SG10201707070RA - Substrate cleaning apparatus and substrate cleaning method - Google Patents

Substrate cleaning apparatus and substrate cleaning method

Info

Publication number
SG10201707070RA
SG10201707070RA SG10201707070RA SG10201707070RA SG10201707070RA SG 10201707070R A SG10201707070R A SG 10201707070RA SG 10201707070R A SG10201707070R A SG 10201707070RA SG 10201707070R A SG10201707070R A SG 10201707070RA SG 10201707070R A SG10201707070R A SG 10201707070RA
Authority
SG
Singapore
Prior art keywords
substrate cleaning
cleaning apparatus
cleaning method
substrate
cleaning
Prior art date
Application number
SG10201707070RA
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201707070RA publication Critical patent/SG10201707070RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
SG10201707070RA 2016-09-02 2017-08-30 Substrate cleaning apparatus and substrate cleaning method SG10201707070RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016171398A JP6710129B2 (en) 2016-09-02 2016-09-02 Substrate cleaning apparatus and substrate cleaning method

Publications (1)

Publication Number Publication Date
SG10201707070RA true SG10201707070RA (en) 2018-04-27

Family

ID=61280768

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201707070RA SG10201707070RA (en) 2016-09-02 2017-08-30 Substrate cleaning apparatus and substrate cleaning method

Country Status (6)

Country Link
US (1) US11081373B2 (en)
JP (1) JP6710129B2 (en)
KR (1) KR102215268B1 (en)
CN (1) CN107799443B (en)
SG (1) SG10201707070RA (en)
TW (1) TWI701728B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6877221B2 (en) * 2017-04-05 2021-05-26 株式会社荏原製作所 Substrate cleaning equipment, substrate cleaning method and control method of substrate cleaning equipment
CN110335835B (en) * 2019-06-06 2021-07-16 上海中欣晶圆半导体科技有限公司 Device and method for cleaning silicon wafer by using two-section type quartz nozzle
KR102583342B1 (en) 2020-10-22 2023-09-26 세메스 주식회사 Apparatus for processing substrate
JP2022138907A (en) * 2021-03-11 2022-09-26 キオクシア株式会社 Substrate cleaning device and substrate cleaning method
JP2023167740A (en) * 2022-05-13 2023-11-24 株式会社荏原製作所 Substrate cleaning device, substrate processing device, substrate cleaning method, and substrate processing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4007766B2 (en) 2000-02-29 2007-11-14 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
WO2005104200A1 (en) * 2004-04-23 2005-11-03 Tokyo Electron Limited Substrate cleaning method, substrate cleaning equipment, computer program and program recording medium
JP5940824B2 (en) * 2012-02-07 2016-06-29 株式会社荏原製作所 Substrate cleaning method
JP2014082470A (en) * 2012-09-27 2014-05-08 Ebara Corp Substrate processing apparatus
JP6265702B2 (en) 2012-12-06 2018-01-24 株式会社荏原製作所 Substrate cleaning apparatus and substrate cleaning method
TWI664672B (en) 2013-07-03 2019-07-01 荏原製作所股份有限公司 Substrate cleaning apparatus and substrate cleaning method
JP6600470B2 (en) 2014-04-01 2019-10-30 株式会社荏原製作所 Cleaning device and cleaning method

Also Published As

Publication number Publication date
US11081373B2 (en) 2021-08-03
US20180068877A1 (en) 2018-03-08
TW201812876A (en) 2018-04-01
TWI701728B (en) 2020-08-11
JP6710129B2 (en) 2020-06-17
CN107799443B (en) 2023-09-26
JP2018037598A (en) 2018-03-08
KR102215268B1 (en) 2021-02-15
CN107799443A (en) 2018-03-13
KR20180026337A (en) 2018-03-12

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