of the sub head rotation center are provided. The eccentric rotary motion of the eccentric shaft of the cam part, the cam part having an eccentric shaft for eccentric rotary motion, the rotary drive part for rotatively moving the cam part around the rotation center are described above. A component mounting head for a component mounting apparatus according to the first aspect or the second aspect, which comprises a cam follower portion that converts into a reciprocating motion in a direction of a sub head rotation center.

According to a fourth aspect of the present invention, the selection disk in the selection mechanism has its peripheral portion fixed to the cam follower portion in the direction of the center of rotation of the sub head, and the reciprocating movement of the cam follower portion causes the selection disk to move. There is provided a component mounting head for a component mounting apparatus according to the third aspect, which performs a lifting operation of a selected disc.

According to a fifth aspect of the present invention, in each of the first sub head and the second sub head, the rotational movement of the plurality of component holding members around the sub head rotation center by the rotary drive source, and the selection mechanism. Any one of the first to fourth aspects, further comprising a rotating mechanism for rotating the selective disk about the sub-head rotation center in FIG.
A component mounting head for the component mounting apparatus according to claim 1.

According to a sixth aspect of the present invention, in each of the selection mechanisms described above, the plurality of recesses in the selection disc are substantially circular or oval on a plane orthogonal to the direction of the center of rotation of the sub head. A component mounting head for a component mounting apparatus according to any one of the first to fifth aspects, which has a cross section.

According to a seventh aspect of the present invention, in each of the first sub-head and the second sub-head, the plurality of component holding members are arranged at positions symmetrical with respect to the rotation center of the sub-head. A component mounting head for a component mounting apparatus according to any one of the first to sixth aspects.

According to an eighth aspect of the present invention, in the selection mechanisms of the first sub-head and the second sub-head, the two component holding members which are arranged at the point-symmetrical positions are arranged at the same time. A component mounting head for a component mounting apparatus according to a seventh aspect, wherein the plurality of recesses are formed in the selective disc so as to be selectively selectable.

According to a ninth aspect of the present invention, in each of the selection mechanisms of the first sub-head and the second sub-head, all of the component holding members can be simultaneously selected, and the plurality of selection disks are provided. A component mounting head for a component mounting apparatus according to any one of the first to eighth aspects, in which a recess is formed.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows a perspective view of a head portion 101 as an example of a component mounting head for a component mounting apparatus according to an embodiment of the present invention.

As shown in FIG. 1, the head portion 101 includes a first sub head and a second sub head provided with a plurality of suction nozzles 1 as an example of a component holding member capable of sucking and holding an electronic component 2 as an example of a component. Three sub heads 3 as an example are provided. Further, each suction nozzle 1 provided in each sub-head 3 is rotatable about a sub-head rotation center R which is a rotation center of each sub-head 3. Further, each sub-head 3 is a nozzle rotating mechanism 10 that is an example of a rotating mechanism that rotationally moves each suction nozzle 3 included in the sub-head 3 around the sub-head rotation center R.
And a nozzle selection mechanism 40 that is an example of a selection mechanism that selects the suction nozzles 1 to be moved up and down from the suction nozzles 1 provided in each, and a lift that moves up and down only the suction nozzles 1 selected by the nozzle selection mechanism 40. A nozzle elevating mechanism 20 which is an example of a mechanism is separately provided. Further, each sub head 3 provided with the nozzle rotating mechanism 10, the nozzle selecting mechanism 40, and the nozzle elevating mechanism 20 is fixed to the head frame 5, whereby each sub head 3 is fixed.
Is integrally formed as the head portion 101.

Next, as an example of a component supply device including the head portion 101 having such a configuration, an electronic component supply device 1
A schematic perspective view of 02 is shown in FIG.

As shown in FIG. 2, the electronic component mounting apparatus 10
2 includes two head portions 101. Further, the electronic component mounting apparatus 102 includes an XY robot 8 that moves each head unit 101 in the X-axis direction or the Y-axis direction in the drawing, which is a direction along the machine base of the electronic component mounting apparatus 102, and the electronic component mounting apparatus 102. And a plurality of parts cassettes 6 as an example of a parts supply section that is provided on both ends of the machine base that face each other in the Y-axis direction in the drawing, and that stores a plurality of electronic parts 2 so as to be supplied, and an electronic parts mounting device. A stage 7 for releasably fixing a circuit board 4, which is an example of a circuit-formed body on which the electronic component 2 is mounted, is provided in the vicinity of the center of the machine base of 102. Here, the circuit-formed body means a resin substrate, paper-
Circuit board such as phenol board, ceramic board, glass epoxy (glass epoxy) board, circuit board such as film board, circuit board such as single layer board or multi-layer board, parts, housing, or frame. Means In FIG. 2, the X-axis direction and the Y-axis direction shown in the drawing are orthogonal to each other.

The XY robot 8 includes an electronic component mounting device 10
Of the opposite ends on the machine base in No. 2, one of the opposite ends where the parts cassette 6 is not provided, that is, both ends in the X-axis direction in the drawing, are formed in a rectangular columnar rigid body in a gate shape. Y-axis robot 8a and each Y-axis robot 8
Each X-axis robot 8b is supported by a beam-shaped both ends thereof, and each Y-axis robot 8a can move forward and backward individually in the Y-axis direction shown in the drawing. It is attached to each X-axis robot 8b so as to be movable back and forth in the X-axis direction shown in the figure.

Further, each parts cassette 6 can supply the electronic component 2 at a component supply position 6a, which is an example of the first component supply position and the second component supply position, and the component supply position 6a has a constant interval. With an array spacing P that is
The parts cassettes 6 are installed at the both ends of the machine base so as to be arranged in a line in parallel with the X-axis direction in the drawing.

Further, the electronic component mounting device 102 is provided with two image pickup devices 30 capable of recognizing the suction posture of the electronic component 2 by capturing an image of the electronic component 2 sucked and held by the suction nozzle 1. . The image pickup device 30 is arranged such that its image pickup direction is upward, and each parts cassette 6 and stage 7
XY is installed on the machine stand between
The sub head 3 including the suction nozzle 1 that suction-holds the electronic component 2 by the movement of the head unit 101 by the robot 8
Is moved so as to pass above the imaging device 30,
An image of the electronic component 2 is captured during this passage, and the suction posture of the electronic component 2 is recognized from the captured image.

The electronic component mounting apparatus 102 controls the head section 101, the XY robot 8, the image pickup apparatus 30, and the parts cassette 6 for controlling the respective operations.
Is equipped with. Further, the control unit 9 recognizes the suction posture of the electronic component 2 based on the image captured by the imaging device 30.

Next, the arrangement of the suction nozzles 1 in the head section 101 of the electronic component mounting apparatus 102 having such a configuration will be described.

FIG. 3 is a layout view showing a planar layout of the suction nozzles 1 in the head section 101. As shown in FIG. 3, the head portion 101 is provided with three sub heads 3 so that the respective sub head rotation centers R are in a line along the X-axis direction in the drawing, and each sub head 3 has six suction nozzles 1.
Is equipped with. In each sub head 3, the suction nozzle 1
Are arranged at equal intervals on the circumference around the sub head rotation center R, that is, six suction nozzles 1 are arranged symmetrically with respect to the sub head rotation center R in a plane. The diameter of the circumference where the suction nozzles 1 are arranged has the same dimension as the arrangement interval P as an example of an interval that is an integer multiple of the arrangement interval P in the parts cassette 6. Each sub-head 3 has an array interval of the axes of the sub-head rotation center R as an example of an interval that is an integer multiple of 2 or more of the array interval P in the parts cassette 6, and is an interval that is twice the array interval P. They are arranged in a line and substantially parallel to the arrangement direction of the parts cassettes 6, that is, substantially parallel to the X-axis direction in the drawing.

As a result, as shown in FIG. 3, on the line connecting the respective sub-head rotation centers R of the sub-heads 3, two suction nozzles 1 for each sub-head 3,
That is, it is possible to arrange a total of 6 suction nozzles 1 in the head portion 101 at the same time.
The array interval of each of the suction nozzles 1 of the book can be the array interval P.

Further, in the head section 101, all the suction nozzles 1 may be the same type of suction nozzles 1 or different types of suction nozzles 1 may be used for each sub head 3.
May be provided. Further, in each of the sub heads 3, the suction nozzles 1 arranged point-symmetrically with respect to the rotation center R of the sub head may be suction nozzles 1 of the same type.

Next, the structure of each sub head 3 included in the head portion 101 will be described in detail.

As shown in FIG. 1, a generally rectangular tube-shaped head frame 5 supports three sub-heads 3 so as to vertically pass therethrough. FIG. 4 is a vertical cross-sectional view of one of the three sub heads 3 supported by the head frame 5, and FIG. 25 is a partially enlarged view of FIG.

As shown in FIGS. 4 and 25, in the lower part of the sub head 3, each suction nozzle 1 is located at the lower end of each axial nozzle shaft 11, and the center of the suction nozzle 1 is aligned with the axis of the nozzle shaft 11. As described above, it is fixed in a detachable manner in a one-to-one manner. As a result, each suction nozzle 1 is integrated with the corresponding nozzle shaft 11, and the combination of the suction nozzle 1 and the nozzle shaft 11 is an example of a component holding member. Further, the nozzle shafts 11 are arranged in a plane according to the arrangement of the suction nozzles 1 described in FIG. 3, and by the substantially cylindrical nozzle holder 12 having the sub-head rotation center R of each suction nozzle 1 as its center, It is supported and attached.

In addition, the nozzle holder 12 is formed with an annular step portion 12b in the upper part of which the diameter of the substantially cylindrical shape is smaller than the other portions, and each nozzle shaft 11 has a nozzle holder 12b. The stepped portion 12b and the lower surface of 12 are penetrated and can be raised and lowered in the nozzle holder 12. The nozzle holder 12 is rotatably supported by a bearing 12a fixed inside the lower portion of the head frame 5 with the center of the nozzle holder 12 as the holder rotation center.

On the left side of the nozzle holder 12 in the drawing, six suction / mounting valves 51 are fixed to the outside of the head frame 5 in a row in the vertical direction, and each suction / mounting valve 51 has a head portion. The vacuum suction device 50 provided in 101 is connected by a pressure guiding tube. The suction / mounting valves 51 are in one-to-one correspondence with the suction nozzles 1, and a series of pressure guiding paths are individually formed from each suction / mounting valve 51 to the corresponding tip of the suction nozzle 1. ing. These pressure guiding passages are formed by penetrating laterally from the suction mounting valve 51 to the lower left portion of the head frame 5 in the drawing, and the pressure guiding passages in the inner portion of the head frame 5. A groove portion formed on the entire outer periphery of the nozzle holder 12 so as to match the through height position and a portion surrounded by the inner peripheral surface of the head frame 5, and a penetrating portion of the nozzle shaft 11 in the nozzle holder 12 from the groove portion. The pressure guiding pipe line is formed so as to penetrate from the outer peripheral surface of 12 to the inner peripheral surface of the penetrating portion of each nozzle shaft 11, and is formed in the axial center portion inside the nozzle shaft 11 so as to be continuous with this pressure guiding pipe line. It is composed of a pressure conduit. As a result, even when the nozzle holder 12 is positioned at an arbitrary position around the holder rotation center due to its rotational movement, the pressure guiding path is retained.

Further, the six suction / mounting valves 51 can be individually opened / closed by the control unit 9, and when the suction / mounting valves 51 are opened, the suction / mounting valves that have been opened are opened. Since the pressure guiding path from the valve 51 to the corresponding tip of the suction nozzle 1 and the pressure guiding tube from the suction mounting valve 51 to the vacuum suction device 50 are in communication with each other,
The electronic component 2 can be suction-held by the suction nozzle 1. Further, when the suction / attachment valve 51 is closed, the pressure guiding path from the closed suction / attachment valve 51 to the corresponding tip of the suction nozzle 1 and the suction / attachment valve 51 to the vacuum suction device. Since the pressure guide tubes up to 50 are blocked by the suction-attaching valve 51 that is closed, the suction holding of the electronic component 2 by the suction nozzle 1 can be released. Therefore, one of the six suction nozzles 1 included in the sub head 3 or a plurality of arbitrary suction nozzles 1 can individually perform the suction holding or the suction holding release of the electronic component 2.

On the outside of the upper surface of the head frame 5,
A rotation motor 15, which is an example of a drive unit in the nozzle rotation mechanism 10, is fixed with its drive shaft 15a facing downward, and the rotation motor 15 is the uppermost portion of the head unit 101. In addition, the drive shaft 1 of the rotation motor 15
A shaft-like spline shaft 13 is fixed to the lower end of the drive shaft 15a so as to rotate integrally with the drive shaft 5a.
The lower portion of the spline shaft 13 is fixed to the center of the upper portion of the nozzle holder 12, and the nozzle holder 1
The center of rotation of the holder 2 is the same as the center of the spline shaft 13 and the center of rotation of the drive shaft 15a of the rotation motor 15. As a result, in the nozzle rotation drive mechanism 10, the drive shaft 15a of the rotation motor 15 is driven to rotate normally and reversely, so that the spline shaft 13 is normally and reversely rotated and the spline shaft 13 is normally and reversely rotated. 12 is rotated in the normal and reverse directions about the holder rotation center, and the forward and reverse rotations around the sub head rotation center R of each suction nozzle 1 supported by the nozzle holder 12 are possible. It should be noted that instead of the case where the drive unit in the nozzle rotation mechanism 10 is the rotation motor 15 provided for each sub head 3, the head unit 101 is provided with one rotation motor, and each of the sub heads 3 is provided by the one rotation motor. Alternatively, the rotation of the spline shaft 13 may be transmitted.

Next, the nozzle selection mechanism 40 for selecting the suction nozzle 1 to be lifted and lowered by the nozzle lifting mechanism 20 from the suction nozzles 1 of the sub head 3 will be described.

The nozzle selection mechanism 40 is the nozzle rotation mechanism 1
In the vicinity of the center of the spline shaft 13 at 0, a spline nut 42 having a substantially T-shaped longitudinal section is integrally formed by combining a substantially cylindrical lower portion and a substantially disc-shaped upper portion. Spline shaft 1
The center of the spline shaft 13 is mounted on the center of rotation of the spline shaft 13 so as to be able to move up and down along the outer periphery of the spline shaft 3.

Further, a select disc portion 41, which is an example of a select disc integrally formed by combining a substantially cylindrical upper portion and a substantially disc-shaped lower portion, allows the entire spline nut 42 to be housed in the spline nut 42. The center of the spline shaft 13 is installed on the center of rotation of the spline shaft 13 so as to be vertically movable along the center of rotation of the shaft 13.

Further, the select disc portion 41 is rotatably mounted on the inner surface of the substantially cylindrical portion thereof to the bearing 46 attached to the outer periphery of the substantially cylindrical portion of the spline nut 42. As a result, the select disk portion 41 is rotatable about the sub head rotation center R, and the spline nut 42 is
It is possible to rotate around the outer circumference of the.

Further, the select disc portion 41 has a sub-head rotation center R at the upper end of its substantially cylindrical portion.
It is provided with a protruding portion 41c which is annularly projected in the direction. Further, the upper peripheral surface portion of the substantially disc-shaped portion of the spline nut 42 can come into contact with the lower portion of the protruding portion 41c of the select disc portion 41.

A spring portion 45, which is an example of an elastic body, has its lower end fixed to the upper portion of the bearing portion 46, and its upper end fixed to the lower surface of the substantially disk-shaped portion of the spline nut 42. As a result, the entire spline nut 42 is supported by the spring portion 45 inside the select disc portion 41, and the spline nut 42 and the upper peripheral surface portion in the substantially disc-shaped portions of the spline nut 42 that can come into contact with each other. The lower portion of the protruding portion 41c of the select disk portion 41 is biased by the spring portion 45 and is always in contact with the lower portion.

Further, in the portions which are in contact with each other, the protruding portion 41c of the select disc portion 41 is provided.
Downwardly formed convex positioning pins 43 are formed, and a plurality of pin receiving portions 42a capable of fitting with the positioning pins 43 are provided at the end of the upper peripheral surface portion of the spline nut 42. In the abutting state, the positioning pin 43 is fitted into the pin receiving portion 42a, so that the select disc portion 41 and the spline nut 42 are fixed to each other in the rotation direction around the sub head rotation center R. To be done. The positioning pin 43 and the pin receiving portion 42a are an example of a relative position fixing mechanism. Further, a total of 18 pin receiving portions 42a are formed on the upper peripheral surface portion of the spline nut 42 at regular intervals on the same circumference, for example, at an angular pitch of 20 degrees over the entire circumference. The respective pin receiving portions 42a can be fitted to the positioning pins 43 of the select disc portion 41.

Further, in the select disc portion 41, a plurality of punched hole portions 41b, which is an example of a recess into which the upper portion of the nozzle shaft 11 can be inserted, are formed on the lower surface of the substantially disc-shaped portion. Here, with reference to FIG. 5 which is a cross-sectional view taken along the line AA in FIG. 4, the arrangement of the punched hole portions 41b in the select disk portion 41 will be described below.

As shown in FIG. 5, the punched hole portion 41b has two kinds of punched hole portions 41b having a substantially circular cross section and a substantially oval cross section in a direction along a plane orthogonal to the sub head rotation center R. , Is arranged on the same circumference as the circumference on which the nozzle shaft 11 around the sub head rotation center R is arranged. Further, as shown in FIG. 5, the hole 41b having the above-mentioned substantially circular cross section is provided at a position of 50 degrees around the sub head rotation center R on the circumference of 0 degrees, 12 degrees.
The punched holes 41b having the above-mentioned oval hole-shaped cross section are arranged at positions of 0 degree, 180 degrees, and 300 degrees. In FIG. 5, the upper end of the circumference of the circle is the origin position, and the angular coordinates are counterclockwise with respect to the sub-head rotation center R. Further, the above arrangement of the punched holes 41b on the circumference is an example, and is not limited to the above arrangement.

Due to the relative positional relationship between the arrangement of the punch hole portion 41b in the select disk portion 41 and the arrangement of the nozzle shaft 11 on the circumference around the sub head rotation center R, the position is set at a position where it can be inserted into the punch hole portion 41b. The one or more nozzle shafts 11 other than the selected nozzle shaft 11 are brought into the selected state. Although the lifting operation of the select disk part 41 will be described later, when the select disk part 41 is lowered in this arrangement state, the upper part of the nozzle shaft 11 in the selected state is moved to the lower surface of the select disk part 41. It is possible to lower the suction nozzle 1 by pressing the nozzle shaft 11 while contacting the suction nozzle 1. On the other hand, the nozzle shaft 11 that is not in the selected state (that is, the nozzle shaft 11 that is located at a position where it can be inserted into the hole 41) is the select disk portion 4
When 1 is lowered, the nozzle shaft 11 is not pushed down by the lower surface of the select disc part 41 because it is inserted into the hole 41b in the select disc part 41. The details of the selection pattern of the suction nozzles 1 based on the shape of the punched holes 41b and the relative positional relationship between the arrangement of the punched holes 41 and the placement of the suction nozzles 1 will be described later.

Further, as shown in FIGS. 4 and 25, in the sub head 3, a notch mechanism 48 which is an example of a disc fixing mechanism for releasably fixing the select disc portion 41 to the head frame 5 in the rotation direction thereof. Is provided. The notch mechanism 48 has a notch-shaped notch portion 41a formed on the outer peripheral portion of the upper end of the substantially cylindrical portion of the select disc portion 41, and a shape corresponding to the notch shape of the notch portion 41a. 41a, and a notch fixing portion 47 attached to the head frame 5 and provided at the tip end thereof.

The notch fixing portion 47 is formed of a plate-shaped member so as to have an L-shaped flat surface, and is attached to the upper left outer side of the head frame 5 in the drawing with the thickness direction thereof being the horizontal direction.

Further, the notch fixing portion 47 is arranged such that the L-shaped plane faces sideways and one of the tip portions thereof is located inside the head frame 5, and the vicinity of its center is a supporting position. Is supported by the head frame 5. The notch fixing portion 47 is movable with the supporting position as a fulcrum, and the notch fixing portion is provided by a spring portion 47b attached to the head frame 5 near the other end portion located outside the head frame 5. 47 is always urged in the clockwise direction in the figure with respect to the fulcrum.
As a result, the notch fixing portion 47 is constantly urged downward in the drawing inside the head frame 5 and the notch fixing portion 4 is pressed.
A part of the lower side of 7 is always in contact with the head frame 5.

As a result, when an upward force is applied to the biting portion 47a located inside the head frame 5, the notch fixing portion 47 is located above the abutting position inside the head frame 5. Then, the other end of the notch fixing portion 47 is moved rightward in the drawing on the outer side of the head frame 5 to contract the spring portion 47b. In addition, when the upward force is released,
The urging force of the spring portion 47b returns the notch fixing portion 47 to the contact state.

Also, the select disc portion 41 is raised,
In addition, when the notch portion 41a of the select disk portion 41 is located at a position where it can be bitten into the biting portion 47a of the notch fixing portion 47, the biting portion 47a of the notch fixing portion 47 is located at the upper end of the select disk portion 41. Without touching, it bites into the notch portion 41a, and the select disc portion 41 is fixed to the head frame 5 in the rotation direction thereof. On the other hand, even when the select disk portion 41 is raised, the notch portion 4 in the select disk portion 41
When 1a is not located at a position where it can be bitten into the biting part 47a of the notch fixing part 47, the biting part 47a of the notch fixing part 47 abuts against the upper end of the select disc part 41 and is pushed up. , The biting portion 47a is the notch portion 4
It does not bite into 1a. In this situation,
If the notch portion 41a is located at a position where it can be bitten by the biting portion 47a by rotating the select disk portion 41, the biting portion 47a can be bitten by the notch portion 41a.

On the upper side of the spline nut 42, the spline shaft 1 has a substantially columnar shape.
A backing block 44 fixed to the upper end of 3 is provided. Further, the pad block 44 includes a pad portion 44a having an annular cross section at a lower portion thereof. When the select disc portion 41 and the spline nut 42 are lifted along the spline shaft 13, the contact portion 44
The a can contact the upper surface of the disk-shaped portion of the spline nut 42 without contacting the select disk portion 41 inside the protruding portion 41c of the select disk portion 41.

First, in the select disk portion 41, the select disk portion 41 is rotated around the sub head rotation center R so that the notch portion 41a is located at a position where it can be engaged with the engaging portion 47a of the notch fixing portion 47. afterwards,
When the select disc portion 41 is raised along the spline shaft 13, the spline nut 42 including the pin receiving portion 42a fitted to the positioning pin 43 of the select disc portion 41 is raised together with the select disc portion 41, The upper surface of the spline nut 42 is brought into contact with the contact portion 44 a of the contact block 44. After this contact, the select disc portion 41 and the spline nut 4 are further
2 is lifted, the spring portion 45 that urges the spline nut 42 upward is contracted, and the positioning pin 43 that fixes the spline nut 42 and the select disk portion 41 in the rotation direction. The fitting between the pin receiving portion 42a and the pin receiving portion 42a is released.

At the same time, the notch portion 41a of the select disc portion 41 in a state where it is preliminarily positioned so that it can be engaged.
The engaging portion 47a of the notch fixing portion 47 engages with the notch fixing portion 47, and only the select disk portion 41 is fixed to the head frame 5 in the rotation direction around the sub head rotation center R. Here, a vertical sectional view of the sub head 3 in such a state is shown in FIG. 4 shows the positioning pin 4
3 shows the sub head 3 in a state where the fitting between the pin 3 and the pin receiving portion 42a is held.

As shown in FIG. 6, by rotating the spline shaft 13 by the rotating motor 15 of the nozzle rotating mechanism 10 in this state, the spline nut 42 can be rotated inside the select disc portion 41, and the spline nut 42 can be rotated. Nut 42 and select disc part 41
Relative rotation movement, that is, the relative rotation movement of the arrangement of the extraction hole portion 41 and the arrangement of the suction nozzle 1 in the select disk portion 41 can be performed.

After the above relative rotational movement,
The select disc portion 41 is moved down along the spline shaft 13, and the spline nut 42 is attached to the select disc portion 4.
By lowering it together with 1, as shown in FIG.
The above-mentioned biting of the biting part 47a into the notch part 41a is released, and the positioning pin 43 of the select disk part 41 is fitted to another pin receiving part 42a of the spline nut 42, so that the relative rotational movement is performed. The select disc portion 41 and the spline nut 42 can be fixed to each other in the rotation direction.

The notch mechanism 48 is provided with a photo sensor or the like capable of monitoring the above-mentioned biting state, and the notch mechanism 48 is used by the photo sensor to select the disc portion 41.
It is also possible to monitor whether or not is fixed with respect to the rotation direction and output the monitoring state to the control unit 9. In such a case, the notch mechanism 4
It is possible to prevent the occurrence of an operation error due to the improper fixing due to 8.

Further, the nozzle shaft 11 has a ring-shaped protrusion-shaped spring receiving portion 11a formed on the peripheral portion of the upper portion thereof.
A biasing spring 1 that is an example of an elastic body that is attached to the lower part of the nozzle holder 12 and the step portion 12b of the nozzle holder 12 and is wound around the outside of each nozzle shaft 11.
The nozzle shaft 11 is supported by the stepped portion 12b of the nozzle holder 12 via 6, and each nozzle shaft 11 is always urged upward by each urging spring 16.
In addition, a stepped portion 11b having a larger shaft diameter than the other portions is formed in the lower portion of each nozzle shaft 11, whereby the nozzle shaft urged upward by the urging spring 16 is formed. 11, the upper surface of the stepped portion 11b is always in contact with the lower surface of the nozzle holder 12, and the upper end position of the lifting operation of the nozzle shaft 11 is limited at the contact position.

Next, the nozzle elevating mechanism 20 for elevating the select disk portion 41 to elevate the nozzle shaft 11 and the suction nozzle 1 will be described.

The nozzle raising / lowering mechanism 20 is a mechanism for converting the forward / reverse rotational movement of the raising / lowering motor 21, which is an example of a rotation driving unit, into the raising / lowering movement of the spline nut 14 and transmitting the same.
As shown in FIG. 4, the lifting motor 21 has a drive shaft 2
The drive shaft 21a is fixed to the outside of the lower right side surface of the head frame 5 in the drawing so that the rotation center of the la 1 is substantially orthogonal to the rotation center R of the sub head.

Further, in FIG. 4, the eccentric cam 2 which is an example of a cam portion which is rotatable in the forward and reverse directions with respect to the drive shaft 21a of the lifting / lowering motor 21 about the rotation axis of the drive shaft 21a.
2 is attached, and the eccentric cam 22 is rotatably supported by the bearing 22b attached inside the head frame 5 at the outer peripheral portion thereof. The eccentric cam 22 is provided with an eccentric shaft 22a centered on an axis eccentric in parallel with the axis of rotation thereof on the left side surface of the eccentric cam 22 in the drawing. As a result, the drive shaft 21a of the lifting / lowering motor 21 is driven to rotate in the forward and reverse directions, whereby the eccentric cam 22 is rotated in the forward and reverse directions about the center of rotation, and the eccentric shaft 2 is rotated.
2a is normally and reversely rotated while being eccentric around the rotation center of the eccentric cam 22.

Further, in FIG. 4, the eccentric shaft 22a of the eccentric cam 22 is provided with a sub head at a lower portion of a lifting cam follower 24, which is an example of a cam follower portion for converting forward / reverse rotational motion of the eccentric cam 22 into a lifting motion. 3 is fitted in the long hole portion 24a formed in a long hole shape in the arrangement direction. A bearing 22c is attached to the outer periphery of the eccentric shaft 22a of the eccentric cam 22, and the elongated hole portion 24a has an eccentric shaft 22a in the vertical direction.
The bearing 22c has the same size as the diameter of the bearing 22c, and in the lateral direction, the bearing 22 in the eccentric rotational movement of the eccentric shaft 22a.
The size is slightly larger than the size between the left end position and the right end position of c. In addition, the lifting cam follower 24
Is an LM rail part 2 whose rod-shaped upper part is vertically movable
The LM block 23 is formed as 4c and is provided with an LM guide portion 23a in the shape of a groove that matches the LM rail portion 24c, and is fixed to the right inner surface of the head frame in the figure. As a result, the LM rail portion 24c can be smoothly moved up and down within the groove-shaped LM guide portion 23a of the LM block 23.

Here, FIG. 8B is a view showing these relationships from another side as a view taken along the line BB in FIG.
8A is a sectional view taken along the line CC in FIG. 8B.
Shown in. As shown in FIGS. 8A and 8B, the eccentric shaft 22a is normally and reversely rotated about the rotation center of the drive shaft 21a by the eccentric cam 22 which is normally and reversely rotated by the lifting motor 21. Long hole 24a in the cam follower 24 for raising and lowering
By the LM rail portion 24c, the horizontal movement in the figure in the rotational movement of the eccentric shaft 22a is not transmitted, but only the vertical movement in the figure is transmitted to the lifting cam follower 24. In the ascending / descending cam follower 24 to which only the vertical movement is transmitted, the LM block 2
The LM rail portion 2 along the LM guide portion 23a in FIG.
4c is moved up and down, and the lifting cam follower 24 can be moved up and down.

The eccentric shaft 22a of the eccentric cam 22
Is located at the lower end of the forward / reverse rotational movement, the ascending / descending cam follower 24 is located at the lower end position of the ascending / descending movement, and when the eccentric shaft 22a is located at the upper end of the rotating movement, the ascending / descending cam follower 24 is It is located at the upper end position of the lifting operation. Therefore, the dimension between the upper end position and the lower end position in the eccentric rotational movement of the bearing 22c of the eccentric shaft 22a of the eccentric cam 22 is the amount by which the ascending / descending cam follower 24 can move up and down.

As shown in FIG. 4, the ascending / descending cam follower 24 sandwiches a part of the peripheral end portion of the substantially disc-shaped portion of the select disc portion 41 from the upper and lower surfaces in the vicinity of the vertical center thereof. Is provided with a nut drive portion 24b that is fixed only in the vertical direction. A bearing 24d is attached to the nut drive portion 24b at a contact portion at the peripheral end portion of the select disk portion 41, whereby the nut drive portion 24b causes the lifting cam follower 2 to move.
4 can be transmitted to the raising / lowering movement of the select disc portion 41, and the rotating movement of the select disc portion 41 is not restricted by the nut drive portion 24b.

Further, the raising / lowering operation of the select disc portion 41 by the raising / lowering cam follower 24 is performed at a position where the engaging portion 47a of the notch fixing portion 47 can be engaged with the notch portion 41a of the select disc portion 41 and the upper surface of the nozzle holder 12. It is done with the neighborhood. Even when the nozzle elevating mechanism 20 positions the elevating cam follower 24 at the lower end of the descending operation, the descending operation is restricted so that the lower end of the select disc portion 41 does not contact the upper end of the nozzle holder 12. .

Six suction nozzles 1 provided in the sub head 3
In the case of performing the raising / lowering operation of one or a plurality of the suction nozzles 1 among them, first, the one or a plurality of suction nozzles 1 to be raised / lowered in the sub head 3 are selected, and then selected by the nozzle selection mechanism 40. The nozzle shaft corresponding to the suction nozzles 1 other than the suction nozzles 1 is located at a position where the upper portion of the nozzle shaft 11 can be inserted into the punching hole 41b of the select disk portion 41 and corresponds to the selected suction nozzle 1. The upper part of 11 is the punch hole 4 of the select disc part 41.
1b, the relative rotation movement of the select disk portion 41 and the spline nut 42 is performed (as described above) so that the positions of the upper portion of each nozzle shaft 11 and the hole portion 41b are not changed. Make a match.

After that, the drive shaft 21a of the ascending / descending motor 21 in the nozzle ascending / descending mechanism 20 is rotationally driven in the forward and reverse directions, and the rotational movement in the forward and reverse directions is performed via the eccentric cam 22.
The lifting / lowering cam follower 24 is converted into the lifting / lowering operation, and the nut drive portion 24b of the lifting / lowering cam follower 24 lowers the select disk portion 41.

As shown in the vertical sectional view of the sub head 3 in FIG. 7, the lowering operation of the select disc portion 41 causes the nozzle shaft 11 corresponding to the selected suction nozzle 1 to have its upper portion on the lower surface of the select disc portion 41. Is pushed down and lowered, and the selected suction nozzle 1 is lowered. On the other hand, since the upper portion of the nozzle shaft 11 corresponding to the suction nozzles 1 other than the selected suction nozzle 1 is inserted into the punch hole portion 41b of the select disc portion 41, it is pushed down by the select disc portion 41. Not descended. The lowering operation of the nozzle shaft 11 by the nozzle elevating mechanism 20 is performed by a force that overcomes the urging force of the urging spring 16 that constantly urges the nozzle shaft 11 upward. It does not affect the operation. After that, the lifting cam follower 24
When the select disk portion 41 is moved up by the nut driving portion 24b, the lowered nozzle shaft 11 is moved up, and the selected suction nozzle 1 is moved up. In FIG. 7, the suction nozzle 1 on the left side in the drawing is the suction nozzle 1 selected above, and the suction nozzle 1 on the right side in the drawing is the suction nozzle 1 not selected above.

Further, since the lifting operation of the selected suction nozzle 1 is performed by the lifting operation of the select disk portion 41 by the lifting cam follower 24, when the lifting cam follower 24 is located at the upper end position of the lifting operation, That is, the bearing 22c of the eccentric shaft 22a in the eccentric cam 22.
Is positioned at the upper end of the eccentric rotation operation, the suction nozzle 1 is positioned at the upper end position of the lifting operation, and when the lifting cam follower 24 is positioned at the lower end position of the lifting operation, that is, When the bearing 22c of the eccentric shaft 22a of the eccentric cam 22 is positioned at the lower end of the eccentric rotation operation, the suction nozzle 1 is positioned at the lower end position of the lifting operation. Therefore, the above-mentioned vertical movement amount of the vertical movement cam follower 24 is the vertical movement amount of the selected suction nozzle 1. Further, since the eccentric cam 22 is normally and reversely rotated by the elevating and lowering motor 21, the elevating and lowering position of the selected suction nozzle 1 is determined by the forward and reverse rotation driving of the elevating and lowering motor 21. It should be noted that the above-described operations such as driving the rotation motor of the nozzle rotation mechanism 10 in the sub head 3, selection operation of the nozzle selection mechanism 40, suction operation of each suction nozzle 1 and driving of the lifting motor 21 of the nozzle lifting mechanism 20 are performed. All are controlled by the control unit 9.

Next, the sucking and taking-out operation of the electronic component 2 from the parts cassette 6 by the suction nozzle 1 in each sub-head 3 of the head section 101 and the mounting operation of the electronic component 2 to the circuit board 4 fixed on the stage 7. Will be described.

First, when the electronic component 2 is picked up and picked up by the suction nozzle 1, the XY robot 8 in FIG.
Thus, the head unit 101 is moved in the X-axis direction or the Y-axis direction in the drawing, and the head unit 101 is moved above the parts cassette 6. Here, in the cross-sectional view of the sub head 3 in the head portion 101 shown in FIG. 9, the suction nozzle 1 on the right side in the drawing is the suction nozzle 1R, the suction nozzle 1 on the left side in the drawing is the suction nozzle 1L, and the suction nozzles 1 included in the sub head 3 are The operation of the suction nozzles 1R and 1L will be described as a representative. The suction nozzles 1 provided in the sub heads 3 may be of the same type,
In addition, it may be a case where the types are all different. Figure 9
Also, in FIG. 10, the suction nozzles 1R and 1L are of different types.

As shown in FIG. 9, the moving operation of the head portion 101 by the XY robot 8 aligns the suction nozzle 1L of the sub head 3 with the component supply position 6a of the parts cassette 6 from which the electronic component 2 is picked up and taken out. Then, the suction nozzle 1L is moved above the component supply position 6a. After that, in the nozzle selection mechanism 40, the upper portion of the nozzle shaft 11 corresponding to the suction nozzle 1R can be inserted into the hole 41b of the select disc portion 41, and the upper portion of the nozzle shaft 11 corresponding to the suction nozzle 1L is located at the select disc portion 41. The positioning of the select disc portion 41 and the punch hole portion 41b at a position where the select disc portion 41 and the spline nut 42 are not inserted into the punch hole portion 41b is performed by the relative rotational movement of the select disc portion 41 and the spline nut 42 as described above. Will be done at. After this alignment, the nozzle lifting mechanism 20
The select disk 41 is lowered by the suction nozzle 1
The upper portion of the nozzle shaft 11 corresponding to L is pushed down by the lower surface of the select disc portion 41, and the suction nozzle 1L is lowered. On the other hand, the upper portion of the nozzle shaft 11 corresponding to the suction nozzle 1R is inserted into the hole 41b of the select disc portion 41, so that it is not pushed down by the lower surface of the select disc portion 41 and the suction nozzle 1R is not lowered.

Here, the stop position after the suction nozzle 1L is lowered must be a position where the lower end of the suction nozzle 1L abuts the upper surface of the electronic component 2 at the component supply position 6a of the parts cassette 6, but the parts cassette The component thickness data of the electronic component 2 housed in 6 is input in the control unit 9 in advance, and the control unit 9 determines the amount of lowering of the suction nozzle 1L based on this component thickness data, and this lowering is performed. The raising / lowering motor 21 of the nozzle raising / lowering mechanism 20 is rotationally driven by an amount corresponding to the amount, and the suction nozzle 1L can be lowered by the lowering amount. As a result, the lower tip of the suction nozzle 1L is brought into contact with the upper surface of the electronic component 2 at the component supply position 6a, and the upper surface of the electronic component 2 is suction-held at the tip of the suction nozzle 1L. Thereafter, the nozzle elevating mechanism 20 raises the suction nozzle 1L while suction-holding the electronic component 2.

After that, the suction nozzle 1R is changed to the suction nozzle 1R.
In the case where the electronic component 2 is sucked and taken out from the same parts cassette 6 as L, the nozzle rotating mechanism 10 of the sub-head 3 causes each of the suction nozzles 1L to pick up the electronic component 2 at the position of the head portion 101. 1 suction nozzle 1
By rotating the suction nozzle 1R by 80 degrees, the suction nozzle 1R is moved above the component supply position 6a. After that, as in the suction nozzle 1L and the suction extraction operation, the nozzle selection mechanism 4
The relative rotation movement of the select disk portion 41 and the spline nut 42 by 0 and the lowering operation of the select disk portion 41 by the nozzle elevating mechanism 20 are performed, and the suction suction of the electronic component 2 is performed by the suction nozzle 1R. The suction nozzle 1R
However, in the case where the electronic component 2 is sucked and taken out from the parts cassette 6 different from the suction nozzle 1L, instead of the rotational movement of each suction nozzle 1 by the nozzle rotation mechanism 10,
The head portion 101 may be moved in the X-axis direction or the Y-axis direction by the XY robot 8 so that the suction nozzle 1R is located above the component supply position 6a of the another parts cassette 6. Further, the nozzle rotating mechanism 1 is moved by the XY robot 8 together with the movement of the head portion 101.
It is also possible to perform the rotational movement of each suction nozzle 1 by 0.

As a result, the electronic component 2 is sucked and held by the suction nozzles 1L and 1R in the sub head 3. After that, in FIG. 2, the X-axis of the head unit 101 shown in FIG. Direction or Y-axis movement is started, and the nozzle selection mechanism 40
In the above, the select disc portion 41 and the spline nut 42 are arranged so that the upper portions of the respective nozzle shafts 11 corresponding to the suction nozzles 1L and 1R are positioned so as not to be inserted into the cutout hole portion 41b of the select disc portion 41. The nozzle shafts 11 are moved relative to each other, and
The upper part of the and the hole 41b are aligned with each other. After this alignment, the select disc portion 41 is lowered by the nozzle elevating mechanism 20 and both the suction nozzles 1L and 1R are lowered. At this time, the control unit 9 causes the lifting motor 2 to move.
By controlling the rotation driving amount of the suction nozzle 1
The lowering amounts of L and 1R are controlled so that the image of the electronic component 2 sucked and held by the suction nozzles 1L and 1R can be picked up by the image pickup device 30, that is, each of the electronic components is the focus of the image pickup device 30. It is located within the height range. After that, when the sub head 3 passes above the imaging device 30, an image of the electronic component 2 suction-held by the suction nozzles 1L and 1R is captured, and the control unit 9
The suction posture of each electronic component 2 is recognized based on the captured image. The head unit 101 is moved above the circuit board 4 after passing above the imaging device 30.

Next, as shown in FIG. 10, the suction nozzle 1L in the sub head 3 is moved to the electronic component 2 in the circuit board 4 by the movement of the head portion 101 by the XY robot 8.
The upper portion of the nozzle shaft 11 corresponding to the suction nozzle 1L in the nozzle selection mechanism 40 is aligned with the upper side of the mounting portion of the selection disc portion 41.
At the position where it is not inserted into the upper part of the nozzle shaft 11 corresponding to the suction nozzle 1R.
So that it can be inserted into the hole 41b of the
The select disc portion 41 and the spline nut 42 are rotated relative to each other, and the extraction hole portion 41 of the select disc portion 41 is moved.
The b is aligned with the upper portion of the nozzle shaft 11.
After this alignment, the nozzle elevating mechanism 20 lowers the suction nozzle 1L. At this time, the control unit 9 controls the rotational drive amount of the lifting motor 21,
The descending amount of the suction nozzle 1L is controlled, and the suction nozzle 1L is controlled.
The electronic component 2 sucked and held by is pressed by the mounting part of the electronic component 2 on the circuit board 4, the electronic component 2 is mounted on the circuit board 4, and the electronic component 2 is sucked onto the electronic component 2 by the suction nozzle 1. The hold is released. Thereafter, the nozzle elevating mechanism 20 raises the suction nozzle 1L.

As for the suction nozzle 1R, the movement of the head portion 101 by the XY robot 8 or the sub head 3 is performed.
In the same manner as the mounting operation of the electronic component 2 by the suction nozzle 1L, the mounting operation of the electronic component 2 on the circuit board 4 is performed by the rotational movement of each suction nozzle 1 by the nozzle rotating mechanism 10 in FIG. .

In addition, above the circuit board 4, when the suction nozzle 1L in a state where the electronic component 2 is suction-held is moved in the X-axis direction or the Y-axis direction, or each suction nozzle 1 is rotationally moved, Instead of raising the suction nozzle 1L to a height position where the upper surface of the stepped portion 11b in the lower part of the shaft 11 abuts the lower surface of the nozzle holder 12, the lower end of the electronic component 2 sucked and held by the suction nozzle 1L is The suction nozzle 1L is moved to a height position where it does not interfere with the upper end of the electronic component 2 having the largest component thickness of the electronic components 2 mounted on the circuit board 4. As a result, the amount of lowering of the suction nozzle 1L can be reduced during the next mounting operation of the electronic component 2 by the suction nozzle 1L, and the lowering operation time of the suction nozzle 1L can be shortened. The control of the height position of the suction nozzle 1L that does not interfere with the electronic component 2 is performed by the control unit 9 controlling the rotational drive amount of the lifting motor 21.

Next, a method for sucking and picking up the electronic component 2 from the parts cassette 6 by the three sub heads 3 included in the head unit 101 will be described below as an example.

Each sub head 3 of the head section 101 is shown in FIG.
The suction nozzles 1 are provided in the arrangement as shown in FIG. 11 and 12 are schematic explanatory views schematically showing the planar arrangement relationship between the arrangement of the suction nozzles 1 in the head portion 101 and the plurality of parts cassettes 6 included in the electronic component mounting apparatus 102. is there. In FIG. 11 and FIG. 12, the sub heads 3 included in the head unit 101 are arranged in order from the left side in the drawing of a first sub head 3-A and a second sub head 3-.
B and the third sub head 3-C. Further, the six suction nozzles 1 included in the first sub head 3-A are suction nozzles 1-A1, 1-A2, ..., 1-A6 in a clockwise order from the suction nozzle 1 located at the left end in the drawing. Similarly, for the second sub head 3-B, the suction nozzle 1-
B1, 1-B2, ..., 1-B6, and the third
Similarly, for the sub head 3-C, the suction nozzle 1-C
, 1-C2, ..., 1-C6. In addition, FIG.
As shown in (A), the parts cassettes 6 are arranged in order from the left side of the drawing in the order of the parts cassettes 6-1, 6-2 ,.
6-6, and the parts cassette 6-1 is the parts supply position 6a.
-1, and the parts cassette 6-2 has a parts supply position 6a-2.
..., the parts cassette 6-6 is a parts supply position 6a
-6 is provided. 11 (B) and (C) and FIGS. 12 (D) and (E), only the parts cassette 6 in which the electronic component 2 is picked up and picked up by the suction nozzle 1 among the respective parts cassettes 6 is shown. ing.

In the description of the member in which the constituent part of the electronic component mounting apparatus 102 is composed of a plurality of members, when the individual members of the plurality of members are specified, the reference numerals of the members are used. For example, the members X-1, X-2,
X-A1 and X-C6 are used, and the members X are used when the individual members of the plurality of members are not specified. Here, X is a number used as a code of the member.

First, FIG. 11A shows a case where the suction pick-up of the electronic component 2 is performed simultaneously by the six suction nozzles 1 of the suction nozzles 1 included in the head portion 101.
As shown in FIG. 11A, the suction nozzle 1-A1 is provided above the component supply position 6a-1 of the parts cassette 6-1 and the suction nozzle 1 is provided above the component supply position 6a-3 of the parts cassette 6-3. -If the suction nozzle 1-C1 is positioned above the component supply position 6a-5 of the parts cassette 6-5, the suction nozzle 1-A4 above the component supply position 6a-2 of the parts cassette 6-2, The suction nozzle 1-B4 is located above the parts supply position 6a-4 of the parts cassette 6-4, and the suction nozzle 1-C4 is located above the parts supply position 6a-6 of the parts cassette 6-6. After that, the suction nozzles 1-A1, 1-A4, 1-B1, 1-B4, 1-C
The six suction nozzles 1 of 1 and 1-C4 simultaneously suck and extract the electronic component 2.

In this case, the electronic components 2 housed in the parts cassettes 6-1 and 6-2 are electronic components 2 having substantially the same thickness, and the parts cassette 6-3 is used.
The electronic components 2 housed in 6 and 6-4 are also electronic components 2 having substantially the same thickness, and the parts cassette 6-
5 and the electronic components 2 housed in the parts cassette 6-6 must also be electronic components 2 having the same thickness. This is because the height positions of the tips of the suction nozzles 1 lowered in the sub heads 3 at substantially the same time are the same height positions.

After the six suction nozzles 1 have simultaneously picked up the electronic component 2 by suction, the nozzle rotating mechanism 10 in each sub head 3 causes each suction nozzle 1 to pick up.
Is rotated 60 degrees counterclockwise, and the suction nozzle 1-
A2, 1-A5, 1-B2, 1-B5, 1-C2, and 1-C5 are located above the component supply positions 6a-1 to 6a-6, respectively, and these six suction nozzles 1
Thus, the electronic component 2 is sucked and taken out at the same time.

Thereafter, in each sub head 3, each suction nozzle 1 is rotated 60 degrees counterclockwise by the nozzle rotating mechanism 10, and the suction nozzles 1-
A3, 1-A6, 1-B3, 1-B6, 1-C3, and 1-C6 are located above the component supply positions 6a-1 to 6a-6, respectively, and these six suction nozzles 1
Thus, the electronic component 2 is sucked and taken out at the same time.

In such a suction and extraction method of the electronic component 2, it is possible to perform the efficient suction and extraction by utilizing the feature of the arrangement of the suction nozzles 1 in each sub head 3.

Next, FIG. 11 (B) shows a case where three suction nozzles 1 out of the suction nozzles 1 of the head portion 101 simultaneously pick up the electronic components 2 by suction.
As shown in FIG. 11B, the suction nozzle 1-A1 is provided above the component supply position 6a-1 of the parts cassette 6-1 and the suction nozzle 1 is provided above the component supply position 6a-3 of the parts cassette 6-3. The suction nozzle 1-C1 is positioned above the component supply position 6a-5 of the parts cassette 6-5. After that, the suction nozzles 1-A1, 1-B1, and 1-
The three suction nozzles 1 of C1 simultaneously suck and take out the electronic component 2.

In each sub-head 3, the nozzle rotating mechanism 10 rotates the suction nozzles 1 counterclockwise by 60 degrees, whereby one suction nozzle 1 in each sub-head 3, that is, a total of 3 suction nozzles. The suction suction of the electronic component 2 is performed simultaneously by the suction nozzle 1 of the book.

In such a sucking and picking-up method of the electronic component 2, for example, when the sucking and picking-up of the electronic component 2 is performed from the component feeding position 6a-1 in the sucking nozzle 1-A1, the component feeding position 6a-1. In the case where there is a displacement in the Y-axis direction in the drawing between the suction center of the electronic component 2 and the center of the suction nozzle 1-A1 in FIG.
By rotating the suction nozzle 1-A1 by a minute amount by the nozzle rotating mechanism 10 in the first sub head 3-A, the center of the suction nozzle 1-A1 is minutely moved in the Y-axis direction in the drawing, and the electronic component 2 described above is moved. It is possible to correct the position deviation that has occurred between the suction center and the center of the suction nozzle 1-A1 to correct the suction posture of the electronic component 2. The correction operation of the suction posture of the electronic component 2 in the Y-axis direction using the nozzle rotation mechanism 10 can be individually performed for each sub head 3 as needed. Therefore, in such a suction and take-out method of the electronic component 2, the suction posture in the Y-axis direction of the electronic component 2 is corrected while performing the efficient sucking and taking-out utilizing the feature of the arrangement of the suction nozzles 1 in each sub head 3. It is possible to perform operations.

Further, before performing the correction operation of the suction posture of the electronic component 2 using the nozzle rotating mechanism 10 as described above, the respective positional deviations of the suction nozzles 1 on which the correction operation is performed are averaged. The head portion 101 is moved in the X-axis direction or the Y-axis direction by the XY robot 8 so as to be displaced, and then the suction posture correction operation of the electronic component 2 using the nozzle rotation mechanism 10 is performed. This may be the case.

In addition, as shown in FIG. 11C, the suction and removal of the electronic component 2 by the three suction nozzles 1 of the suction nozzles 1 included in the head portion 101 at the same time is performed by the second suction nozzle 1 as shown in FIG.
In the sub head 3-B, the electronic component 2 may be sucked and taken out from the parts cassette 6-4.

Next, FIG. 12D shows a case where the suction nozzles 1 of the head section 101 individually and non-simultaneously pick up the electronic components 2 by suction. As shown in FIG. 12D, the suction nozzle 1 in the first sub head 3-A
-A1 is the parts supply position 6a-1 of the parts cassette 6-1
The electronic component 2 is suctioned and taken out by the suction nozzle 1-A1.

Then, in the first sub head 3-A,
The suction nozzle 1 is rotated 60 degrees counterclockwise by the nozzle rotating mechanism 10 to position the suction nozzle 1-A2 above the component supply position 6a-1 and the suction nozzle 1-A.
The electronic component 2 is sucked and taken out by the step 2. Then the first
In the sub head 3-A, the suction nozzles 1 are rotated by the nozzle rotating mechanism to move the suction nozzles 1.
Are sequentially positioned above the component supply position 6a-1, and the suction nozzle 1 picks up the electronic component 2 by suction.

After that, the head unit 1 is moved by the XY robot 8.
01 is moved leftward in the X-axis direction in the drawing to move the suction nozzle 1-B1 in the second sub head 3-B to the component supply position 6.
The electronic component 2 is suctioned and taken out by the suction nozzle 1-B1 by being positioned above a-1. After that, as in the case of the sub head 3-A, all the suction nozzles 1 in the second sub head 3-B pick up the electronic component 2 by suction.

After that, the head portion 101 is further moved leftward in the X-axis direction by the XY robot 8 to move to the third position.
Similarly, with respect to the sub head 3-C, all the suction nozzles 1 suction and extract the electronic component 2.

After the suction and ejection of the electronic component 2 by all the suction nozzles 1 in one sub head 3 as described above, the suction nozzles 1 in another sub head 3 are taken out.
Instead of the case where the electronic component 2 is sucked and taken out by one, the electronic component 2 is sucked and taken out by one suction nozzle 1 in one sub head 3, and then the electronic component 2 is taken by the suction nozzle 1 in another sub head 3. It is also possible to perform the adsorption and removal of the above.

For example, after the electronic component 2 is sucked and taken out by the suction nozzle 1-A1, the head unit 101 is moved by the XY robot 8 so that the electronic component 2 is moved by the suction nozzle 1-B1 in the second sub head 3-B. The electronic component 2 is sucked and taken out, and then the XY robot 8 moves the head portion 101 to suck and take out the electronic component 2 by the suction nozzle 1-C1 in the third sub head 3-C. In the sub head 3 from which the electronic component 2 has been sucked and taken out, after the sucking and taking out, the respective suction nozzles 1 are rotated counterclockwise by 60 degrees by the nozzle rotating mechanism 10. Accordingly, after the suction nozzle 1-C1 of the third sub-head 3-C suctions and takes out the electronic component 2, the XY robot 8 moves the head portion 101 rightward in the X-axis direction in the drawing to move the second sub-head 3 The electronic component 2 is sucked and taken out by the suction nozzle 1-B2 in -B, and then the XY robot 8 moves the head unit 101 to the right in the X-axis direction in the drawing to move the first sub-head 3-.
The suction nozzle 1-A2 in A picks up the electronic component 2 by suction. By performing such suction and take-out operation, suction and take-out of the electronic components 2 by all the suction nozzles 1 are performed.

In such a suction and take-out method of the electronic component 2, in the head portion 101, the suction and take-out of the electronic component 2 is always performed by one suction nozzle 1, so that, for example, the suction nozzle 1- In the case where the electronic component 2 is sucked and taken out from the component supply position 6a-1 at A1, a suction mark X between the suction center of the electronic component 2 at the component supply position 6a-1 and the center of the suction nozzle 1-A1 is shown. In the case where there is a positional deviation in the axial direction or the Y-axis direction, the suction nozzle 1-A1 is moved to the illustrated X-axis direction or the Y direction by the movement of the head unit 101 by the XY robot 8.
The electronic component 2 by the suction nozzle 1-A1 is corrected by slightly moving in the axial direction to correct the positional deviation generated between the suction center of the electronic component 2 and the center of the suction nozzle 1-A1.
Can be corrected.

Further, even when the types of the electronic components 2 sucked and taken out by the respective suction nozzles 1 are different and the component thicknesses of the electronic components 2 are different, the head portion 10
In 1, the electronic component 2 is always picked up and picked up by the single suction nozzle 1. Therefore, the operations of the respective suction nozzles 1 do not affect each other, and the suction and removal of the electronic component 2 is performed by each suction nozzle 1. It can be performed.

Next, FIG. 12 (E) shows a case where five suction nozzles 1 out of the suction nozzles 1 of the head section 101 simultaneously pick up the electronic components 2 by suction.
The adsorption extraction methods shown in FIGS. 11A and 11B are performed in combination. Even in such a suction and extraction method of the electronic component 2, it is possible to perform the efficient suction and extraction using the feature of the arrangement of the suction nozzles 1 in each sub head 3.

Next, FIG. 12 (F) is another example of the case where three suction nozzles 1 of the suction nozzles 1 of the head portion 101 simultaneously pick up the electronic components 2 by suction. . As shown in FIG. 12 (F), the arrangement state of the suction nozzles 1 in each sub head 3 is different from the arrangement state shown in FIG. 11 (B). By the nozzle rotation mechanism 10 provided, each suction nozzle 1 is rotated clockwise by 90 degrees to move the suction nozzle 1-A1 above the component supply position 6a-1 of the parts cassette 6-1 and the suction nozzle 1-A1 of the parts cassette 6-3. The suction nozzle 1-B1 is positioned above the component supply position 6a-3, and the suction nozzle 1-C1 is positioned above the component supply position 6a-5 of the parts cassette 6-5. After that, suction nozzle 1
-A1, 1-B1, and 1-C1 three suction nozzles 1
Thus, the electronic components 2 are simultaneously sucked and taken out.

In each sub-head 3, the nozzle rotating mechanism 10 rotates each suction nozzle 1 counterclockwise by 60 degrees, so that each suction head 1 in each sub-head 3, that is, a total of 3 suction nozzles. The suction suction of the electronic component 2 is performed simultaneously by the suction nozzle 1 of the book.

In the suction and take-out method of the electronic component 2 as described above, for example, in the case where the suction and take-out of the electronic component 2 is performed from the component supply position 6a-1 in the suction nozzle 1-A1, the component supply position 6a-1. In the case where there is a displacement in the X-axis direction in the drawing between the suction center of the electronic component 2 and the center of the suction nozzle 1-A1 in
By rotating the suction nozzle 1-A1 by a minute amount by the nozzle rotating mechanism 10 in the sub head 3-A, the center of the suction nozzle 1-A1 is slightly moved in the X-axis direction in the drawing, and the suction center of the electronic component 2 is moved. And suction nozzle 1-
It is possible to correct the position deviation that has occurred between the center of A1 and the position of the electronic component 2 to correct the suction posture. The correction operation of the suction posture of the electronic component 2 in the X-axis direction using the nozzle rotation mechanism 10 can be individually performed for each sub head 3 as needed.

For example, in the case where the parts cassette 6 is provided with a moving mechanism for slightly moving the electronic component 2 located at the component supply position 6a in the Y-axis direction in the figure, for example, the component supply position 6a-1 electronic component 2
In the case where there is a displacement in the Y-axis direction in the drawing between the suction center of 1 and the center of the suction nozzle 1-A1, the electronic component 2 positioned at the component supply position 6a by the moving mechanism is moved in the Y-axis direction in the drawing. By moving the suction nozzle 1-
The center of A1 is slightly moved in the Y-axis direction in the figure to correct the positional deviation between the suction center of the electronic component 2 and the center of the suction nozzle 1-A1 to correct the suction posture of the electronic component 2. Corrections can be made.

Therefore, in such a suction and take-out method of the electronic component 2, while performing the efficient sucking and taking-out utilizing the feature of the arrangement of the suction nozzles 1 in each sub head 3, the X-axis direction and the Y-direction of the electronic component 2 are obtained. It is possible to correct the suction posture in the axial direction.

In the case where each parts cassette 6 is provided with two parts supply positions 6a along the Y-axis direction in the drawing, and the intervals between the parts supply positions 6a are the arrangement intervals P of the parts cassettes 6, respectively. That is, in each parts cassette 6, two suction nozzles 1 which are arranged point-symmetrically with respect to the nozzle rotation center R and along the Y-axis direction are simultaneously installed at two locations in each parts cassette 6. It becomes possible to dispose above the component supply position 6a. Therefore, in such a case, the above Y in each sub head 3
It is possible to simultaneously suck and take out the electronic component 2 by the two suction nozzles 1 arranged in the axial direction.

In each of the above-described embodiments, the case where the electronic component 2 is sucked and taken out from the plurality of parts cassettes 6 has been described. In the case where the electronic component 2 can be supplied by a plate-shaped component supply tray instead of the parts cassette 6, the electronic components 2 are arranged at a constant interval, for example, an arrangement interval P in the component supply tray. Therefore, it may be arranged in the X-axis direction and the Y-axis direction.

Next, an example of a method of mounting the electronic components 2 on the circuit board 4 after the electronic components 2 are picked up from the parts cassette 6 by the three sub heads 3 provided in the head unit 101 will be described as an example. This will be described below.

FIG. 13, FIG. 14 and FIG.
12 is a schematic explanatory view schematically showing a method of mounting the electronic component 2 on the circuit board 4 by the suction nozzle 1 included in each sub head 3 of 01. FIG. Note that in FIGS. 13, 14 and 15, the same reference numerals as those used in FIGS. 11 and 12 are used to identify the sub head 3 and the suction nozzle 1.

FIG. 16 is a schematic diagram of FIG. 13, FIG. 14 and FIG.
6 is a plan view of the circuit board 4 on which the electronic component 2 is mounted by the mounting method of the electronic component 2 shown in FIG. As shown in FIG. 16, the circuit board 4 has a plurality of mounting areas Z1, Z2, Z3, and Z4 in which a plurality of electronic components 2 are mounted,
In each of the mounting areas Z1, Z2, Z3, and Z4, a plurality of mounting positions at which the electronic components 2 are mounted are arranged in a row along the X-axis direction in the drawing at a mounting pitch Q that is a constant interval. . From the left side of the drawing, the mounting positions in the mounting area Z1 are mounted areas Z1-1, Z1-2, ..., Z1-.
Let N be the mounting position in the mounting region Z2 from the left side in the drawing, and mounting regions Z2-1, Z2-2, ..., Z2-N, and the mounting position in the mounting region Z3 from the left side in the drawing, mounting region Z3-1. , Z3-N, and the mounting positions in the mounting area Z4 are the mounting areas Z4-1, Z4-2, ..., Z4-N from the left side in the drawing. Here, N is an integer and represents the number of electronic components 2 to be mounted in each mounting area Z1, Z2, Z3, and Z4. In addition, in the mounting areas Z1, Z2, and Z3, the intervals between the mounting positions Z1-1, Z2-1, and Z3-1 are twice the array interval P of the parts cassette 6.

First, in the mounting method of the electronic component 2 shown in FIG. 13, the mounting areas Z1, Z2, and Z3 on the circuit board 4 are used.
The procedure of the method of mounting the electronic component 2 in the case where the electronic component 2 is continuously mounted at each of the mounting positions described above is shown.

As shown in FIG. 13, first, step S1
In the above, the XY robot 8 moves the head portion 101 to above the circuit board 4 to align the suction nozzle 1-A1 of the first sub-head 3-A with the mounting position Z1-1 of the mounting area Z1 of the circuit board 4. And the suction nozzle 1-B1 in the second sub head 3-B.
And the suction nozzle 1-C1 in the third sub head 3-C
And are positioned at the left end in the X-axis direction in the drawing on the circumference around each sub-head rotation center R. Along with that, the first
In the sub head 3-A, the suction nozzle 1-A1 moves to the second
In the sub head 3-B, the suction nozzle 1-B1 moves to the third
The suction nozzle 1-C1 is selected in the sub head 3-C. After that, in the first sub head 1-A, the suction nozzle 1-A1 is lowered, the electronic component 2 that is suction-held is mounted at the mounting position Z1-1 of the circuit board 4, and after the suction-holding of the electronic component 2 is released. The suction nozzle 1-A1 is raised.

After that, in step S2, each suction nozzle 1 is rotated counterclockwise by 60 degrees by the nozzle rotating mechanism 10 in the first sub head 3-A, and the head portion 101 is slightly moved by the XY robot 8. Adsorption nozzle 1-B in the second sub head 3-B
1 and the mounting position Z2- of the mounting area Z2 on the circuit board 4.
Fine adjustment of the alignment with 1 is performed. Then the second
In the sub head 3-B, the suction nozzle 1-B1 is lowered, the electronic component 2 that is suction-held is mounted at the mounting position Z2-1 of the circuit board 4, and the suction nozzle 1 is released after the suction-holding of the electronic component 2 is released. -B1 is raised.

Then, in step S3, each suction nozzle 1 is rotated counterclockwise by 60 degrees by the nozzle rotating mechanism 10 in the second sub head 3-B, and the head portion 101 is slightly moved by the XY robot 8. Adsorption nozzle 1-C in the third sub head 3-C
1 and the mounting position Z3 of the mounting area Z3 on the circuit board 4.
Fine adjustment of the alignment with 1 is performed. Then the third
In the sub head 3-C, the suction nozzle 1-C1 is lowered, the electronic component 2 that is suction-held is mounted at the mounting position Z3-1 of the circuit board 4, and the suction nozzle 1 is released after the suction-holding of the electronic component 2 is released. -C1 is raised.

Thereafter, in step S4, the suction nozzles 1 in the third sub head 3-C rotate the suction nozzles 1 60 degrees counterclockwise, and the XY robot 8 moves the head portion 101 in the X-axis direction in the figure. By moving to the right, the suction nozzle 1-A2 in the first sub head 3-A and the mounting area Z1 in the circuit board 4
The mounting position Z1-2 is aligned with the mounting position Z1-2. At the same time, the suction nozzle 1- in the first sub head 3-A.
A2 is the suction nozzle 1- in the second sub head 3-B.
B2 is the suction nozzle 1- in the third sub head 3-C.
C2 is selected. After that, in the first sub head 3-A, the suction nozzle 1-A2 is lowered, the electronic component 2 that is suction-held is mounted at the mounting position Z1-2 of the circuit board 4, and after the suction-holding of the electronic component 2 is released. , Suction nozzle 1-
A2 is raised.

After that, the same procedure is repeated,
The electronic component 2 is mounted at the mounting positions of the mounting areas Z1, Z2, and Z3 on the circuit board 4.

In such a mounting method of the electronic component 2, it is possible to reduce the movement operation of the head portion 101 by the XY robot 8 when mounting the electronic component 2. Further, since the rotation movement of each suction nozzle 1 by the nozzle rotating mechanism 10 in the sub head 3 is performed when the mounting operation of the electronic component 2 is being performed in the other sub head 3, the mounting operation of the electronic component 2 is affected. Never give. Further, since the mounting operation of the electronic component 2 can be continuously performed by the three sub heads 3 provided in the head unit 101, the time required for the mounting operation of the electronic component 2 can be shortened.

Next, the electronic component 2 shown in FIG. 14 and FIG.
The mounting method shows the procedure of the mounting method of the electronic component 2 in the case where the electronic component 2 is continuously mounted at each mounting position of the mounting area Z4 on the circuit board 4.

As shown in FIG. 14, first, step S1
1, the head portion 101 is moved above the circuit board 4 by the XY robot 8, and the position of the suction nozzle 1-A1 in the first sub-head 3-A and the mounting position Z4-1 of the mounting area Z4 in the circuit board 4 is set. Make a match. At the same time, the suction nozzle 1 in the second sub head 3-B
-B1 and the suction nozzle 1 in the third sub head 3-C
-C1 and C1 are located at the left end in the X-axis direction in the drawing on the circumference around each sub-head rotation center R. Then the first
In the sub head 3-A, the suction nozzle 1-A1 is selected, the suction nozzle 1-A1 is lowered, and the electronic component 2 suction-held is mounted at the mounting position Z4-1 of the circuit board 4, and the electronic component 2 After releasing the suction hold of the suction nozzle 1-
A1 is increased.

Thereafter, in step S12, the XY robot 8 moves the head portion 101 leftward in the X-axis direction in the drawing, and the suction nozzle 1 in the first sub-head 3-A.
-A4 and the mounting position Z of the mounting area Z4 on the circuit board 4.
Alignment with 4-2 is performed. After that, in the first sub head 3-A, the suction nozzle 1-A4 is selected, the suction nozzle 1-A4 is lowered, and the electronic component 2 suction-held is mounted on the mounting position Z4-2 of the circuit board 4. After releasing the suction holding of the electronic component 2, the suction nozzle 1-A
4 is raised.

Then, in step S13, in the first sub head 3-A, each suction nozzle 1 is rotated counterclockwise by 60 degrees by the nozzle rotating mechanism 10, and the XY robot 8 moves the head portion 101 to the X axis shown in the drawing. Is moved leftward in the direction, and the suction nozzle 1-B1 in the second sub head 3-B and the mounting area Z4 in the circuit board 4 are moved.
The mounting position Z4-3 is aligned with the mounting position Z4-3. Then, in the second sub head 3-B, the suction nozzle 1-B
1 is selected, the suction nozzle 1-B1 is lowered, and the electronic component 2 suction-held is mounted on the circuit board 4 at the mounting position Z4.
-3, the suction nozzle 1-B1 is raised after the suction holding of the electronic component 2 is released.

After that, in step S14, the head portion 101 is moved leftward in the X-axis direction by the XY robot 8 to move the suction nozzle 1 in the second sub head 3-B.
-B4 and the mounting position Z of the mounting area Z4 on the circuit board 4.
Positioning with 4-4 is performed. After that, in the second sub head 3-B, the suction nozzle 1-B4 is selected, the suction nozzle 1-B4 is lowered, and the electronic component 2 suction-held is mounted on the mounting position Z4-4 of the circuit board 4. After releasing the suction holding of the electronic component 2, the suction nozzle 1-B
4 is raised.

Then, in steps S15 and S16 in FIG. 15, the same operation procedure is performed for the second sub head 3-B and the third sub head 3-C, and the electronic component 2 is placed at the mounting position in the mounting area Z4. It is attached to Z4-5 and Z4-6.

Then, in step S17, in the third sub-head 3-C, each suction nozzle 1 is rotated counterclockwise by 60 degrees by the nozzle rotating mechanism 10, and the XY robot 8 moves the head portion 101 to the X-axis shown in the figure. The suction nozzle 1-C2 in the third sub head 3-C and the mounting area Z4 in the circuit board 4 are moved rightward in the direction.
The mounting position Z4-7 is aligned with the mounting position Z4-7. Then, in the third sub head 3-C, the suction nozzle 1-C
2 is selected, the suction nozzle 1-C2 is lowered, and the electronic component 2 suction-held is attached to the mounting position Z4 of the circuit board 4.
The suction nozzle 1-C2 is lifted after the suction holding of the electronic component 2 is released by being mounted on -7.

After that, in step S18, in the third sub head 3-C, the nozzle rotating mechanism 10 rotates each suction nozzle 1 by 60 degrees counterclockwise, and the XY robot 8 moves the head portion 101 to the X axis shown in the drawing. Is moved rightward in the direction, and the suction nozzle 1-B5 in the second sub head 3-B and the mounting area Z4 in the circuit board 4 are moved.
The mounting position Z4-8 is aligned with. Then, in the second sub head 3-B, the suction nozzle 1-B
5 is selected, the suction nozzle 1-B5 is lowered, and the electronic component 2 suction-held is mounted on the circuit board 4 at the mounting position Z4.
The suction nozzle 1-B5 is lifted after the suction holding of the electronic component 2 is released by being mounted on the -8.

After that, the same operation procedure is repeated to mount the electronic component 2 at each mounting position of the mounting area Z4 on the circuit board 4.

In such a mounting method of the electronic component 2, as in the mounting method of the electronic component 2 in FIG. 13, the moving distance of the head portion 101 by the XY robot 8 at the time of mounting the electronic component 2 is made small. In addition, since the rotation of each suction nozzle 1 by the nozzle rotating mechanism 10 in the sub head 3 is performed when the mounting operation of the electronic component 2 is being performed in the other sub head 3, the mounting operation of the electronic component 2 is not performed. It has no effect.
Further, since the mounting operation of the electronic component 2 can be continuously performed by the three sub heads 3 provided in the head unit 101, the time required for the mounting operation of the electronic component 2 can be shortened.

Next, the arrangement of the punched holes 41b of the select disk portion 41 in each sub head 3 and the nozzle shaft 11 will be described.
Will be described, that is, the relationship between the arrangement of the vent hole portion 41b and the arrangement of the suction nozzle 1.

First, as shown in FIG. 5, the above-mentioned substantially circular shape is arranged at a position of 50 degrees on the circumference where the nozzle shaft 11 around the rotation center of the sub head on the lower surface of the select disk portion 41 is arranged. The vent hole portion 41b having a cross section of is referred to as a vent hole portion 41b-2.
The punched hole portion 41b having the above-mentioned substantially oval cross section arranged at respective positions of 180 degrees, 300 degrees,
The hole 41b-1 for 0 degrees, the hole 41b-3 for 120 degrees, and the hole 4 for 180 degrees 4
For 1b-4 and 300 degrees, the hole 41b-5 is formed. Note that, in FIG. 5, angular coordinates are used in a counterclockwise direction with respect to the sub-head rotation center R, with the illustrated upper end position of the circumference being the origin position.

In addition, in the hole 41b-2, 5
Nozzle shaft 1 whose central axis is located at 0 degree
The upper part of 1 can be inserted. In addition, the hole 41
In b-1, the upper portion of the nozzle shaft 11 whose central axis is located at a position of 10 degrees or 350 degrees can be inserted, and similarly, in the hole 41b-3, 1
At the position of 10 degrees or 130 degrees, and at the position of 170 degrees or 190 degrees in the hole portion 41b-4, the hole portion 41b is formed.
In -5, each hole 41b is formed on the circumference at a position of 290 degrees or 310 degrees so that the upper portion of the nozzle shaft 11 with its central axis can be inserted. .

Further, a total of 18 pin receiving portions 42a formed on the spline nut 42 are formed on the same circumference with an angular pitch of 20 degrees. The select disc part 41 and the spline nut 42 are rotated relative to each other, and then the positioning pin 43 of the select disc part 41 and the pin receiving part 42a of the spline nut 42 are fitted to each other, and the select disc part 41 and the spline nut 42 are fitted together. In the case where movements are performed such that 42 and 42 are fixed to each other in the rotation direction around the sub head rotation center R, the movement is an integer multiple of the formation angle pitch of the pin receiving portion 42a, That is, it is performed at a moving angle that is an integral multiple of 20 degrees.

17 to 22 are schematic explanatory views showing the relationship between the arrangement of the punched holes 41b of the select disk portion and the arrangement of the suction nozzles 1 for each of the above movement angles. It should be noted that FIGS. 17 to 22 show the relationship of the respective arrangements when the arrangement of the suction nozzle 1 is fixed and the arrangement of the extraction hole portion 41b of the select disk portion 41 is moved at each of the above movement angles. There is.

The reference numerals for identifying the sub head 3 and the suction nozzle 1 are the same as those used in FIGS. 11, 12 and 13, and in the following description, the respective sub heads 3 will be described. Since the same applies to the above, the description of each sub head 3 will be represented by the description of the sub head 3-A.

First, as shown in FIG. 17 (A), the arrangement of the punched holes 41b of the select disk portion 41 is the arrangement described in FIG. 5, and the suction nozzle 1-
A1 is 90 degrees, suction nozzle 1-A2 is 30 degrees, suction nozzle 1-A3 is 330 degrees, suction nozzle 1-A4 is 270 degrees.
Degree, suction nozzle 1-A5 is 210 degree, suction nozzle 1-A
6 is located at the 150 degree position. According to this arrangement state, all the suction nozzles 1 can be lowered by lowering the select disc portion 41.

Next, in FIG. 17B, the select disk portion 41 is rotated counterclockwise by 20 degrees from the state of FIG. 17A, and the arrangement of the suction nozzles 1 is fixed. The layout is the same as that in FIG. 17A. Positions of the suction nozzle 1-A2 and the extraction hole portion 41b-1, positions of the suction nozzle 1-A3 and the extraction hole portion 41b-5, positions of the suction nozzle 1-A5 and the extraction hole portion 41b-4, and suction. The positions of the nozzle 1-A6 and the hole 41b-3 are aligned with each other, and the suction nozzle 1-A1 and the suction nozzle 1-A4 are not aligned with the positions of any of the holes 41b. According to this arrangement, only the suction nozzle 1-A1 and the suction nozzle 1-A4 can both be lowered by lowering the select disk portion 41.

Next, in FIG. 17C, the select disk portion 41 is further rotated counterclockwise by 20 degrees from the state shown in FIG. 17B, and the arrangement of each suction nozzle 1 is shown in FIG. It is similar to (A). Positions of the suction nozzle 1-A1 and the hole 41b-2, positions of the suction nozzle 1-A2 and the hole 41b-1, positions of the suction nozzle 1-A3 and the hole 41b-5, suction nozzle The positions of 1-A5 and the extraction hole 41b-4 and the positions of the suction nozzle 1-A6 and the extraction hole 41b-3 are the same, and the suction nozzle 1-A4 has any of the extraction holes 41b. Does not match the position of. According to this arrangement, the suction nozzle 1-
Only A4 can be lowered by lowering the select disc portion 41.

Next, in FIG. 18 (D), the select disk portion 41 is further rotated counterclockwise by 20 degrees from the state of FIG. 17 (C), and the arrangement of each suction nozzle 1 is shown in FIG. It is similar to (A). According to this arrangement state, all the suction nozzles 1 can be lowered by lowering the select disc portion 41.

Since the same description is made below, the description is omitted, but in FIG. 18 (E), the suction nozzle 1-A is shown.
3 and the suction nozzle 1-A6, only the suction nozzle 1-A3 in FIG. 18 (F), all the suction nozzles 1 in FIG. 19 (G), and the suction nozzle 1- in FIG. 19 (H). Only A2 and suction nozzle 1-A5 are shown in FIG.
In (I), only the suction nozzle 1-A2 is shown in FIG.
In FIG. 20 (K), all the suction nozzles 1 in FIG.
The suction nozzle 1-A1 and the suction nozzle 1-A4
20 (L), only the suction nozzle 1-A1 and all the suction nozzles 1 in FIG. 21 (M).
21 (N), only the suction nozzles 1-A3 and 1-A6, only the suction nozzles 1-A6 in FIG. 21 (O), and all the suction nozzles 1 in FIG. 22 (P). In FIG. 22 (Q), the suction nozzle 1-A
2 and the suction nozzle 1-A5, only the suction nozzle 1-A5 in FIG.
It can be lowered by lowering 1.

Next, one or a plurality of suction nozzles 1 out of the six suction nozzles 1 provided in the sub head 3 are selected, and a predetermined operation is performed by the selected suction nozzles 1, After that, the procedure of the operation of the sub head 3 until the selection operation of the suction nozzle 1 to be selected next is performed will be described below by using an example of a selection operation pattern.
In the following description, the plurality of parts cassettes 6
The selection operation of the suction nozzle 1 in the case where the suction nozzle 1 included in the sub head 3 suctions and takes out the electronic component 2 will be described. Further, the reference numerals for identifying the sub head 3, the suction nozzle 1, and the parts cassette 6 are as shown in FIG.
The same reference numerals as those used in FIG. 5 are used, and the same reference numerals as those used in FIG. 5 and FIG. 17 are used for specifying the respective punched holes 41b of the select disc portion 41. . Further, the arrangement of the respective punched holes 41b in the select disk portion 41, and the sub head rotation center R
The angular coordinate with respect to is as described in FIG. The selection operation of the sub head 3-A will be described below on behalf of the selection operation of each of the sub heads 3 included in the head unit 101.

First, the suction nozzle 1-A1 picks up the electronic component 1 from the component supply position 6a-1 of the parts cassette 6-1 by suction, and then the suction nozzle 1 located at a position symmetrical with the suction nozzle 1-A1. -Parts cassette 6 by A4
23 is a schematic explanatory view schematically showing the procedure of the above-described selection operation when the electronic component 1 is picked up and picked up from the second component supply position 6a-2.

As shown in FIG. 23 (A), the notch portion 41a of the select disc portion 41 is located at a position with an angular coordinate of 180 degrees, and the notch fixing portion 47 can be engaged with the engaging portion 47a. It is located. Further, the positions of the suction nozzle 1-A2 and the hole 41b-4, the positions of the suction nozzle 1-A3 and the hole 41b-3, the positions of the suction nozzle 1-A4 and the hole 41b-2, The positions of the suction nozzle 1-A5 and the extraction hole portion 41b-1 and the positions of the suction nozzle 1-A6 and the extraction hole portion 41b-5 are the same, and the suction nozzle 1-A1 has any of the extraction hole portions 41b. Does not match the position of. The suction nozzle 1-A1 is located above the component supply position 6a-1. In this arrangement, the select disk unit 41 is lowered to lower only the suction nozzle 1-A1 and the suction nozzle 1-A1 suctions and picks up the electronic component 2 from the component supply unit 6a-1.

After that, as shown in FIG. 23B, the select disk portion 41 is raised so that the notch portion 41a is engaged with the engaging portion 47a of the notch fixing portion 47 so that only the select disk portion 41 is included in the head frame 5. Fixed to
The suction nozzles 1 are rotated clockwise by 180 degrees around the sub head rotation center R. By this rotational movement, the positions of the suction nozzle 1-A1 and the hole 41b-2, the positions of the suction nozzle 1-A2 and the hole 41b-1, the positions of the suction nozzle 1-A3 and the hole 41b-5. , The position of the suction nozzle 1-A5 and the position of the extraction hole 41b-4, and the position of the suction nozzle 1-A6 and the position of the removal hole 41b-3 are respectively matched. The state does not match the position of 41b. Also, the suction nozzle 1
-A4 is located above the component supply position 6a-1.

After that, the select disk portion 41 is lowered to release the above-mentioned engagement between the notch portion 41a and the engagement portion 47a, and the positioning pin 43 and the pin receiving portion 42 are also released.
By fitting a, the select disc portion 41 and the spline nut 42 are fixed in the rotation direction around the sub head rotation center R. After the above fixing, as shown in FIG. 23 (C), the select disk portion 41 and each suction nozzle 1 are rotated 180 degrees clockwise while maintaining the positional relationship between each suction nozzle 1 and each hole 41b. Rotate and move in degrees.
By this rotational movement, the suction nozzle 1-A4 is positioned above the component supply position 6a-2, and by lowering the select disk portion 41, only the suction nozzle 1-A4 is lowered, and the suction nozzle 1-A4 moves the component. The electronic component 2 is sucked and taken out from the supply unit 6a-2.

Incidentally, in FIG. 23, the sub head 3-
The procedure of the above selection operation when the electronic component 2 is sucked and taken out from the suction nozzle 1-A1 and the suction nozzle 1-A4 of the suction nozzle 1 included in A has been described, but the suction nozzle 1 included in the sub head 3-A is described. The selection operation can be performed for the other suction nozzles 1 that are arranged at positions symmetrical to each other with respect to the sub-head rotation center R among the above, in the same procedure as described above.

Further, in FIG. 23A, the notch portion 41a of the select disc portion 41 is located at a position of 180 degrees, and the notch portion 4 of the notch fixing portion 47 is caught.
7a, instead of being located at a position where it can be bitten in, when it is not located at a biteable position, after suction and removal of the electronic component 2 by the suction nozzle 1-A1, The select disk portion 41 is rotationally moved together with each suction nozzle 1, the notch portion 41a of the select disk portion 41 is positioned at the above 180 degree position, and the notch fixing portion 47 can be engaged with the engaging portion 47a. After that, the operation shown in FIG. 23 (B) is performed.

The suction nozzle 1-A4 positioned above the component supply position 6a-1 by the operation in FIG. 23 (B) is moved above the component supply position 6a-2 in FIG. 23 (C). In the moving operation of moving, instead of rotating the suction nozzles 1, the suction nozzles 1-A4 are moved by the movement of the head unit 101 in the X-axis direction.
It may be a case of moving in the axial direction.

Next, by the suction nozzle 1-A1 and the suction nozzle 1-A4, which are point-symmetrical to each other, the component supply position 6a-1 of the parts cassette 6-1 and the parts cassette 6 are detected.
Of the electronic components 1 from the component supply positions 6a-2 of -2 at the same time, and then the component cassettes by the suction nozzles 1-A3 and the suction nozzles 1-A6 that are located in different point-symmetrical positions from each other. A schematic diagram showing the procedure of the above selection operation in the case where the electronic components 1 are picked up and picked up simultaneously from the component supply position 6a-1 of 6-1 and the component supply position 6a-2 of the parts cassette 6-2. An explanatory diagram is shown in FIG.

As shown in FIG. 24 (A), the notch portion 41a of the select disk portion 41 is located at the position of the angular coordinate of 160 degrees, and the notch portion 41a is the notch fixing portion 4.
7 is not located at a position where it can be bitten into the biting portion 47a. Further, the positions of the suction nozzle 1-A2 and the hole 41b-4, the positions of the suction nozzle 1-A3 and the hole 41b-3, the positions of the suction nozzle 1-A5 and the hole 41b-1, Suction nozzle 1-A6 and vent hole 4
The positions of the suction nozzles 1b-5 and 1b-5 are aligned with each other.
-A1 and suction nozzle 1-A4 are any of the hole 41
It also does not match the position of b. Also, the suction nozzle 1-A
1 is located above the component supply position 6a-1, and the suction nozzle 1-A4 is located above the component supply position 6a-2. In this arrangement, the select disk unit 41 is lowered to suck the suction nozzle 1-A1 and the suction nozzle 1-A4.
Only the electronic parts 2 are sucked and taken out simultaneously from the component supply unit 6a-1 by the suction nozzle 1-A1 and from the component supply 6a-2 by the suction nozzle 1-A4.

After that, as shown in FIG. 24B, the select disk portion 41 is raised, and the select disk portion 41 is rotated counterclockwise by 20 degrees together with the suction nozzles 1 to move the select disk portion 41. Notch part 4
1a is located at a position with an angular coordinate of 180 degrees and is located at a position where the notch fixing portion 47 can be engaged with the engaging portion 47a. After that, the select disc portion 41 is further raised so that the notch portion 41a of the select disc portion 41 is engaged with the engaging portion of the notch fixing portion 47, and only the select disc portion 41 is fixed to the head frame 5, The suction nozzles 1 are rotated clockwise by 60 degrees around the sub head rotation center R.

As a result of this rotational movement, as shown in FIG. 24C, the positions of the suction nozzle 1-A1 and the hole 41b-4, the positions of the suction nozzle 1-A2 and the hole 41b-3, The positions of the suction nozzle 1-A4 and the extraction hole portion 41b-1 and the positions of the suction nozzle 1-A5 and the extraction hole portion 41b-5 are respectively matched, and the suction nozzle 1-A3 and the suction nozzle 1 are aligned.
-A6 is in a state where it does not match the position of any of the punched holes 41b.

After that, the select disk portion 41 is lowered to release the above-mentioned engagement between the notch portion 41a and the engagement portion 47a, and the positioning pin 43 and the pin receiving portion 42 are also removed.
By fitting a, the select disc portion 41 and the spline nut 42 are fixed in the rotation direction around the sub head rotation center R. After the fixing, as shown in FIG. 24 (D), the select disk portion 41 and the suction nozzles 1 are moved counterclockwise with the positional relationship between the suction nozzles 1 and the punched holes 41b being maintained. Rotation movement of 160 degrees is performed. By this rotational movement, the suction nozzle 1-A3 is positioned above the component supply position 6a-1 and the suction nozzle 1-A6 is positioned above the component supply position 6a-2, and the selection disc portion 41 is lowered to suction. Only the nozzles 1-A3 and the suction nozzles 1-A6 are lowered to move the suction nozzles 1-A.
3 from the component supply unit 6a-1 and the suction nozzle 1-
By A6, each electronic component 2 is sucked and taken out from the component supply unit 6a-2 at the same time.

In FIG. 24, among the suction nozzles 1 of the sub head 3-A, the suction nozzles 1-A1 and 1-A4, which are located in point-symmetrical positions with respect to each other, simultaneously suction the electronic components 2. The procedure of the above selection operation in the case where the suction nozzles 1-A3 and the suction nozzles 1-A6 that are also point-symmetrical to each other perform the suction extraction of the electronic component 2 at the same time after the extraction is performed has been described. Among the suction nozzles 1 included in 3-A, the selection operation can be performed for the other suction nozzles 1 which are line-symmetrical to each other in the same procedure as described above.

Next, when the plurality of electronic components 2 are mounted on the circuit board 4 by utilizing the fact that the head portion 101 is provided with the three sub heads 3, each electronic component 2 is attached.
About the method of shortening the time required for the mounting operation of
This will be described with reference to FIGS. 26 and 27. FIG. 26 is a timing chart showing the temporal relationship between the lifting / lowering operation of each sub-head 3, the rotating operation, the moving operation by the XY robot 8, and the nozzle selecting operation when the mounting operation is performed by the head unit 101, and FIG. Shows the suction nozzle 901 as a comparison target with the timing chart of FIG.
7 is a timing chart of a conventional component mounting head 900 provided in a row of zero pieces. Note that the same reference numerals as those used in FIGS. 9 and 10 are used to identify the sub head 3 and the suction nozzle 1. Also, FIG.
6 and FIG. 27, the horizontal axis is the time axis, and the vertical axis shows the items of each operation in the head unit 101 or the component mounting head 900. Here, the XY movement operation refers to the movement operation of the head unit 101 or the component mounting head 900 in the X-axis direction or the Y-axis direction by the XY robot 8 or the like, and the selection operation refers to the suction nozzle 1 or the suction nozzle 1 for performing the lifting operation. A selection operation of the suction nozzle 901 by the nozzle selection mechanism 40 or the like is shown, a lifting operation is a lifting operation of the suction nozzle 1 or the suction nozzle 901, and a rotation operation is a head unit 1.
In No. 01, the rotation operation of each suction nozzle 1 about the sub head rotation center R is provided. In the component mounting head 900, a mechanism for rotating each suction nozzle 901 around the sub head rotation center R like the head unit 101 is provided. However, since the respective suction nozzles 901 can be rotationally moved around their respective centers, the rotation operation of the respective suction nozzles 901 is shown. Further, in FIG. 26 and FIG. 27, regarding the XY movement operation and the rotation operation, in relation to other operations, time periods in which the respective operations can be performed are shown.

In FIG. 26, first, one sub head 3 included in the head portion 101, for example, the first sub head 3 is provided.
Focusing on the operation of mounting the electronic component 2 at the component mounting position on the circuit board 4 in -A, the first sub head 3 will be described.
-In A, mounting the electronic component 2 on the circuit board 4 1
As the book suction nozzle 1, for example, a suction nozzle 1-A1
Is selected. After that, the electronic component 2 already mounted on the circuit board 4 (or the electronic component 2 to be mounted) and the electronic component 2 sucked and held by the suction nozzle 1-A1 do not interfere with each other at a height position H2 (hereinafter, referred to as a height position H2). Interference avoidance height position H
The suction nozzle 1-A1 is lowered to 2), the lowering is stopped at the interference avoidance height position H2, and the mounting operation standby state is set (hereinafter, operation 1 is a lowering standby operation). Then, the suction nozzle 1-A1 is lowered from the interference avoidance height position H2 to the mounting height position H3 to fix the electronic component 2 to the circuit board 4 and suck the electronic component 2 by the suction nozzle 1-A1. Release the holding, suction nozzle 1-A
1 is raised and the electronic component 2 is mounted on the circuit board 4 (hereinafter, the mounting operation will be referred to as operation 2). After that, the suction nozzle 1-A1 is further raised above the interference avoidance height position H2 in the ascending / descending height range of the suction nozzle 1 to reach the upper end position H.
1 and then, in the first sub head 3-A, for example, the suction nozzle 1-A2 is selected as another suction nozzle 1 for performing the mounting operation of the electronic component 2 (hereinafter, operation 3 is a rising selection operation).

As described above, the mounting operation in the first sub head 3-A can be divided into the operation 1, the operation 2 and the operation 3, and each of such operations is sequentially repeated to obtain a plurality of electronic parts. 2 is mounted on the circuit board 4. Further, the operation of mounting the electronic component 2 on the circuit board 4 is performed by the second sub head 3-B and the third sub head 3
The same operation is performed for -C, and 1 in sub head 3
After the electronic component 2 is mounted by the single suction nozzle 1, the single suction nozzle 1 in another sub head 3
The mounting operation of the electronic components 2 is performed in such a manner that the mounting operations of the respective sub heads 3 are sequentially performed.

As shown in FIG. 26, specifically, for example, operation 1 is performed in the first sub head 3-A,
After the suction nozzle 1-A1 is placed in the mounting standby state, the second
Also in the sub head 3-B, the suction nozzle 1-B1 is selected and the operation 1 is similarly performed.
Is lowered to the interference avoidance height position H2, the descending is stopped at the interference avoidance height position H2, and the mounting operation standby state is set. Then, in the first sub head 3-A, operation 2
After the suction nozzle 1-A2 is selected in the operation 3, the suction nozzle 1-A1 is lowered to the interference avoidance height position H2 by performing the operation 1 again. The suction nozzle 1-B that has been in the mounting operation standby state is stopped in the second sub head 3-B while the descent is stopped at H2 and the mounting operation standby state is set.
1 is lowered from the interference avoidance height position H2 to the mounting height position H3, and the mounting operation is performed as operation 2.

After the operation 1 is performed in the second sub head 3-B and the suction nozzle 1-B1 is placed in the mounting standby state, the suction nozzle 1-C1 is also selected in the third sub head 3-C. Then, the same operation 1 is performed, the suction nozzle 1-C1 is lowered to the interference avoidance height position H2, the descending is stopped at the interference avoidance height position H2, and the mounting operation standby state is set.

Then, in the second sub head 3-B,
The rising selection operation is performed as operation 3, and the suction nozzle 1-B
After selecting 2, the operation 1 is performed again, whereby the suction nozzle 1-B2 is lowered to the interference avoidance height position H2, and the descending is stopped at the interference avoidance height position H2, and the mounting operation is performed. In the third sub head 3-C, the suction nozzle 1-C1 in the mounting operation standby state is lowered from the interference avoidance height position H2 to the mounting height position H3 in the third sub head 3-C, and the second operation is performed. The mounting operation is performed as. At this time, the suction nozzle 1-A2 in the first sub head 3-A remains in the mounting operation standby state.

Then, in the third sub head 3-C,
The rising selection operation is performed as the operation 3, and the suction nozzle 1-C
After 2 is selected, the operation 1 is performed again, whereby the suction nozzle 1-C2 is lowered to the interference avoidance height position H2, the descending is stopped at the interference avoidance height position H2, and the mounting operation is performed. In the first sub-head 3-A, the suction nozzle 1-A2 in the mounting operation standby state is lowered from the interference avoidance height position H2 to the mounting height position H3 in the first sub head 3-A, and the operation 2 is performed. The mounting operation is performed as.

In this way, in each sub head 3, the circuit board 4 of the electronic component 2 by the suction nozzle 1 is sequentially repeated.
Mounting operation is performed.

Further, the suction nozzle 1 is moved to align the suction nozzle 1 on which the electronic component 2 to be mounted on the circuit board 4 is suction-held with the mounting position of the electronic component 2 on the circuit board 4. Is a head unit 10 by the XY robot 8.
The movement is performed by the XY movement of 1. However, this movement is performed when the mounting operation of the movement 2 is not performed in any of the sub heads 3.

Further, in each sub-head 3, the rotation movement of each suction nozzle 1 about the sub-head rotation center R can be performed individually for each sub-head 3, so that each sub-head 3 has its own suction nozzle 1. Movement 2
The above rotational movement can be performed if the mounting operation is not performed.

Further, although the control unit 9 recognizes the suction posture by the suction nozzle 1 of each electronic component 2 from the image of each electronic component 2 taken by the image pickup device in the electronic component mounting device 102, For example, when the mounting angle of the electronic component 2 along the mounting surface of the circuit board 4 is displaced between the suction posture of the electronic component 2 and the mounting posture of the electronic component 2 to be mounted at the mounting position of the circuit board 4. There is. In such a case, based on the result of the above recognition, the rotational movement around the sub head rotation center R causes the rotational movement around the sub head rotation center R of the suction nozzle 1 that holds the electronic component 2 by suction. By performing the correction operation, the correction operation based on the rotational movement that eliminates the positional deviation is performed. However, since the correction operation based on the rotational operation can be performed individually for each sub head 3, each sub head 3 has its own operation. If the suction nozzle 1 included in is not performing the mounting operation of the operation 2, it can be freely performed.

Even when the suction nozzle 1 is performing the mounting operation of the operation 2 in one sub head 3, the other sub heads 3 are operated next without being affected by the mounting operation. It is possible to perform the lifting operation of each suction nozzle 1 in which the mounting operation of No. 2 is performed, and next, the suction nozzle 1 in which the mounting operation is performed is positioned at the interference avoidance height position H2, and the mounting operation standby state is set. It is possible to

In addition, in one sub head 3, before the suction nozzle 1 completes the mounting operation of the operation 2, in the other sub heads 3 in which the electronic component 2 is mounted next, the operation of the suction nozzle 1 is performed. Then, the suction nozzle 1 is positioned at the interference avoidance height position H2, and the mounting operation standby state is set.

The interference avoidance height position H2 is set in the electronic component mounting apparatus 102 in consideration of the maximum component thickness of the component thicknesses of the electronic components 2 mounted on the circuit board 4.
It is determined by the control unit 9. Instead of such a case, the component thickness of the electronic component 2 already mounted on the circuit board 4 by the head unit 101 and the electronic component 2 suction-held by each suction nozzle 1 in the head unit 101.
In the case where the controller 9 determines the optimum interference height position H2 each time the suction nozzle 1 picks up the electronic component 2 in the head unit 101 in consideration of the maximum component thickness among the component thicknesses. May be

On the other hand, in the conventional component mounting head 900, the mounting operation of the electronic component 2 to the circuit board 4 is sequentially performed by the ten suction nozzles 901 of the component mounting head 900, so that FIG. As shown, except that the standby operation in the descending standby operation, which is the operation 1 of the suction nozzle 901, is unnecessary, the operations 1 to 3 are sequentially repeated for each suction nozzle 1 in the sub head 3. The component mounting head 90
At 0, each operation from Operation 1 to Operation 3 is repeatedly performed for each suction nozzle 901.

Comparing the timing charts of FIGS. 26 and 27, first, the component mounting head 900 shown in FIG.
In the timing chart of FIG. 2, the time T2 required for the mounting operation of each electronic component 2 is the time required for the XY movement, the time required for the rotational movement, or the suction nozzle 90.
1 is lifted from the interference avoidance height position H2 and the upper end position H
1, the selection operation of another suction nozzle 901 is performed, and the another suction nozzle 901 is moved to the interference avoidance height position H2.
It is the total of the longest time required to be lowered to and the time required for the mounting operation in the second operation.

On the other hand, in the timing chart of the head unit 101 shown in FIG. 26, the time T1 required for the mounting operation of each electronic component 2 is the time required for the XY movement and the time required for the mounting operation in the operation 2. Is the sum of Since the head portion 101 includes the three sub heads 3, the position H for rotational movement and interference avoidance height H of the suction nozzle 1 is set.
Other sub-heads 3 perform the mounting operation, etc. for the ascending operation from 2 to the upper end position H1, the selecting operation of the other suction nozzle 1 and the lowering operation of the other suction nozzle 1 to the interference avoidance height position H2. This is because, when the sub-head 3 is mounted, the mounting operation can be performed individually for each sub-head 3.

Therefore, from the time required for the XY movement, the time required for the rotational movement, or the raising operation from the interference avoidance height position H2 of the suction nozzle 1 to the upper end position H1, the interference avoidance height position of the other suction nozzle 1 is described. In the case where the time required for the descending operation to reach H2 is shorter than the time required for the mounting operation of one electronic component 2 in the head unit 101, the time T1 required for the mounting operation of the electronic component 2 per unit is shorter than the time T2 in the conventional component mounting head 900. Can be shortened. Therefore, when the head unit 101 includes three sub heads 3, the time required for mounting the electronic component 2 can be shortened by performing the above-described continuous operation for each sub head 3. Therefore, it is possible to provide an efficient electronic component mounting method.

Next, regarding the three sub-heads 3 included in the head section 101, an example of an arrangement different from the arrangement of the suction nozzles 1 in FIG. 3 is a schematic plan layout view of the suction nozzles 1 shown in FIGS. 28 and 29. It will be described based on.

First, FIG. 28A shows a case where four suction nozzles in each sub head 3 are arranged at even intervals on the circumference of the sub head rotation center R of each suction nozzle 1. Is. That is, in each sub head 3, the four suction nozzles 1 are arranged point-symmetrically with respect to the rotation center R of each sub head. Further, in each of the sub heads 3, the diameter of the circumference in which the suction nozzle 1 is arranged has the same dimension as the arrangement interval P in the parts cassette 6. In addition, each sub head 3
Are arranged in a line with the arrangement intervals of the respective sub-head rotation centers R being twice as large as the arrangement interval P in the parts cassette 6 and substantially parallel to the arrangement direction of the parts cassette 6.

As a result, as shown in FIG.
On the line connecting the respective sub-head rotation centers R of the sub-heads 3, two suction nozzles 1 for each sub-head 3, that is, a total of six suction nozzles 1 in the head portion 101, are provided to six adjacent parts cassettes 6. It is possible to arrange them simultaneously above the component supply position 6a.

Further, as shown in FIG. 28B, in each sub-head 3 provided with the suction nozzle 1 having such an arrangement, the suction nozzle 1 is provided at the upper end position in the drawing on the circumference where the suction nozzle 1 is arranged. When each of the suction nozzles 1 is arranged, the suction nozzles 1 arranged at the upper end position can be arranged in a line, and at the same time, the suction nozzles 1 can be arranged.
Can be simultaneously arranged above the component supply positions 6a in the three parts cassettes 6 at intervals of twice the arrangement interval P.

In addition, instead of the case where the suction nozzles 1 of each sub head 3 are all arranged in the same manner, FIG.
And (B), as a combination of the above-described embodiments and the like, a sub head 3 having an arrangement of six suction nozzles 1 in FIG. 3 and a sub head 3 having an arrangement of four suction nozzles 1 in FIG. May be provided in combination with the head unit 101.

According to the above embodiment, the following various effects can be obtained.

First, the three sub heads 3 included in the head unit 101 each include six suction nozzles 1, and in each sub head 3, the suction nozzle 1 rotates around the sub head rotation center R of each suction nozzle 1. By arranging the suction nozzles 1 in such a manner that the suction nozzles 1 can rotate around the sub head rotation center R by the nozzle rotation mechanism 10 in the respective sub heads 3, the suction nozzles 1 can be arbitrarily rotated on their circumferences. The head unit 101 can be positioned, and the number of equipments per unit area of the suction nozzle 1 in the head unit 101 can be increased.

Further, in each of the sub heads 3, the suction nozzles 1 are arranged at equal intervals on the circumference around the sub head rotation center R of each of the suction nozzles 1, and the suction nozzles 1 are further arranged. The diameter of the circumference is the same as the arrangement interval P in the parts cassette 6, and each sub-head 3 has an arrangement interval of the axes of the respective sub-head rotation centers R that is 2 times the arrangement interval P of the parts cassette 6. Parts cassette 6 in a row with double spacing
By arranging the sub-heads 3 substantially parallel to each other, on the line connecting the respective sub-head rotation centers R of the sub-heads 3, there are two suction nozzles 1 for each sub-head 3, that is, a total of 6 suction nozzles in the head portion 101. It is possible to arrange the suction nozzles 1 of the same time at the same time.
Can be the same as the arrangement interval P of. As a result, each sub head rotation center R in the sub head 3
On the line connecting the two heads, two suction nozzles 1 for each sub head 3, that is, a total of six suction nozzles 1 in the head portion 101, are simultaneously provided above the component supply position 6a in the adjacent six parts cassettes 6. The electronic components 2 can be arranged, and the electronic components 2 can be sucked and taken out from the component supply positions 6a at the same time.

Therefore, it is possible to shorten the time required for picking up and picking up the electronic component 2 by the head section 101 while increasing the number of the suction nozzles 1 equipped per unit area in the head section 101. It is possible to improve the mounting efficiency of the electronic component in the electronic component mounting apparatus 102 including the 101.

Further, in each sub-head 3 in the head section 101, a nozzle selection mechanism 40 capable of selecting one or a plurality of arbitrary suction nozzles 1 out of the six suction nozzles 1 included in the sub-head 3, and nozzle selection Since the nozzle raising / lowering mechanism 20 for raising / lowering the suction nozzle 1 or the plurality of suction nozzles 1 selected by the mechanism 40 is individually provided, a plurality of suction / pickup of the electronic component 2 from the component supply unit 6 can be performed. The suction nozzles 1 capable of simultaneously sucking and taking out the electronic components 2 from the component supply position 6a are selected from the suction nozzles 1 included in the sub heads 3 to perform the descending operation, and the above components The electronic component 2 can be sucked and taken out from the supply position 6a at the same time, and the time required for the head unit 101 to suck and take the electronic component 2 can be shortened. .

Further, in the nozzle selection mechanism 40 in each sub head 3, a select in which a plurality of punched holes 41b capable of inserting the upper portion of the nozzle shaft 11 are formed in the circumferential shape in which each nozzle shaft 11 is arranged. Since the disc portion 41 is provided, the disc portion 41 is positioned at a position where it can be inserted into the ejection hole portion 41b due to the relative positional relationship between the arrangement of the ejection hole portion 41b and the arrangement of the nozzle shaft 11 in the select disc portion 41. Nozzle shaft 1
One or a plurality of nozzle shafts 11 other than 1 are brought into a selected state, and in this arrangement state, the select disc portion 41 is lowered by the nozzle elevating mechanism 20, and only the nozzle shaft 11 in the selected state is The upper portion is pushed down by the lower surface of the select disk portion 41 to lower the suction nozzle 1, and the sub-heads 3 can perform any lifting operation of the suction nozzle 1.

Further, in each sub head 3, the select disk portion 41 is moved toward the head frame 5 with respect to the rotation direction thereof.
Is provided with a notch mechanism 48 for fixing the select disc portion 41 and the spline nut 42 to the rotational direction thereof and a pin receiving portion 42a. By fixing the select disk portion 41 and rotating the suction nozzle 1 about the sub-head rotation center R, the relative movement between the arrangement of the punched hole portion 41b of the select disk portion 41 and the arrangement of the suction nozzle 1 is performed. Can be any suction nozzle 1
Can be positioned at a position selectable by the nozzle selection mechanism 40. Further, after this selection operation, the fixing by the notch mechanism 48 is released, and the select disk portion 41 and the spline nut 42 are fixed in the rotation direction by the positioning pin 43 and the pin receiving portion 42a, and suction is performed. By performing the rotational movement of the nozzle 1, it is possible to perform the rotational movement of the suction nozzle 1 while holding the selectable position.

Therefore, with such a structure of the nozzle selection mechanism 40, it is possible to simultaneously perform the operation of sucking and picking up the electronic component 2 from each of the component supply positions 6a.

Further, as a mechanism in which each sub-head 3 of the head portion 101 individually carries out the raising / lowering operation of each suction nozzle 1, for example, an air cylinder mechanism in which an air cylinder is individually provided for each suction nozzle 1 is provided. In such a case, the structure becomes complicated due to the installation of a large number of compressed air pipes for driving each of the air cylinders, and the air cylinder mechanism has a long shape with respect to its operating direction. As a result, the weight of each sub-head itself becomes large, the moving speed of the head portion decreases, and the time required for the mounting operation becomes long. Further, although each suction nozzle 1 can be lowered by an air cylinder, there is a problem that it is difficult to control the lowering amount and it is difficult to perform an accurate and reliable mounting operation. Further, for example, in the case where each suction nozzle 1 is provided with a ball screw mechanism using a motor individually, the suction amount can be lowered while controlling the descending amount of each suction nozzle 1. In the above, there is a problem that the shape becomes long with respect to the operation direction and the weight becomes large, the moving speed of the head portion decreases, and the time required for the mounting operation becomes long.

However, each of the sub heads 3 is provided with the select disk portion 41, and the nozzle elevating mechanism 20 for elevating the suction nozzles 1 selected by the nozzle selecting mechanism 40 is provided one by one. Since it is provided, it is not necessary to install a large number of compressed air pipes and the like, and the mechanical structure thereof can be made simpler than that of a cylinder or the like, and the nozzle lifting mechanism 2
At 0, the eccentric cam 22 and the ascending / descending cam follower 24 can be lowered while controlling the descending amount of the select disk portion 41 to descend the suction nozzle 1. Therefore,
The structure of each sub-head 3 can be simplified, the size and weight can be reduced, the moving speed of the head portion 101 can be increased, and the time required for mounting electronic components can be shortened. At the same time, a reliable and accurate mounting operation of the electronic component can be performed while controlling the descending amount of the suction nozzle.

In addition, since the suction head mounting valve 51 corresponding to each suction nozzle 1 is provided in each sub head 3, the suction holding or release of the suction holding of the electronic component 2 is performed for each suction nozzle 1. Therefore, it is possible to shorten the time required for sucking and taking out or mounting the electronic component 2 by one or a plurality of arbitrary suction nozzles 1.

Further, in each sub head 3 in the head portion 101, each suction nozzle 1 provided in the sub head 3
Since the nozzle rotation mechanism 10 that rotates around the sub-head rotation center R is provided, the electronic component 2 is sucked and taken out by the lifting operation of the selected suction nozzle 1 by the nozzle lifting mechanism 20. After that, the suction nozzle 1 is rotated by the nozzle rotating mechanism 10 without moving the head portion 101 by the XY robot 8, and the suction nozzle 1 different from the suction nozzle 1 that has performed the suction extraction. Is placed at a position where the electronic component 2 can be sucked and picked up from the component supply position 6a at the same time, and the other suction nozzle 1 is lowered by the nozzle elevating mechanism 20 to suck and pick up the electronic component 2. You can Further, in each sub-head 3, the operations of the nozzle elevating mechanism 20 and the nozzle rotating mechanism 10 are repeatedly performed, so that the head unit 101 simultaneously picks up and picks up the electronic components 2 from the plurality of component supply units 6a. This can be performed continuously, and the time required for the suction and removal of the electronic component 2 by the head unit 101 can be shortened, and the electronic component mounting efficiency in the electronic component mounting apparatus 102 including the head unit 101 can be improved. It becomes possible.

Further, also in the mounting operation of the electronic component 2 on the circuit board 4, the operation for the suction nozzle 1 by the nozzle elevating mechanism 20 and the nozzle rotating mechanism 10 is repeatedly performed in combination so that the head portion 101 The mounting operation of the electronic component 2 on the circuit board 4 can be continuously performed, and the time required for the mounting operation of the electronic component 2 by the head unit 101 can be shortened.
It is possible to improve the mounting efficiency of the electronic component in the electronic component mounting device 102 including 01.

Further, since each of the sub heads 3 in the head section 101 is provided with the nozzle rotating mechanism 10, when the electronic component 2 is picked up and picked up, the electronic part 2 at the component supply position 6a where the electronic part 2 is picked up and picked up. In the case where there is a displacement in the X-axis direction or the Y-axis direction between the suction center of No. 2 and the center of the suction nozzle 1 that picks up the electronic component 2 from the component supply position 6a, the nozzle By rotating the suction nozzle 1 by a minute amount by the rotation mechanism 10, the center of the suction nozzle 1 is finely moved in the X-axis direction or the Y-axis direction, and the suction center of the electronic component 2 and the center of the suction nozzle 1 are moved. It is possible to correct the position deviation that has occurred during the time and correct the suction posture of the electronic component 2. Further, the correction operation of the suction posture of the electronic component 2 in the X-axis direction or the Y-axis direction using the nozzle rotating mechanism 10 can be individually performed for each sub head 3 as needed.
Therefore, in the head portion 101, the suction and removal of the electronic component 2 can be stably performed, and such a head portion 1
The electronic component mounting apparatus 102 including 01 does not prevent the electronic component mounting efficiency from being improved.

Further, in the case where a plurality of electronic components 2 sucked and held by the three sub heads 3 included in the head portion 101 are mounted on the circuit board 4, the first sub head 3-which is the three sub heads 3 is mounted. In the case where the mounting operation is sequentially performed for each one suction nozzle of the suction nozzles 1 of the A, the second sub head 3-B, and the third sub head 3-C, When the suction nozzles in one of the sub heads 3 are performing the mounting operation, the other sub heads 3 do not affect the mounting operation, and the rotation movement of each suction nozzle 1 and the interference avoidance height position of the suction nozzles 1 in the other sub heads 3 It is possible to individually perform the ascending operation from H2 to the upper end position H1, the selecting operation of the suction nozzle 1, and the descending operation of the suction nozzle 1 to the interference avoidance height position H2. As a result, when the electronic nozzle 2 is mounted on the circuit board 4 by the suction nozzle 1 in the one sub head 3 or before the electronic head 2 is raised after the mounting operation, the other sub head 3 is Then, the suction nozzle 1 which performs the mounting operation is lowered to the interference avoidance height position H2 to be in the mounting operation standby state, and when the mounting operation is completed, the head section 101 is moved in the XY direction to be in the mounting operation standby state. After aligning the suction nozzle 1 with the mounting position of the electronic component 2 on the circuit board 4, the suction nozzle 1 can be lowered from the interference avoidance height position H2 to perform the mounting operation of the electronic component 2. Therefore, in such an electronic component mounting method, when the mounting operation of one suction nozzle 1 is completed, the next suction nozzle 1 is always in the mounting operation standby state, so that a plurality of continuous suction nozzles 1 are continuously mounted. The time required to mount the electronic component 2 on the circuit board 4 can be shortened, and it is possible to provide a mounting method of the electronic component with improved mounting efficiency.

By properly combining the arbitrary embodiments of the aforementioned various embodiments, the effects possessed by them can be produced.

[0194]

According to the first aspect of the present invention, the first sub head and the second sub head of the component mounting head are provided with a plurality of component holding members rotatably arranged around respective sub head rotation centers. Therefore, in each of the sub-heads, by the rotational movement of the component holding member around the sub-head rotation center, it is possible to position the component holding member at any position on the circumference of the respective rotational movement, It is possible to increase the number of equipments per unit area of the component holding member in the component mounting head.

Further, the arrangement direction of the respective sub head rotation centers and the arrangement direction of the component supply positions are substantially parallel to each other, and the distance between the respective sub head rotation centers is an integer multiple of 2 or more of the fixed distance. Further, since the diameter of the circumference around the rotation center of each of the sub heads is the same as an integral multiple of the constant interval, the one component holding member in the first sub head is connected to the first component supply position. When positioned above, the one component holding member in the second sub head can be positioned above the second component supply position, and the first component by the one component holding member in the first sub head. Extraction of the component from the supply position, and the portion from the second component supply position by the one component holding member in the second sub head It is possible to perform the extraction in simultaneously.

Further, in each of the sub heads, there is provided a selection mechanism having a selection disk provided with a plurality of recesses through which the upper portion of the component holding member can be inserted, and the arrangement of the recesses and the arrangement of the component holding members are provided. Depending on the positional relationship, one or a plurality of the component holding members are brought into a selected state,
By lowering the selection disk by the lifting mechanism,
The component holding member in the selected state can be pushed down to be lowered, and by such a mechanism, the simultaneous removal operation of the components from each of the first component supply position and the second component supply position is achieved. It becomes possible.

Therefore, it is possible to reduce the time required for taking out the component by the component mounting head while increasing the number of the component holding members provided per unit area in the component mounting head. It is possible to improve the component mounting efficiency in the component mounting apparatus.

Further, as a mechanism in which each sub-head of the component mounting head individually raises and lowers each component holding member,
For example, in the case of providing an air cylinder mechanism in which an air cylinder is individually provided for each of the component holding members, the structure thereof is provided by installing a plurality of compressed air pipes for individually driving the air cylinders. Is complicated and the shape of the air cylinder is long with respect to its operating direction, the weight of each sub-head itself increases, the moving speed of the component mounting head decreases, and the time required for mounting operation is reduced. Has the problem of becoming longer. Further, although each of the component holding members can be lowered by the air cylinder mechanism, it is difficult to control the amount of lowering and it is difficult to perform an accurate and reliable mounting operation. Furthermore, for example, in the case where a ball screw mechanism using a motor is individually provided for each of the component holding members, it is possible to descend while controlling the descending amount of each of the component holding members, There is a problem in that the mechanism has a long shape with respect to the operation direction and also has a large weight, the moving speed of the component mounting head decreases, and the mounting operation takes a long time.

However, each of the sub heads is provided with the selection mechanism having the selection disk and the elevating mechanism for elevating the component holding member selected by the selection mechanism. Therefore, it is not necessary to install a large number of compressed air pipes and the like, and the mechanical structure thereof can be made simpler than that of the cylinder mechanism and the like, and the cam portion and the cam follower portion in the elevating mechanism. Thus, it is possible to lower the component holding member while lowering the selective disc while controlling the lowering amount. Therefore, the structure of each of the sub heads can be simplified, the size and weight of each of the sub heads can be reduced, the moving speed of the component mounting head can be increased, and the time required for component mounting can be shortened. In addition to the above, it is possible to perform a reliable and accurate component mounting operation while controlling the descending amount of the component holding member.

According to the second aspect of the present invention, in each of the selection mechanisms in each of the sub heads, the rotation direction of the plurality of component holding members and the plurality of recesses of the selection disk about the sub head rotation center. By providing a relative position fixing mechanism for releasably fixing a relative position with respect to, and a disc fixing mechanism for releasably fixing the selected disc in the rotation direction, the disc fixing mechanism described above It is possible to perform the rotational movement of the plurality of component holding members while fixing the selection disc and move the relative positions of the plurality of component holding members and the plurality of recesses of the upper machine selection disc, as desired. The component mounting head capable of bringing the one or a plurality of component holding members of (1) into a selected state and obtaining the effect of the first aspect. It can be provided to become.

According to the third or fourth aspect of the present invention, since the cam mechanism, the rotation drive portion, and the cam follower portion are provided in the lifting mechanism of each of the sub heads, the rotation drive portion is provided. The cam portion is rotated about its rotation center, and the rotational movement of the eccentric shaft due to the rotational movement of the cam portion is transmitted to the cam follower portion, and the eccentricity transmitted in the cam follower portion. Can be converted into reciprocating motion in the direction of the center of rotation of the sub head. Further, by this reciprocating motion, the selected disk fixed to the cam follower portion can be raised and lowered while controlling the amount of raising and lowering, and the raising and lowering operation of the selected component holding member can be performed while controlling the amount of raising and lowering, A reliable and accurate mounting operation of the component can be performed, and the first aspect or the second aspect
It is possible to provide a component mounting head that can obtain the effects of the aspects.

According to the fifth aspect of the present invention, the rotational movement of each component holding member in the sub head about the sub head rotation center and the rotational movement of the selection disk in the selection mechanism about the sub head rotation center are performed. By providing each of the sub heads with a rotation mechanism for performing, moving the component holding member in each of the sub heads to a position on the circumference around the sub head rotation center that can be positioned above the component supply position, And the component mounting that can perform the selecting operation of the component holding member in the selection mechanism by performing the rotational movement of the selection disk, and can obtain the effect of any one of the first to fourth aspects. It becomes possible to provide a head.

According to the sixth aspect of the present invention, in the selection mechanism in each of the sub heads, the cross section of the recess formed in the selection disk has a substantially circular shape or a substantially oval shape. It is possible to provide a component mounting head that can have various selection patterns of the component holding member by the selection mechanism and can obtain the effect of any one of the first to fifth aspects.

According to the seventh aspect of the present invention, the component holding members are arranged at positions symmetrical with respect to the rotation center of the sub heads of the sub heads. The component holding members of the point-symmetrical set can be simultaneously positioned above the two component supply positions at two positions, and the component holding members of the set can move the component from the two component supply positions. It is possible to take out at the same time. Further, by performing the rotational movement of each of the component holding members in this state, the other set of the component holding members located in the point-symmetrical positions are continuously moved above the two component supplying positions. The parts can be placed one after another, and the simultaneous removal of the above parts can be performed continuously. Therefore, it is possible to shorten the time required to take out the component by the component mounting head,
It is possible to improve the component mounting efficiency in the component mounting apparatus including such a component mounting head.

According to the eighth aspect of the present invention, the first
In each of the selection mechanisms of the sub head and the second sub head, the recesses are formed on the selection disk so that the two component holding members arranged at the point-symmetrical positions can be simultaneously selected. By doing so, it becomes possible to provide a component mounting head that can obtain the effects of the seventh aspect.

According to the ninth aspect of the present invention, the first aspect
In each of the selection mechanisms of the sub head and the second sub head, the recesses are formed on the selection disk so that all the component holding members can be simultaneously selected, so that, for example, the components are held. It is possible to simultaneously lower each of the component holding members in the state and perform image pickup by the image pickup device that performs the image pickup of the holding state of the component in each of the component holding members at the same time. It is possible to provide a component mounting head that can be shortened and that can obtain the effect of any one of the first to eighth aspects.

[Brief description of drawings]

FIG. 1 is a perspective view of a head unit according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view of an electronic component mounting apparatus including the head unit of the above embodiment.

FIG. 3 is a plan layout view of suction nozzles in the head unit of the embodiment.

FIG. 4 is a vertical cross-sectional view of a sub head included in the head unit of the above embodiment.

5 is a cross-sectional view taken along the line AA of the sub head of FIG.

FIG. 6 is a vertical cross-sectional view of a sub head included in the head unit of the above embodiment, showing a state in which a select disk unit is fixed by a notch mechanism.

FIG. 7 is a vertical cross-sectional view of a sub head included in the head unit of the above embodiment, showing a state in which a suction nozzle is lowered.

8 is a diagram showing an elevating cam follower and an LM block of the sub head of FIG. 4, and FIG. 8B is a view of B- of FIG.
It is a B arrow line view, (A) is CC in the said figure (B).
FIG.

FIG. 9 is a vertical cross-sectional view of the sub head according to the above-described embodiment in a state where an electronic component is picked up and taken out.

FIG. 10 is a vertical cross-sectional view of the sub head of the above embodiment in a state where an electronic component mounting operation is performed.

FIG. 11 is a schematic explanatory view showing the relationship between the arrangement of suction nozzles and the arrangement state of parts cassettes in the head unit of the above embodiment.

FIG. 12 is a schematic explanatory view showing the relationship between the arrangement of suction nozzles and the arrangement state of parts cassettes in the head unit of the above embodiment.

FIG. 13 is a schematic explanatory view showing a method of mounting an electronic component by the head unit of the above embodiment.

FIG. 14 is a schematic explanatory view showing another mounting method of the electronic component by the head unit of the above embodiment.

FIG. 15 is a schematic explanatory view showing another mounting method of the electronic component by the head unit of the embodiment.

FIG. 16 is a schematic plan view of a circuit board on which electronic components are mounted by the head unit of the above embodiment.

FIG. 17 is a schematic explanatory view showing an arrangement relationship between a select disk portion and suction nozzles in the sub head of the above embodiment.

FIG. 18 is a schematic explanatory view showing an arrangement relationship between a select disk portion and suction nozzles in the sub head of the above embodiment.

FIG. 19 is a schematic explanatory view showing an arrangement relationship between a select disk portion and suction nozzles in the sub head of the above embodiment.

FIG. 20 is a schematic explanatory view showing an arrangement relationship between a select disk portion and suction nozzles in the sub head of the above embodiment.

FIG. 21 is a schematic explanatory view showing an arrangement relationship between a select disk portion and suction nozzles in the sub head of the above embodiment.

FIG. 22 is a schematic explanatory view showing an arrangement relationship between a select disk portion and suction nozzles in the sub head of the above embodiment.

FIG. 23 is a schematic explanatory view showing a suction nozzle selection operation by the nozzle selection mechanism in the sub head of the embodiment.

FIG. 24 is a schematic explanatory view showing a suction nozzle selection operation by the nozzle selection mechanism in the sub head of the embodiment.

25 is a partially enlarged view of a vertical cross-sectional view of the sub head in FIG. 4 described above.

FIG. 26 is a timing chart in the mounting operation of the electronic component by the head unit of the above embodiment.

FIG. 27 is a timing chart in a mounting operation of an electronic component by a conventional component mounting head.

FIG. 28 is a plan layout view showing the arrangement of suction nozzles in the head section of the embodiment.

FIG. 29 is a plan layout view showing still another arrangement of the suction nozzles in the head unit of the above embodiment.

FIG. 30 is a schematic perspective view of a conventional component mounting head.

[Explanation of symbols]

1 ... Suction nozzle, 2 ... Electronic component, 3 ... Sub head, 4 ...
Circuit board, 5 ... Head frame, 6 ... Parts cassette,
6a ... Component supply position, 7 ... Stage, 8 ... XY robot, 8a ... Y-axis robot, 8b ... X-axis robot, 9 ... Control unit, 10 ... Nozzle rotating mechanism, 11 ... Nozzle shaft,
11a ... Spring receiving portion, 11b ... Step portion, 12 ... Nozzle holder, 12a ... Bearing, 12b ... Step portion, 13 ... Spline shaft, 15 ... Rotating motor, 15a ... Drive shaft, 16
... biasing spring, 20 ... nozzle elevating mechanism, 21 ... elevating motor, 21a ... drive shaft, 22 ... eccentric cam, 22a ... eccentric shaft, 22b ... bearing, 23 ... LM block, 23a ... L
M guide part, 24 ... Elevating cam follower, 24a ... Oblong hole part, 24b ... Nut drive part, 24c ... LM rail part, 2
4d ... Bearings, 30 ... Imaging device, 40 ... Nozzle selection mechanism, 41 ... Select disk part, 41a ... Notch part, 41b
... Hole hole portion, 41c ... Projection portion, 42 ... Spline nut, 42a ... Pin receiving portion, 43 ... Positioning pin, 44 ... Abutment block, 44a ... Abutment portion, 45 ... Spring portion, 46 ... Bearing, 47 ... Notch fixing portion , 47a ... biting part, 47
b ... Spring part, 48 ... Notch mechanism, 50 ... Vacuum suction device,
51 ... Suction / mounting valve, 101 ... Head part, 102 ... Electronic component mounting device, P ... Arrangement interval, Q ... Mounting pitch, R ...
Sub head rotation center, Z1 to Z4 ... Mounting area.

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3C007 AS01 AS06 BS03 DS08 FS01                       NS17                 5E313 AA01 AA11 CC08 CD06 EE01                       EE24 EE25 FF24 FF28

Claims (9)

[Claims] 1. A first component supply position (6) among the component supply positions in a component supply section (6) in which a plurality of component supply positions (6a) are arranged at a constant interval (P).
A plurality of component holding members (1) for holding the component (2) supplied to (a) and mounting it on the circuit forming body (4) are rotatably arranged on the circumference around the sub head rotation center (R). A plurality of first sub-heads (3) and a plurality of components (2) supplied to the second component supply position (6a) among the component supply positions of the component supply unit are held and attached to the circuit forming body. A second sub-head (3) in which the component holding member (1) is rotatably arranged on the circumference around the sub-head rotation center (R), and the arrangement direction of the respective sub-head rotation centers and the component supply position. The arrangement directions are substantially parallel to each other, the distance between the rotation centers of the sub heads is an integer multiple of 2 or more of the constant distance, and the diameter of the circumference around the rotation centers of the sub heads has the constant distance. With the same dimension that is an integer multiple of What, in each of the first sub-head and the second sub-head, one or a plurality of the component holding member Selectable selection mechanism from among the plurality of component holding members (40)
And an elevating mechanism (20) for elevating and lowering the one or more component holding members selected by the selecting mechanism, each of the selecting mechanisms being a plurality of insertable upper parts of the component holding members. Recess of (41
b) includes a selection disk (41) formed on the circumference around the sub head rotation center and rotatable about the sub head rotation center, and the plurality of component holding members or the selection disk around the sub head rotation center. The rotational movement of causes the one or more component holding members excluding the component holding member positioned so that the upper portion thereof can be inserted into the concave portion of the selection disk to be in a selected state, and each of the lifting mechanisms is , The selection disc is lowered to allow the upper part of the component holding member positioned to be inserted into the concave portion to be inserted into the concave portion, and the one or more component holding members selected by the selection mechanism are held. A component mounting head for a component mounting apparatus, characterized in that the upper part of the member is pushed down by the lower surface of the selection disk to lower the one or more component holding members. 2. The selection mechanism of each of the first sub-head and the second sub-head, wherein the plurality of component holding members and the plurality of recesses in the selection disk are relatively arranged with respect to a rotation direction around the sub-head rotation center. A relative position fixing mechanism (42a, 43) for releasably fixing various positions, and a disc fixing mechanism (48) for releasably fixing the selected disc in the rotation direction. While fixing the selection disc,
Performing the rotational movement of the plurality of component holding members to move the relative positions of the plurality of component holding members and the plurality of recesses of the upper machine selection disk to hold the one or more component holdings. The component mounting head for the component mounting apparatus according to claim 1, wherein the member is in a selected state. 3. An eccentric mechanism for rotating the center of rotation and an eccentric rotation about the center of rotation in a direction substantially orthogonal to a direction of the center of rotation of the subhead in the lifting mechanism of each of the first subhead and the second subhead. A cam part (22) having a core shaft, a rotary drive part (21) for rotating the cam part around the rotation center, and an eccentric rotary motion of the eccentric shaft of the cam part for rotating the sub head. The component mounting head for the component mounting apparatus according to claim 1 or 2, further comprising a cam follower portion (24) for converting into a reciprocating motion in a central direction. 4. The selection disc in the selection mechanism is
4. The component mounting head for a component mounting apparatus according to claim 3, wherein the peripheral portion is fixed to the cam follower portion in the direction of the center of rotation of the sub head, and the reciprocating motion of the cam follower portion raises and lowers the selected disk. 5. In each of the first sub-head and the second sub-head, the rotational movement of the plurality of component holding members around the sub-head rotation center by a rotary drive source, and the sub-head rotation of the selection disk in the selection mechanism. 5. A rotating mechanism for rotating around a center is provided.
Part mounting head for the component mounting apparatus according to claim 1. 6. The selection mechanism according to claim 1, wherein the plurality of recesses in the selection disc have a cross section of a substantially circular shape or a substantially oval shape on a plane orthogonal to the direction of the rotation center of the sub head. 5. A component mounting head for the component mounting device according to claim 5. 7. The first subhead and the second subhead respectively, wherein the plurality of component holding members are arranged at positions symmetrical with respect to a rotation center of the subhead. Part mounting head for the component mounting apparatus according to claim 1. 8. The selection disks of the first sub head and the second sub head, wherein the two component holding members arranged at the point-symmetrical positions can be selected simultaneously. The component mounting head for a component mounting apparatus according to claim 7, wherein the plurality of recesses are formed in the component mounting head. 9. The selection mechanism of each of the first sub head and the second sub head, wherein the plurality of recesses are formed in the selection disk so that all the component holding members can be simultaneously selected. 1
8. A component mounting head for the component mounting device according to any one of 1 to 8.