SG10201909509UA - Substrate cleaning member and substrate cleaning apparatus - Google Patents

Substrate cleaning member and substrate cleaning apparatus

Info

Publication number
SG10201909509UA
SG10201909509UA SG10201909509UA SG10201909509UA SG10201909509UA SG 10201909509U A SG10201909509U A SG 10201909509UA SG 10201909509U A SG10201909509U A SG 10201909509UA SG 10201909509U A SG10201909509U A SG 10201909509UA SG 10201909509U A SG10201909509U A SG 10201909509UA
Authority
SG
Singapore
Prior art keywords
substrate cleaning
cleaning apparatus
cleaning member
substrate
cleaning
Prior art date
Application number
SG10201909509UA
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201909509UA publication Critical patent/SG10201909509UA/en

Links

Classifications

    • B08B1/32—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B08B1/143—
    • B08B1/20—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
SG10201909509UA 2018-10-12 2019-10-11 Substrate cleaning member and substrate cleaning apparatus SG10201909509UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018193312A JP7166132B2 (en) 2018-10-12 2018-10-12 SUBSTRATE CLEANING MEMBER AND SUBSTRATE CLEANING APPARATUS

Publications (1)

Publication Number Publication Date
SG10201909509UA true SG10201909509UA (en) 2020-05-28

Family

ID=68280895

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201909509UA SG10201909509UA (en) 2018-10-12 2019-10-11 Substrate cleaning member and substrate cleaning apparatus

Country Status (7)

Country Link
US (1) US11501983B2 (en)
EP (1) EP3636356A1 (en)
JP (1) JP7166132B2 (en)
KR (1) KR20200041791A (en)
CN (1) CN111048442A (en)
SG (1) SG10201909509UA (en)
TW (1) TWI820206B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021206431A1 (en) 2020-04-06 2021-10-14 주식회사 엘지에너지솔루션 Separator for electrochemical element and method for manufacturing same
JP6892176B1 (en) * 2020-11-19 2021-06-23 不二越機械工業株式会社 Work cleaning device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB772599A (en) 1954-01-23 1957-04-17 Service Eng Ltd Improvements relating to brushing machines
US5375291A (en) 1992-05-18 1994-12-27 Tokyo Electron Limited Device having brush for scrubbing substrate
US5937469A (en) 1996-12-03 1999-08-17 Intel Corporation Apparatus for mechanically cleaning the edges of wafers
JPH11283952A (en) * 1998-03-30 1999-10-15 Shibaura Mechatronics Corp Brushing cleaner
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US20040040576A1 (en) 2002-08-29 2004-03-04 Yuxia Sun Wafer cleaning brush
KR100562502B1 (en) 2003-07-02 2006-03-21 삼성전자주식회사 Apparatus and method for treating a substrate's edge
JP3933670B2 (en) 2005-03-29 2007-06-20 東京エレクトロン株式会社 Substrate cleaning method and substrate cleaning apparatus
JP4768556B2 (en) 2006-09-15 2011-09-07 Ｎｅｃ液晶テクノロジー株式会社 Substrate cleaning apparatus and substrate cleaning method
JP2007272236A (en) 2007-04-11 2007-10-18 Advanced Display Inc Device and method for washing end surface of substrate, and manufacturing method for semiconductor device
JP2008282865A (en) 2007-05-08 2008-11-20 Fuji Electric Device Technology Co Ltd Scrubbing cleaning equipment, and roll sponge assembly for use therein
KR101020676B1 (en) * 2008-11-26 2011-03-09 세메스 주식회사 Apparatus for cleaning a substrate
WO2010125663A1 (en) * 2009-04-30 2010-11-04 アイオン株式会社 Cleaning sponge roller
JP5535687B2 (en) 2010-03-01 2014-07-02 株式会社荏原製作所 Substrate cleaning method and substrate cleaning apparatus
JP5645752B2 (en) * 2011-05-25 2014-12-24 株式会社荏原製作所 Substrate cleaning method and roll cleaning member
US9704729B2 (en) * 2013-06-13 2017-07-11 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein
JP7224128B2 (en) 2018-08-09 2023-02-17 株式会社荏原製作所 Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and substrate cleaning tool manufacturing method

Also Published As

Publication number Publication date
CN111048442A (en) 2020-04-21
TW202017030A (en) 2020-05-01
KR20200041791A (en) 2020-04-22
US20200118843A1 (en) 2020-04-16
JP7166132B2 (en) 2022-11-07
TWI820206B (en) 2023-11-01
US11501983B2 (en) 2022-11-15
JP2020061514A (en) 2020-04-16
EP3636356A1 (en) 2020-04-15

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