SG11201607632YA - Substrate processing apparatus and pipe cleaning method for substrate processing apparatus - Google Patents

Substrate processing apparatus and pipe cleaning method for substrate processing apparatus

Info

Publication number
SG11201607632YA
SG11201607632YA SG11201607632YA SG11201607632YA SG11201607632YA SG 11201607632Y A SG11201607632Y A SG 11201607632YA SG 11201607632Y A SG11201607632Y A SG 11201607632YA SG 11201607632Y A SG11201607632Y A SG 11201607632YA SG 11201607632Y A SG11201607632Y A SG 11201607632YA
Authority
SG
Singapore
Prior art keywords
processing apparatus
substrate processing
cleaning method
pipe cleaning
pipe
Prior art date
Application number
SG11201607632YA
Inventor
Junji Kunisawa
Toru Maruyama
Masayoshi Imai
Koji Maeda
Mitsuru Miyazaki
Teruaki Hombo
Fujihiko Toyomasu
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201607632YA publication Critical patent/SG11201607632YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201607632YA 2014-03-27 2015-03-17 Substrate processing apparatus and pipe cleaning method for substrate processing apparatus SG11201607632YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014066998A JP6159282B2 (en) 2014-03-27 2014-03-27 Substrate processing apparatus and piping cleaning method for substrate processing apparatus
PCT/JP2015/057938 WO2015146724A1 (en) 2014-03-27 2015-03-17 Substrate processing device, and washing method for plumbing of substrate processing device

Publications (1)

Publication Number Publication Date
SG11201607632YA true SG11201607632YA (en) 2016-10-28

Family

ID=54195246

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201607632YA SG11201607632YA (en) 2014-03-27 2015-03-17 Substrate processing apparatus and pipe cleaning method for substrate processing apparatus

Country Status (7)

Country Link
US (1) US10438818B2 (en)
JP (1) JP6159282B2 (en)
KR (2) KR102282729B1 (en)
CN (1) CN106165067B (en)
SG (1) SG11201607632YA (en)
TW (1) TWI649780B (en)
WO (1) WO2015146724A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101776016B1 (en) 2015-10-21 2017-09-07 세메스 주식회사 method for cleaning piping and Apparatus for treating substrate
JP2017177303A (en) * 2016-03-31 2017-10-05 株式会社荏原製作所 Substrate polishing device, method for cleaning the same and device for supplying liquid to substrate polishing device
CN116469811A (en) * 2016-12-16 2023-07-21 株式会社荏原制作所 Cleaning liquid supply device, cleaning unit, and storage medium storing program

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4537640A (en) * 1977-08-30 1985-08-27 Schering Aktiengesellschaft Rinsing of articles to remove an adhering substance
JPS6369588A (en) 1986-09-09 1988-03-29 Mitsubishi Electric Corp System for supplying pure water to semiconductor washing vessel
JPH0647105B2 (en) * 1989-12-19 1994-06-22 株式会社荏原総合研究所 Purification method and device for pure water or ultrapure water
JPH04139822A (en) 1990-10-01 1992-05-13 Nec Corp Cleaning device for semiconductor device
JP2533460Y2 (en) * 1991-12-13 1997-04-23 大日本スクリーン製造株式会社 Substrate cleaning device
JP3433215B2 (en) 1993-03-29 2003-08-04 芝浦メカトロニクス株式会社 Cleaning equipment
US5542441A (en) 1994-08-03 1996-08-06 Yieldup International Apparatus for delivering ultra-low particle counts in semiconductor manufacturing
JPH1099855A (en) * 1996-08-05 1998-04-21 Sony Corp Ultrapure water supply plant equipped with ultrafiltration function and supply of ultrapure water
JP2008246319A (en) * 2007-03-29 2008-10-16 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method
JP5511190B2 (en) * 2008-01-23 2014-06-04 株式会社荏原製作所 Operation method of substrate processing apparatus
JP5744382B2 (en) * 2008-07-24 2015-07-08 株式会社荏原製作所 Substrate processing apparatus and substrate processing method
KR101958874B1 (en) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
JP5422143B2 (en) * 2008-06-04 2014-02-19 株式会社荏原製作所 Substrate gripping mechanism
CN103839857B (en) * 2008-06-04 2017-09-19 株式会社荏原制作所 Substrate board treatment and method, substrate grasping mechanism and substrate grasping method
CA2746773A1 (en) * 2011-07-18 2013-01-18 Fiber Connections Inc. Field terminated fiber optic and electrical connection device
JP6212253B2 (en) * 2012-11-15 2017-10-11 株式会社荏原製作所 Substrate cleaning apparatus and substrate cleaning method
JP6104836B2 (en) * 2014-03-13 2017-03-29 東京エレクトロン株式会社 Separation / reproduction apparatus and substrate processing apparatus

Also Published As

Publication number Publication date
US20170117165A1 (en) 2017-04-27
WO2015146724A1 (en) 2015-10-01
JP2015191972A (en) 2015-11-02
CN106165067A (en) 2016-11-23
KR102282729B1 (en) 2021-07-29
KR20160138145A (en) 2016-12-02
TW201543540A (en) 2015-11-16
KR20210080609A (en) 2021-06-30
CN106165067B (en) 2019-12-13
TWI649780B (en) 2019-02-01
US10438818B2 (en) 2019-10-08
JP6159282B2 (en) 2017-07-05

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