SG11202005740XA - Wafer cleaning apparatus and wafer cleaning method - Google Patents

Wafer cleaning apparatus and wafer cleaning method

Info

Publication number
SG11202005740XA
SG11202005740XA SG11202005740XA SG11202005740XA SG11202005740XA SG 11202005740X A SG11202005740X A SG 11202005740XA SG 11202005740X A SG11202005740X A SG 11202005740XA SG 11202005740X A SG11202005740X A SG 11202005740XA SG 11202005740X A SG11202005740X A SG 11202005740XA
Authority
SG
Singapore
Prior art keywords
wafer cleaning
cleaning apparatus
cleaning method
wafer
cleaning
Prior art date
Application number
SG11202005740XA
Inventor
Kensaku Igarashi
Tatsuo Abe
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of SG11202005740XA publication Critical patent/SG11202005740XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11202005740XA 2018-02-02 2019-01-16 Wafer cleaning apparatus and wafer cleaning method SG11202005740XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018016959A JP6642597B2 (en) 2018-02-02 2018-02-02 Wafer cleaning apparatus and wafer cleaning method
PCT/JP2019/000982 WO2019150940A1 (en) 2018-02-02 2019-01-16 Wafer cleaning process device and wafer cleaning method

Publications (1)

Publication Number Publication Date
SG11202005740XA true SG11202005740XA (en) 2020-07-29

Family

ID=67479697

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202005740XA SG11202005740XA (en) 2018-02-02 2019-01-16 Wafer cleaning apparatus and wafer cleaning method

Country Status (6)

Country Link
JP (1) JP6642597B2 (en)
KR (1) KR102650020B1 (en)
CN (1) CN111602231B (en)
SG (1) SG11202005740XA (en)
TW (1) TWI780296B (en)
WO (1) WO2019150940A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7351331B2 (en) * 2021-10-29 2023-09-27 株式会社Sumco Single-wafer spin cleaning drying method for silicon wafers
WO2023097193A1 (en) * 2021-11-23 2023-06-01 Lam Research Corporation Apparatuses and techniques for cleaning a multi-station semiconductor processing chamber

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1763072A4 (en) * 2004-06-04 2010-02-24 Tokyo Electron Ltd Substrate cleaning method and computer readable recording medium
JP2009064795A (en) * 2005-12-27 2009-03-26 Tokyo Electron Ltd Substrate processing device and substrate processing method
JP2008060107A (en) 2006-08-29 2008-03-13 Toshiba Matsushita Display Technology Co Ltd Spin cleaner
JP2008108775A (en) * 2006-10-23 2008-05-08 Sumitomo Precision Prod Co Ltd Rotary substrate-treating device
JP2010003816A (en) * 2008-06-19 2010-01-07 Tokyo Seimitsu Co Ltd Wafer cleaning device
JP5371863B2 (en) * 2010-03-30 2013-12-18 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP5890108B2 (en) * 2011-04-27 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス Cleaning method
JP5978071B2 (en) * 2012-08-31 2016-08-24 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
JP6059087B2 (en) * 2013-05-31 2017-01-11 東京エレクトロン株式会社 Liquid processing apparatus, liquid processing method, and storage medium
JP2015046522A (en) * 2013-08-29 2015-03-12 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus
JP6626762B2 (en) * 2016-03-30 2019-12-25 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
JP6712482B2 (en) * 2016-03-31 2020-06-24 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
JP6817748B2 (en) * 2016-08-24 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment and substrate processing method

Also Published As

Publication number Publication date
KR102650020B1 (en) 2024-03-22
TW201935547A (en) 2019-09-01
CN111602231A (en) 2020-08-28
CN111602231B (en) 2023-09-01
WO2019150940A1 (en) 2019-08-08
KR20200112829A (en) 2020-10-05
JP6642597B2 (en) 2020-02-05
JP2019134124A (en) 2019-08-08
TWI780296B (en) 2022-10-11

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