SG10201906216RA - Substrate cleaning device and substrate cleaning method - Google Patents

Substrate cleaning device and substrate cleaning method

Info

Publication number
SG10201906216RA
SG10201906216RA SG10201906216RA SG10201906216RA SG10201906216RA SG 10201906216R A SG10201906216R A SG 10201906216RA SG 10201906216R A SG10201906216R A SG 10201906216RA SG 10201906216R A SG10201906216R A SG 10201906216RA SG 10201906216R A SG10201906216R A SG 10201906216RA
Authority
SG
Singapore
Prior art keywords
substrate cleaning
cleaning device
cleaning method
substrate
cleaning
Prior art date
Application number
SG10201906216RA
Inventor
Haiyang Xu
Mitsuhiko Inaba
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201906216RA publication Critical patent/SG10201906216RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B08B1/143—
    • B08B1/145—
    • B08B1/20—
    • B08B1/32—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0217—Use of a detergent in high pressure cleaners; arrangements for supplying the same
SG10201906216RA 2018-07-06 2019-07-03 Substrate cleaning device and substrate cleaning method SG10201906216RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018129086A JP7079164B2 (en) 2018-07-06 2018-07-06 Board cleaning device and board cleaning method

Publications (1)

Publication Number Publication Date
SG10201906216RA true SG10201906216RA (en) 2020-02-27

Family

ID=69102266

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201906216RA SG10201906216RA (en) 2018-07-06 2019-07-03 Substrate cleaning device and substrate cleaning method

Country Status (6)

Country Link
US (4) US11164757B2 (en)
JP (1) JP7079164B2 (en)
KR (1) KR102454619B1 (en)
CN (1) CN110690141A (en)
SG (1) SG10201906216RA (en)
TW (1) TWI786309B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6758247B2 (en) * 2017-05-10 2020-09-23 株式会社荏原製作所 Cleaning equipment and substrate processing equipment, cleaning equipment maintenance methods, and programs

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60193010A (en) * 1984-03-14 1985-10-01 Yoshiki Kogyo Kk Pid controller
JPH0814452B2 (en) * 1985-03-04 1996-02-14 株式会社日立製作所 Refrigerator temperature control system
DE3621083A1 (en) * 1986-06-24 1988-01-07 Philips Patentverwaltung Control method for generating a manipulated variable and circuit arrangement for carrying out this control method
JP3764228B2 (en) 1996-12-17 2006-04-05 芝浦メカトロニクス株式会社 Brush cleaning device
JP3463908B2 (en) * 1997-02-17 2003-11-05 大日本スクリーン製造株式会社 Substrate cleaning method and substrate cleaning apparatus
JP3949807B2 (en) * 1998-03-09 2007-07-25 沖電気工業株式会社 Substrate cleaning apparatus and substrate cleaning method
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
JP3953716B2 (en) * 2000-08-01 2007-08-08 株式会社荏原製作所 Substrate cleaning device
DE10253739B3 (en) * 2002-11-19 2004-05-06 Mtu Friedrichshafen Gmbh Idling rev regulation method for IC engine has two filters providing different filtered actual revs signals each compared with required revs signal for providing regulation disparities for rev regulator
JP2006261393A (en) * 2005-03-17 2006-09-28 Seiko Epson Corp Device and method for washing substrate
JP2006324429A (en) 2005-05-18 2006-11-30 Nec Electronics Corp Method for cleaning after mechanical chemical polishing
JP2008300608A (en) * 2007-05-31 2008-12-11 Yaskawa Electric Corp Substrate carrier provided with elevating/lowering position confirmation means and semiconductor manufacturing device provided with the same
US8868250B2 (en) * 2010-09-28 2014-10-21 Cisco Technology, Inc. Fan speed control
JP2013089797A (en) * 2011-10-19 2013-05-13 Ebara Corp Substrate cleaning method and substrate cleaning device
JP5328876B2 (en) * 2011-12-01 2013-10-30 株式会社日立パワーソリューションズ Roll press equipment
JP5878441B2 (en) * 2012-08-20 2016-03-08 株式会社荏原製作所 Substrate cleaning apparatus and substrate processing apparatus
JP6262983B2 (en) * 2012-10-25 2018-01-17 株式会社荏原製作所 Substrate cleaning apparatus and substrate cleaning method
JP5825267B2 (en) * 2013-01-21 2015-12-02 コニカミノルタ株式会社 Image processing apparatus and motor rotation control method
JP6279276B2 (en) * 2013-10-03 2018-02-14 株式会社荏原製作所 Substrate cleaning apparatus and substrate processing apparatus
JP6085572B2 (en) * 2014-01-09 2017-02-22 株式会社荏原製作所 Pressure control apparatus and polishing apparatus provided with the pressure control apparatus
JP5632115B1 (en) * 2014-03-04 2014-11-26 株式会社ニレコ Feedback control method, feedback control device, and program
KR102193334B1 (en) * 2014-04-18 2020-12-22 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing device, substrate processing system, and substrate processing method
JP2015220402A (en) * 2014-05-20 2015-12-07 株式会社荏原製作所 Substrate cleaning device and method performed by substrate cleaning device
JP6454245B2 (en) * 2014-10-21 2019-01-16 東京エレクトロン株式会社 Substrate liquid processing method, substrate liquid processing apparatus, and computer readable storage medium storing substrate liquid processing program
KR102454775B1 (en) * 2015-02-18 2022-10-17 가부시키가이샤 에바라 세이사꾸쇼 Substrate cleaning apparatus, substrate cleaning method and substrate processing apparatus
JP6328577B2 (en) 2015-02-24 2018-05-23 株式会社荏原製作所 Load measuring device and load measuring method
JP6646460B2 (en) * 2016-02-15 2020-02-14 株式会社荏原製作所 Substrate cleaning device and substrate processing device
JP6767834B2 (en) * 2016-09-29 2020-10-14 株式会社荏原製作所 Substrate cleaning equipment and substrate processing equipment
CN106847822B (en) * 2017-03-08 2018-11-16 长江存储科技有限责任公司 3D nand memory part, manufacturing method and step calibration method
CN108227477B (en) * 2017-12-06 2020-12-29 中国飞机强度研究所 Self-adaptive PID control method

Also Published As

Publication number Publication date
KR102454619B1 (en) 2022-10-17
US11164757B2 (en) 2021-11-02
KR20200005481A (en) 2020-01-15
US20230307259A1 (en) 2023-09-28
JP2020009882A (en) 2020-01-16
US20230326770A1 (en) 2023-10-12
CN110690141A (en) 2020-01-14
US20220020610A1 (en) 2022-01-20
JP7079164B2 (en) 2022-06-01
TW202006815A (en) 2020-02-01
US20200013640A1 (en) 2020-01-09
TWI786309B (en) 2022-12-11

Similar Documents

Publication Publication Date Title
PL3205764T3 (en) Cleaning method and cleaning device
GB2570974B (en) Cleaning robot and cleaning device thereof
SG11202007852YA (en) Substrate cleaning device and substrate cleaning method
TWI562216B (en) Substrate cleaning method and substrate cleaning apparatus
EP3718652C0 (en) Cleaning method and cleaning device
SG11201911753QA (en) Cleaning device and cleaning method
SG11202100206TA (en) Configuration method and device
PL3446797T3 (en) Cleaning device and method for cleaning an auger
SG10201707070RA (en) Substrate cleaning apparatus and substrate cleaning method
SG11202100352YA (en) Interaction method and device
HUE056992T2 (en) Method and device for surface treatment
EP3623062A4 (en) Cleaning device and cleaning apparatus
EP3614419A4 (en) Film-forming device and method for cleaning same
SG10201909509UA (en) Substrate cleaning member and substrate cleaning apparatus
EP3505261A4 (en) Cleaning device and cleaning method
SG10201705171XA (en) Cleaning apparatus and substrate processing apparatus
SG11201708086UA (en) Cleaning member and substrate cleaning apparatus
SG10201912088UA (en) Substrate cleaning device
SG11202005740XA (en) Wafer cleaning apparatus and wafer cleaning method
GB201818884D0 (en) Forthing device and method thereof
SG11202011443TA (en) Membrane cleaning device and membrane cleaning method
SG10201906216RA (en) Substrate cleaning device and substrate cleaning method
EP4020528A4 (en) Substrate cleaning method and substrate cleaning device
KR102274622B9 (en) Substrate Inspection Device and Substrate Inspection Method
IL277901A (en) Cleaning device and method of cleaning