JP3463908B2 - Substrate cleaning method and substrate cleaning apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a substrate such as a glass substrate for a semiconductor wafer or a photomask, a glass substrate for a liquid crystal display device, a substrate for an optical disk, etc., by applying a cleaning tool with a desired pressing load. The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning.

[0002]

2. Description of the Related Art As a conventional substrate cleaning apparatus of this type,
For example, there is one disclosed in Japanese Patent Laid-Open No. 3-52228. This apparatus is configured so that the height position of the cleaning tool with respect to the held substrate can be arbitrarily adjusted, and by adjusting the height position, the pressing load of the cleaning tool on the substrate at the time of cleaning the substrate is set to a desired value. It is configured to be washable.

Further, JP-A-8-141518, JP-A-8-141519, and JP-A-8-243518.
The apparatus disclosed in Japanese Patent Laid-Open Publication No. 2003-242242 includes a sensor such as a load cell that detects the pressing load of the cleaning tool on the substrate. The substrate can be cleaned with higher accuracy by adjusting to a designated pressing load or by feedback control using the detection information from the sensor.

[0004]

However, the conventional example having such a structure has the following problems. In the above conventional apparatus, the pressing means for causing the cleaning tool to act on the substrate with a desired pressing load is configured to be driven by a control signal such as an electric signal. That is, when a desired pressing load is designated, the pressing unit is controlled by the control signal having a value corresponding to the pressing load, and the cleaning tool is caused to act on the substrate. The correspondence relationship between the pressing load and the control value of the pressing means is uniquely determined by the same type (having the same configuration) of the substrate cleaning apparatus. However, even with the same type of substrate cleaning equipment, there are machine differences (differences in machine part assembly accuracy and control system accuracy, etc.) between individual substrate cleaning equipment. Therefore, there is a problem that the pressing load of the cleaning tool on the substrate varies, and the pressing load of the cleaning tool on the substrate at the time of cleaning the substrate does not match the specified pressing load.

Further, even when the pressing means is replaced due to failure or damage, the pressing load of the cleaning tool on the substrate at the time of cleaning the substrate is not likely to be the specified pressing load.

Japanese Unexamined Patent Publication (Kokai) No. 8-267023 uses a pressing load measuring tool that receives a cleaning tool at the same level as the cleaning surface of the substrate and measures the pressing load from the cleaning tool. A device for measuring the pressing load from the cleaning tool at the same level as the cleaning surface, adjusting the control value of the pressing means so as to obtain the desired pressing load, and performing the actual substrate cleaning using the control value of the adjustment result. Is disclosed. According to this apparatus, the control value of the pressing unit that provides the desired pressing load is adjusted with reference to the measurement result obtained by using the pressing load measuring tool before the actual substrate cleaning. The substrate can be cleaned by causing the cleaning tool to accurately act on the substrate against the pressing load of. However, in this apparatus, when cleaning the substrate by changing the pressing load, it is always necessary to adjust the control value of the pressing means using the pressing load measuring tool, which is troublesome and reduces productivity. Was also invited.

Further, the conventional apparatus having the sensor for detecting the pressing load of the cleaning tool against the substrate has the following problems.

Since a detection signal such as an electric signal is output from this sensor, it is necessary to calibrate the correspondence between the detection value from this sensor and the pressing load. Conventionally, this calibration work was performed with the sensor removed from the device, and after the calibration work, the sensor was incorporated into the device and the calibration result was stored in the device. Therefore, the correspondence between the detection value from the sensor and the pressing load after being installed in the device may deviate from the calibration result, the pressing load cannot be detected accurately, and the substrate cleaning may not be performed accurately. . Such inconvenience also occurs when the sensor or the like is replaced due to failure or damage.

The present invention has been made in view of the above circumstances, and it is possible to accurately adjust the pressing load and detect the pressing load for each individual device with good work efficiency and without lowering productivity. It is an object of the present invention to provide a substrate cleaning method and a substrate cleaning apparatus that can be carried out.

[0010]

The present invention has the following constitution in order to achieve such an object. That is, according to the first aspect of the present invention, the pressing load of the cleaning tool on the substrate is arbitrarily designated, the pressing means is controlled, and the cleaning tool acts on the substrate with the designated pressing load to clean the substrate. In the substrate cleaning method, the actual pressing load from the cleaning tool incorporated in the substrate cleaning device at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning device and the substrate cleaning device are incorporated. The preparatory step of investigating the corresponding relationship with the control value of the pressing means for two or more different actual pressing loads, and the control value of the pressing means for the designated pressing load in the preparatory step Obtained by using a relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing means for the above, the pressing means is controlled by the control value, and the pressing load according to the control value It is characterized in that and a substrate cleaning step of cleaning the substrate by applying to a substrate the cleaning tool.

According to a second aspect of the present invention, in the substrate cleaning method according to the first aspect, the substrate cleaning apparatus is provided with a pressing load detecting means for detecting a pressing load of the cleaning tool on the substrate, and In the preparing step, the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus and the substrate cleaning apparatus are incorporated. The corresponding relationship with the detected value from the pressed load detecting means is further investigated for two or more different actual pressing loads, and in the substrate cleaning step, when the detected value is obtained from the pressing load detecting means, The obtained detection is performed using a relational expression determined based on the correspondence between the actual pressing load and the detected value from the pressing load detecting means for two or more points examined in the preparation step. The pressing load corresponding to the asking,
It is characterized in that the substrate is cleaned using the detection information.

According to a third aspect of the present invention, the pressing load of the cleaning tool on the substrate is arbitrarily designated, the pressing unit is controlled based on the detection information from the pressing load detecting unit, and the specified pressing load is applied. In a substrate cleaning method in which a cleaning tool is applied to a substrate to clean the substrate, the cleaning tool incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by a substrate holding means incorporated in the substrate cleaning apparatus. Of the actual pressure load from the pressure cleaning device and the detection value from the pressure load detecting means incorporated in the substrate cleaning apparatus for two or more different actual pressure loads, and a detecting step from the pressure load detecting means. When the value is obtained, the obtained value is obtained by using a relational expression determined based on the correspondence between the actual pressing load and the detected value from the pressing load detecting means for two or more points examined in the preparing step. A substrate cleaning step of determining a pressing load corresponding to the detected value, controlling the pressing means based on the detected information, and causing the cleaning tool to act on the substrate with the specified pressing load to clean the substrate. It is characterized by that.

According to a fourth aspect of the present invention, the substrate holding means for holding the substrate rotatably around the vertical axis, the cleaning tool for cleaning the cleaning surface of the substrate, and the pressing load of the cleaning tool on the substrate are designated. A pressing load designating unit, a pressing unit that causes the cleaning tool to act on a substrate with a pressing load specified by the pressing load designating unit, and a cleaning tool with a specified pressing load on the substrate held by the substrate holding unit. In a substrate cleaning apparatus comprising: a cleaning control unit that controls the substrate to be cleaned by operating the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding unit incorporated in the substrate cleaning apparatus. Pressing load measuring means for receiving the built-in cleaning tool and measuring an actual pressing load from the cleaning tool, the actual pressing load measured by using the pressing load measuring means, and the actual pressing load Using the control information associating means for associating the control value of the pressing means incorporated in the substrate cleaning device at the time of measurement, the pressing load measuring means and the control information associating means, the actual pressing load and the The cleaning control means further comprises: a control information storage means for storing the result of checking the correspondence with the control value of the pressing means for two or more different actual pressing loads. The control value of the pressing means with respect to the load is calculated using a relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing means for two or more points stored in the control information storage means. It is characterized in that the pressing means is controlled by the obtained control value, and the cleaning tool acts on the substrate with a pressing load according to the control value to clean the substrate.

According to a fifth aspect of the present invention, in the substrate cleaning apparatus according to the fourth aspect, the pressure load detection means for detecting the pressure load of the cleaning tool on the substrate and the pressure load measurement means are used for measurement. Detection information associating means for associating the actual pressing load with the detection value from the pressing load detecting means incorporated in the substrate cleaning apparatus when measuring the actual pressing load, the pressing load measuring means, and the And a detection information storage unit that stores the result of checking the correspondence relationship between the actual pressing load and the detection value from the pressing unit for two or more different actual pressing loads using the detection information associating unit. And further, the cleaning control means, when a detection value is obtained from the pressing load detecting means, sets the actual pressing loads for two or more points stored in the detection information storage means. The pressing load corresponding to the obtained detection value is obtained by using the relational expression determined based on the correspondence with the detection value from the pressing load detection means, and the substrate is cleaned using the detection information. It is characterized by being configured as described above.

According to a sixth aspect of the present invention, the substrate holding means for holding the substrate rotatably around the vertical axis, the cleaning tool for cleaning the cleaning surface of the substrate, and the pressing load of the cleaning tool on the substrate are designated. A pressing load designating unit, a pressing unit that causes the cleaning tool to act on the substrate with an arbitrary pressing load, and a pressing load detection unit that detects the pressing load of the cleaning tool on the substrate,
Cleaning in which the pressing unit is controlled based on the detection information from the pressing load detecting unit, and the substrate held by the substrate holding unit is controlled by applying a cleaning tool with a designated pressing load to wash the substrate. In a substrate cleaning apparatus including a control means, the cleaning tool incorporated in the substrate cleaning apparatus is received at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus. Pressing load measuring means for measuring the actual pressing load from the device, the actual pressing load measured by using the pressing load measuring means, and the pressing load incorporated in the substrate cleaning apparatus when measuring the actual pressing load. By using the detection information associating unit that associates the detection value from the detecting unit with each other, the pressing load measuring unit and the detection information associating unit, the actual pressing load and the pressing load detecting unit The cleaning control means further includes: detection information storage means for storing a result of checking the correspondence relationship with the known value for two or more different actual pressing loads, and the cleaning control means detects from the pressing load detecting means. Once the value is obtained,
The obtained detection value is obtained by using a relational expression determined based on the correspondence relationship between the actual pressure load and the detection value from the pressure load detection unit for two or more points stored in the detection information storage unit. It is configured such that the pressing load corresponding to the above is obtained, the pressing means is controlled based on the detection information, and the cleaning tool is caused to act on the substrate with the specified pressing load to clean the substrate. Is.

[0016]

The operation of the method invention according to claim 1 is as follows. First, the following preparatory steps are performed with at least the cleaning tool and the pressing means incorporated in the substrate cleaning apparatus.

That is, the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus and the substrate cleaning apparatus incorporated in the substrate cleaning apparatus. The correspondence with the control value of the pressing means is examined for two or more different actual pressing loads.

For example, the result of the examination is the actual pressing load Wi (i
= 1, 2, ...) Assume that the control value of the pressing means is Ci. The actual pressing load (W1, W2,
...) and the control values (C1, C2, ...) Of the pressing means, based on the relational expression (C
x = f (Wx)) can be determined.

After the above-mentioned preparation process, the following substrate cleaning process is performed. That is, the control value (Cx) of the pressing means with respect to the designated pressing load (Wx) was determined based on the correspondence between the actual pressing load and the controlling value of the pressing means for two or more points examined in the preparation step. Relational expression (Cx = f (W
x)) is used, the pressing means is controlled by the control value (Cx), and the pressing load (W) corresponding to the control value (Cx) is obtained.
In step x), the cleaning tool is applied to the substrate to clean the substrate. As described above, the control value of the pressing means for the specified pressing load can be obtained only by substituting the specified pressing load into the above relational expression, and therefore, the specified pressing load can be dealt with. Therefore, the above preparatory steps are
If it is rotated, the substrate can be continuously washed with various pressing loads. Further, since the above relational expression is in accordance with the assembling accuracy of the mechanical part of this device and the accuracy of the control system, the pressing control can be accurately performed.

Further, since the correspondence between the actual pressing load and the control value of the pressing means may change when the pressing means is replaced, the preparatory step is carried out even after the replacement of the pressing means, and thereafter, the preparation is performed. The substrate cleaning process can be continuously performed by using the relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing means examined in the process.

A method invention according to a second aspect is directed to a substrate cleaning apparatus equipped with a pressure load detecting means for detecting a pressure load of a cleaning tool on a substrate, and the pressure load detecting means is calibrated according to the first aspect. Using the same principle as the pressure control of the invention described above, the pressure load detection means is carried out in a state of being incorporated in the device.

That is, in the preparation step, the correspondence between the actual pressing load and the control value of the pressing means is examined for two or more actual pressing loads, and in addition to that, it is held by the substrate holding means incorporated in the substrate cleaning apparatus. The actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus and the detected value from the pressing load detecting means incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate to be cleaned are different from each other. Further investigate the actual pressing load above the point.

For example, the result of the examination shows that the actual pressing load Wj (j
= 1, 2, ...), the detection value from the pressing load detection means is Sj. Actual pressure load (W
1, W2, ...) And the detection value (S
, S2, ...), the relational expression (Wx = g (Sx)) used in the following substrate cleaning process can be determined.

After the above-mentioned preparation process, the following substrate cleaning process is performed. That is, when the pressing control of the invention according to claim 1 is performed in the substrate cleaning step and the detection value (Sx) is obtained from the pressing load detection means, the actual pressing load for two or more points examined in the preparing step is The detected value (S) obtained using the relational expression (Wx = g (Sx)) determined based on the correspondence between
x) is substituted into the above relational expression to obtain the pressing load (Wx) corresponding to the detected value (Sx), and the detected information (Sx =
The substrate is cleaned using Wx). As described above, since the pressing load detecting means is calibrated in the state where the pressing load detecting means is incorporated in the apparatus, the correspondence between the actual pressing load and the detected value from the pressing load detecting means is accurate.

Even when the pressing load detecting means is replaced, the newly installed pressing load detecting means can be calibrated by performing the above-mentioned preparation process after the replacement of the pressing load detecting means.

A method invention according to a third aspect is directed to a substrate cleaning apparatus which is provided with a pressing load detecting means and which controls the pressing means based on detection information from the pressing load detecting means.

In the preparatory process of the invention described in claim 3, only the correspondence between the actual pressing load and the detected value from the pressing load detecting means is carried out by the same procedure as the preparing process of the invention described in claim 2. Are examined for two or more actual pressing loads.

In the substrate cleaning step, as in the second aspect of the present invention, when the detection value is obtained from the pressing load detecting means, the actual pressing load and the pressing load detection for two or more points examined in the preparing step are performed. The pressing load corresponding to the obtained detection value is obtained by using the relational expression determined based on the correspondence with the detection value from the means. In the invention according to claim 3, the pressing means is controlled based on the detection information, and the cleaning tool is caused to act on the substrate with a specified pressing load to clean the substrate.

An apparatus invention according to a fourth aspect of the present invention suitably carries out the substrate cleaning method according to the first aspect of the present invention, and its operation is as follows.

First, in the preparing step, the pressing load measuring means and the control information associating means are used to make the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus. The correspondence relationship between the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus and the control value of the pressing unit incorporated in the substrate cleaning apparatus is checked for a predetermined actual pressing load and stored in the control information storage unit. Next, as for the different actual pressing loads, the correspondence between the actual pressing loads and the control values of the pressing means is checked and stored in the control information storage means in the same manner as above. This operation is performed twice or more, and the correspondence relationship between the actual pressing load and the control value of the pressing unit is checked for two or more different actual pressing loads and stored in the control information storage unit.
Based on the data stored in the control information storage means, the relational expression used in the following substrate cleaning process can be determined.

In the substrate cleaning step, the cleaning control means controls each component as follows. That is, the control value of the pressing means for the pressing load designated by the pressing load designating means is determined based on the correspondence between the actual pressing load and the control value of the pressing means for two or more points stored in the control information storage means. The pressing means is controlled with the control value, and the cleaning tool is caused to act on the substrate held by the substrate holding means with a pressing load corresponding to the control value to clean the substrate.

The apparatus invention according to a fifth aspect is for suitably carrying out the substrate cleaning method according to the invention according to the above-mentioned second aspect, and its operation is as follows.

That is, in the preparation step, the pressing load measuring means and the detection information associating means are used to make the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus. Correspondence between the actual pressure load from the cleaning tool incorporated in the substrate and the detection value from the pressure load detection means incorporated in the substrate cleaning apparatus is further investigated for two or more different actual pressure loads to store the detection information. Memorize it.

In the substrate cleaning step, the cleaning control means, when the detection value is obtained from the pressing load detecting means, the actual pressing load for two or more points stored in the detection information storage means and the detection from the pressing load detecting means. Using a relational expression determined based on the correspondence with the value, the pressing load corresponding to the obtained detection value is obtained, and the substrate is cleaned using the detection information.

The apparatus invention according to a sixth aspect of the present invention suitably implements the substrate cleaning method according to the third aspect of the present invention, and its operation is as follows.

That is, in the preparatory step, the correspondence relationship between the actual pressing load and the detection value from the pressing load detecting means is examined for two or more different actual pressing loads in the same manner as in the invention described in claim 5. It is stored in the detection information storage means.

In the substrate cleaning step, the cleaning control means, when the detection value is obtained from the pressing load detecting means, the actual pressing load for two or more points stored in the detection information storage means and the detection from the pressing load detecting means. Using the relational expression determined based on the corresponding relationship with the value, find the pressing load corresponding to the obtained detection value, control the pressing means based on the detection information, and wash with the specified pressing load The tool is applied to the substrate to clean the substrate.

[0038]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. <First Embodiment> FIG. 1 is a vertical sectional view showing a schematic structure of the whole substrate cleaning apparatus according to a first embodiment of the present invention, and FIG. 2 is a plan view thereof.

A rotary table 3 for vacuum-holding a substrate W is attached to the upper end of a rotary shaft 2 which rotates around a vertical axis by the drive of an electric motor 1 so as to be integrally rotatable. A substrate holding mechanism 4 that holds the substrate rotatably around the core is configured.

The substrate holding mechanism 4 is not limited to the vacuum suction type, and for example, a plurality of substrate supporting members for supporting a plurality of positions on the outer peripheral portion of the substrate W are provided on the rotary table 3, and
A substrate holding mechanism is configured by providing positioning pins that regulate the horizontal position of the substrate W supported by the substrate support member, and the substrate W is rotatably held in a state of being separated from the upper surface of the turntable 3. May be.

The periphery of the substrate holding mechanism 4 and the substrate W held by the substrate holding mechanism 4 is covered with a cup 5 which can be raised and lowered by an elevation drive mechanism (not shown). A nozzle 6 is provided on the lateral outer side of the cup 5 to jet a cleaning liquid such as pure water toward the rotation center side of the substrate W.

An angle-shaped support arm 7 is provided on the lateral outer side of the cup 5 so as to be rotatable around a first axis P1 in the vertical direction by an electric motor (not shown). A cleaning brush 8 as a cleaning tool that cleans the surface (cleaning surface in this embodiment) of the substrate W is provided below the tip-side arm portion 7a so as to be rotatable around the second axis P2 in the vertical direction. ing.

As the cleaning brush 8, a nylon brush, a mohair brush, a sponge, a felt, a plastic, or the like is used.

As shown in the enlarged vertical sectional view of the main part of FIG.
The bearing 9 is attached to the arm portion 7a on the front end side of the support arm 7.
The rotator 1 is rotatable about the second axis P2 via
0 is provided, and the pulley 11 and the motor M, which are integrally rotatably attached to the rotating body 10, include the timing belt 12.
Are interlockingly connected via. Pulley 1 of rotating body 10
A pair of guide rollers 1 at both sides sandwiching 1
0a is provided, and its guide roller 10a is configured to act on a spline portion 13a formed at an intermediate portion of the cleaning tool support 13, and the cleaning tool support 13 can be raised and lowered while rotating integrally with the rotating body 10. Is configured. The cleaning brush 8 is integrally attached to the lower end of the cleaning tool support 13.

A spring seat 14 is integrally rotatably attached to the cleaning tool support 13, and a compression coil spring 16 is provided between the spring seat 14 and the spring seat 15 attached to the rotary body 10, and the cleaning brushes 8 and A weight balance mechanism 17 is configured to maintain the cleaning brush 8 at a predetermined height with respect to the distal arm portion 7a in balance with the weight of the cleaning tool support 13.

A bearing 18 is provided at the upper end of the cleaning tool support 13.
The contact member 19 is attached only through relative rotation via the air cylinder 20, and the air cylinder 20 is provided on the upper side of the distal end side arm portion 7a so as to correspond to the upper end of the contact member 18. The lower end of the cylinder rod 21 is in contact with the contact member 19.

The air cylinder 20, as shown in FIG.
A minute gap is formed between the inner peripheral surface of the cylinder 22 and the outer peripheral surfaces of the piston 23 and the cylinder rod 21. Then, the relief valve 2 capable of changing the setting of the relief pressure between the compressor 24 and the space on the opposite side of the cylinder rod 21 with the piston 23 in between.
5 is connected via a first air pipe 26, and the space on the cylinder rod 21 side with the piston 23 in between and the compressor 24 are connected to the second air pipe 28 via a metering valve 27. The air cylinder 20 is connected to the air cylinder 20 via a pressure means, and the air cylinder 20 can be expanded and contracted in a non-sliding state with little resistance while aligning the air cylinder 20 with the supply air.

The weight balance mechanism 17 including the spring seats 14 and 15 and the compression coil spring 16 and the center of the air cylinder 20 in plan view are provided so as to coincide with the rotation center P2 of the cleaning brush 8. .

As shown in FIG. 3, the sensor arm 29 is integrally attached to the abutting member 19, and the sensor arm 29 is provided by the vertical wall of the support arm 7 so that it can be raised and lowered only. A screw member 30 is attached to the tip end side of the arm 29 for use. Support arm 7
A load cell type pressure sensor 31 is provided at a predetermined position therein, and the screw member 30 is configured to come into contact with the pressure sensor 31 by being lowered.

A magnetic fluid seal 32 and a labyrinth mechanism 33 are provided between the tip side arm portion 7a and the lower side of the rotating body 10.
Is provided, and it is configured so that it is possible to prevent dust generated due to wear due to the rotation of the bearing 9 above it from falling onto the substrate W and intrusion of the cleaning liquid.

As shown in FIG. 4, a controller 34 is connected to the relief valve 25, and the controller 34 has a pressing load setting device 35 as a pressing load designating means and a pressing load adjusting switch constituting a detection information associating means. 36, the adjustment confirmation switch 37, and the preparation start command switch 3
8 and the pressure sensor 31 via the load cell amplifier 39. The controller 34 includes a detection information storage memory 40 as a detection information storage unit.

The present embodiment is provided with a pressing load measuring tool 50 as a pressing load measuring means. This will be described with reference to FIGS.

As shown in the exploded perspective view of FIG.
A cylindrical member 42 externally fitted to the rotary shaft 2 is connected to a lower part of the rotary shaft 2, and a notch 43 formed in the cylindrical member 42 is externally fitted to a positioning pin 44 attached to the rotary shaft 2 while rotating. The center portion of the base 3 is fastened and fixed to the upper end of the rotary shaft 2 with a pair of screws 45 so that the rotary base 3 can be attached to and detached from the rotary shaft 2.

Further, a load meter 53 is mounted on a support bracket 52 which is equipped with a cylindrical member 51 which is fitted onto the positioning pin 44 and which can be tightened by a pair of screws 45. The support bracket 52 is attached to the rotary shaft 2, and the load meter 53 is placed on the support bracket 52. The load meter 53 receives the cleaning brush 8 and presses it so that the actual pressing load from the cleaning brush 8 can be measured. A load measuring tool 50 is configured.

Although not shown, the load cell 53 is provided with a load cell for measuring the load therein, and a pressure sensitive portion 54 for receiving the cleaning brush 8 by the load cell and measuring the actual pressing load from the cleaning brush 8. A display unit 55 that displays the measured actual pressing load is provided.

As shown in the side view of the main part of FIG. 6, the surface of the pressure-sensitive portion 54 that receives the cleaning brush 8 in the state where the pressing load measuring tool 50 is provided on the rotary shaft 2 (see FIG. 6A). Of the substrate W held by the substrate holding mechanism 4 [FIG.
(See (b)] The surface is set to the same level as the surface.

The pressing load measuring tool 50 may be constructed as shown in FIG. 7, for example, in addition to the above construction. In the configuration of FIG. 7, instead of the tubular member 51 provided in the support bracket 52 of FIGS. 5 and 6, a locking member 56 that is externally fitted and locked from above is connected to the vertical wall 5a of the cup 5 and a screw 57 is provided. The pressing load measuring tool 50 is configured so as to be clamped and fixed by.

Then, the locking member 56 is fixed to the vertical wall 5a of the cup 5 with the cup 5 lowered to the lowest position, and the load meter 53 is placed on the support bracket 52 thereof, whereby the pressure sensitive portion 54 The receiving surface of the cleaning brush 8 is set to the same level as the surface of the substrate W held by the substrate holding mechanism 4. Note that FIG. 7A is a plan view of relevant parts showing a configuration of a modified example of the pressing load measuring tool 50, and FIG. 7B is a view taken along the line AA of FIG. 7A.

With the above configuration, for example, the following preparatory step including calibration of the pressure load detecting means including the pressure sensor 31 and the load cell amplifier 39 is performed with the device assembled and set in the factory.

That is, the worker first mounts the support bracket 52 on the rotary shaft 2 in place of the rotary table 3 and mounts the load meter 53 on the support bracket 52. Next, the support arm 7 is rotated around the first axis P1 to position the cleaning brush 8 above the load meter 53. Then, the preparation start command switch 38 is pressed. When the preparation start command switch 38 is pressed, a predetermined pressing load W1 (for example, 20
In step g), the controller 34 sets the relief pressure of the relief valve 25 with the temporarily stored control value so that the cleaning brush 8 presses the pressure sensitive portion 54 of the load meter 53. The operator confirms the actual pressing load in this state on the display portion 55 of the load meter 53, and if the actual pressing load is the same as the pressing load W1, presses the adjustment confirmation switch 37. On the other hand, if the actual pressing load is different from the pressing load W1, the pressing load adjusting switch 36 adjusts the actual pressing load to the pressing load W1. The pressure load adjusting switch 36 is used for the relief valve 2
5 is a switch for giving a command to finely change the control value from the controller 34 for setting the relief pressure of 5 up and down. The controller 34 changes the control value for setting the relief pressure of the relief valve 25 according to a command from the pressing load adjusting switch 36. Accordingly
The actual pressing load with which the cleaning brush 8 presses the pressure sensitive portion 54 of the load meter 53 changes. The operator adjusts the pressing load adjusting switch 36 so that the actual pressing load displayed on the display portion 55 of the load meter 53 becomes the same as the pressing load W1, and the actual pressing load becomes the same as the pressing load W1. Then, the adjustment confirmation switch 37 is pressed. When the adjustment confirmation switch 37 is pressed, the controller 34 at this time corresponds to the pressing load W1 the detection value (denoted as S1) from the pressure sensor 31 input to the controller 34 via the load cell amplifier 39. Detection information storage memory 40
Remember.

When the adjustment confirmation switch 37 is pressed by the first adjustment of the pressing load W1, the controller 34
Is a control value temporarily stored so that the cleaning brush 8 presses the pressure sensitive portion 54 of the load meter 53 with a predetermined pressing load W2 (for example, 50 g) different from the initial pressing load W1. The relief pressure of the relief valve 25 is set by.
Hereinafter, similarly to the above, the actual pressing load displayed on the display unit 55 of the load meter 53 is adjusted to be the same as the above pressing load W2, and when the actual pressing load is the same as the above pressing load W2, the adjustment confirmation switch Press 37. As a result, the controller 34 determines that the detection value (referred to as S2) from the pressure sensor 31 input to the controller 34 via the load cell amplifier 39 at this time point corresponds to the pressing load W2. Store in 40.

As a result, there are two different points of correspondence between the actual pressing load and the detection value from the pressure sensor 31 (detection value from the pressing load detection means) input to the controller 34 via the load cell amplifier 39. This is obtained for the actual pressing load. FIG. 8 is a graph showing this correspondence.

As is clear from the graph shown in FIG. 8, the pressure load detecting means obtains the correspondence between the actual pressure loads obtained for two different actual pressure loads and the detected values from the pressure load detecting means. The following relational expression (linear expression) for obtaining the actual pressing load (Wx) corresponding to the detected value (Sx)
Is required.

Wx = a × Sx + b (1) where a and b are determined from the correspondence between the actual pressing load obtained for two different actual pressing loads and the detection value from the pressure load detecting means. It is a coefficient.

The actual substrate cleaning process performed after the above-mentioned preparation process is performed as follows. First of all, the worker
Of the type of film formed on the substrate W (aluminum film, oxide film, nitride film, polysilicon film, pattern film,
(A bare silicon film or the like) and the pressure load (Ws) at the time of cleaning corresponding to the nature and type of contaminants attached to the substrate W are designated from the pressure load setting device 35, and the cleaning brush is used. 8 is positioned off the substrate W. In this state, the controller 34 opens the relief valve 25 to apply the pressing load of the cleaning brush 8 to the substrate W during the substrate cleaning. Along with this, the detection value (Sx) from the pressing load detection means is input to the controller 34.
In the controller 34, when the detection value (Sx) is input from the pressing load detecting means, the detection value (Sx) is substituted into the above formula (1), and the pressing load (Wx) corresponding to the detection value (Sx) is input. ). Then, the pressing load (Wx) corresponding to the detection value (Sx) from the pressing load detecting means is compared with the pressing load (Ws) designated by the pressure load setting device 35, and when both match (Wx = Ws). The controller 34 stores the control value for the relief valve 25 at that time.

Then, when the cleaning brush 8 is positioned on the substrate W to start cleaning, the controller 34 gives the relief valve 25 the control value stored as described above,
The relief valve 25 is initialized so that the relief valve 25 maintains the relief pressure according to the control value, and the cleaning brush 8 is pressed against the substrate W with a designated pressing load (Ws) to clean the substrate W. Is done. The relief valve 25
Cleans the substrate W while maintaining the relief pressure corresponding to the designated pressing load (Ws), so that, for example, the surface difference of the substrate W held by the substrate holding mechanism 4 due to warp deformation is caused. Even if there is, the pressing load applied to the surface of the substrate W by the cleaning brush 8 is always the specified pressing load on the entire surface of the substrate W, and the pressing force is always constant regardless of the height difference of the surface of the substrate W. The entire surface of the substrate W can be cleaned while applying a load to the substrate W.

Thereafter, similarly, the substrate W under various pressing loads
Can be continuously washed. Note that, for example, the pressure sensor 3
1, the load cell amplifier 39, the sensor arm 29, the screw member 30, and other members are exchanged, and the correspondence between the actual pressing load stored in the detection information storage memory 40 and the detection value from the pressing load detection means changes. In that case, the above-mentioned preparation step is performed after the members are replaced (after being incorporated in the apparatus).
Moreover, you may perform the said preparation process regularly. In any case, if the above preparatory step is performed once, the substrate W can be continuously washed under various pressure loads thereafter, and the processing efficiency is improved and the productivity is improved. Further, in this embodiment, the pressure sensor 3
1, the load cell amplifier 39, the sensor arm 29, the screw member 30, the cleaning brush 8, and other members are incorporated into the apparatus, and then the pressing load detecting means is calibrated, so that the actual pressing load and the detected value from the pressing load detecting means are adjusted. The correspondence with is accurate for each device.

In the above embodiment, the pressing load measuring tool 5
The actual pressing load and the detected value from the pressing load detecting means are compared with each other from the result of checking the correspondence between the actual pressing load measured by using 0 and the detected value from the pressing load detecting means for two different actual pressing loads. I decided the relational expression (linear expression) of (1) of
For example, the correspondence relationship between the actual pressing load measured using the pressing load measuring tool 50 and the detection value from the pressing load detecting means is calculated as follows.
A more accurate relational expression can be obtained by investigating three or more different actual pressing loads and determining the relational expression (linear expression) between the actual pressing load and the detection value from the pressing load detection means by a method such as the least square method from the results. Is obtained. This modification can be similarly applied to the case of determining the relational expression between the actual pressing load and the detection value from the pressing load detection means in the following embodiments.

Further, the actual pressing load measured by using the pressing load measuring tool 50 and the detection value from the pressing load detecting means are associated with each other by the following structure other than the structure of the above embodiment. Can also be realized. That is, a setting device that can set the actual pressing load is provided, and in the preparation process, the controller 34 controls the pressing unit with a predetermined control value, and the actual pressing load of the cleaning brush 8 by the pressing unit with the control value is set. It is measured by the pressing load measuring tool 50. If the operator sets the measured value (actual pressing load) from the setting device,
The predetermined control value and the actual pressing load set by the setting device are grasped by the controller 34, and the two can be associated with each other. This modification can be similarly applied to the case of associating the actual pressing load with the detection value from the pressing load detection means in the following embodiments.

<Second Embodiment> The configuration of the second embodiment device will be described with reference to FIGS.

In the second embodiment device, the pressure sensor 31, the load cell amplifier 39, the sensor arm 29, and the screw member 30 are omitted from the first embodiment device, and the controller 34 stores the detection information storage memory 40. Instead, the control information storage memory 41 is provided, and when the pressing load is specified from the pressing load setting device 35 when the substrate W is cleaned,
The controller 34 is configured to control the pressing means with a control value according to the pressing load.

Therefore, in the preparation process of the second embodiment apparatus, the correspondence between the actual pressing load and the control value of the pressing means is examined.

That is, in the same process as the preparation process of the first embodiment, the measured value (actual pressing load) by the pressing load measuring tool 50 is the predetermined pressing load Wi (i = 1, 2,
...) and press the adjustment confirmation switch 37. As a result, the controller 34 sets the control value Ci at the time when the adjustment confirmation switch 37 is pressed to the pressing load Wi.
Is stored in the control information storage memory 41 as corresponding to. In this embodiment, the pressing load adjusting switch 36 and the adjustment confirmation switch 37 constitute the control information associating means in the present invention.

When the correspondence between the actual pressing load and the control value of the pressing means is examined for at least two different actual pressing loads, the specified pressing load (Wx) is obtained as shown in FIG.
The following relational expression (linear expression) for obtaining the control value (Cx) corresponding to can be determined.

Cx = c × Wx + d (2) where c and d are coefficients determined from the correspondence between the actual pressing load obtained for two different actual pressing loads and the control value of the pressing means. .

At the time of cleaning the substrate W, the pressing load setting device 3
When the pressing load (Ws) is designated from 5, the controller 34 obtains the control value of the pressing means corresponding to the pressing load (Ws) by the above equation (2). Then, when the cleaning brush 8 is positioned on the substrate W to start cleaning, the controller 34 gives the control value obtained as described above to the pressing means (relief valve 25), and the relief valve 25 controls the same. Relief valve 25 to maintain the relief pressure according to the value
Is initialized, and the cleaning brush 8 is pressed against the substrate W with a designated pressing load (Ws) to clean the substrate W. The other structure is the same as that of the first embodiment, and the detailed description thereof will be omitted.

Also in this second embodiment, the above-mentioned preparation process may be performed when the device is assembled and set in the factory, after replacing the parts, or periodically, after the preparation process is performed. The substrate W can be continuously washed under various pressing loads, and the processing efficiency is good and the productivity is improved. Further, since the actual pressing load and the control value of the pressing means are associated after the member is incorporated in the device, the correspondence between the actual pressing load and the control value of the pressing means is accurate for each device. Is.

Even when the relational expression (linear expression) for obtaining the control value corresponding to the designated pressing load is determined, the correspondence between the actual pressing load and the detection value from the pressing means is set to two different actual pressing forces. You may decide from the result of examining the load,
It may be determined by a method such as the least squares method from the results of examining the actual pressing loads of three or more different points. This modified example can be similarly applied to the case of determining the relational expression between the actual pressing load and the control value of the pressing means in the following embodiments.

Regarding the correspondence between the actual pressing load measured by using the pressing load measuring tool 50 and the control value of the pressing means, the actual pressing load measured by using the pressing load measuring tool 50 and the pressing load detection Similar to the case of associating with the detection value from the means, for example, a setting device capable of setting the actual pressing load is provided, and in the preparation step, the controller 34 controls the pressing means with a predetermined control value, The actual pressing load from the cleaning brush 8 by the pressing means at the control value is measured by the pressing load measuring tool 5.
The measurement may be performed at 0, and the measured value (actual pressing load) may be set from the setting device so that the two are associated with each other. This modified example can be similarly applied to the case of associating the actual pressing load with the control value of the pressing means in the following embodiments.

<Third Embodiment> A third embodiment of the apparatus is shown in FIG.
This will be described with reference to FIG.

The apparatus of the third embodiment has a pressure sensor 31,
While omitting the load cell amplifier 39, the sensor arm 29, and the screw member 30, the load cell type pressure sensor 60 is sandwiched between the upper end portion of the contact member 19 and the lower end portion of the cylinder rod 21 of the air cylinder 20. attachment,
The pressure sensor 60 can detect the momentary pressing load of the cleaning brush 8 against the substrate W when the substrate W is cleaned, by receiving a reaction force from the substrate W when cleaning the substrate W. The center of the pressure sensor 60 in plan view is configured to coincide with the rotation center P2 of the cleaning brush 8. Then, when cleaning the substrate W, the controller 34 takes in the detection information from the pressure sensor 60 and controls the pressing means by feedback control so that the pressing load is always the designated pressing load.

Therefore, in the preparation process of the apparatus of the third embodiment, the correspondence relationship between the actual pressing load and the control value of the pressing means is examined for two or more different actual pressing loads, and the control information storage memory in the controller 34 is examined. 41, and
Actual pressure load, pressure sensor 60, load cell amplifier 61
The actual pressure load at two or more different points is checked for the correspondence with the detection value from the pressure load detection means, and is stored in the detection information storage memory 40 in the controller 34.

Correspondence between the actual pressing load and the control value of the pressing means can be examined with the same configuration as in the second embodiment or its modification, and based on this result, it corresponds to the designated pressing load. Relational expression for calculating control value (Equation (2) above)
You can decide. Correspondence between the actual pressing load and the detection value from the pressing load detecting means can be examined with the same configuration as that of the first embodiment or its modification, and based on this result, A relational expression (Equation (1) above) for obtaining the pressing load corresponding to the detected value can be determined. In this embodiment, the pressing load adjusting switch 36 and the adjustment confirming switch 37 constitute the detection information associating means and the control information associating means in the present invention.

When cleaning the substrate W, the pressing load setting device 3 is used.
When the pressing load (Ws) is designated from 5, the controller 34 obtains the control value of the pressing means corresponding to the pressing load (Ws) by the above equation (2). Then, when the cleaning brush 8 is positioned on the substrate W and cleaning is started, the controller 34 gives the control value obtained as described above to the pressing means (relief valve 25) and the specified pressing load ( W
In s), the cleaning brush 8 is pressed against the substrate W to clean the substrate W. During the cleaning of the substrate W, the controller 34
Receives the detection value from the pressing load detection means, obtains the pressing load (current pressing load) corresponding to the detected value using the above formula (1), and compares it with the specified pressing load (Ws). Then, when the current pressing load is smaller than the specified pressing load (Ws), the pressing unit is controlled to increase the pressing load of the cleaning brush 8 on the substrate W, while the current pressing load is specified. Pressing load (W
When it is larger than s), the pressing means is controlled so as to reduce the pressing load of the cleaning brush 8 on the substrate W. In this way, the pressing load is always applied to the substrate W with the specified pressing load to uniformly wash the substrate W.

The feedback control may be performed with a certain allowable range. That is, the allowable range between the lower limit pressure load obtained by subtracting a predetermined amount from the designated pressure load (Ws) and the upper limit pressure load obtained by adding a predetermined amount to the designated pressure load (Ws) is determined, and the current pressure load is Only when the pressing means is out of the allowable range, the pressing means is controlled so as to be within the allowable range.

The other structure is the same as that of the first and second embodiments, and the detailed description thereof will be omitted. According to the third embodiment, the same effect as the first and second embodiments can be obtained.

<Fourth Embodiment> The configuration of a fourth embodiment device will be described with reference to FIGS. 13 and 14.

In the fourth embodiment, the pressing means in the third embodiment is composed of a linear actuator 70 and a power supply 71 instead of the air cylinder 20.

A pressure sensor 60 is provided at the upper end of the contact member 19.
The operation rod 72 is connected with the operation rod 7 in between.
2 is a coil 73 that constitutes the linear actuator 70
Penetrated inside.

As shown in FIG. 14, the power supply device 72 comprises a power supply 74 and a variable resistor 75, and the controller 34 controls the coil 73 by adjusting the resistance value (control value) of the variable resistor 75. It is configured so that the current to be flown is changed and the electromagnetic force of the linear actuator 70 is adjusted to linearly move the operating rod 72 up and down within the coil 73 to change the pressing load of the cleaning brush 8 against the substrate W.
Other configurations and operations are the same as those in the third embodiment, and therefore detailed description thereof will be omitted.

In the above first and second embodiments as well,
The pressing means may be composed of the linear actuator 70 and the power supply device 71 instead of the air cylinder 20. Further, the pressing means of the fifth and sixth embodiments, which will be described later, are used as the air cylinder 20
You may comprise.

<Fifth Embodiment> The configuration of the fifth embodiment of the apparatus will be described with reference to FIGS. Note that FIG. 15 is an enlarged vertical sectional view of an essential part of the fifth embodiment, and FIG.
5 is a side view, and FIG. 17 is a transverse sectional view.

The apparatus of the fifth embodiment has a cleaning tool support 13
The rotating body 10 and the rotating body 10 are connected to each other via a pair of upper and lower links 80 to form a parallel four-link mechanism, and the contact member 81 mounted on the upper end of the cleaning tool support 13 so as to be relatively rotatable is operated. The rod 72 is in contact with the pressure sensor 60. The center of the pressure sensor 60 in plan view is configured to coincide with the rotation center P2 of the cleaning brush 8. Other configurations and operations are similar to those of the fourth embodiment, and therefore detailed description thereof will be omitted.

<Sixth Embodiment> The configuration of the sixth embodiment device will be described with reference to FIG.

The sixth embodiment device is constructed as follows. That is, the support cylinder 91 is attached to the device frame 90.
Is rotatably provided via a bearing 92, and a support cylinder 91 is provided with a rotation support shaft 93 integrated with one end of the support arm 7 so as to be able to move up and down. A pulley 94 is integrally attached to the support cylinder 91, and the pulley 9
4 and an electric motor 95 capable of rotating in the forward and reverse directions are interlockingly connected via a transmission belt 96.

On the other end of the support arm 7, a cleaning tool support 13 to which a cleaning brush 8 is attached is rotatably provided, and the cleaning tool support 13 and the electric motor M provided on the support arm 7 are connected to each other. The belt type transmission mechanism 97 is interlockingly connected.

A spring seat 98 is attached at an intermediate position of the rotary support shaft 93, and between the spring seat 98 and the support cylinder 91,
A compression coil spring 99 for urging the rotation support shaft 93 to rise is provided, and the weight balance mechanism 100 is configured so that the cleaning brush 8 can be maintained at the cleaning position for the substrate W in a natural state with a slight supporting force. ing.

The linear actuator 70 is provided at a position corresponding to the lower side of the rotation support shaft 93, and the rotation support shaft 93 is supported by the operation rod 72 in the coil 73 thereof via the pressure sensor 60. Other configurations and operations are similar to those of the fourth embodiment, and thus detailed description thereof will be omitted.

Instead of the compression coil spring 99, a non-linear spring having a constant repulsive force regardless of the degree of elastic displacement may be used. Regarding this, the compression coil springs 16 of the first to fifth embodiments can be similarly applied.

<Seventh Embodiment> The configuration of a seventh embodiment device will be described with reference to FIG.

The device of the seventh embodiment is constructed as follows. Cleaning tool support 13 inserted in the rotating body 10
Slightly above the middle of the above and the upper side of the rotating body 10, and
The lower side of the cleaning tool support 13 and the lower side of the rotary body 10 are connected to each other via a stretchable first bellows 110 made of stainless steel so as to be integrally rotatable.

The stopper member 11 is provided at a portion facing the upper end of the cleaning tool support 13 in the tip side arm portion 7a through a second bellows 111 made of stainless steel which can be expanded and contracted.
2 is provided, and the upper end side of the cleaning tool support 13 is rotatably fitted and held in the stopper member 112. A closed space S is formed by the tip side arm portion 7a, the second bellows 111, and the stopper member 112, and a supply / discharge hole 113 that communicates with the closed space S is provided above the tip side arm portion 7a. Each of the first and second bellows 110 and 111 may be made of plastic.

A supply source (not shown) of pressurized air is connected to the supply / discharge hole 113 via an air pipe 114, and a pressure gauge 115 as a pressing load detecting means is provided at an intermediate position of the air pipe 114. Regulator 116 as pressing means
And an on-off valve 117 are provided so as to automatically maintain the pressure in the air pipe 114 within a set range.

In the cleaning of the substrate W in the seventh embodiment, the regulator 116 adjusts the pressure in the air pipe 18 by feedback control based on the pressure in the air pipe 114 detected by the pressure gauge 19. The substrate W is cleaned with a designated pressing load.

That is, for example, when the substrate W held by the substrate holding mechanism 4 is warped and has a height difference on its surface, the cleaning brush is rotated as the substrate W is rotated and the cleaning brush 8 is moved. The pressing load on the substrate W by 8 changes. At a portion where the substrate W is warped (high portion), the pressure gauge 115 detects a pressure higher than the pressure in the air pipe 114 according to the designated pressing load. Therefore, the regulator 116 works to reduce the pressure in the air pipe 114 so that the pressure in the air pipe 114 becomes a pressure according to the designated pressing load,
The second bellows 111 is contracted. As a result, the cleaning brush 8 supported by the cleaning tool support 13 is raised, and the pressing load of the cleaning brush 8 on the substrate W is maintained at the specified pressing load. On the other hand, in the recessed portion (low portion) of the substrate W, the pressure gauge 115 detects a pressure lower than the pressure in the air pipe 114 according to the designated pressing load, and therefore the regulator 116 The pressure in the pipe 114 is increased, and the second bellows 111 is expanded so that the pressure in the air pipe 114 becomes a pressure according to the designated pressing load. As a result, the cleaning brush 8 supported by the cleaning tool support 13 is lowered, and the pressing load of the cleaning brush 8 on the substrate W can be maintained at the designated pressing load. Also in this feedback control, an allowable range may be provided and the pressing means may be controlled so as to be within the allowable range.

In the preparation step of the seventh embodiment, the correspondence between the actual pressing load and the control value of the regulator 116 is checked for two or more different actual pressing loads, and control (not shown) in the regulator 116 is performed. The actual pressure load and the pressure gauge 115 are stored in the information storage memory.
The corresponding relationship with the pressure (detection value) in the air pipe 114 detected at 2 is checked for two or more different actual pressing loads and stored in a detection information storage memory (not shown) in the regulator 116. As a result, a relational expression for obtaining the control value corresponding to the designated pressing load and a relational expression for obtaining the pressing load corresponding to the pressure (detection value) in the air pipe 114 detected by the pressure gauge 115 are determined.

When cleaning the substrate W, a pressing load is specified for the regulator 116 by a pressing load setting device (not shown). The regulator 116 obtains the control value corresponding to the designated pressing load by the above relational expression, adjusts the pressure in the air pipe 114 with the control value, and sets the cleaning brush 8 of the substrate W at the designated pressing load. Press on the surface. The other structure is the same as that of the third embodiment, and the detailed description thereof will be omitted.

<Eighth Embodiment> FIG. 20 shows the configuration of the eighth embodiment.
Will be described with reference to.

This eighth embodiment apparatus is the same as the second embodiment of the seventh embodiment.
The first bellows 11 on the upper side,
The upper side of 0 is closed by a lid member 120 to form a closed space S1, and the lid member 120 is provided on the distal end side arm portion 7a so as to be rotatable and movable up and down via a seal member 121. Further, the supply / discharge hole 113 formed in the tip side arm portion 7a and the closed space S1 are communicatively connected via a through hole 122 formed in the lid member 120.

A vacuum suction source (not shown) is connected to the supply / discharge hole 113 via an air pipe 114a, and a pressure gauge 115a and a vacuum regulator 116a are provided at an intermediate position of the air pipe 114a. The pressure inside the air pipe 114a is automatically maintained at a pressure according to a designated pressing load.

In the eighth embodiment, when the weight of the cleaning brush 8 and the cleaning tool support 13 becomes larger than the designated pressing load applied to the substrate W by themselves, the internal space S1. There is an advantage that the internal pressure can be raised by making it a negative pressure to cancel a part of the above weight and obtain a designated pressing load. If the specified pressing load exceeds the above weight,
The air pipe 114a may be connected to the pressurized air source as in the embodiment. Other configurations and operations are the same as those in the seventh embodiment, and thus detailed description thereof will be omitted.

<Ninth Embodiment> The configuration of a ninth embodiment of the apparatus will be described with reference to FIG. Note that FIG. 21A is an enlarged vertical sectional view of an essential part of the ninth embodiment, and FIG. 21B is a horizontal sectional view.

This ninth embodiment device is a cleaning tool support 13
An intermediate portion in the longitudinal direction is formed to have an oval shape in cross section, and the oval portion is provided on the rotating body 10 so that it can only move up and down. A compression coil spring 130, which is driven by air, is interposed so that the upper end of the cleaning tool support 13 and the upper part of the tip side arm portion 7a apply a pressing force to the side where the cleaning tool support 13 is lowered. Single-acting air cylinder 1
A single-acting air cylinder 131 connected through 31
An air pipe 114 is connected to. Also, the rotating body 1
An expandable seal member 132 is integrally provided by thermal welding between the lower part of 0 and the lower part of the cleaning tool support 13 to prevent sliding between the rotating body 10 and the cleaning tool support 13. It is configured so that dust that accompanies it can be prevented from dropping onto the substrate W or the cleaning liquid entering.
Other configurations and operations are the same as those in the seventh embodiment, and thus detailed description thereof will be omitted.

<Tenth Embodiment> The configuration of a tenth embodiment of the apparatus will be described with reference to FIG.

In the tenth embodiment, the pressing means and the pressing load detecting means of the sixth embodiment are replaced with those of the ninth embodiment, and the weight balancing mechanism 100 is omitted, and the single-acting air cylinder 131 is used. The self-weight of each upper member is received by the single-acting air cylinder 131.
The cylinder rod 140 of the single-acting air cylinder 131 is connected to the lower end of the rotation support shaft 93. In addition, this tenth
The embodiment apparatus may also include the weight balancing mechanism 100. Other configurations and operations are the same as those in the sixth and ninth embodiments, and thus detailed description thereof will be omitted.

The cleaning of the substrate W in each of the above embodiments may be performed while rotating the cleaning brush 8 around the second axis P2, or rotating the cleaning brush 8 around the second axis P2. You may go without doing it.

Further, in each of the above-described embodiments, in order to clean the entire surface of the rotated substrate W with the cleaning brush 8, the support arm 7 is rotated around the first axis P1 and the cleaning brush 8 is moved to the substrate. The support arm 7 is horizontally moved in an arc shape from the center of the surface of the substrate W to the outer peripheral portion along the surface of W (reciprocating movement between them if necessary). For example, the support arm 7 is linearly moved by an air cylinder or the like. It may be configured to move.

The present invention is not limited to the circular substrate as in each of the above embodiments, but can be similarly applied to a substrate cleaning apparatus for a square substrate.

[0119]

As is apparent from the above description, according to the substrate cleaning method of the first aspect of the present invention, the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus is cleaned as a preparatory step. Correspondence between the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus and the control value of the pressing means incorporated in the substrate cleaning apparatus at the same level as that of the surface is determined for two or more different actual pressing loads. Since the pressure control in the subsequent substrate cleaning process is performed by using the relational expression determined based on the correspondence between the examined actual pressure load and the control value of the pressure means, It is possible to perform accurate pressing control according to the assembly accuracy of the mechanical portion of the substrate cleaning apparatus and the accuracy of the control system. Also, the preparation process is when the device is assembled (set in the factory)
Since it can be performed after replacing the pressing means and the pressing means, the labor for work can be reduced, and after performing the preparatory step, the substrate can be continuously washed with various pressing loads. Since it is not necessary to adjust the pressing means each time the pressing load changes, productivity is improved.

According to the substrate cleaning method of the second aspect of the present invention, the following effect can be obtained in addition to the effect of the first aspect of the invention. That is, in the preparation step, the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning apparatus and the substrate cleaning apparatus incorporated in the substrate cleaning apparatus. The corresponding relationship with the detected value from the pressed load detecting means is checked for two or more different actual pressing loads. In the substrate cleaning step, the checked actual pressing load and the detected value from the pressing load detecting means are checked. Since the pressing load corresponding to the detection value obtained from the pressing load detecting means is obtained by using the relational expression determined based on the correspondence relationship, the pressing load detecting means is incorporated in the device. Thus, the pressing load detecting means can be calibrated, and the correspondence between the actual pressing load and the detection value from the pressing load detecting means becomes accurate. Therefore, it is possible to detect the pressing load of the cleaning tool on the substrate and accurately perform the substrate cleaning using the detection information.

According to the substrate cleaning method of the third aspect of the invention, as in the case of the second aspect of the invention, the pressure load detecting means is calibrated with the pressure load detecting means incorporated in the apparatus. Since the correspondence between the actual pressing load and the detection value from the pressing load detection means becomes accurate, the pressing load of the cleaning tool on the substrate is detected, and the pressing means is controlled based on the detection information. The substrate can be cleaned with high precision by causing the cleaning tool to act on the substrate with a designated pressing load.

According to the invention of claim 4, claim 1
It is possible to realize a substrate cleaning apparatus that can preferably carry out the substrate cleaning method according to the invention described in (1).

According to the invention of claim 5, claim 2
It is possible to realize a substrate cleaning apparatus that can preferably carry out the substrate cleaning method according to the invention described in (1).

According to the invention of claim 6, claim 3
It is possible to realize a substrate cleaning apparatus that can preferably carry out the substrate cleaning method according to the invention described in (1).

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing a schematic configuration of an entire substrate cleaning apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a schematic configuration of the entire first embodiment apparatus.

FIG. 3 is an enlarged vertical cross-sectional view of a main part of the device according to the first embodiment.

FIG. 4 is a block diagram showing a schematic configuration of a control system of the first embodiment device.

FIG. 5 is an exploded perspective view showing a configuration of a pressing load measuring tool.

FIG. 6 is a vertical sectional view showing the configuration of a pressing load measuring tool.

7A and 7B are a plan view of a main part and a view taken along the line AA of the configuration showing a modified example of the pressing load measuring tool.

FIG. 8 is a graph showing a correspondence relationship between an actual pressing load and a detection value from a pressing load detection means.

FIG. 9 is a graph showing a correspondence relationship between an actual pressing load and a control value of a pressing unit.

FIG. 10 is a block diagram showing a schematic configuration of a control system of the second embodiment device.

FIG. 11 is an enlarged vertical cross-sectional view of the main parts of the third embodiment device.

FIG. 12 is a block diagram showing a schematic configuration of a control system of a third embodiment device.

FIG. 13 is an enlarged vertical cross-sectional view of a main part of the fourth embodiment device.

FIG. 14 is a block diagram showing a schematic configuration of a control system of a fourth embodiment device.

FIG. 15 is an enlarged vertical cross-sectional view of the main parts of the fifth embodiment device.

16 is a side view of FIG.

FIG. 17 is a cross-sectional view of the fifth embodiment device.

FIG. 18 is a partially omitted front view showing the configuration of a sixth embodiment device.

FIG. 19 is an enlarged vertical cross-sectional view of the main parts of the seventh embodiment device.

FIG. 20 is an enlarged vertical cross-sectional view of the essential parts of the eighth embodiment device.

FIG. 21 is an enlarged vertical cross-sectional view and a horizontal cross-sectional view of the main part of the ninth embodiment device.

FIG. 22 is a partially omitted front view showing the configuration of the device of the tenth embodiment.

[Explanation of symbols]

4: Substrate holding mechanism 8: Cleaning brush 20: Air cylinder 31, 60: Pressure sensor 34: Controller 35: Press load setting device 36: Push load adjustment switch 37: Adjustment confirmation switch 39, 61: Load cell amplifier 40: Detection information storage memory 41: Control information storage memory 50: Pressing load measuring tool 70: Linear actuator 71: Power supply device 75: Variable resistor 115, 115a: pressure gauge 116, 116a: Regulator W: Substrate

Claims (6)

(57) [Claims] 1. A substrate cleaning method for cleaning a substrate by arbitrarily designating a pressing load of the cleaning tool on the substrate, controlling the pressing means, and causing the cleaning tool to act on the substrate with the specified pressing load. The actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the cleaning apparatus and the pressing means incorporated in the substrate cleaning apparatus. A preparatory step of checking the correspondence with the control value for two or more different actual pressing loads, and the control value of the pressing means for the specified pressing load,
Obtained using a relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing means for two or more points examined in the preparation step, and controlling the pressing means with the control value, A substrate cleaning step of cleaning the substrate by causing the cleaning tool to act on the substrate with a pressing load according to the control value. 2. The substrate cleaning method according to claim 1, wherein the substrate cleaning apparatus is provided with a pressing load detecting means for detecting a pressing load of the cleaning tool on the substrate, and in the preparing step, the substrate cleaning apparatus is provided. From the actual pressing load from the cleaning tool incorporated in the substrate cleaning apparatus and the pressing load detecting means incorporated in the substrate cleaning apparatus at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in In addition to further examining the corresponding relationship with the detection value of the actual pressure load of two or more different points, when the detection value is obtained from the pressure load detection means in the substrate cleaning step, the two or more points checked in the preparation step. The pressure load corresponding to the obtained detection value is obtained by using a relational expression determined based on the correspondence relation between the actual pressure load and the detection value from the pressure load detection means. The substrate cleaning method is characterized in that the substrate is cleaned using the detected information. 3. The pressing load of the cleaning tool on the substrate is arbitrarily specified, the pressing means is controlled based on the detection information from the pressing load detecting means, and the cleaning tool is made to act on the substrate with the specified pressing load. In a substrate cleaning method for cleaning a substrate with a substrate, an actual pressing load from the cleaning tool incorporated in the substrate cleaning device at the same level as the cleaning surface of the substrate held by the substrate holding means incorporated in the substrate cleaning device, A preparatory step of checking the correspondence relationship with the detection value from the pressing load detection means incorporated in the substrate cleaning apparatus for two or more different actual pressing loads, and when the detection value is obtained from the pressing load detection means, The pressure corresponding to the obtained detection value is obtained by using a relational expression determined based on the correspondence between the actual pressure load and the detection value from the pressure load detection means for two or more points examined in the preparation step. A substrate cleaning step of determining the weight, controlling the pressing means based on the detection information, and causing the cleaning tool to act on the substrate with a specified pressing load to clean the substrate. Substrate cleaning method. 4. A substrate holding means for holding a substrate rotatably around a vertical axis, a cleaning tool for cleaning a cleaning surface of the substrate, a pressing load designating means for designating a pressing load of the cleaning tool on the substrate, A pressing unit that applies the cleaning tool to the substrate with a pressing load specified by the pressing load specifying unit, and a cleaning tool that acts on the substrate held by the substrate holding unit with the specified pressing load to clean the substrate In the substrate cleaning apparatus including the cleaning control means for controlling the cleaning tool described above, Pressing load measuring means for receiving and measuring the actual pressing load from the cleaning tool, the actual pressing load measured by using the pressing load measuring means, and the substrate for measuring the actual pressing load Using the control information associating means for associating the control value of the pressing means incorporated in the cleaning device and the pressing load measuring means and the control information associating means, the actual pressing load and the control value of the pressing means. And a control information storage unit that stores the result of checking the correspondence relationship with two or more different actual pressing loads, and the cleaning control unit has the pressing unit for the specified pressing load. Of the control value is calculated using a relational expression determined based on the correspondence between the actual pressing load and the control value of the pressing means for two or more points stored in the control information storage means, and the control value The substrate cleaning apparatus is configured to control the pressing means and clean the substrate by causing the cleaning tool to act on the substrate with a pressing load according to the control value. 5. The substrate cleaning apparatus according to claim 4, wherein a pressing load detecting unit that detects a pressing load of the cleaning tool on the substrate, and an actual pressing load measured by using the pressing load measuring unit, Using detection information associating means for associating with the detection value from the pressure load detecting means incorporated in the substrate cleaning apparatus when measuring the actual pressure load, the pressure load measuring means and the detection information associating means are used. And a detection information storage unit that stores a result of checking the correspondence relationship between the actual pressing load and the detection value from the pressing unit for two or more different actual pressing loads, and The washing control means, when the detection value is obtained from the pressing load detecting means, from the actual pressing load and the pressing load detecting means for two or more points stored in the detection information storage means. Using a relational expression determined based on the correspondence with the detection value, the pressing load corresponding to the obtained detection value is obtained, and the detection information is used to clean the substrate. Substrate cleaning equipment. 6. A substrate holding means for holding a substrate so as to be rotatable about a vertical axis, a cleaning tool for cleaning a cleaning surface of the substrate, and a pressing load designating means for designating a pressing load of the cleaning tool on the substrate. Pressing means for acting the cleaning tool on the substrate with the pressing load, pressing load detecting means for detecting the pressing load of the cleaning tool on the substrate, and controlling the pressing means based on the detection information from the pressing load detecting means. A cleaning control means for controlling the substrate held by the substrate holding means to wash the substrate by applying a cleaning tool with a designated pressing load; Pressure load measuring means for receiving the cleaning tool incorporated in the substrate cleaning apparatus and measuring an actual pressing load from the cleaning tool at the same level as the cleaning surface of the substrate held by the substrate holding means. Detection information associating means for associating the actual pressing load measured by using the pressing load measuring means with the detection value from the pressing load detecting means incorporated in the substrate cleaning apparatus when measuring the actual pressing load. And using the pressing load measuring means and the detection information associating means, the correspondence between the actual pressing load and the detection value from the pressing load detecting means was examined for two or more different actual pressing loads. Detection information storage means for storing the result, and the cleaning control means stores two or more points stored in the detection information storage means when the detection value is obtained from the pressing load detection means. Using the relational expression determined based on the correspondence between the actual pressing load and the detection value from the pressing load detecting means, the pressing load corresponding to the obtained detection value is obtained, By controlling the pressing means on the basis of broadcast information, substrate cleaning apparatus characterized by being configured so as to clean the substrate by the action of cleaning tools on the substrate at a specified pressing load.